[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP3365426B2 - Chip type electronic components - Google Patents

Chip type electronic components

Info

Publication number
JP3365426B2
JP3365426B2 JP29209992A JP29209992A JP3365426B2 JP 3365426 B2 JP3365426 B2 JP 3365426B2 JP 29209992 A JP29209992 A JP 29209992A JP 29209992 A JP29209992 A JP 29209992A JP 3365426 B2 JP3365426 B2 JP 3365426B2
Authority
JP
Japan
Prior art keywords
chip
type electronic
electronic component
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP29209992A
Other languages
Japanese (ja)
Other versions
JPH06120069A (en
Inventor
達郎 久保内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Chemi Con Corp
Original Assignee
Nippon Chemi Con Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Chemi Con Corp filed Critical Nippon Chemi Con Corp
Priority to JP29209992A priority Critical patent/JP3365426B2/en
Publication of JPH06120069A publication Critical patent/JPH06120069A/en
Application granted granted Critical
Publication of JP3365426B2 publication Critical patent/JP3365426B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Description

【発明の詳細な説明】 【0001】 【産業上の利用分野】この発明は、プリント基板に表面
実装されるチップ型電子部品の端子構造に関する。 【0002】 【従来の技術】一般に、チップ型電子部品をプリント基
板に表面実装する場合には、予め配線パターンの所定位
置にクリーム半田を塗布したプリント基板上にチップ型
電子部品を搭載した後、VPS法や熱循環法等でクリー
ム半田を溶融させるとともに、この半田をチップ型電子
部品の外部端子に付着させて、チップ型電子部品を配線
パターンに接続して行っている。 【0003】 【発明が解決しようとする課題】しかしながら、チップ
型電子部品の接続に使われる半田量は、チップ型電子部
品の外部端子が微小なために余り多くを塗布できないの
で、チップ型電子部品は、リードスルー実装される部品
等に比べて、外部端子とプリント基板との接合部が脆弱
になってしまう。そして、このようなチップ型電子部品
は、プリント基板の震動が原因になって、プリント基板
から離脱することがあった。 【0004】また、チップ型電子部品をプリント基板に
実装した際に、チップ型電子部品が所定の配線パターン
からズレて載置されたり、外部端子に歪みや汚れなどが
あった場合などには、図5のように外部端子に半田が適
正に付着しないなどの半田フィレット13の外観不良が
起こることがある上に、チップ型電子部品11はプリン
ト基板14との適正な接合力を充分に得られない。この
とき、図6にも示すように、チップ型電子部品11の外
部端子10に付着する半田12に偏りがあったすると、
溶融した半田12の表面張力などと相まって、チップ型
電子部品11が一方の外部端子10を支点にして立ち上
がる、いわゆるマンハッタン現象が起きてしまうことが
あった。 【0005】この発明の目的は、プリント基板に強固に
実装できるチップ型電子部品を提供することにある。 【0006】 【課題を解決するための手段】この発明は、電気素子を
内包する外装体に設けた平板状の外部子の一部に、外部
端子を貫通する切り込み部を連続して形成するととも
に、この連続する切り込み部を折り曲げて下方に向かっ
て開く突片を形成したことを特徴としている。 【0007】 【作用】この発明は、チップ型コンデンサ8等のチップ
型電子部品の外部端子3に、その外部端子3の一部を折
り曲げて下方に向かって開く突片を形成している。この
ため、チップ型電子部品をプリント基板9に実装した場
合、外部端子3と突片5とに半田7が付着するので、従
来のチップ型電子部品11の外部端子10に比べて、外
部端子3と半田7との接合面積が増加し、その結果、チ
ップ型コンデンサ8などのチップ型電子部品をプリント
基板9に強固に実装することができる。 【0008】 【実施例】図1は本発明の実施例によるチップ型電子部
品の斜視図である。図2は本発明の実施例によるチップ
型電子部品の完成前の底面からの斜視図である。図3は
図1のA方向の部分断面図である。図4は本発明の実施
例によるチップ型電子部品をプリント基板に実装した状
態を示す部分断面図である。図5は本発明の他の実施例
によるチップ型電子部品の斜視図である。図6は本発明
の他の実施例によるチップ型電子部品の斜視図である。 【0009】図1及び図3に示すように、直方体状の外
装体1は、絶縁性を有する合成樹脂等からなり、モール
ド加工で、たとえばコンデンサ素子2を内包している。
電気素子としては、コンデンサ素子2の他に抵抗、イン
ダクタなど、外装体に内包できるものであれば良い。 【0010】外装体1の両端面に設けられた外部端子3
は、外装体1の内部から導出されていて、外装体1の端
面及び外装体1がプリント基板8に接する面である底面
に沿うように平板状に形成されている。この外部端子3
は、図3のように外装体1の内部でコンデンサ素子2の
内部電極4に溶接等で接続している。 【0011】また、外部端子3には、外部端子3に一体
の四角形状の突片5を形成している。この突片5は、外
部端子3を形成加工するときに、図2に示すような外部
端子5を貫通するコの字状に連続する三辺の切込み部6
を打ち抜き加工などで形成し、外部端子3を内部電極4
に接続した後、図1のように折り曲げるとよい。また、
四角形状の突片5の折り曲げる角度は、図4に示すよう
にチップ型電子部品を実装した場合に適正な半田フィレ
ットの角度よりも小さい角度に折り曲げるのがよい。こ
の場合、突片5の全ての表面が半田7に覆われるので、
外部端子3の半田7との接合面積が増加して強固な実装
状態を実現できる。さらに、半田7は突片5に沿って這
い上がるので、突片5を折り曲げる角度を調節すること
により、好適な半田フィレットを形成することができ
る。 【0012】この実施例では、チップ型コンデンサ8の
外部端子3に、その外部端子3の一部を四角形状に折り
曲げた突片5を形成している。このため、チップ型コン
デンサ8をプリント基板9に実装した場合、外部端子3
と四角形状の突片5とに半田7が付着して、従来のチッ
プ型電子部品11の外部端子10よりも、外部端子3の
半田7との接合面積が増加する。その結果、チップ型電
子部品8をプリント基板9に強固に接続した状態を実現
できる。 【0013】なお、突片5は本実施例のように四角形状
のものに限定されずに、例えば舌片状のもの、あるいは
図5のようなV字状のものであっても良い。さらに、本
実施例では外部端子3に突片5を一つ形成したが、突片
5は、図6に示すような櫛歯状のものでも良い。この場
合も、半田との接合面積が増えるので外部端子とプリン
ト基板との接合力を向上させることができる。 【0014】また本実施例では、直方体状の外装体1の
両端面に外部端子3を設けたものを例にとって説明した
が、外装体の一端面のみに外部端子を設けたものであっ
ても、本発明の実施に差し支えない。 【0015】 【発明の効果】以上のように本発明は、電気素子を内包
する外装体に設けた平板状の外部子の一部に、外部端子
を貫通する切り込み部を連続して形成するとともに、こ
の連続する切り込み部を折り曲げて下方に向かって開く
突片を形成しているので、外部端子に突片が形成される
分だけ、外部端子の半田との接合する面積が増加して、
チップ型電子部品をプリント基板に強固に実装すること
ができる。このため、プリント基板に実装されたチップ
型電子部品に機械的なストレスがかかっても、チップ型
電子部品がプリント基板から離脱することを防ぎ、チッ
プ型電子部品の信頼性を向上させることができる。 【0016】また、チップ型電子部品をプリント基板に
強固に取り付けることができるので、チップ型電子部品
のマンハッタン現象を防止することができる。 【0017】さらに、外部端子に付着する半田は突片に
沿って付着するので、突片の折り曲げる角度を調節する
ことにより、好適な半田フィレットを形成することがで
き、チップ型電子部品の外部端子に付着する半田の外観
不良を防止できる。
Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal structure of a chip-type electronic component surface-mounted on a printed circuit board. 2. Description of the Related Art Generally, when a chip-type electronic component is surface-mounted on a printed circuit board, the chip-type electronic component is mounted on a printed circuit board previously coated with cream solder at a predetermined position of a wiring pattern. The cream solder is melted by a VPS method, a thermal circulation method, or the like, and the solder is attached to an external terminal of the chip electronic component to connect the chip electronic component to a wiring pattern. [0003] However, the amount of solder used to connect the chip-type electronic components cannot be applied too much because the external terminals of the chip-type electronic components are very small, so that the chip-type electronic components cannot be applied. In this case, the joint between the external terminal and the printed board becomes weaker than a component or the like mounted by lead-through. In addition, such chip-type electronic components sometimes come off the printed circuit board due to vibration of the printed circuit board. In addition, when the chip-type electronic component is mounted on a printed circuit board, the chip-type electronic component is displaced from a predetermined wiring pattern, or when the external terminals are distorted or stained. As shown in FIG. 5, the appearance of the solder fillet 13 such as the solder does not properly adhere to the external terminals may occur, and the chip-type electronic component 11 can obtain a sufficient bonding force with the printed circuit board 14. Absent. At this time, as shown in FIG. 6, if there is a bias in the solder 12 attached to the external terminals 10 of the chip-type electronic component 11,
The so-called Manhattan phenomenon, in which the chip-type electronic component 11 rises with one external terminal 10 as a fulcrum, sometimes occurs in combination with the surface tension of the molten solder 12 or the like. An object of the present invention is to provide a chip-type electronic component that can be firmly mounted on a printed circuit board. According to the present invention, a cutout penetrating an external terminal is continuously formed in a part of a flat external member provided on an exterior body containing an electric element. , Bend this continuous cut and turn downward
It is characterized by forming a protruding piece that opens . According to the present invention, a projection is formed on the external terminal 3 of a chip-type electronic component such as the chip-type capacitor 8 by bending a part of the external terminal 3 and opening downward . For this reason, when the chip-type electronic component is mounted on the printed circuit board 9, the solder 7 adheres to the external terminal 3 and the protruding piece 5. As a result, a chip-type electronic component such as a chip-type capacitor 8 can be firmly mounted on the printed circuit board 9. FIG. 1 is a perspective view of a chip-type electronic component according to an embodiment of the present invention. FIG. 2 is a perspective view of the chip-type electronic component according to the embodiment of the present invention from the bottom surface before completion. FIG. 3 is a partial sectional view in the direction A of FIG. FIG. 4 is a partial sectional view showing a state in which a chip-type electronic component according to an embodiment of the present invention is mounted on a printed circuit board. FIG. 5 is a perspective view of a chip-type electronic component according to another embodiment of the present invention. FIG. 6 is a perspective view of a chip-type electronic component according to another embodiment of the present invention. As shown in FIGS. 1 and 3, a rectangular parallelepiped exterior body 1 is made of an insulating synthetic resin or the like, and contains, for example, a capacitor element 2 by molding.
The electric element may be any element that can be included in the exterior body, such as a resistor and an inductor, in addition to the capacitor element 2. [0010] External terminals 3 provided on both end surfaces of the exterior body 1
Is drawn out from the inside of the exterior body 1 and is formed in a flat plate shape along the end surface of the exterior body 1 and the bottom surface which is the surface where the exterior body 1 is in contact with the printed circuit board 8. This external terminal 3
Is connected to the internal electrode 4 of the capacitor element 2 by welding or the like inside the exterior body 1 as shown in FIG. The external terminal 3 is formed with a rectangular projecting piece 5 integral with the external terminal 3. When the external terminal 3 is formed and processed, the protruding piece 5 has three notches 6 continuous in a U-shape penetrating the external terminal 5 as shown in FIG.
Are formed by punching or the like, and the external terminals 3 are connected to the internal electrodes 4.
After the connection, it may be bent as shown in FIG. Also,
As shown in FIG. 4, the angle at which the quadrangular protruding piece 5 is bent is preferably smaller than an appropriate solder fillet angle when a chip-type electronic component is mounted. In this case, since the entire surface of the protruding piece 5 is covered with the solder 7,
The bonding area of the external terminal 3 with the solder 7 increases, and a strong mounting state can be realized. Further, since the solder 7 crawls along the protruding piece 5, a suitable solder fillet can be formed by adjusting the angle at which the protruding piece 5 is bent. In this embodiment, the external terminal 3 of the chip type capacitor 8 is formed with a protruding piece 5 in which a part of the external terminal 3 is bent in a square shape. Therefore, when the chip type capacitor 8 is mounted on the printed circuit board 9, the external terminals 3
Then, the solder 7 adheres to the rectangular protruding piece 5 and the external terminal 10 of the conventional chip-type electronic component 11, and the bonding area of the external terminal 3 with the solder 7 increases. As a result, a state in which the chip-type electronic component 8 is firmly connected to the printed circuit board 9 can be realized. The protruding piece 5 is not limited to a square shape as in this embodiment, but may be, for example, a tongue shape or a V-shaped shape as shown in FIG. Further, in this embodiment, one protruding piece 5 is formed on the external terminal 3, but the protruding piece 5 may have a comb-like shape as shown in FIG. Also in this case, the bonding area between the external terminal and the printed circuit board can be improved because the bonding area with the solder increases. In this embodiment, the case where the external terminals 3 are provided on both end surfaces of the rectangular parallelepiped exterior body 1 is described as an example. However, the external terminals are provided only on one end surface of the exterior body. However, the present invention can be implemented. As described above, according to the present invention, a cutout penetrating an external terminal is continuously formed in a part of a flat external element provided on an exterior body containing an electric element. Since the continuous notch is bent to form a protruding piece that opens downward, the area of the external terminal to be joined to the solder increases by the amount of the protruding piece formed on the external terminal. do it,
Chip-type electronic components can be firmly mounted on a printed circuit board. Therefore, even if mechanical stress is applied to the chip-type electronic component mounted on the printed circuit board, the chip-type electronic component can be prevented from separating from the printed circuit board, and the reliability of the chip-type electronic component can be improved. . Further, since the chip-type electronic component can be firmly attached to the printed circuit board, the Manhattan phenomenon of the chip-type electronic component can be prevented. Furthermore, since the solder adhering to the external terminals adheres along the protruding pieces, a suitable solder fillet can be formed by adjusting the bending angle of the protruding pieces. It is possible to prevent poor appearance of solder adhering to the substrate.

【図面の簡単な説明】 【図1】本発明の実施例によるチップ型電子部品の斜視
図である。 【図2】本発明の実施例によるチップ型電子部品の完成
前の底面からの斜視図である。 【図3】図1のA方向の部分断面図である。 【図4】本発明に実施例によるチップ型電子部品をプリ
ント基板に実装した状態を示す部分断面図である。 【図5】本発明による他の実施例によるチップ型電子部
品の斜視図である。 【図6】本発明による他の実施例によるチップ型電子部
品の斜視図である。 【図7】従来のチップ型電子部品をプリント基板に実装
した状態を示す側面図である。 【図8】従来のチップ型電子部品をプリント基板に実装
した状態を示す側面図である。 【符号の説明】 1 外装体 2 コンデンサ素子 3、10 外部端子 4 内部電極 5 突片 6 切込み部 7、12 半田 8 チップ型コンデンサ 9、14 プリント基板 11 チップ型電子部品 13 半田フィレット
BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a chip-type electronic component according to an embodiment of the present invention. FIG. 2 is a perspective view of a chip-type electronic component according to an embodiment of the present invention from the bottom surface before completion. FIG. 3 is a partial cross-sectional view in the direction A of FIG. 1; FIG. 4 is a partial cross-sectional view showing a state in which a chip-type electronic component according to an embodiment of the present invention is mounted on a printed circuit board. FIG. 5 is a perspective view of a chip-type electronic component according to another embodiment of the present invention. FIG. 6 is a perspective view of a chip-type electronic component according to another embodiment of the present invention. FIG. 7 is a side view showing a state in which a conventional chip-type electronic component is mounted on a printed circuit board. FIG. 8 is a side view showing a state in which a conventional chip-type electronic component is mounted on a printed circuit board. [Description of Signs] 1 Exterior body 2 Capacitor element 3, 10 External terminal 4 Internal electrode 5 Projection piece 6 Notch 7, 12 Solder 8 Chip type capacitor 9, 14 Printed circuit board 11 Chip type electronic component 13 Solder fillet

Claims (1)

(57)【特許請求の範囲】 【請求項1】 電気素子を内包する外装体に設けた平板
状の外部子の一部に、外部端子を貫通する切り込み部を
連続して形成するとともに、この連続する切り込み部を
折り曲げて下方に向かって開く突片を形成したことを特
徴とするチップ型電子部品。
(57) [Claim 1] A notch portion penetrating an external terminal is continuously formed in a part of a flat outer member provided on an exterior body containing an electric element. A chip-type electronic component in which a continuous cut portion is bent to form a protruding piece that opens downward .
JP29209992A 1992-10-06 1992-10-06 Chip type electronic components Expired - Fee Related JP3365426B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29209992A JP3365426B2 (en) 1992-10-06 1992-10-06 Chip type electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29209992A JP3365426B2 (en) 1992-10-06 1992-10-06 Chip type electronic components

Publications (2)

Publication Number Publication Date
JPH06120069A JPH06120069A (en) 1994-04-28
JP3365426B2 true JP3365426B2 (en) 2003-01-14

Family

ID=17777536

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29209992A Expired - Fee Related JP3365426B2 (en) 1992-10-06 1992-10-06 Chip type electronic components

Country Status (1)

Country Link
JP (1) JP3365426B2 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1950775B1 (en) * 1998-12-15 2013-07-03 Murata Manufacturing Co. Ltd. Monolithic ceramic capacitor
KR100373489B1 (en) * 2001-06-20 2003-02-25 주식회사 쎄라텍 Surface mounted chip inductor and manufacturing method therefor
JP4867999B2 (en) * 2009-01-20 2012-02-01 Tdk株式会社 Multilayer capacitor

Also Published As

Publication number Publication date
JPH06120069A (en) 1994-04-28

Similar Documents

Publication Publication Date Title
JP3365426B2 (en) Chip type electronic components
JPH0888103A (en) Surface-mounted electronic component
JPS6175553A (en) Electronic part
KR100188450B1 (en) Fixing end structure of electronic unit
JP4213820B2 (en) Electronic components
JP2858252B2 (en) Electrode structure of electronic components for surface mounting
JPH06120071A (en) Chip part
JPH066027A (en) Manufacturing method of circuit module
JPH054295Y2 (en)
JP2750595B2 (en) Connection members for electronic components for surface mounting
JPH0514492Y2 (en)
JPH0684680U (en) Surface mount connector
JPH0711462Y2 (en) Terminal board for electronic parts
JP4218912B2 (en) Electronic components
JPH0234463B2 (en)
JP2727950B2 (en) Chip type electrolytic capacitor
JPH084696Y2 (en) Hybrid integrated circuit
JP2663742B2 (en) How to attach the connector
JP2991055B2 (en) Surface mount electronic components
JP2823826B2 (en) Electronic component manufacturing method
JP3157975B2 (en) Ladder type filter
JPH07170144A (en) Surface mount type electronic component
JPH0528917B2 (en)
JP4213818B2 (en) Electronic components
JP3563197B2 (en) Electronic components

Legal Events

Date Code Title Description
S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20081101

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20091101

Year of fee payment: 7

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101101

Year of fee payment: 8

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111101

Year of fee payment: 9

LAPS Cancellation because of no payment of annual fees