JP3364415B2 - Element cooling device - Google Patents
Element cooling deviceInfo
- Publication number
- JP3364415B2 JP3364415B2 JP25515397A JP25515397A JP3364415B2 JP 3364415 B2 JP3364415 B2 JP 3364415B2 JP 25515397 A JP25515397 A JP 25515397A JP 25515397 A JP25515397 A JP 25515397A JP 3364415 B2 JP3364415 B2 JP 3364415B2
- Authority
- JP
- Japan
- Prior art keywords
- shaped
- pipe
- fin member
- heat
- fin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0275—Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、例えばＩＣ、Ｌ
ＳＩ等の半導体素子を冷却するための素子冷却装置に関
するものである。BACKGROUND OF THE INVENTION The present invention relates to, for example, IC, L
The present invention relates to an element cooling device for cooling semiconductor elements such as SI.
【０００２】[0002]
【従来の技術】図７及び図８は例えば特願平９−２３２
５６３号公報に示される従来の素子冷却装置を示す正面
図及び側面図である。これら各図において、１は例えば
１〜２ｍｍの間隔を介して整列され、肉厚０．１ｍｍ程
度のアルミニウム薄板で形成された多数のフィン部材、
２はこれら各フィン部材１を整列方向に貫通し、拡管す
ることにより各フィン部材１と固着一体化される複数の
管状部材であり、例えば外径８ｍｍ程度の銅管が用いら
れている。そして、これらフィン部材１及び管状部材２
でフィン積層体３が構成される。４は一方の面４ａに例
えばＩＣ、ＬＳＩ等の半導体素子などのように発熱して
冷却を必要とする被冷却素子５が装着された受熱板であ
り、他方の表面４ｂにはフィン積層体３の各フィン部材
１の一端側１ａがそれぞれ当接されている。7 and 8 show, for example, Japanese Patent Application No. 9-232.
It is the front view and side view which show the conventional element cooling device shown by 563 publication. In each of these figures, 1 is a large number of fin members formed of aluminum thin plates with a wall thickness of about 0.1 mm, which are arranged with an interval of 1 to 2 mm, for example.
Reference numeral 2 denotes a plurality of tubular members that penetrate the respective fin members 1 in the alignment direction and expand the pipes so as to be fixedly integrated with the respective fin members 1. For example, a copper pipe having an outer diameter of about 8 mm is used. And these fin member 1 and tubular member 2
The fin stack 3 is constituted by. Reference numeral 4 is a heat receiving plate having a surface to be cooled 5 such as a semiconductor element such as an IC, an LSI or the like that needs to be cooled and is mounted on one surface 4a, and the fin stack 3 on the other surface 4b. One end side 1a of each fin member 1 is in contact with each other.
【０００３】次に動作について説明する。例えばＩＣ、
ＬＳＩ等の半導体素子などの被冷却素子５で発生した熱
は、受熱板４から各フィン部材１に伝達され、各フィン
部材１を介して大気中あるいは冷却風中に放出され、こ
れを繰り返すことにより被冷却素子５は冷却される。Next, the operation will be described. For example, IC
The heat generated in the cooled element 5 such as a semiconductor element such as an LSI is transferred from the heat receiving plate 4 to each fin member 1 and is radiated into the atmosphere or the cooling air through each fin member 1, and this is repeated. Thereby, the cooled element 5 is cooled.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら上述した
従来装置では、被冷却素子５で発生した熱は受熱板４か
らその受熱板４と当接している各フィン部材１の一端側
１ａに伝達され、各フィン部材１の一端側１ａから受熱
板４と反対側に位置する各フィン部材１の他端側１ｂに
各フィン部材１中を熱伝導により伝達されるので、被冷
却素子５で発生した熱を受熱板４を通して各フィン部材
１の一端側１ａから他端側１ｂまで十分に伝達させるこ
とができず、フィン効率が低くなるという課題があっ
た。However, in the above-mentioned conventional device, the heat generated in the cooled element 5 is transferred from the heat receiving plate 4 to the one end side 1a of each fin member 1 in contact with the heat receiving plate 4, The heat generated in the element to be cooled 5 is transferred from the one end side 1a of each fin member 1 to the other end side 1b of each fin member 1 located on the opposite side of the heat receiving plate 4 by heat conduction. Cannot be sufficiently transmitted from the one end side 1a to the other end side 1b of each fin member 1 through the heat receiving plate 4, and there is a problem that the fin efficiency becomes low.
【０００５】この発明は上記のような課題を解決するた
めになされたものであり、速やかに熱伝達することがで
きる素子冷却装置を提供することを目的とする。The present invention has been made to solve the above problems, and an object of the present invention is to provide an element cooling device capable of rapidly transferring heat.
【０００６】[0006]
【課題を解決するための手段】この発明の請求項１に係
る素子冷却装置は、所定の間隔を介して整列され良伝熱
性の薄板状部材で形成された多数のフィン部材と、各フ
ィン部材の一端側が一方の面に当接され、他方の表面に
被冷却素子が装着される受熱板と、Ｕ字状の一方側が各
フィン部材の一端側に位置し、Ｕ字状の他方側が各フィ
ン部材の他端側に位置するよう各フィン部材に挿着され
た複数のＵ字状ヒートパイプと、Ｕ字状ヒートパイプの
Ｕ字状の一方側端部を連通する連通管とを設けたもので
ある。 According to claim 1 of the present invention
The element cooling device, which is a
Fins made of flexible thin plate-like members and each fin
One end of the fin member is brought into contact with one surface and the other surface
The heat receiving plate on which the element to be cooled is mounted and the U-shaped one side are
It is located on one end side of the fin member and the other side of the U-shape is
The fin member is inserted and attached to the other end of the fin member.
Of multiple U-shaped heat pipes and U-shaped heat pipes
With a communication pipe that connects one end of the U-shape
is there.
【０００７】また、この発明の請求項２に係る素子冷却
装置は、所定の間隔を介して整列され良伝熱性の薄板状
部材で形成された多数のフィン部材と、各フィン部材の
一端側が一方の面に当接され、他方の表面に被冷却素子
が装着される受熱板と、Ｕ字状の一方側が上記各フィン
部材の一端側に位置し、Ｕ字状の他方側が各フィン部材
の他端側に位置するように各フィン部材に挿着された複
数のＵ字状ヒートパイプと、Ｕ字状ヒートパイプのＵ字
状の一方側端部を連通する第１連通管と、Ｕ字状ヒート
パイプのＵ字状の他方側端部を連通する第２連通管とを
設けたものである。 The element cooling according to claim 2 of the present invention
The device is a thin plate that is aligned with a certain distance and has good heat conductivity.
Of a large number of fin members and the fin members
One end is in contact with one surface, and the other surface is the element to be cooled.
The heat receiving plate to which is attached, and one side of the U-shape is the fins described above.
Located on one end side of the member, the other side of the U-shape is each fin member
Of each fin member so that it is located on the other end side of
Number of U-shaped heat pipes and U-shaped U-shaped heat pipes
Communication pipe that communicates one end of the U-shape with U-shaped heat
A second communicating pipe that communicates the other end of the U-shaped side of the pipe
It is provided.
【０００８】また、この発明の請求項３に係る素子冷却
装置は、所定の間隔を介して整列され良伝熱性の薄板状
部材で形成された多数のフィン部材と、各フィン部材の
一端側が一方の面に当接され、他方の表面に被冷却素子
が装着される受熱板と、Ｕ字状の一方側が上記各フィン
部材の一端側に位置し、Ｕ字状の他方側が各フィン部材
の他端側に位置するように各フィン部材に挿着された複
数のＵ字状ヒートパイプと、Ｕ字状ヒートパイプのＵ字
状の一方側端部を連通する第１連通管と、Ｕ字状ヒート
パイプのＵ字状の他方側端部を連通する第２連通管と、
第１連通管の端部と第２連通管の端部とをそれぞれ接合
してループを構成するベント管とを設けたものである。 Further , the element cooling according to claim 3 of the present invention.
The device is a thin plate that is aligned with a certain distance and has good heat conductivity.
Of a large number of fin members and the fin members
One end is in contact with one surface, and the other surface is the element to be cooled.
The heat receiving plate to which is attached, and one side of the U-shape is the fins described above.
Located on one end side of the member, the other side of the U-shape is each fin member
Of each fin member so that it is located on the other end side of
Number of U-shaped heat pipes and U-shaped U-shaped heat pipes
Communication pipe that communicates one end of the U-shape with U-shaped heat
A second communicating pipe that communicates with the other end of the U-shaped pipe,
Joining the end of the first communicating pipe and the end of the second communicating pipe, respectively
And a vent pipe forming a loop is provided.
【０００９】[0009]
【発明の実施の形態】実施の形態１．
以下、この発明の実施の形態１を図１及び図２に基づい
て説明する。これら各図において、１は例えば１〜２ｍ
ｍの間隔を介して整列され、肉厚０．１ｍｍ程度のアル
ミニウム薄板で形成された多数のフィン部材、４は一方
の面４ａに例えばＩＣ、ＬＳＩ等の半導体素子などのよ
うに発熱して冷却を必要とする被冷却素子５が装着され
た受熱板であり、他方の表面４ｂには各フィン部材１の
一端側１ａがそれぞれ当接されている。６はＵ字状の一
方側６ａが各フィン部材１の一端側１ａに位置し、Ｕ字
状の他方側６ｂが各フィン部材１の他端側１ｂに位置す
るように各フィン部材１に挿着され、内部を真空排気し
た後に作動液が所定量封入された複数のＵ字状ヒートパ
イプである。Ｕ字状ヒートパイプ６の真空排気は何れか
一方側端部が予め封止されており、他方側端部より真空
排気される。各フィン部材１と複数のＵ字状ヒートパイ
プ６とにより、上述した従来装置に相当するフィン積層
体が構成される。BEST MODE FOR CARRYING OUT THE INVENTION Embodiment 1. The first embodiment of the present invention will be described below with reference to FIGS. 1 and 2. In each of these figures, 1 is, for example, 1 to 2 m.
A large number of fin members 4 arranged with an interval of m and formed of an aluminum thin plate with a wall thickness of about 0.1 mm generate heat on one surface 4a like semiconductor elements such as IC and LSI, and cool. This is a heat receiving plate to which the element to be cooled 5 that requires is attached, and one end side 1a of each fin member 1 is in contact with the other surface 4b. 6 is inserted into each fin member 1 such that one side 6a of the U-shape is located at one end side 1a of each fin member 1 and the other side 6b of the U-shape is located at the other end side 1b of each fin member 1. These are a plurality of U-shaped heat pipes that are attached to each other, and after evacuation of the inside, a predetermined amount of hydraulic fluid is enclosed. One of the ends of the U-shaped heat pipe 6 is vacuum-sealed in advance, and the other end of the U-shaped heat pipe 6 is vacuum-exhausted. Each fin member 1 and the plurality of U-shaped heat pipes 6 form a fin laminated body corresponding to the above-described conventional device.
【００１０】次に動作について説明する。例えばＩＣ、
ＬＳＩ等の半導体素子などの被冷却素子５で発生した熱
は、受熱板４から各フィン部材１に伝達され、各フィン
部材１から大気中あるいは冷却風中に放熱されるととも
にＵ字状ヒートパイプ６のＵ字状の一方側６ａを加熱す
る。Ｕ字状ヒートパイプ６のＵ字状の一方側６ａが加熱
されると、その内部に封入された作動液が加熱されて蒸
気が発生し、破線矢印で示すようにＵ字状ヒートパイプ
６のＵ字状の他方側６ｂに作動液の蒸気が移動し、Ｕ字
状の他方側６ｂを加熱する。これにより、Ｕ字状の他方
側６ｂ周囲の各フィン部材１、すなわち各フィン部材１
の他端側１ｂが加熱され、その各フィン部材１の他端側
１ｂから大気中あるいは冷却風中に放熱され、作動液は
凝縮液化する。Ｕ字状ヒートパイプ６のＵ字状の他方側
６ｂで凝縮液化した作動液は、Ｕ字状ヒートパイプ６の
Ｕ字状の一方側６ａに還流し、これら動作が自然的に繰
り返されることにより被冷却素子５は冷却される。Next, the operation will be described. For example, IC
The heat generated in the cooled element 5 such as a semiconductor element such as an LSI is transferred from the heat receiving plate 4 to each fin member 1 and is radiated from each fin member 1 to the atmosphere or the cooling air and a U-shaped heat pipe. The U-shaped one side 6a of 6 is heated. When the U-shaped one side 6a of the U-shaped heat pipe 6 is heated, the working liquid enclosed therein is heated to generate steam, and as shown by a broken arrow, The vapor of the hydraulic fluid moves to the U-shaped other side 6b and heats the U-shaped other side 6b. Thereby, each fin member 1 around the other side 6b of the U-shape, that is, each fin member 1
The other end side 1b of each of the fin members 1 is heated and radiated from the other end side 1b of each fin member 1 into the atmosphere or the cooling air, and the working fluid is condensed and liquefied. The working fluid condensed and liquefied on the other side 6b of the U-shaped heat pipe 6 flows back to the one side 6a of the U-shaped heat pipe 6, and these operations are naturally repeated. The cooled element 5 is cooled.
【００１１】この実施の形態１においては、Ｕ字状の一
方側６ａが各フィン部材１の一端側１ａに位置し、Ｕ字
状の他方側６ｂが各フィン部材１の他端側１ｂに位置す
るように各フィン部材１に挿着されたＵ字状ヒートパイ
プ６の熱輸送効果により、被冷却素子５で発生した熱を
各フィン部材１の他端側１ｂまで速やかに熱伝達させる
ことができ、フィン効率が向上するので、高性能化（小
型化）を図ることができる。In the first embodiment, the U-shaped one side 6a is located at one end side 1a of each fin member 1, and the U-shaped other side 6b is located at the other end side 1b of each fin member 1. By the heat transport effect of the U-shaped heat pipe 6 inserted into each fin member 1 as described above, the heat generated in the cooled element 5 can be quickly transferred to the other end 1b of each fin member 1. Since the fin efficiency is improved, the performance can be improved (downsized).
【００１２】実施の形態２．
この発明の実施の形態２を図３に基づいて説明する。図
３において、１は各フィン部材、１ａは一端側、１ｂは
他端側、４は受熱板、４ａは一方の面、４ｂは他方の表
面である。７はＵ字型パイプ７ａの一方側７ｂが各フィ
ン部材１の一端側１ａに位置し、Ｕ字型パイプ７ａの他
方側７ｃが各フィン部材１の他端側１ｂに位置するよう
に各フィン部材１に挿着され、Ｕ字型パイプ７ａの一方
側７ｂ端部と他方側７ｃ端部をベント管７ｄで接合して
ループを構成し、そのループの内部を真空排気した後に
作動液が所定量封入された複数のループ状ヒートパイプ
である。各フィン部材１と複数のループ状ヒートパイプ
７とにより、上述した従来装置に相当するフィン積層体
が構成される。Embodiment 2. The second embodiment of the present invention will be described with reference to FIG. In FIG. 3, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a is one surface, and 4b is the other surface. Each of the fins 7 has one end 7b of the U-shaped pipe 7a located at one end side 1a of each fin member 1 and the other end 7c of the U-shaped pipe 7a located at the other end side 1b of each fin member 1. A loop is formed by attaching the member 1 to one end 7b of the U-shaped pipe 7a and the other end 7c of the U-shaped pipe 7d by a vent pipe 7d to form a loop. It is a plurality of loop-shaped heat pipes sealed in a fixed amount. Each fin member 1 and the plurality of loop-shaped heat pipes 7 constitute a fin laminated body corresponding to the above-mentioned conventional device.
【００１３】次に動作について説明する。被冷却素子５
で発生した熱は、受熱板４から各フィン部材１に伝達さ
れ、各フィン部材１から大気中あるいは冷却風中に放熱
されるとともに、ループ状ヒートパイプ７のＵ字型パイ
プ７ａの一方側７ｂを加熱する。ループ状ヒートパイプ
７のＵ字型パイプ７ａの一方側７ｂが加熱されると、そ
の内部に封入された作動液が加熱されて蒸気が発生し、
破線矢印で示すようにループ状ヒートパイプ７のＵ字型
パイプ７ａの他方側７ｃに作動液の蒸気が移動し、Ｕ字
型パイプ７ａの他方側７ｃを加熱する。これにより、Ｕ
字型パイプ７ａの他方側７ｃ周囲の各フィン部材１、す
なわち各フィン部材１の他端側１ｂが加熱され、その各
フィン部材１の他端側１ｂから大気中あるいは冷却風中
に放熱され、作動液は凝縮液化する。ループ状ヒートパ
イプ７のＵ字型パイプ７ａの他方側７ｃで凝縮液化した
作動液は、蒸気の流れに逆らうことなく同方向の流れと
なり、ループ状ヒートパイプ７のベント管７ｄを経てＵ
字型パイプ７ａの一方側７ｂに還流し、これら動作が自
然的に繰り返されることにより被冷却素子５は冷却され
る。Next, the operation will be described. Cooled element 5
The heat generated in 1 is transferred from the heat receiving plate 4 to each fin member 1 and is radiated from each fin member 1 to the atmosphere or the cooling air, while the loop-shaped heat pipe 7 has one side 7b of the U-shaped pipe 7a. To heat. When the one side 7b of the U-shaped pipe 7a of the loop-shaped heat pipe 7 is heated, the working fluid enclosed therein is heated to generate steam,
As shown by the broken line arrow, the vapor of the working fluid moves to the other side 7c of the U-shaped pipe 7a of the loop heat pipe 7 and heats the other side 7c of the U-shaped pipe 7a. This makes U
Each fin member 1 around the other side 7c of the character-shaped pipe 7a, that is, the other end side 1b of each fin member 1 is heated and radiated from the other end side 1b of each fin member 1 to the atmosphere or the cooling air, The working fluid is condensed and liquefied. The working liquid condensed and liquefied on the other side 7c of the U-shaped pipe 7a of the loop-shaped heat pipe 7 becomes a flow in the same direction without countering the flow of steam, and passes through the vent pipe 7d of the loop-shaped heat pipe 7 and U
The element 5 to be cooled is cooled by being returned to the one side 7b of the V-shaped pipe 7a and repeating these operations naturally.
【００１４】この実施の形態２においては、Ｕ字型パイ
プ７ａの一方側７ｂが各フィン部材１の一端側１ａに位
置し、Ｕ字型パイプ７ａの他方側７ｃが各フィン部材１
の他端側１ｂに位置するように各フィン部材１に挿着さ
れ、Ｕ字型パイプ７ａの一方側７ｂ端部と他方側７ｃ端
部をベント管７ｄで接合してループを構成したループ状
ヒートパイプ７の熱輸送効果により、被冷却素子５で発
生した熱を各フィン部材１の他端側１ｂまで速やかに熱
伝達させることができ、フィン効率が向上するので、高
性能化（小型化）を図ることができる。また、ループ状
ヒートパイプ７内の作動液はその内部をループ状に循環
することになり、蒸気流と液流が一方向となるので、凝
縮液の戻りが蒸気流に阻害されることがないので、熱輸
送量が増大し、冷却能力を大幅に向上させることができ
る。また、ループ状ヒートパイプ７のベント管７ｄの部
分より真空排気することにより、上記実施の形態１に比
べて真空排気すべき配管の長さが半分になり、真空排気
の時間が半分程度に短縮でき、作業効率を大幅に改善す
ることができる。In the second embodiment, one side 7b of the U-shaped pipe 7a is located at one end side 1a of each fin member 1 and the other side 7c of the U-shaped pipe 7a is each fin member 1.
Of the U-shaped pipe 7a is joined to each fin member 1 so as to be located on the other end side 1b of the U-shaped pipe 7a and the other end 7c is joined by a vent pipe 7d to form a loop. Due to the heat transport effect of the heat pipe 7, the heat generated in the cooled element 5 can be quickly transferred to the other end side 1b of each fin member 1 and the fin efficiency is improved, resulting in higher performance (smaller size). ) Can be planned. Further, the working liquid in the loop heat pipe 7 circulates in a loop shape inside the heat pipe 7, and the vapor flow and the liquid flow are in one direction, so that the return of the condensate is not hindered by the vapor flow. Therefore, the amount of heat transport is increased, and the cooling capacity can be greatly improved. Further, by evacuating from the vent pipe 7d portion of the loop heat pipe 7, the length of the pipe to be evacuated is halved as compared with the first embodiment, and the time of evacuating is reduced to about half. It is possible to greatly improve the work efficiency.
【００１５】実施の形態３．
この発明の実施の形態３を図４に基づいて説明する。図
４において、１は各フィン部材、１ａは一端側、１ｂは
他端側、４は受熱板、４ａは一方の面、４ｂは他方の表
面である。８はＵ字状の一方側８ａが各フィン部材１の
一端側１ａに位置し、Ｕ字状の他方側８ｂが各フィン部
材１の他端側１ｂに位置するように各フィン部材１に挿
着された複数のＵ字状ヒートパイプである。９はＵ字状
ヒートパイプ８のＵ字状の一方側８ａ端部相互を連通す
る連通管である。これらＵ字状ヒートパイプ８および連
通管９の内部を真空排気した後に作動液が所定量封入さ
れる。各フィン部材１、複数のＵ字状ヒートパイプ８、
連通管９により、上述した従来装置に相当するフィン積
層体が構成される。Embodiment 3. The third embodiment of the present invention will be described with reference to FIG. In FIG. 4, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a is one surface, and 4b is the other surface. 8 is inserted into each fin member 1 so that one side 8a of the U-shape is located at one end side 1a of each fin member 1 and the other side 8b of the U-shape is located at the other end side 1b of each fin member 1. It is a plurality of U-shaped heat pipes worn. Reference numeral 9 denotes a communication pipe that connects the ends of the U-shaped one side 8a of the U-shaped heat pipe 8 to each other. After evacuating the insides of the U-shaped heat pipe 8 and the communication pipe 9, a predetermined amount of working fluid is filled. Each fin member 1, a plurality of U-shaped heat pipes 8,
The communication pipe 9 constitutes a fin laminated body corresponding to the above-described conventional device.
【００１６】次に動作について説明する。被冷却素子５
で発生した熱の受熱板４から各フィン部材１の他端側１
ｂまでの伝達動作は上述した実施の形態１と同様であ
る。この実施の形態３においては、連通管９により複数
のＵ字状ヒートパイプ８のＵ字状の一方側８ａ端部相互
を連通させており、これにより、内部の圧力が均等にな
り、作動液の蒸発温度が一定になるので、受熱板４全面
にわたり均一に冷却を行うことができる。また、連通管
９を設けたことにより、内部の真空排気、作動液封入の
作業が一度で完了でき、製造コストを低減できる。Next, the operation will be described. Cooled element 5
From the heat receiving plate 4 for the heat generated in the other end side 1 of each fin member 1
The transmission operation up to b is the same as in the first embodiment described above. In the third embodiment, the communication pipe 9 connects the ends of the U-shaped one side 8a of the plurality of U-shaped heat pipes 8 to each other, thereby equalizing the internal pressure, and Since the evaporation temperature is constant, the entire surface of the heat receiving plate 4 can be cooled uniformly. Further, since the communication pipe 9 is provided, the work of evacuation and filling of the working fluid inside can be completed at once, and the manufacturing cost can be reduced.
【００１７】実施の形態４．
この発明の実施の形態４を図５に基づいて説明する。図
５において、１は各フィン部材、１ａは一端側、１ｂは
他端側、４は受熱板、４ａは一方の面、４ｂは他方の表
面である。８はＵ字状の一方側８ａが各フィン部材１の
一端側１ａに位置し、Ｕ字状の他方側８ｂが各フィン部
材１の他端側１ｂに位置するように各フィン部材１に挿
着された複数のＵ字状ヒートパイプである。１０はＵ字
状ヒートパイプ８のＵ字状の一方側８ａ端部相互を連通
する第１連通管、１１はＵ字状ヒートパイプ８のＵ字状
の他方側８ｂ端部相互を連通する第２連通管である。こ
れらＵ字状ヒートパイプ８および第１，第１連通管１
０，１１の内部を真空排気した後に作動液が所定量封入
される。各フィン部材１、複数のＵ字状ヒートパイプ
８、各連通管１０，１１により、上述した従来装置に相
当するフィン積層体が構成される。Embodiment 4. Embodiment 4 of the present invention will be described with reference to FIG. In FIG. 5, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a is one surface, and 4b is the other surface. 8 is inserted into each fin member 1 so that one side 8a of the U-shape is located at one end side 1a of each fin member 1 and the other side 8b of the U-shape is located at the other end side 1b of each fin member 1. It is a plurality of U-shaped heat pipes worn. Reference numeral 10 is a first communication pipe that communicates the U-shaped one side 8a ends of the U-shaped heat pipe 8, and 11 is a first communication pipe that communicates the U-shaped other side 8b ends of the U-shaped heat pipe 8 with each other. It is a two-way pipe. These U-shaped heat pipe 8 and first and first communication pipes 1
After evacuating the inside of 0 and 11, the working fluid is sealed in a predetermined amount. Each fin member 1, a plurality of U-shaped heat pipes 8, and each communication pipes 10 and 11 constitute a fin laminated body corresponding to the above-mentioned conventional device.
【００１８】次に動作について説明する。被冷却素子５
で発生した熱の受熱板４から各フィン部材１の他端側１
ｂまでの伝達動作は上述した実施の形態３と同様であ
る。この実施の形態４においては、第１連通管１０によ
り複数のＵ字状ヒートパイプ８のＵ字状の一方側８ａ端
部相互を連通させており、かつ第２連通管１１により複
数のＵ字状ヒートパイプ８のＵ字状の他方側８ｂ端部相
互を連通させており、これにより、内部の蒸気圧力がさ
らに均等になり、作動液の蒸発温度が一定になるので、
受熱板４全面にわたりより一層均一に冷却、放熱を行う
ことができる。Next, the operation will be described. Cooled element 5
From the heat receiving plate 4 for the heat generated in the other end side 1 of each fin member 1
The transmission operation up to b is the same as in the third embodiment described above. In the fourth embodiment, the U-shaped one side 8a ends of the plurality of U-shaped heat pipes 8 are made to communicate with each other by the first communication pipe 10, and the plurality of U-shaped portions are made by the second communication pipe 11. The other end of the U-shaped heat pipe 8 on the other side 8b is communicated with each other, whereby the vapor pressure inside becomes more uniform and the evaporation temperature of the working fluid becomes constant.
It is possible to more evenly cool and radiate heat over the entire surface of the heat receiving plate 4.
【００１９】実施の形態５．
この発明の実施の形態５を図６に基づいて説明する。図
６において、１は各フィン部材、１ａは一端側、１ｂは
他端側、４は受熱板、４ａは一方の面、４ｂは他方の表
面である。８はＵ字状の一方側８ａが各フィン部材１の
一端側１ａに位置し、Ｕ字状の他方側８ｂが各フィン部
材１の他端側１ｂに位置するように各フィン部材１に挿
着された複数のＵ字状ヒートパイプ、１０はＵ字状ヒー
トパイプ８のＵ字状の一方側８ａ端部相互を連通する第
１連通管、１１はＵ字状ヒートパイプ８のＵ字状の他方
側８ｂ端部相互を連通する第２連通管である。１２，１
３は第１，第２連通管１０，１１の端部をそれぞれ接合
してループを構成するベント管である。これらＵ字状ヒ
ートパイプ８および第１，第１連通管１０，１１、ベン
ト管１２，１３の内部を真空排気した後に作動液が所定
量封入される。各フィン部材１、複数のＵ字状ヒートパ
イプ８、各連通管１０，１１、各ベント管１２，１３に
より、上述した従来装置に相当するフィン積層体が構成
される。Embodiment 5. The fifth embodiment of the present invention will be described with reference to FIG. In FIG. 6, 1 is each fin member, 1a is one end side, 1b is the other end side, 4 is a heat receiving plate, 4a is one surface, and 4b is the other surface. 8 is inserted into each fin member 1 so that one side 8a of the U-shape is located at one end side 1a of each fin member 1 and the other side 8b of the U-shape is located at the other end side 1b of each fin member 1. A plurality of attached U-shaped heat pipes, 10 is a first communication pipe that communicates the ends of the U-shaped one side 8a of the U-shaped heat pipe 8, and 11 is a U-shaped heat pipe 8. Is a second communication pipe that communicates the other end of the other side 8b. 12, 1
Reference numeral 3 is a vent pipe that forms a loop by joining the ends of the first and second communication pipes 10 and 11, respectively. The U-shaped heat pipe 8, the first and first communication pipes 10 and 11, and the vent pipes 12 and 13 are evacuated, and then a predetermined amount of hydraulic fluid is filled therein. Each fin member 1, a plurality of U-shaped heat pipes 8, each communicating pipe 10, 11, and each vent pipe 12, 13 constitute a fin laminated body corresponding to the above-mentioned conventional device.
【００２０】次に動作について説明する。被冷却素子５
で発生した熱の受熱板４から各フィン部材１の他端側１
ｂまでの伝達動作は上述した実施の形態４と同様であ
る。この実施の形態５においては、ベント管１２，１３
により第１，第２連通管１０，１１の端部をそれぞれ接
合してループを構成しており、作動液はその内部をルー
プ状に循環、すなわち、作動液の蒸気はＵ字状ヒートパ
イプ８のＵ字状の一方側８ａから他方側８ｂへ、その他
方側８ｂで凝縮液化した作動液は第２連通管１１へ、第
２連通管１１の作動液は各ベント管１２，１３を経て第
１連通管１０へ、第１連通管１０から各Ｕ字状ヒートパ
イプ８のＵ字状の一方側８ａに還流することになり、蒸
気流と液流が一方向となるので、凝縮液の戻りが蒸気流
に阻害されることがないので、上述した実施の形態４の
ものに比べて熱輸送量が増大し、冷却能力を大幅に向上
させることができる。Next, the operation will be described. Cooled element 5
From the heat receiving plate 4 for the heat generated in the other end side 1 of each fin member 1
The transmission operation up to b is the same as in the fourth embodiment described above. In the fifth embodiment, the vent pipes 12, 13
The end portions of the first and second communication pipes 10 and 11 are joined to each other to form a loop, and the working fluid circulates in a loop, that is, the vapor of the working fluid is a U-shaped heat pipe 8 The U-shaped one side 8a from the other side 8b, the working liquid condensed and liquefied on the other side 8b to the second communicating pipe 11, the working liquid of the second communicating pipe 11 through the vent pipes 12, 13 Since the first communication pipe 10 recirculates from the first communication pipe 10 to the U-shaped one side 8a of each U-shaped heat pipe 8, the vapor flow and the liquid flow are in one direction, so that the condensate is returned. Is not hindered by the vapor flow, the amount of heat transport is increased and the cooling capacity can be greatly improved as compared with the above-described fourth embodiment.
【００２１】[0021]
【発明の効果】この発明の請求項１に係る素子冷却装置
は、所定の間隔を介して整列され良伝熱性の薄板状部材
で形成された多数のフィン部材と、各フィン部材の一端
側が一 方の面に当接され、他方の表面に被冷却素子が装
着される受熱板と、Ｕ字状の一方側が各フィン部材の一
端側に位置し、Ｕ字状の他方側が各フィン部材の他端側
に位置するよう各フィン部材に挿着された複数のＵ字状
ヒートパイプと、Ｕ字状ヒートパイプのＵ字状の一方側
端部を連通する連通管とを設けたことにより、内部の圧
力が均等になり、作動液の蒸発温度が一定になるので、
受熱板全面にわたり均一に冷却を行うことができる。 The element cooling device according to claim 1 of the present invention.
Is a thin plate member aligned with a predetermined interval and having good heat conductivity.
Many fin members formed by and one end of each fin member
Side is brought into contact with the surface of the hand, the cooling element instrumentation on the other surface
The heat receiving plate to be attached and one side of the U-shape is one of the fin members.
Located on the end side, the other side of the U-shape is the other end side of each fin member
U-shape inserted into each fin member so as to be located at
Heat pipe and one side of U-shaped heat pipe
By providing a communication pipe that connects the ends, the internal pressure
Since the force becomes even and the evaporation temperature of the hydraulic fluid becomes constant,
The entire surface of the heat receiving plate can be cooled uniformly.
【００２２】また、この発明の請求項２に係る素子冷却
装置は、所定の間隔を介して整列され良伝熱性の薄板状
部材で形成された多数のフィン部材と、各フィン部材の
一端側が一方の面に当接され、他方の表面に被冷却素子
が装着される受熱板と、Ｕ字状の一方側が上記各フィン
部材の一端側に位置し、Ｕ字状の他方側が各フィン部材
の他端側に位置するように各フィン部材に挿着された複
数のＵ字状ヒートパイプと、Ｕ字状ヒートパイプのＵ字
状の一方側端部を連通する第１連通管と、Ｕ字状ヒート
パイプのＵ字状の他方側端部を連通する第２連通管とを
設けたことにより、内部の蒸気圧力がさらに均等にな
り、作動液の蒸発温度が一定になるので、受熱板全面に
わたりより一層均一に冷却、放熱を行うことができる。 The element cooling according to claim 2 of the present invention
The device is a thin plate that is aligned with a certain distance and has good heat conductivity.
Of a large number of fin members and the fin members
One end is in contact with one surface, and the other surface is the element to be cooled.
The heat receiving plate to which is attached, and one side of the U-shape is the fins described above.
Located on one end side of the member, the other side of the U-shape is each fin member
Of each fin member so that it is located on the other end side of
Number of U-shaped heat pipes and U-shaped U-shaped heat pipes
Communication pipe that communicates one end of the U-shape with U-shaped heat
A second communicating pipe that communicates the other end of the U-shaped side of the pipe
By providing it, the steam pressure inside becomes more uniform.
As the evaporation temperature of the working fluid becomes constant, the entire heat receiving plate
It is possible to perform cooling and heat dissipation more evenly than the above.
【００２３】また、この発明の請求項３に係る素子冷却
装置は、所定の間隔を介して整列され良伝熱性の薄板状
部材で形成された多数のフィン部材と、各フィン部材の
一端側が一方の面に当接され、他方の表面に被冷却素子
が装着される受熱板と、Ｕ字状の一方側が上記各フィン
部材の一端側に位置し、Ｕ字状の他方側が各フィン部材
の他端側に位置するように各フィン部材に挿着された複
数のＵ字状ヒートパイプと、Ｕ字状ヒートパイプのＵ字
状の一方側端部を連通する第１連通管と、Ｕ字状ヒート
パイプのＵ字状の他方側端部を連通する第２連通管と、
第１連通管の端部と第２連通管の端部とをそれぞれ接合
してループを構成するベント管とを設けたことにより、
蒸気流と液流が一方向となるので、凝縮液の戻りが蒸気
流に阻害されることがないので、上述した請求項４のも
のに比べて熱輸送量が増大し、冷却能力を大幅に向上さ
せることができる。 Further, the element cooling according to claim 3 of the present invention.
The device is a thin plate that is aligned with a certain distance and has good heat conductivity.
Of a large number of fin members and the fin members
One end is in contact with one surface, and the other surface is the element to be cooled.
The heat receiving plate to which is attached, and one side of the U-shape is the fins described above.
Located on one end side of the member, the other side of the U-shape is each fin member
Of each fin member so that it is located on the other end side of
Number of U-shaped heat pipes and U-shaped U-shaped heat pipes
Communication pipe that communicates one end of the U-shape with U-shaped heat
A second communicating pipe that communicates with the other end of the U-shaped pipe,
Joining the end of the first communicating pipe and the end of the second communicating pipe, respectively
By providing a vent pipe that constitutes a loop,
Since the vapor flow and liquid flow are in one direction, the return of the condensate is steam
Since it is not obstructed by the flow,
The heat transfer amount is increased and the cooling capacity is greatly improved.
Can be made.
【図１】 この発明の実施の形態１を示す斜視図であ
る。FIG. 1 is a perspective view showing a first embodiment of the present invention.
【図２】 この発明の実施の形態１を示す正面図であ
る。FIG. 2 is a front view showing the first embodiment of the present invention.
【図３】 この発明の実施の形態２を示す斜視図であ
る。FIG. 3 is a perspective view showing a second embodiment of the present invention.
【図４】 この発明の実施の形態３を示す斜視図であ
る。FIG. 4 is a perspective view showing a third embodiment of the present invention.
【図５】 この発明の実施の形態４を示す斜視図であ
る。FIG. 5 is a perspective view showing a fourth embodiment of the present invention.
【図６】 この発明の実施の形態５を示す斜視図であ
る。FIG. 6 is a perspective view showing a fifth embodiment of the present invention.
【図７】 従来装置を示す正面図である。FIG. 7 is a front view showing a conventional device.
【図８】 従来装置を示す側面図である。FIG. 8 is a side view showing a conventional device.
１ フィン部材、１ａ 一端側、１ｂ 他端側、４ 受
熱板、６ Ｕ字状ヒートパイプ、６ａ 一方側、６ｂ
他方側、７ ループ状ヒートパイプ、７ａ Ｕ字型パイ
プ、７ｂ 一方側、７ｃ 他方側、７ｄ ベント管、８
Ｕ字状ヒートパイプ、８ａ 一方側、８ｂ 他方側、
９ 連通管、１０ 第１連通管、１１ 第２連通管、１
２ ベント管、１３ ベント管。DESCRIPTION OF SYMBOLS 1 Fin member, 1a One end side, 1b Other end side, 4 Heat receiving plate, 6 U-shaped heat pipe, 6a One side, 6b
Other side, 7 Loop heat pipe, 7a U-shaped pipe, 7b One side, 7c Other side, 7d Vent pipe, 8
U-shaped heat pipe, 8a one side, 8b other side,
9 communication pipe, 10 1st communication pipe, 11 2nd communication pipe, 1
2 vent pipes, 13 vent pipes.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大串 哲朗 東京都千代田区丸の内二丁目２番３号 三菱電機株式会社内 (56)参考文献 特開 平10−303347（ＪＰ，Ａ) 特開 昭62−89152（ＪＰ，Ａ) 実開 昭58−52467（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) F28D 15/02 H01L 23/427 H05K 7/20 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Tetsuro Ogushi 2-3-3 Marunouchi, Chiyoda-ku, Tokyo Mitsubishi Electric Corporation (56) References JP-A-10-303347 (JP, A) JP-A-62 −89152 (JP, A) Actual development Sho 58-52467 (JP, U) (58) Fields investigated (Int.Cl. 7 , DB name) F28D 15/02 H01L 23/427 H05K 7/20
Claims (3)
薄板状部材で形成された多数のフィン部材と、上記各フ
ィン部材の一端側が一方の面に当接され、他方の表面に
被冷却素子が装着される受熱板と、Ｕ字状の一方側が上
記各フィン部材の一端側に位置し、Ｕ字状の他方側が上
記各フィン部材の他端側に位置するように上記各フィン
部材に挿着された複数のＵ字状ヒートパイプと、上記Ｕ
字状ヒートパイプのＵ字状の一方側端部を連通する連通
管とを備えたことを特徴とする素子冷却装置。 1. Arranged at a predetermined interval and having good heat conductivity.
A large number of fin members formed of thin plate-shaped members
One end of the fin member is brought into contact with one surface and the other surface
The heat receiving plate on which the element to be cooled is mounted and the U-shaped one side
Note: Located on one end side of each fin member, the other side of U-shape is upper
Note that each of the fins described above should be located on the other end side of each fin member.
A plurality of U-shaped heat pipes attached to the member,
Communication that connects the one end of the U-shaped heat pipe
An element cooling device comprising a tube.
薄板状部材で形成された多数のフィン部材と、上記各フ
ィン部材の一端側が一方の面に当接され、他方の表面に
被冷却素子が装着される受熱板と、Ｕ字状の一方側が上
記各フィン部材の一端側に位置し、Ｕ字状の他方側が上
記各フィン部材の他端側に位置するように上記各フィン
部材に挿着された複数のＵ字状ヒートパイプと、上記Ｕ
字状ヒートパイプのＵ字状の一方側端部を連通する第１
連通管と、上記Ｕ字状ヒートパイプのＵ字状の他方側端
部を連通する第２連通管とを備えたことを特徴とする素
子冷却装置。 2. Arranged at a predetermined interval with good heat conductivity.
A large number of fin members formed of thin plate-shaped members
One end of the fin member is brought into contact with one surface and the other surface
The heat receiving plate on which the element to be cooled is mounted and the U-shaped one side
Note: Located on one end side of each fin member, the other side of U-shape is upper
Note that each of the fins described above should be located on the other end side of each fin member.
A plurality of U-shaped heat pipes attached to the member,
1st which connects the U-shaped one side end part of a U-shaped heat pipe
Communication pipe and the other end of the U-shaped heat pipe on the other side of the U-shape
And a second communication pipe for communicating the parts with each other.
Child cooling system.
薄板状部材で形成された多数のフィン部材と、上記各フ
ィン部材の一端側が一方の面に当接され、他方の表面に
被冷却素子が装着される受熱板と、Ｕ字状の一方側が上
記各フィン部材の一端側に位置し、Ｕ字状の他方側が上
記各フィン部材の他端側に位置するように上記各フィン
部材に挿着された複数のＵ字状ヒートパイプと、上記Ｕ
字状ヒートパイプのＵ字状の一方側端部を連通する第１
連通管と、上記Ｕ字状ヒートパイプのＵ字状の他方側端
部を連通する第２連通管と、上記第１連通管の端部と第
２連通管の端部とをそれぞれ接合してループを構成する
ベント管とを備えたことを特徴とする素子冷却装置。 3. Alignment with a predetermined interval and good heat transfer
A large number of fin members formed of thin plate-shaped members
One end of the fin member is brought into contact with one surface and the other surface
The heat receiving plate on which the element to be cooled is mounted and the U-shaped one side
Note: Located on one end side of each fin member, the other side of U-shape is upper
Note that each of the fins described above should be located on the other end side of each fin member.
A plurality of U-shaped heat pipes attached to the member,
1st which connects the U-shaped one side end part of a U-shaped heat pipe
Communication pipe and the other end of the U-shaped heat pipe on the other side of the U-shape
A second communication pipe that communicates between the first and second communication pipes and an end of the first communication pipe.
The ends of two communicating pipes are joined to form a loop.
An element cooling device comprising a vent pipe.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25515397A JP3364415B2 (en) | 1997-09-19 | 1997-09-19 | Element cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25515397A JP3364415B2 (en) | 1997-09-19 | 1997-09-19 | Element cooling device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1197596A JPH1197596A (en) | 1999-04-09 |
| JP3364415B2 true JP3364415B2 (en) | 2003-01-08 |
Family
ID=17274817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25515397A Expired - Lifetime JP3364415B2 (en) | 1997-09-19 | 1997-09-19 | Element cooling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3364415B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002271074A (en) | 2001-03-08 | 2002-09-20 | Toshiba Corp | Cooling device and electronic equipment provided with built-in cooling device |
| JP3960876B2 (en) * | 2002-08-01 | 2007-08-15 | 古河電気工業株式会社 | heatsink |
| TWI255689B (en) * | 2003-12-16 | 2006-05-21 | Asia Vital Components Co Ltd | Structure and manufacturing method of heat sink module |
| JP5333161B2 (en) * | 2009-11-11 | 2013-11-06 | 富士通株式会社 | heatsink |
-
1997
- 1997-09-19 JP JP25515397A patent/JP3364415B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH1197596A (en) | 1999-04-09 |
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