JP3231119B2 - Heat resistant conductive carrier tape - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a polyphenylene ether resin composition comprising a base material layer on one or both sides of a base material layer comprising a polyphenylene ether resin composition containing a polyphenylene ether resin and a polystyrene resin. Also, a polyphenylene ether-based resin composition having a low content of polyphenylene ether resin and a conductive layer made of a conductive resin composition containing a conductivity-imparting material, a heat-resistant conductive composite plastic sheet obtained by integrally laminating by co-extrusion, The present invention relates to a heat-resistant conductive carrier tape which has been subjected to embossing.

[0002]

2. Description of the Related Art Soft trays, embossed carrier tapes, and the like are conventionally known as packaging forms of ICs and electronic device parts using ICs. The plastic sheet, which is the raw material of the soft tray or embossed carrier tape, generally has a high surface resistivity and is therefore very easy to be charged, and is likely to destroy the function of the IC. Therefore, as a remedy,
(1) a method of applying an antistatic agent to the surface of a packaging container,
(2) A method of applying a conductive paint, and (3) a method of kneading an antistatic agent or carbon black into a general-purpose resin have been proposed.

On the other hand, as the IC encapsulant becomes resin, the amount of moisture absorbed by the IC mold increases, and the rapid dehumidification that occurs when the IC is bonded to the circuit board surface causes deterioration of IC functions and corrosion of wiring. In order to prevent such accidents, pre-drying at 125 ° C. to 150 ° C., which is called baking, is generally performed before bonding the IC to the circuit board surface.

As a material for the baking packaging container, many heat-resistant conductive resin compositions have been proposed, and a tray formed by injection molding using the resin composition has been used. However, injection molded trays are not suitable for high-speed mounting of ICs because the movement of the mounting machine is complicated. Further, when the conventional heat-resistant conductive resin composition is formed into a sheet, there are problems such as insufficient strength of the sheet and insufficient secondary formability. As a remedy, a heat-resistant conductive composite plastic sheet in which a conductive resin layer is laminated on a base layer made of a polyphenylene ether-based resin composition has been proposed in JP-A-62-18261. To
When filled with carbon black, the melt viscosity rises significantly, and the fluidity of the base layer resin and the conductive layer resin does not match during co-extrusion, resulting in poor lamination and embossing of the sheet, and a practical heat-resistant conductive material. It is expected that it will be difficult to obtain a flexible carrier tape.

[0005]

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks. The present invention is directed to a base material layer comprising a polyphenylene ether resin composition containing a polyphenylene ether resin and a polystyrene resin. A conductive layer composed of a polyphenylene ether-based resin composition having a lower content of polyphenylene ether resin than the polyphenylene ether-based resin composition forming the material layer and a conductive resin composition containing a conductivity-imparting material is integrally laminated by co-extrusion. Heat-resistant, mechanical properties, and conductivity suitable for packaging ICs and electronic components, characterized in that the heat-resistant conductive composite plastic sheet is embossed by vacuum forming, hot plate forming, etc. It is intended to provide a heat-resistant conductive carrier tape having the following.

[0006]

That is, the present invention relates to a method for producing a polyphenylene ether resin composition comprising 38 to 96 parts by weight of a polyphenylene ether resin and 62 to 4 parts by weight of a polystyrene resin. A conductive resin composition containing 100 parts by weight of a polyphenylene ether resin having a polyphenylene ether resin content of 5 to 40 parts by weight less than the polyphenylene ether resin composition constituting the base material layer and 4 to 50 parts by weight of a conductivity-imparting material A heat-resistant conductive carrier loop obtained by embossing a heat-resistant conductive composite plastic sheet obtained by integrally laminating a conductive layer made of a product by co-extrusion by vacuum forming, hot plate forming or the like.

Hereinafter, the present invention will be described in more detail. The polyphenylene ether resin used in the present invention is a homopolymer or a copolymer described in US Pat. No. 3,383,435. First, the substrate layer of the present invention will be described. The polyphenylene ether-based resin composition used in the base material layer contains a polyphenylene ether resin and a polystyrene-based resin as essential components, and the content of the polyphenylene ether resin in 100 parts by weight of the resin composition is 38 to 96.
Part by weight is preferable, and particularly preferably 48 to 88 parts by weight. If the amount is less than 38 parts by weight, sufficient mechanical properties and heat resistance cannot be obtained. If the amount exceeds 96 parts by weight, pelletization and sheet production by a kneader become extremely difficult, and furthermore, embossing of the sheet becomes difficult.

As the polystyrene resin, it is preferable to use an impact-resistant polystyrene resin containing 2 to 10% by weight of a rubber component or a mixture of the impact-resistant polystyrene resin and a transparent polystyrene resin for enhancing the impact resistance.

Further, a modifier may be added to the polyphenylene ether-based resin composition of the present invention in order to improve mechanical properties such as impact resistance and embossability. As a modifier for polyphenylene ether resin,
Ethylene-acrylate copolymer resins and ethylene-vinyl acetate copolymer resins are known, and in the present invention, it is preferable to use ethylene-ethyl acrylate copolymer resins, and among them, the content of ethyl acrylate is preferred. An ethylene-ethyl acrylate copolymer resin in an amount of 5 to 20% by weight is optimal.

The amount of the modifier added is preferably 1 to 20 parts by weight, and most preferably 2 to 15 parts by weight, per 100 parts by weight of the polyphenylene ether resin composition. If the added amount is less than 1 part by weight, the effect as a modifier is not sufficiently obtained, and if it exceeds 20 parts by weight, the compatibility is lowered to cause delamination. Further, in the case where peeling occurs due to the addition of the modifier, a filler can be further added to prevent peeling. The amount of the filler is preferably 0.3 to 10 parts by weight based on 100 parts by weight of the polyphenylene ether-based resin composition. If the amount of the filler is less than 0.3 part by weight, a sufficient effect cannot be obtained, and if it exceeds 10 parts by weight, the mechanical properties and the embossability deteriorate. As the filler, inorganic fillers such as calcium carbonate, talc and mica can be used, but carbon black is most suitable.

As processing aids, various additives such as antioxidants and lubricants can be added as required.
Further, the scrap of the heat-resistant conductive composite plastic sheet of the present invention can be added to the base material layer to such an extent that the mechanical properties are not significantly reduced.

Next, the conductive layer will be described. The conductive resin composition used for the conductive layer of the present invention contains a polyphenylene ether resin, a polystyrene resin, and a conductivity-imparting material as essential components. The polyphenylene ether-based resin composition used for the conductive layer contains a polyphenylene ether resin and a polystyrene-based resin, and the content of the polyphenylene ether resin in 100 parts by weight of the resin composition is preferably 22 to 88 parts by weight, and more preferably 35 to 77 parts by weight. The parts by weight are optimal. If the content is less than 22 parts by weight, it is difficult to obtain sufficient mechanical properties and heat resistance, and if it exceeds 88 parts by weight, lamination with the material layer by coextrusion becomes difficult, and the sheet is extruded by an extruder. Cannot be molded. The content of the polyphenylene ether resin in the polyphenylene ether-based resin composition of the conductive layer,
For lamination by co-extrusion, it is necessary to match the fluidity with the material layer, and the polyphenylene ether resin used for the base material layer contains 5 to 40 parts by weight less than the polyphenylene ether resin contained in the resin composition. Is preferred.

As the polystyrene resin used for the conductive layer, the same one as the above-mentioned material layer can be used.

Further, a modifier may be added to the polyphenylene ether-based resin composition in order to improve mechanical properties such as impact resistance and embossability. As the modifying material, those similar to the modifying material for the material layer described above can be used. The amount of the modifier added is preferably 1 to 20 parts by weight, and most preferably 4 to 10 parts by weight, per 100 parts by weight of the polyphenylene ether-based resin composition. If the amount is less than 1 part by weight, the effect as a modifier is not sufficiently obtained, and if it exceeds 20 parts by weight, the heat resistance is reduced and the effect of the reinforcing agent is further reduced.

Various conductive fillers such as carbon fiber, metal fiber, metal powder, and carbon black can be used as the conductivity-imparting material used in the conductive layer. However, in consideration of mechanical properties and embossability, carbon black can be used. Is preferred. The carbon black that can be used in the present invention includes furnace black, channel black, acetylene black and the like, and preferably has a carbon purity of 98%.
As described above, the volatile matter content is 1.5% or less. If the carbon black has a volatile content exceeding 1.5%, foaming may occur on the sheet surface during extrusion. The addition amount of carbon black is 4 to 50 parts by weight based on 100 parts by weight of the polyphenylene ether-based resin composition, and less than 4 parts by weight does not provide sufficient conductivity,
If it exceeds 50 parts by weight, the mechanical properties will be reduced.

In addition, various additives such as an antioxidant and a lubricant can be added to the resin composition used for the conductive layer, if necessary, as a processing aid.

The method for producing a heat-resistant conductive composite plastic sheet (hereinafter abbreviated as a conductive sheet) of the present invention comprises:
The raw materials used for the base material layer and the conductive layer are kneaded by various kneaders such as a twin-screw extruder and a continuous kneader to produce pellets of each resin composition, and then two or more, If necessary, supply the resin composition for the base layer and the conductive layer to two or more extruders, respectively.
-A method in which a conductive layer is laminated on one or both surfaces of the material layer by a co-extrusion method using a die or a multi-manifold die.

It is appropriate that the series of processing temperatures is in the range of 250 to 320 ° C. If the temperature is lower than this temperature range, sufficient molding cannot be performed, and if the temperature is higher, the resin may be decomposed.

The total thickness of the conductive sheet obtained by the coextrusion method of the present invention is preferably 0.1 to 5.0 m / m, and preferably 0.2 to 2.0 m / m.
m is optimal. If the thickness of the conductive sheet is less than 0.1 m / m, the strength as a packaging container for ICs or the like is insufficient, and the thickness is 5.0 m / m.
Exceeding the range causes excessive wall thickness during embossing, making molding difficult.

The conductive sheet of the present invention is formed by laminating a conductive layer on one side or both sides of a base material layer, and the ratio of the conductive layer to the total thickness of the sheet is preferably 2 to 70%,
5-50% is optimal. If the wall thickness is less than 2%, it is difficult to process by an extruder, and if it exceeds 70%, mechanical properties and embossability deteriorate. The thickness of each layer is preferably uniform, and the range of the thickness accuracy of the conductive layer with respect to the entire thickness is preferably within ± 10%. If the thickness is not uniform, good mechanical properties and embossability cannot be stably obtained.

In order to obtain the heat-resistant conductive carrier tape (hereinafter abbreviated as carrier tape) of the present invention from the conductive sheet,
Embossing may be performed by a known method such as vacuum forming, pressure forming, and hot plate forming. Generally, the sheet width at the time of processing is preferably 8 to 60 mm. If it is less than 8 mm, sufficient tape strength to withstand high-speed mounting cannot be obtained, and if it exceeds 60 mm, handling properties during mounting are poor.

Although the embossed shape of the carrier tape of the present invention is determined by the shape of the electronic component to be packaged, the embossed opening dimension is preferably smaller than the sheet width in the flow direction, and 3 mm larger than the sheet width. It is necessary to be smaller than this. If the size of the opening of the embossed portion is larger than the above-mentioned size, it becomes difficult to take up the film on a take-up reel or to use it for a mounting machine, and the shape of the embossed portion due to shrinkage during heating and drying tends to be easily generated.

The thickness of the embossed portion after molding is 0.05.
m / m or more, more preferably 0.
07 m / m or more. The surface resistivity of a carrier tape suitable for packaging electronic components is preferably 10 ¹⁰ Ω / cm or less. If the sheet thickness is less than 0.05 m / m, the surface specific resistance exceeds 10 ¹⁰ Ω / cm, and 0.07 m / m
If it is less than 10, sufficient strength cannot be obtained in the embossed portion.

When baking processing of electronic parts such as ICs is performed using the carrier tape of the present invention, electronic parts and the like are stored in an embossed portion, and then wound around a reel, and
Heating and drying at a temperature of at least C is possible.

[0025]

The present invention will be described below with reference to examples. Example 1 70 parts by weight of a polyphenylene ether resin as a base material layer,
A resin composition containing 30 parts by weight of an impact-resistant polystyrene resin, 4 parts by weight of an ethylene-ethyl acrylate copolymer as a modifier and processing aids A and B was used, and 40 parts by weight of a polyphenylene ether resin as a conductive layer. Resin obtained by adding 26 parts by weight of carbon black as a conductivity-imparting agent, 7.4 parts by weight of an ethylene-ethyl acrylate copolymer resin as a modifier, and further processing aids A, B and C to 60 parts by weight of an impact-resistant polystyrene resin The composition was used. Next, each resin composition was co-extruded by a feed block method using three extruders. A sheet having a three-layer structure of conductive layer / substrate layer / conductive layer was obtained in which the total thickness was 0.3 m / m and the thickness of the substrate layer was 85% of the whole. This sheet is width 24
The carrier tape was obtained by embossing 13 mm long, 19 mm wide and 3 mm deep by vacuum forming. Table 2 and Table 3 show the measurement results of the sheet physical properties and the carrier tape physical properties. Table 1 shows the resin composition of the base layer and the conductive layer together with the following examples and comparative examples.

Example 2 In Example 1, the modifier for the base material layer was 7.4 parts by weight,
The same operation as in Example 1 was performed, except that 2 parts by weight of carbon black was added as a filler for preventing peeling, and processing aid C was added. Tables 2 and 3 show the measurement results of various physical properties. Example 3 The same operation was performed as in Example 1, except that a mixture of a polystyrene-based resin and an impact-resistant polystyrene resin and a transparent polystyrene resin at a ratio of 2: 1 was used for both the base material layer and the conductive layer. Was. Tables 2 and 3 show the measurement results of various physical properties. Example 4 The same operation as in Example 1 was carried out except that the polyphenylene ether resin was changed to 60 parts by weight of the base material layer and the conductive layer was changed to 50 parts by weight, and the impact-resistant polystyrene resin was changed to 40 parts by weight and 50 parts by weight, respectively. Was. Tables 2 and 3 show various physical property measurement results.
Shown in

Comparative Example 1 The same operation as in Example 1 was performed, except that both the base material layer and the conductive layer were replaced with a transparent polystyrene resin as the impact-resistant polystyrene resin in the polyphenylene ether-based resin. The impact strength is inferior to the examples. Tables 2 and 3 show the measurement results of various physical properties. Comparative Example 2 A single-layer sheet was extruded using only one resin composition having conductivity using a single extruder. The impact strength and the heat distortion temperature were inferior to those of the examples. Tables 2 and 3 show the measurement results of various physical properties. Comparative Example 3 A carrier tape was obtained in the same manner using a thermosheet EC (Electrical Chemical Industry Co., Ltd.) of a styrene-based conductive sheet. The tensile strength and the heat distortion temperature were inferior to the examples. Tables 2 and 3 show the results of various physical property measurements.

[0028]

[Table 1]

[0029]

[Table 2]

[0030]

[Table 3]

(1) Manufacturers and trade names of raw materials used Polyphenylene ether resin: Mitsubishi Gas Chemical Co., Ltd., YPX-100L high impact polystyrene resin: Denki Kagaku Kogyo Co., Ltd.
Denkastyrol HI-RQB. Transparent polystyrene resin: Denki Kagaku Kogyo Co., Ltd., Denkastyrol GP-1B Conductivity imparting material: Denki Kagaku Kogyo Co., Ltd., Denka Black granular modifier: Ethylene-ethyl acrylate copolymer resin: Nihon Unicar Co., Ltd., NUC -6169 Processing aid A: Nihon Ciba Geigy Co., Ltd., Irganox-245 Processing aid B: Asahi Denka Kogyo Co., Ltd., PEP-36 Processing aid C: Hoechst Japan, VP-ET
−132

(2) Method for measuring physical properties The methods for measuring physical properties shown in Tables 2 and 3 were performed by the following methods. Substrate Layer Thickness The amount of resin discharged according to the number of rotations of the extruder for the substrate layer and the conductive layer at the time of forming the sheet was measured, and the ratio was calculated based on the discharge amount ratio. Conductive layer thickness accuracy Measure the thickness of each layer of the sheet cross section at 20 mm intervals in the width direction using a wide stand microscope (manufactured by Peak Corporation), and measure the difference between the average value and the maximum or minimum value. It is shown as a ratio to the thickness. Surface resistance The surface resistance was measured using a Lorester MCP-Tester (manufactured by Mitsubishi Yuka Co., Ltd.) at 10 locations in the width direction of the sheet, at two locations on each of the front and back surfaces, for a total of 40 locations, and the logarithmic average was taken as the surface resistance. . Tensile properties According to JIS-K-6732, 10mm / min by Instron
A tensile test was performed at a tensile speed of.

Impact strength Using a DuPont impact tester / Toyo Seiki Co., Ltd., 300 g, 50
A 0 g or 1 kg weight was dropped to obtain a 50% breaking height, and an energy value was calculated from the weight of the weight at that time.
The calculation was performed according to JIS-K-7211. Embossability The sheet is slit to a width of 24 mm, and the length is reduced to 1 mm by vacuum forming.
When a 3 mm, 19 mm wide, and 3 mm deep embossed film was formed, a hole formed in the formed portion was evaluated as x, and a film formed without opening the hole was evaluated as ○. Carrier tape surface resistance Lorester MCP-7 tester (Mitsubishi Yuka Co., Ltd.)
Electrodes were applied to the pockets at the center of the bottom of the pocket and the flange, and the surface resistance was measured. Thermal deformation temperature Temperature at which dimensional change of 1% or more occurs at the mouth or depth of the pocket when the embossed tape is heated for 24 hours.

[0034]

As described above, one or both sides of a base layer made of a polyphenylene ether-based resin composition containing a polyphenylene ether resin and a polystyrene-based resin are more effective than the polyphenylene ether-based resin composition forming the base layer. A conductive layer made of a conductive resin composition containing a polyphenylene ether-based resin having a low content of polyphenylene ether resin and a conductivity-imparting material, and a composite plastic sheet laminated integrally by co-extrusion, vacuum forming,
A heat-resistant conductive carrier tape obtained by embossing by hot plate molding or the like can be used as a packaging container for ICs, electronic components, and the like at the time of heating and drying.

──────────────────────────────────────────────────続 き Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) B32B 1/00-35/00 B65D 85/00 B65D 85/38

Claims (6)

(57) [Claims] 1. A polyphenylene ether resin containing 38 to 96 parts by weight of a polyphenylene ether resin and 62 to 4 parts by weight of a polystyrene resin which is an impact-resistant polystyrene resin or a mixture of an impact-resistant polystyrene resin and a transparent polystyrene resin. One or both surfaces of the base layer made of the composition, a polyphenylene ether resin, and a polystyrene resin which is an impact-resistant polystyrene resin or a mixture of an impact-resistant polystyrene resin and a transparent polystyrene resin, and has a resin composition of 100% by weight. Parts by weight of the polyphenylene ether resin is 22 to 88 parts by weight,
From the polyphenylene ether-based resin composition forming the base material layer
Also has a polyphenylene ether resin content of 5 to 40 weight
A heat-resistant conductive composite plastic sheet obtained by integrally laminating a conductive layer made of a conductive resin composition containing 100 parts by weight of a polyphenylene ether-based resin composition and 4 to 50 parts by weight of a conductivity-imparting material by co-extrusion. 2. The heat-resistant conductive composite plastic sheet according to claim 1, wherein the base material layer and / or the conductive layer further contains a modifier in an amount of 1 to 20 parts by weight based on 100 parts by weight of the polyphenylene ether-based resin composition. 3. A further substrate layer and / or the conductive layer filler to the polyphenylene ether-based resin composition 100 parts by weight comprising 0.3 to 10 parts by claim 1 or claim 2
Heat conductive composite plastic sheet. 4. The claimed conductivity-imparting material is carbon black
The heat-resistant conductive composite plastic sheet according to any one of items 1 to 3 . 5. The heat-resistant conductive composite plastic sheet according to claim 2 , wherein the modifier is an ethylene-ethyl acrylate copolymer resin. 6. A heat-resistant conductive carrier tape, characterized in that the heat-resistant conductive composite plastic sheet according to any one of claims 1 to 5 is embossed.