JP3222842B2 - Board connection connector - Google Patents
Board connection connectorInfo
- Publication number
- JP3222842B2 JP3222842B2 JP28621498A JP28621498A JP3222842B2 JP 3222842 B2 JP3222842 B2 JP 3222842B2 JP 28621498 A JP28621498 A JP 28621498A JP 28621498 A JP28621498 A JP 28621498A JP 3222842 B2 JP3222842 B2 JP 3222842B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- substrate
- board
- contact portion
- fpc
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Connector Housings Or Holding Contact Members (AREA)
Description
【0001】[0001]
【発明の属する技術分野】この発明は基板接続用コネク
タに関する。The present invention relates to a connector for connecting a board.
【0002】[0002]
【従来の技術】図4はフレキシブル基板接続用コネクタ
に2枚のフレキシブル基板を装着した状態を示す断面図
である。2. Description of the Related Art FIG. 4 is a sectional view showing a state in which two flexible substrates are mounted on a connector for connecting a flexible substrate.
【0003】ハウジング110には、第1の基板挿入部
111と第2の基板挿入部112とが階段状に設けられ
ている。第1の基板挿入部111には、第1のフレキシ
ブル基板160と接触する第1のコンタクト120が配
列されている。第2の基板挿入部112には、第2のフ
レキシブル基板150と接触する第2のコンタクト13
0が配列されている。The housing 110 has a first board insertion section 111 and a second board insertion section 112 provided in a stepped manner. The first contacts 120 that are in contact with the first flexible board 160 are arranged in the first board insertion section 111. The second substrate insertion portion 112 has a second contact 13 that contacts the second flexible substrate 150.
0 is arranged.
【0004】第1及び第2の基板挿入部111,112
の上方に位置するハウジング110の開口部113に
は、L形の加圧部材140が回転可能に装着されてい
る。この加圧部材140は第1加圧部材142及び第2
加圧部材141を有する。[0004] First and second substrate insertion portions 111 and 112
An L-shaped pressing member 140 is rotatably mounted in the opening 113 of the housing 110 located above the housing 110. The pressing member 140 includes a first pressing member 142 and a second pressing member.
It has a pressure member 141.
【0005】加圧部材140の第2加圧部材141は、
第2のフレキシブル基板150を介して、第2のコンタ
クト130の接触部131を押圧する。加圧部材140
の第1加圧部材142は、第1及び第2のフレキシブル
基板160,150を介して、第1のコンタクト120
の接触部121を押圧する。The second pressing member 141 of the pressing member 140 is
The contact portion 131 of the second contact 130 is pressed via the second flexible substrate 150. Pressing member 140
The first pressing member 142 is connected to the first contact 120 via the first and second flexible substrates 160 and 150.
Is pressed.
【0006】[0006]
【発明が解決しようとする課題】しかし、上記基板接続
用コネクタは、加圧部材140の回転支持部143から
第1及び第2フレキシブル基板160,150を押す第
1加圧部142までの距離が長いため、第1及び第2フ
レキシブル基板160,150を押す力が小さくなって
しまい、安定した接触力を得ることができないという問
題がある。However, in the connector for board connection, the distance from the rotation supporting portion 143 of the pressing member 140 to the first pressing portion 142 for pressing the first and second flexible substrates 160 and 150 is small. Since the length is long, the force for pressing the first and second flexible substrates 160 and 150 is small, and there is a problem that a stable contact force cannot be obtained.
【0007】また、第1基板挿入部111と第2基板挿
入部112とがハウジング110に階段状に設けられて
いるため、ハウジング110の基板挿入方向の長さ方向
の寸法が大きくなり、コネクタが大型化するという問題
があった。Further, since the first substrate insertion portion 111 and the second substrate insertion portion 112 are provided in the housing 110 in a stepwise manner, the length of the housing 110 in the length of the substrate insertion direction is increased, and the connector is not used. There was a problem of being larger.
【0008】この発明はこのような事情に鑑みてなされ
たもので、その課題は接触安定性が得られ、しかも小型
化を図ることができる基板接続用コネクタを提供するこ
とである。The present invention has been made in view of such circumstances, and an object of the present invention is to provide a connector for connecting a board which can obtain contact stability and can be reduced in size.
【0009】[0009]
【課題を解決するための手段】上記課題を解決するため
請求項1記載の発明は、インシュレータと、このインシ
ュレータに設けられ、前記インシュレータ内に互いに平
行に挿入される複数の基板中の最下部以外の基板の導体
パターンと接触可能な接触部を有する上側のコンタクト
と、前記インシュレータに設けられ、前記最下部の基板
の導体パターンと接触可能な接触部を有する下側のコン
タクトと、前記複数の基板中の最上部の基板を押圧して
前記最下部の基板の導体パターンに前記下側のコンタク
トの接触部を接触させる押圧部材とを備え、前記各基板
と前記各コンタクトの接触部とが基板積層方向に交互に
配置され、前記上側のコンタクトの接触部に設けられた
突部と前記下側のコンタクトの接触部とが基板積層方向
に対向していることを特徴とする。According to a first aspect of the present invention, there is provided an insulator and a plurality of substrates provided on the insulator and inserted into the insulator in parallel with each other, except for a lowermost portion of the plurality of substrates. An upper contact having a contact portion capable of contacting the conductor pattern of the substrate, a lower contact provided on the insulator and having a contact portion capable of contacting the conductor pattern of the lowermost substrate, and the plurality of substrates A pressing member for pressing the uppermost substrate in the lowermost substrate and bringing the contact portion of the lower contact into contact with the conductor pattern of the lowermost substrate, wherein each of the substrates and the contact portion of each of the contacts are laminated on the substrate. The protrusions provided at the contact portions of the upper contacts and the contact portions of the lower contacts face each other in the substrate laminating direction. The features.
【0010】上側のコンタクトのコンタクト接触部を複
数の基板中の最上部の基板に押し付けたとき、下側のコ
ンタクトのコンタクト接触部を複数の基板中の最下部の
基板の導体パターンに大きな力で押し付けることができ
る。When the contact contact portion of the upper contact is pressed against the uppermost substrate of the plurality of substrates, the contact contact portion of the lower contact is applied to the conductor pattern of the lowermost substrate of the plurality of substrates with a large force. Can be imposed.
【0011】請求項2記載の発明は、請求項1に記載の
基板接続用コネクタにおいて、前記上側のコンタクトが
基板積層方向へ複数個配列されていることを特徴とす
る。According to a second aspect of the present invention, in the connector for board connection according to the first aspect, a plurality of the upper contacts are arranged in a board stacking direction.
【0012】複数の上側のコンタクトをインシュレータ
に基板積層方向へ保持させることによって、3つ以上の
基板を基板積層方向へ配列することができる。By holding a plurality of upper contacts in the substrate laminating direction by the insulator, three or more substrates can be arranged in the substrate laminating direction.
【0013】[0013]
【発明の実施の形態】以下、この発明の実施の形態を図
面に基づいて説明する。Embodiments of the present invention will be described below with reference to the drawings.
【0014】図1はこの発明の第1実施形態に係る基板
接続用コネクタの斜視図である。FIG. 1 is a perspective view of a board connecting connector according to a first embodiment of the present invention.
【0015】基板接続用コネクタ1は、ハウジング(イ
ンシュレータ)10と、第1のコンタクト(上側のコン
タクト)20と、第2のコンタクト(下側のコンタク
ト)30と、押圧部材40とを備える。The board connector 1 includes a housing (insulator) 10, a first contact (upper contact) 20, a second contact (lower contact) 30, and a pressing member 40.
【0016】ハウジング10は、ほぼ直方体形状であ
る。その前面にFPC挿入口11,12が設けられ、上
面10bに開口部13が設けられている。The housing 10 has a substantially rectangular parallelepiped shape. FPC insertion ports 11 and 12 are provided on the front surface, and an opening 13 is provided on the upper surface 10b.
【0017】図2は図1の基板接続用コネクタに基板を
装着していない状態を示す断面図、図3は基板を装着し
た状態を示す断面図である。FIG. 2 is a sectional view showing a state where the board is not mounted on the board connecting connector of FIG. 1, and FIG. 3 is a sectional view showing a state where the board is mounted.
【0018】この実施形態では基板としてFPC(Fl
exible Printed Circuit)5
0,60を用いた。In this embodiment, an FPC (Fl
exible printed circuit) 5
0,60 was used.
【0019】第1のコンタクト20は、押圧部材40を
回転可能に支持する支持部21と、FPC50の導電パ
ターン(図示せず)と接触するコンタクト接触部(接触
部)22と、FPC50の下方のFPC60を押圧する
突部23と、ハウジング10の孔14に圧入される圧入
部24とを備える。The first contact 20 includes a supporting portion 21 for rotatably supporting the pressing member 40, a contact contact portion (contact portion) 22 for contacting a conductive pattern (not shown) of the FPC 50, and a lower portion of the FPC 50. A projection 23 for pressing the FPC 60 and a press-fit portion 24 that is press-fitted into the hole 14 of the housing 10 are provided.
【0020】支持部21の先端部21aは鉤形に形成さ
れている。The tip 21a of the support 21 is formed in a hook shape.
【0021】コンタクト接触部22aはばね部22の先
端に形成され、上下方向(基板積層方向)へ変位可能で
ある。The contact contact portion 22a is formed at the tip of the spring portion 22 and can be displaced in a vertical direction (substrate stacking direction).
【0022】コンタクト接触部22aは、押圧部材40
と上下方向で対向する。FPC挿入口11に挿入された
FCP50は押圧部材40とコンタクト接触部22aと
の間に位置する。The contact contact portion 22a is
And in the vertical direction. The FCP 50 inserted into the FPC insertion slot 11 is located between the pressing member 40 and the contact contact portion 22a.
【0023】また、ばね部22には、突部23がコンタ
クト接触部22aと一体に形成されている。The spring portion 22 has a protrusion 23 formed integrally with the contact contact portion 22a.
【0024】第2のコンタクト30は、FPC60の導
電パターン(図示せず)と接触するコンタクト接触部
(接触部)31と、ハウジング10の孔15に圧入され
る圧入部32とを備える。The second contact 30 has a contact contact portion (contact portion) 31 that contacts a conductive pattern (not shown) of the FPC 60 and a press-fit portion 32 that is press-fitted into the hole 15 of the housing 10.
【0025】コンタクト接触部31aは、突部23と上
下方向で対向する。FPC挿入口12に挿入されたFP
C60は突部23とコンタクト接触部31aとの間に位
置する。The contact contact portion 31a is opposed to the protrusion 23 in the vertical direction. FP inserted into FPC insertion slot 12
C60 is located between the protrusion 23 and the contact contact portion 31a.
【0026】コンタクト接触部31aは、ばね部31の
先端に形成され、上下方向へ変位可能である。The contact contact portion 31a is formed at the tip of the spring portion 31 and is displaceable in the vertical direction.
【0027】押圧部材40には長手方向に沿って溝42
が形成され、この溝42に第1 のコンタクト20の支持
部21の先端部21aが回転可能に支持される。The pressing member 40 has a groove 42 along the longitudinal direction.
Is formed, and the tip end 21a of the support portion 21 of the first contact 20 is rotatably supported in the groove 42.
【0028】次に、このコネクタ1へのFPC50,6
0の装着を説明する。Next, the FPCs 50, 6
The mounting of 0 will be described.
【0029】まず、押圧部材40の溝42に支持部21
の先端部21aを係合させる(図2参照)。First, the support portion 21 is inserted into the groove 42 of the pressing member 40.
(See FIG. 2).
【0030】FPC50,60をFPC挿入口11,1
2に挿入する。その結果、FPC50,60とコンタク
ト接触部22a,31aとが上下方向に交互に配置され
る。The FPCs 50 and 60 are inserted into the FPC insertion ports 11 and 1
Insert into 2. As a result, the FPCs 50 and 60 and the contact contact portions 22a and 31a are alternately arranged in the vertical direction.
【0031】このとき、FPC50の導体パターンは第
1のコンタクト20のコンタクト接触部22aに接触す
る。At this time, the conductor pattern of the FPC 50 comes into contact with the contact contact portion 22a of the first contact 20.
【0032】また、FPC60の導体パターンは第2の
コンタクト30のコンタクト接触部31aに接触する。The conductor pattern of the FPC 60 contacts the contact contact portion 31a of the second contact 30.
【0033】その後、押圧部材40の溝42と支持部2
1の先端部21aとの接点を回転中心として押圧部材4
0を反時計方向へ回転させ(図3参照)、平面押圧部4
1をFPC50に押し当て、FPC50を押し下げる。Thereafter, the groove 42 of the pressing member 40 and the support portion 2
The pressing member 4 having a contact point with the tip 21a of the first member as a center of rotation.
0 in the counterclockwise direction (see FIG. 3),
1 is pressed against the FPC 50, and the FPC 50 is pressed down.
【0034】その結果、第1のコンタクト20のばね部
22の弾性力によって第1のコンタクト20のコンタク
ト接触部22aがFPC50に押し付けられる。As a result, the contact portion 22a of the first contact 20 is pressed against the FPC 50 by the elastic force of the spring portion 22 of the first contact 20.
【0035】このとき、コンタクト接触部22aが下方
へ変位し、突部23がFPC60を押し下げる。At this time, the contact contact portion 22a is displaced downward, and the projection 23 pushes down the FPC 60.
【0036】その結果、第1のコンタクト20のばね部
22の弾性力によって第2のコンタクト30のコンタク
ト接触部31aがFCP60に押し付けられる。As a result, the contact portion 31a of the second contact 30 is pressed against the FCP 60 by the elastic force of the spring portion 22 of the first contact 20.
【0037】このとき、ハウジング10の開口部13は
押圧部材40によって塞がれる。At this time, the opening 13 of the housing 10 is closed by the pressing member 40.
【0038】この実施形態によれば以下の効果を奏す
る。According to this embodiment, the following effects can be obtained.
【0039】コンタクト接触部22aに一体に設けられ
た突部23に第2のコンタクト30のコンタクト接触部
31aが上下方向で対向しているので、押圧部材40で
第1のコンタクト20のコンタクト接触部22aをFP
C50に押し付けたとき、第2のコンタクト30のコン
タクト接触部31aをFPC60の導体パターンに大き
な力で押し付けることができ、従来のコネクタの第2加
圧部141に比し第2のコンタクト30のコンタクト接
触部31aとFPC60との安定した接触力を得ること
ができるとともに、押圧部材40による大きな挟持力が
確保されるので、FPC60が確実に保持される。Since the contact contact portion 31a of the second contact 30 is vertically opposed to the projection 23 provided integrally with the contact contact portion 22a, the contact member of the first contact 20 is pressed by the pressing member 40. 22a to FP
When pressed against C50, the contact contact portion 31a of the second contact 30 can be pressed with a large force against the conductor pattern of the FPC 60, and the contact of the second contact 30 can be reduced as compared with the second pressing portion 141 of the conventional connector. A stable contact force between the contact portion 31a and the FPC 60 can be obtained, and a large clamping force by the pressing member 40 is secured, so that the FPC 60 is securely held.
【0040】また、従来の構成のコネクタのように、F
CP挿入部111,112を階段状に配置する必要がな
いので、ハウジング10の基板挿入方向の寸法が大きく
ならず、基板接続用コネクタの小型化を図ることができ
る。As in the case of the conventional connector,
Since it is not necessary to dispose the CP insertion portions 111 and 112 in a stepwise manner, the dimension of the housing 10 in the board insertion direction does not increase, and the size of the board connection connector can be reduced.
【0041】上記実施形態の変形例として、複数の第1
のコンタクト20をハウジング10の上下方向に配置し
て3枚以上のFPCを装着できるようにしてもよい。As a modified example of the above embodiment, a plurality of first
The contacts 20 may be arranged vertically in the housing 10 so that three or more FPCs can be mounted.
【0042】この変形例によれば、実装密度をより高め
ることもできる。According to this modification, the mounting density can be further increased.
【0043】なお、上記実施形態では回転式の押圧部材
40を用いたが、FPC50,60を押圧できる構成で
あれば回転式に拘泥するものではなく、例えば押圧部材
をコンタクト20とFPC50との間に挿入してFPC
60をコンタクト接触部31aに押し付ける、挿入式と
してもよい。In the above embodiment, the rotary pressing member 40 is used. However, the configuration is not limited to the rotary type as long as it can press the FPCs 50 and 60. For example, the pressing member is connected between the contact 20 and the FPC 50. FPC
60 may be inserted into the contact contact portion 31a.
【0044】また、上記実施形態では基板としてFPC
を用いたが、FFC(Flexible Flat C
able)を用いてもよいし、ハードなプリント基板を
用いてもよい。In the above embodiment, the substrate is an FPC.
Was used, but FFC (Flexible Flat C
able) or a hard printed circuit board may be used.
【0045】[0045]
【発明の効果】以上に説明したように請求項1に記載の
発明の基板接続用コネクタによれば、上側のコンタクト
のコンタクト接触部を複数の基板中の最上部の基板に押
し付けたとき、下側のコンタクトのコンタクト接触部を
複数の基板中の最下部の基板の導体パターンに大きな力
で押し付けることができ、従来のコネクタに比し第2の
コンタクトのコンタクト接触部と基板との安定した接触
力を得ることができる。As described above, according to the connector for board connection according to the first aspect of the present invention, when the contact portion of the upper contact is pressed against the uppermost board of the plurality of boards, The contact contact portion of the side contact can be pressed with a large force against the conductor pattern of the lowermost substrate among the plurality of substrates, and the contact contact portion of the second contact and the stable contact between the substrate and the conventional contact can be achieved. You can gain power.
【0046】請求項2に記載の発明の基板接続用コネク
タによれば、複数の上側のコンタクトをインシュレータ
に基板積層方向へ保持させることによって、3つ以上の
基板を基板積層方向へ配列することができ、実装密度を
更に向上させることができる。According to the second aspect of the present invention, it is possible to arrange three or more substrates in the substrate stacking direction by causing the insulator to hold the plurality of upper contacts in the substrate stacking direction. The mounting density can be further improved.
【図1】図1はこの発明の第1実施形態に係る基板接続
用コネクタの斜視図である。FIG. 1 is a perspective view of a board connection connector according to a first embodiment of the present invention.
【図2】図2は基板接続用コネクタに基板を装着してい
ない状態を示す断面図である。FIG. 2 is a cross-sectional view showing a state where a board is not mounted on the board connecting connector.
【図3】図3は基板接続用コネクタに基板を装着した状
態を示す断面図である。FIG. 3 is a cross-sectional view showing a state where the board is mounted on the board connecting connector.
【図4】図4は従来のフレキシブル基板接続用コネクタ
にFPCを装着した状態を示す断面図である。FIG. 4 is a sectional view showing a state in which an FPC is mounted on a conventional connector for connecting a flexible substrate.
10 ハウジング(インシュレータ) 20,30 コンタクト 22,31 接触部 23 突部 40 押圧部材 50,60 FPC(基板) DESCRIPTION OF SYMBOLS 10 Housing (insulator) 20, 30 Contact 22, 31 Contact part 23 Projection 40 Pressing member 50, 60 FPC (substrate)
Claims (2)
に設けられ、前記インシュレータ内に互いに平行に挿入
される複数の基板中の最下部以外の基板の導体パターン
と接触可能な接触部を有する上側のコンタクトと、前記
インシュレータに設けられ、前記最下部の基板の導体パ
ターンと接触可能な接触部を有する下側のコンタクト
と、前記複数の基板中の最上部の基板を押圧して前記最
下部の基板の導体パターンに前記下側のコンタクトの接
触部を接触させる押圧部材とを備え、 前記各基板と前記各コンタクトの接触部とが基板積層方
向に交互に配置され、前記上側のコンタクトの接触部に
設けられた突部と前記下側のコンタクトの接触部とが基
板積層方向に対向していることを特徴とする基板接続用
コネクタ。An upper contact provided on the insulator, the upper contact having a contact portion provided on the insulator and capable of contacting a conductor pattern of a substrate other than the lowermost substrate among a plurality of substrates inserted in parallel with the insulator; A lower contact provided on the insulator and having a contact portion capable of contacting the conductor pattern of the lowermost substrate; and a conductor pattern of the lowermost substrate by pressing an uppermost substrate of the plurality of substrates. And a pressing member for bringing the contact portion of the lower contact into contact with the substrate. The substrate and the contact portion of the contact are alternately arranged in the substrate stacking direction, and are provided at the contact portion of the upper contact. A connector for connecting a board, wherein a projection and a contact portion of the lower contact face each other in a board stacking direction.
複数個配列されていることを特徴とする請求項1に記載
の基板接続用コネクタ。2. The board connection connector according to claim 1, wherein a plurality of the upper contacts are arranged in a board laminating direction.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28621498A JP3222842B2 (en) | 1998-10-08 | 1998-10-08 | Board connection connector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP28621498A JP3222842B2 (en) | 1998-10-08 | 1998-10-08 | Board connection connector |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2000113933A JP2000113933A (en) | 2000-04-21 |
JP3222842B2 true JP3222842B2 (en) | 2001-10-29 |
Family
ID=17701460
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP28621498A Expired - Fee Related JP3222842B2 (en) | 1998-10-08 | 1998-10-08 | Board connection connector |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3222842B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7491078B2 (en) | 2007-04-26 | 2009-02-17 | Hon Hai Precision Ind. Co., Ltd. | Stacked electrical connector |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002260759A (en) * | 2001-03-05 | 2002-09-13 | Jst Mfg Co Ltd | Horizontal electric connector |
JP2003109695A (en) * | 2001-09-26 | 2003-04-11 | Molex Inc | Fpc connector |
JP4514127B2 (en) * | 2004-10-01 | 2010-07-28 | 株式会社エンプラス | Socket for electrical parts |
JP5030391B2 (en) * | 2005-04-08 | 2012-09-19 | オリンパスメディカルシステムズ株式会社 | Electronic endoscope |
KR100918538B1 (en) | 2005-01-17 | 2009-09-21 | 올림푸스 가부시키가이샤 | Endoscope electric connector, endoscope, and electric connector assembling method |
WO2007108207A1 (en) | 2006-03-20 | 2007-09-27 | Sumitomo Bakelite Co., Ltd. | Circuit board and connection substrate |
JP4177415B2 (en) | 2006-05-10 | 2008-11-05 | 日本航空電子工業株式会社 | connector |
JP2008066245A (en) * | 2006-09-11 | 2008-03-21 | Molex Inc | Relay connector |
JP5215700B2 (en) * | 2008-03-26 | 2013-06-19 | イリソ電子工業株式会社 | connector |
-
1998
- 1998-10-08 JP JP28621498A patent/JP3222842B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7491078B2 (en) | 2007-04-26 | 2009-02-17 | Hon Hai Precision Ind. Co., Ltd. | Stacked electrical connector |
Also Published As
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JP2000113933A (en) | 2000-04-21 |
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