JP3380097B2 - Semiconductor device substrate, method of manufacturing semiconductor device substrate, method of manufacturing semiconductor device using semiconductor device substrate, and semiconductor device - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to a semiconductor device substrate,
Method of manufacturing a substrate for a semiconductor device, a method of manufacturing a semiconductor device and the semiconductor device using a substrate for a semiconductor device, particularly a semiconductor device substrate having an internal metal plate, a method of manufacturing a substrate for a semiconductor device, a substrate for a semiconductor device The present invention relates to a semiconductor device manufacturing method and a semiconductor device used.

[0002]

2. Description of the Related Art A printed circuit board has been generally used as a substrate for mounting a circuit component such as a resistor or a capacitor, but recently, a PPGA (Plastic Pin Grid Array) has been used.
Alternatively, products such as BGA (Ball Grid Array) products in which a printed circuit board is used as a circuit board of a semiconductor device have been manufactured. In these semiconductor devices, a semiconductor element is mounted on a semiconductor device substrate, and the semiconductor element is sealed by one-side resin sealing or potting,
This is a product with external connection terminals such as lead pins or solder balls attached.

FIG. 5 shows a conventional example of a semiconductor device substrate used for manufacturing such a semiconductor device. In this example, circuit boards 10, 10 and 10 which are individual boards of a semiconductor device are integrally supported by a frame 11, and the whole shape is formed in a strip shape. As the semiconductor device substrate, a plurality of circuit boards are continuously formed in a strip shape as described above, one semiconductor device substrate is provided for each circuit board, and a large number of circuit boards are connected vertically and horizontally. It may be used as a large-sized board that has been installed.

By the way, a semiconductor device substrate is more liable to warp or waviness than a ceramic package or the like, and its heat dissipation is inferior. A semiconductor device substrate having a core metal (copper or other metal plate) inside is used. The semiconductor device substrate containing such a core metal has an advantage that the substrate can be prevented from warping or waviness and the heat dissipation property can be improved.

The semiconductor device substrate shown in FIG. 5 also has a core metal, and the core metal 12 is arranged in a plane arrangement in accordance with the portion on which the semiconductor element is mounted.
FIG. 6 shows a cross-sectional view of this semiconductor device substrate. The semiconductor device substrate is a film-shaped prepreg (adhesive plastic sheet) in which the core metal 12 is arranged in the inner layer.
14a, 14b, 14c are stacked, and formed into a plate by heating and pressing. Reference numeral 16 is a copper foil forming a conductor layer such as a wiring pattern, 18 is a through hole, 20
Is a slit, and 22 is a solder resist.

[0006]

In the case of manufacturing a semiconductor device using the above semiconductor device substrate, semiconductor elements are mounted on each circuit board 10, and the semiconductor element mounting surface of the semiconductor device substrate is provided on one side. After resin sealing, the individual circuit boards 10 are separated from the frame 11 to form semiconductor devices. The position where the circuit board 10 is separated from the frame 11 is shown by line A in FIGS. This separation position finally becomes the end face of the substrate of the semiconductor device.
Cut off and cut.

By the way, in the circuit board 10, a wiring pattern for connecting to external connection terminals is provided around the mounted semiconductor element, and the through holes 18 are arranged on the outer peripheral edge side of the board. Therefore, when the core metal 12 is arranged, the outer dimensions of the core metal 12 are set so that the through holes 18 and the core metal 12 do not interfere with each other. If the core metal 12 is expanded to the position where the through holes 18 are arranged, holes for penetrating the through holes 18 must be processed. However, since the arrangement pitch of the through holes 18 is extremely small, it is necessary to process such through holes. Is difficult. Therefore, the through hole 18
The core metal 12 is made to escape collectively at the portion where the is arranged.

Therefore, when the individual circuit boards 10 are cut into individual pieces, the resin portion where the core metal 12 is not present is cut, and at the time of this cutting, a crack is formed on the end surface of the board. There is a problem that the end face of the semiconductor device may be crushed or resin scraps may come out from the end face. Further, as a semiconductor device, there is a problem that the processed end face of the substrate is insufficiently sealed and moisture enters from the end face of the substrate. This is because the prepregs 14a, 14b, and 14c are solidified to form a semiconductor device substrate, and therefore the substrate is structurally fragile at the processed end surface.

Further, in the conventional circuit board 10, the size of the core metal 12 arranged in the board is about the same as that of the semiconductor element mounted on the board for the above-mentioned reason, and the improvement of heat dissipation is insufficient. There is also a problem that the deformation of the entire circuit board 10 cannot be suppressed appropriately. The present invention has been made to solve these problems, and provides a circuit board having high reliability and excellent appearance by having a function of suppressing moisture absorption of the board.
Of semiconductor device substrate, semiconductor device substrate
Manufacturing method, manufacturing of semiconductor device using semiconductor device substrate
An object is to provide a method and a semiconductor device.

[0010]

The present invention has the following constitution in order to achieve the above object. That is, one or a plurality of circuit boards made of a resin plate are juxtaposed to a frame made of a resin plate with a slit having a predetermined width in which the inner peripheral edge position of the hole matches the outer shape of the circuit board. In the semiconductor device substrate supported by the frame by the connecting portions provided at the four corners of the resin plate, the metal plate is continuously arranged in the entire resin plate including the circuit board, the connecting portion, and the frame, In the outer peripheral edge portion except the four corners of the circuit board, the metal plate is formed in the through hole forming range made of only resin by retracting inward from the end surface of the circuit board, and the through hole is provided in the through hole forming range. It is characterized by being done. In addition, the semiconductor device substrate is formed in a strip shape in which a plurality of circuit boards are supported by a frame. Further, in the semiconductor device substrate, a metal plate is continuously arranged in the entire circuit board made of a resin plate, and the metal plate is an end surface of the circuit board except for the four corners of the circuit board. retracts inward than formed in the through hole forming range consisting only of resin, wherein the through hole is provided in the through-hole forming area. Also, a thermal via is provided on the surface of the circuit board on which the semiconductor element is mounted. Further, one or a plurality of circuit boards made of a resin plate are juxtaposed to a frame made of a resin plate with a slit having a predetermined width, and are supported by the frame by connecting portions provided at four corners of the circuit board. In the method for manufacturing a substrate for a semiconductor device, a metal plate is continuously arranged over the entire resin plate including the circuit board, the connecting portion, and the frame, and an outer peripheral edge of the circuit board excluding four corners. As for the parts, the metal plate is retracted inward from the end face of the circuit board to form a resin plate formed in a through hole forming area made of only resin, and a wiring pattern is formed on the surface of the resin plate. A plurality of through holes are formed in the through hole forming range, and then the resin plate is subjected to router processing to form a slit having a predetermined width in which the inner peripheral edge position of the hole matches the outer shape of the circuit board. Characterized in that it formed. Also,
In a method of manufacturing a semiconductor device, a semiconductor element is mounted on a circuit board of the semiconductor device substrate, and a semiconductor element mounting surface of the semiconductor device substrate is resin-sealed on one side, and then a connecting portion between the circuit board and the frame is formed. It is characterized in that the semiconductor device is manufactured by cutting. Further, a semiconductor device is manufactured by mounting a semiconductor element on a circuit board of the semiconductor device substrate, and resin-sealing a semiconductor element mounting surface of the semiconductor device substrate on one side. Further, in a semiconductor device in which a semiconductor element is mounted on a semiconductor element mounting surface of a circuit board made of resin, and the semiconductor element and an external connection terminal are electrically connected to each other through a through hole formed in the circuit board, A metal plate is continuously arranged in the entire resin plate including the circuit board, the connecting portion, and the frame, and the metal plate is an end surface of the circuit board in the outer peripheral edge portion except the four corners of the circuit board. retracts inward than formed on the scan <br/> Ruhoru forming range consisting only of resin, wherein the through hole is provided in the through-hole forming area. Further, a thermal via is provided on a mounting surface of the semiconductor element of the circuit board, and an external connection terminal is provided at an end of the thermal via.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below with reference to the accompanying drawings. FIG. 1 shows a circuit board 10.
FIG. 3 is an explanatory diagram showing an overall configuration of an embodiment of a semiconductor device substrate in which the substrate is continuously connected to a frame 11 to form a strip shape. In this specification, a substrate used in each semiconductor device is referred to as a circuit substrate 10, and the entire substrate supporting the circuit substrate 10 with a frame 11 as shown in FIG. 1 is referred to as a semiconductor device substrate. In the embodiment shown in FIG. 1, three circuit boards 10 are continuously arranged on the frame 11.

The strip-shaped semiconductor device substrate shown in FIG. 1 is preliminarily perforated by matching the shape and size of the slit 20 formed around each circuit board 10 with the external dimensions of the substrate in the final product of the semiconductor device. It is characterized in that it is formed and connected to the frame 11 by the connecting portions 10a at the four corners of the circuit board 10. Since the slit 20 has the inner peripheral edge position of the hole aligned with the outer dimension of the substrate of the final product, it has a wider elongated hole shape as compared with the conventional semiconductor device substrate shown in FIG.

Further, in this embodiment, as shown in FIG. 1, the core metal (metal plate) 12 provided in the inner layer of the board is excluded from the circuit board 10 except the area where the through hole 18 is formed in the outer peripheral edge portion. It is characterized in that it is continuously provided up to the frame 11 at the four corners, and is also provided in the frame 11 portion. FIG. 2 shows the arrangement of the core metal 12 for one circuit board 10. In this way, at the corners of the circuit board 10, the core metal 12 is left at least at the connecting portions with the connecting portions 10a.

As shown in FIG. 2, since the through holes 18 are arranged at the outer peripheral edge portions of the respective sides of the circuit board 10, the core metal 12 recedes inward with a constant width in this range.
The area where the core metal 12 is retracted is a portion where the through hole 18 is formed, and the inner layer of the circuit board 10 is formed only by the resin 14. In contrast,
The core metal 12 continues to the end faces at the four corners of the circuit board 10.

Since the slit 20 has its inner peripheral edge formed in accordance with the size of the substrate of the product, in the embodiment, a small hole for processing is made in the substrate for the semiconductor device and then the hole is expanded by cutting such as router processing. The inner peripheral edge of the slit 20 is processed. Compared to the conventional method of partially cutting the circuit board 10 in the subsequent step to determine the board size, the processing by this router causes less damage even if the end surface of the board is resin, and cracks on the end surface. There is an advantage that processing can be performed without causing or causing resin scrap.

When observing the end surface actually processed by router and the end surface formed by cutting, the end surface is much smoother than that in the case of cutting by router processing, and a substrate excellent in appearance is obtained. At the same time, the structure makes it difficult for resin scraps to be generated from the end faces. Also,
Since the router is processed, it is possible to prevent the resin from being slightly fused due to the friction between the resin and the router to improve the airtightness at the end face, and prevent moisture from entering from the end face of the substrate. The router processing may be performed after the wiring pattern is formed on the semiconductor device substrate or before the wiring pattern is formed.

Further, in this embodiment, since the portion of the outer peripheral edge of the circuit board 10 where the resin 14 for arranging the through hole 18 is exposed is preliminarily punched by the router processing, the connecting portion 10a is formed in a later step. Only cut off. The connecting portion 10a is easily cut, and at the same time, the core metal 12 is left in the connecting portion 10a. Therefore, even if the connecting portion 10a is cut, unlike the case where the resin portion is cut, the end face is cracked. Or
It is possible to reliably cut without causing the end face to be rough. As a result, the reliability of the circuit board 10 can be improved and, in addition, the reliability of the entire semiconductor device can be improved.

FIG. 3 is a sectional view of a semiconductor device substrate in which slits 20 are formed in advance by router processing.
In the figure, the line B shows the position of the end surface of the substrate which is the final product.
The slit 20 is formed by router processing so that the inner peripheral edge of the hole is aligned with the end surface position (line B).
The core metal 12 is set to have the largest dimension within the range where it does not interfere with the portion where the through hole 18 is formed. Further, the core metal 12 is extended to the frame 11 portion.

In the case of manufacturing a semiconductor device substrate in which the core metal 12 is arranged in the inner layer, an example of FIG. 3 will be described. An intermediate layer prepreg 14b in which a hole for inserting the core metal 12 is formed on the lower layer prepreg 14a. And set it so that the core metal 12 is dropped into the hole formed in the prepreg 14b.
A substrate for a semiconductor device having the core metal 12 is obtained by applying pressure and heating the whole on top. A conductor layer is provided on the surface of this semiconductor device substrate by adhesion of copper foil, copper sputtering, etc., the conductor layer is etched to form a wiring pattern, and a through hole is formed in the substrate by drilling or the like to form a wiring pattern on the back surface. Through holes can be formed for connection or for connecting external connection terminals. These processing methods are the same as the conventional method for manufacturing a semiconductor device substrate. The resin layer of the semiconductor device substrate may be a glass epoxy substrate or a prepreg laminate (paste layer), or may be formed by applying a resin such as polyimide or epoxy.

When a semiconductor device is manufactured using the above semiconductor device substrate, the semiconductor element 24 is mounted on each circuit board 10 of the above semiconductor device substrate, and the semiconductor element mounting surface is resin-sealed on one side. After that, the external connection terminal 30 is joined to connect the frame 11 and the circuit board 10 to each other.
0a is cut to obtain a semiconductor device product. FIG. 4 shows a sectional view of the semiconductor device thus obtained. 26 is a sealing resin. In order to improve the heat dissipation of the semiconductor device, in the illustrated example, the thermal via 32 is provided on the mounting surface of the semiconductor element 24, the external connection terminal 34 is provided at the end of the thermal via 32, and the external connection terminal 34 is mounted on the mounting substrate. Configured to connect. As the external connection terminal 34, a lead pin can be used instead of the solder ball. Further, the semiconductor element may be cap-sealed.

The semiconductor device of the present embodiment has a circuit board 10
Since the end surface of is formed by the router processing, cracks and resin scraps do not occur, and a product with good appearance can be obtained. In addition, it prevents the end face of the substrate from being slightly fused due to the friction between the router and the resin, and prevents moisture from entering from the end face of the substrate, which is more reliable than the product using the conventional metal core semiconductor device substrate. It is an expensive semiconductor device. In addition, the core metal 1 arranged on the inner layer of the circuit board 10
By increasing the size of 2, it is possible to improve the heat dissipation of the semiconductor device.

In this embodiment, the core metal 12 is provided up to the frame 11 when the semiconductor device substrate is manufactured.
Since the core metal 12 is arranged in almost the entire range of the frame 11 and the circuit board 10, there is also an advantage that deformation such as warpage of the strip-shaped frame as a whole reinforced by the core metal 12 can be prevented. Further, as compared with the case where the core metal 12 is partially provided on the circuit board 10, the thickness of the strip-shaped frame as a whole is equalized, and the circuit board 10 is clamped by a mold and resin-sealed on one side. At that time, there is an advantage that the clamping force is surely applied to enable accurate resin sealing.

In the above embodiment, the semiconductor device substrate in which the circuit board 10 is supported by the frame 11 and formed in a strip shape has been described. However, a semiconductor device substrate in which only one circuit board is supported by the frame, Even when using a large-sized semiconductor device substrate in which a large number of circuit boards 10 are arranged vertically and horizontally, a highly reliable circuit board can be obtained by the same method as in the above embodiment.

[0024]

According to the substrate for a semiconductor device and the method for manufacturing a substrate for a semiconductor device according to the present invention, as described above,
It can be provided as a product having excellent characteristics such that cracks do not occur on the end surface of the substrate and moisture can be prevented from entering the substrate. By using this semiconductor device substrate, a semiconductor with higher reliability can be provided. The device can be obtained. Further, according to the method of manufacturing a semiconductor device of the present invention, it is possible to easily obtain a highly reliable semiconductor device, and so on.

[Brief description of drawings]

FIG. 1 is an explanatory diagram showing an overall shape of a strip-shaped board in which a circuit board is supported by a frame.

FIG. 2 is an explanatory diagram showing a configuration of a single circuit board separated from a frame.

FIG. 3 is a cross-sectional view of a circuit board.

FIG. 4 is a cross-sectional view of a semiconductor device in which a semiconductor element is mounted on a circuit board.

FIG. 5 is an explanatory diagram showing an overall shape of a conventional example in which a circuit board is supported by a frame.

FIG. 6 is a cross-sectional view of a conventional circuit board.

[Explanation of symbols]

10 circuit board 10a connecting part 11 frames 12 core metal 14 resin 14a, 14b, 14c prepreg 16 copper foil 18 through holes 20 slits 22 Solder resist 24 Semiconductor element 26 Sealing resin 30 External connection terminal 32 Thermal via 34 External connection terminal

─────────────────────────────────────────────────── ─── Continuation of the front page (56) References Japanese Patent Laid-Open No. 5-67694 (JP, A) Actual Development 1-47053 (JP, U) (58) Fields investigated (Int.Cl. ⁷ , DB name) H01L 23/12

Claims (9)

(57) [Claims] 1. A single or a plurality of circuit boards made of a resin plate are juxtaposed to a frame made of a resin plate, with a slit having a predetermined width that matches the inner peripheral edge position of the hole with the outer shape of the circuit board. In a substrate for a semiconductor device supported by the frame by connecting portions provided at four corners of the circuit board, a metal plate is continuously arranged inside the entire resin plate including the circuit board, the connecting portion, and the frame. In the outer peripheral edge portion excluding the four corners of the circuit board, the metal plate recedes inward from the end surface of the circuit board and is made of resin.
A substrate for a semiconductor device, characterized in that it is formed in a through-hole formation area consisting of only one , and a through-hole is provided in the through-hole formation area. 2. The substrate for a semiconductor device according to claim 1, wherein a plurality of circuit boards are supported by a frame and are formed in a strip shape. 3. The entire inside of the circuit board made of a resin plate,
Metal plates are continuously arranged, and at the outer peripheral edge portion excluding the four corners of the circuit board, the metal plate recedes inward from the end surface of the circuit board and is made of resin.
A substrate for a semiconductor device, characterized in that it is formed in a through-hole formation area consisting of only one , and a through-hole is provided in the through-hole formation area. 4. The substrate for a semiconductor device according to claim 1, wherein a thermal via is provided on a surface of the circuit board on which the semiconductor element is mounted. 5. A single or a plurality of circuit boards made of a resin plate are juxtaposed to a frame made of a resin plate with a slit having a predetermined width, and the frame is connected to the frame by connecting portions provided at four corners of the circuit board. In the method for manufacturing a supported substrate for a semiconductor device, a metal plate is continuously arranged in the entire resin plate including the circuit board, the connecting portion, and the frame, and four corner portions of the circuit board are provided. Except for the outer peripheral edge, the metal plate retracts inward from the end surface of the circuit board.
A resin plate is formed in a through hole forming area made of resin only , a wiring pattern is formed on the surface of the resin plate, a plurality of through holes are formed in the through hole forming area, and then the resin plate is formed. A method of manufacturing a substrate for a semiconductor device, which comprises performing a router process to form a slit having a predetermined width such that the inner peripheral edge position of the hole matches the outer shape of the circuit board. 6. A semiconductor device is mounted on the circuit board of the semiconductor device substrate according to claim 1 or 2, and a semiconductor device mounting surface of the semiconductor device substrate is resin-sealed on one side, and then the circuit board and the frame are formed. A method of manufacturing a semiconductor device, which comprises manufacturing a semiconductor device by cutting a connecting part of the semiconductor device. 7. A semiconductor device is manufactured by mounting a semiconductor element on the circuit board of the semiconductor device substrate according to claim 3, and sealing the semiconductor element mounting surface of the semiconductor device substrate on one side with a resin. Manufacturing method of semiconductor device. 8. A semiconductor element is mounted on a semiconductor element mounting surface of a circuit board made of resin, and the semiconductor element and an external connection terminal formed on the circuit board are electrically connected through a through hole formed on the circuit board. In the semiconductor device connected to, a metal plate is continuously disposed on the entire inside of the circuit board, and the outer peripheral edge portion excluding the four corners of the circuit board has the metal plate inside the end surface of the circuit board. Back to the resin
It is formed in the through hole forming range consisting only, the semiconductor device characterized by through holes provided in the through-hole forming area. 9. The semiconductor device according to claim 8, wherein a thermal via is provided on a mounting surface of the semiconductor element of the circuit board, and an external connection terminal is provided at an end of the thermal via.