JP3214316B2 - Apparatus and method for mounting conductive ball and method for forming bump - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus and a method for mounting a conductive ball for mounting a conductive ball for forming a bump on an electrode of a work, and a method for forming a bump.

[0002]

2. Description of the Related Art As a method of forming a bump on an electrode of a work such as a chip or a substrate, a conductive ball such as a solder ball is mounted on the work electrode, and then the conductive ball is heated to form a bump on the electrode. There are known ways to do this.

A conventional conductive ball mounting apparatus for mounting a conductive ball on an electrode of a workpiece moves a mounting head above a storage portion of the conductive ball, where the mounting head moves up and down. After picking up the conductive balls by suctioning them to the suction holes formed on the lower surface, the mounting head is moved above the work, and then moved up and down again, and the vacuum suction state is released to remove the conductive balls. It is designed to be mounted on the work electrode.

[0004]

However, the above-described conventional method requires an operation of moving the mounting head above the storage portion of the conductive ball and an operation of performing an up and down operation to pick up the conductive ball. In addition, there is a problem that the tact time becomes long and the working efficiency does not increase, and there is a problem that an erroneous pickup of the conductive ball tends to occur. Further, since a piping system and a suction device for vacuum-sucking the conductive balls to the lower surface of the mounting head are required, there is a problem that the device becomes complicated.

Accordingly, the present invention provides a conductive ball mounting apparatus and a mounting method capable of mounting a conductive ball on a workpiece electrode at a high speed with a reduced tact time and eliminating the need for a piping system or a suction device. And a method for forming a bump.

[0006]

According to the present invention, there is provided an apparatus for mounting a conductive ball, comprising: a work positioning portion; and a mounting head for mounting the conductive ball on an electrode of the work. The mounting head has a container for storing the conductive balls, and a plurality of holes are formed at positions corresponding to the electrodes of the work at the bottom of the container, and an opening / closing means for opening and closing these holes is provided. And the thickness of the bottom is
The hole is larger than the diameter of the conductive ball.
The conductive balls fit into the vertical line,
The opening / closing means is provided on the bottom of the container.
It has a closing plate and a bottom plate, and this opening / closing plate slides on this bottom plate.
The opening / closing plate and the bottom plate have one conductor.
The holes into which the conductive balls fit are each opened,
The hole of the bottom plate is positioned with respect to the hole of the bottom.
Was opened .

Further, the mounting head is positioned above the work positioned at the positioning portion, and the bottom of the mounting head is
By aligning the holes with the electrodes of the work, and opening and closing these holes by opening and closing means, the conductive balls stored inside the mounting head are dropped from these holes, and It was mounted on the electrode.

A flux is applied to a plurality of electrodes on a substrate, a mounting head is positioned above the substrate, and a hole at the bottom of the mounting head is aligned with the electrodes. By opening and closing the holes, the solder balls stored in the mounting head are dropped from these holes, mounted on the electrode coated with the flux, and then heated to melt and solidify the solder balls. I did it.

[0009]

In the above construction, the conductive balls are stored in the mounting head, the holes are aligned with the electrodes of the work, and the holes are opened and closed to drop the conductive balls from the holes. It is mounted on the work electrode.

[0010]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of a conductive ball mounting apparatus according to one embodiment of the present invention, FIG. 2 is a perspective view of the mounting head, FIG. 3 is a cross-sectional view of the mounting head, and FIGS. FIG.

In FIG. 1, reference numeral 1 denotes a base, on which a guide rail 2 is provided. Guide rail 2
Numeral denotes a work positioning unit that transports the work 3 and positions the work 3 at a predetermined position. A large number of electrodes 4 are formed on the upper surface of the work 3. The work 3 of the present embodiment is a substrate.

Reference numeral 5 denotes a mounting head, to which a nut 6 is connected. The nut 6 is screwed to a feed screw 7 in the X direction. The feed screw 7 and the guide rail 8 in the X direction are provided on a base plate 9. When the motor 10 is driven to rotate the feed screw 7, the mounting head 5 moves horizontally in the X direction. The mounting head 5 moves up and down by a vertical mechanism (not shown).

On both sides of the base 1, feed screws 1 in the Y direction are provided.
1 and guide rails 12 and 13 are provided. Base plate 9
A nut (not shown) screwed to the feed screw 11 is provided on the lower surface of the left end of the nut. Therefore, the motor 14
Is driven to rotate the feed screw 11, the base plate 9 and the mounting head 5 held by the base plate 9 move horizontally in the Y direction. As described above, by driving the motor 10 and the motor 14, the mounting head 5 is moved in the X direction and the Y direction, and its position is adjusted.

Next, the structure of the mounting head 5 will be described with reference to FIGS. The mounting head 5 is mainly composed of a box-shaped container 19. A large amount of conductive balls 15 such as solder balls are stored in the container 19.
A large number of holes 21 for dropping the conductive balls 15 are formed in 0. The hole 21 is opened at a position corresponding to the electrode 4 of the work 3.

An opening / closing plate 22 and a bottom plate 23 are provided on the bottom of the container 19.
Are provided in an overlapping manner. The bottom plate 23 is mounted on a support plate 24 attached to the side surface of the container 19,
2 is slidable on the bottom plate 23. Reference numeral 25 denotes a cylinder, and a clamper 27 for holding the opening / closing plate 22 is connected to the rod 26 of the cylinder. Therefore, when the rod 26 of the cylinder 25 advances and retreats, the opening / closing plate 22 slides on the bottom plate 23. As shown in FIG.
The bottom plate 23 is provided with holes 29 and 30 corresponding to the holes 21 of the bottom 20 of the container 19, respectively. Bottom plate 2
The hole 30 of the third hole is opened slightly shifted from the hole 21 of the bottom 20. On the other hand, the hole 2 of the opening / closing plate 22
9 matches the hole 21 of the bottom 20 when the rod 26 is projected, and the hole 3 of the bottom plate 23 when the rod 26 is retracted.
Matches 0.

As shown in FIG. 3, the thickness of the bottom portion 20 of the container 19 is much larger than the diameter of the conductive ball 15, and a plurality of holes 21 formed in the bottom portion (in this embodiment, as shown in the drawing). Of the conductive balls 15 are fitted in a row. The thickness of the opening / closing plate 22 and the bottom plate 23 is substantially the same as the diameter of the conductive ball 15, and one conductive ball 15 is fitted into each of the holes 29 and 30. FIG. 3 shows a state in which the rod 26 of the cylinder 25 is retracted and the opening / closing plate 22 is retracted to the left. In this state, the hole 29 is displaced from the hole 21, so that the hole 21
The conductive ball 15 in the inside does not fall into the hole 29 of the opening / closing plate 22, but when the opening / closing plate 22 advances rightward and the hole 29 matches the hole 21, one conductive ball in the hole 21 is formed. The ball 15 falls into the hole 29.

The conductive ball mounting apparatus has the above-described configuration, and the operation will be described next. In FIG.
When the work 3 is positioned at a predetermined position by the guide rail 2, the mounting head 5 moves above the work 3 and aligns the hole 30 of the bottom plate 23 with the electrode 4 of the work 3. In this positioning, the positions of the work 3 and the hole 30 are measured by an optical system (not shown), and based on the measurement results,
The motors 10 and 14 are driven to move the mounting head 5 in the X direction and the Y direction.
This is done by moving in the direction.

FIG. 4A shows a state in which the above-mentioned positioning has been completed. In this state, the hole 30 of the bottom plate 23 is aligned with the electrode 4 of the work 3. Opening / closing plate 2
2 is in a forward position (position moved to the right in the figure), and its hole 29 matches the hole 21 of the bottom 20, and one conductive ball 15 fits into the hole 29. I have. The flux 31 is applied on the electrode 4 in a previous step.

Next, as shown in FIG.
When the rod 26 of FIG. 5 is retracted, the opening / closing plate 22 retreats leftward, and the hole 29 matches the hole 30 in the bottom 23, and the conductive ball 15 in the hole 29 passes through the hole 30. It falls on the flux 31. When the opening / closing plate 22 retreats in this manner, the hole 29 is displaced from the hole 21 of the bottom 20, and the conductive balls 15 in the hole 21 do not fall into the hole 29.

Next, the mounting head 5 is raised,
The rod 26 of the cylinder 25 projects and the opening / closing plate 22 advances, and the hole 21 of the bottom 20 and the hole 29 of the opening / closing plate 22 are
As shown in (a), the conductive ball 15 in the hole 21 fits into the hole 29. By repeating the above operation, the conductive ball 1 is placed on the electrode 4 of the work 3.
5 will be installed one after another.

FIG. 5A shows the work 3 on which the conductive balls 15 are mounted as described above. This work 3 is sent to a heating furnace and heated. Then, the conductive balls 15 are melted and then solidified, so that the conductive balls 15 shown in FIG.
The bump 15 'shown in FIG.

[0022]

According to the present invention, the conductive balls in the mounting head are mounted on the electrodes of the work by storing the conductive balls in the mounting head and opening and closing the holes by opening / closing means. Therefore, the operation of picking up the conductive ball, which is conventionally required, is not required, so that the tact time can be greatly reduced, the work efficiency can be improved, and the occurrence of pick-up errors can be completely eliminated. In addition, mounting errors when mounting the conductive balls on the electrodes of the work are reduced. Further, a piping system and a suction device for vacuum suction, which have been conventionally required, can be eliminated.

[Brief description of the drawings]

FIG. 1 is a plan view of a conductive ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a mounting head of the conductive ball mounting apparatus according to one embodiment of the present invention.

FIG. 3 is a sectional view of a mounting head of the conductive ball mounting apparatus according to one embodiment of the present invention.

FIG. 4 is an explanatory view of the operation of the conductive ball mounting apparatus according to one embodiment of the present invention.

FIG. 5 is an explanatory view of the operation of the conductive ball mounting apparatus according to one embodiment of the present invention.

[Explanation of symbols]

 2 Guide rail 3 Work 4 Electrode 5 Mounting head 15 Conductive ball 19 Container 20 Bottom 21, 29, 30 Hole 22 Opening / closing plate 23 Bottom plate 25 Cylinder

Claims (4)

(57) [Claims] An apparatus for mounting a conductive ball, comprising: a work positioning portion; and a mounting head for mounting a conductive ball on an electrode of the work, wherein the mounting head stores the conductive ball. the equipped, and provided with a closing means for opening said plurality of holes in a position corresponding to the electrode of the workpiece at the bottom of the container, and to open and close these holes, the bottom
The thickness of the hole is larger than the diameter of the conductive ball.
So that multiple conductive balls fit in a row
And the opening / closing means is placed on the bottom of the container.
An open / close plate and a bottom plate are provided.
It can slide on the bottom plate.
The board has a hole to which one conductive ball fits.
A hole in the bottom plate is provided with the hole in the bottom portion.
A mounting device for a conductive ball, wherein the hole is displaced with respect to a portion . 2. The conductive ball mounting device according to claim 1,
A method of mounting the conductive balls used, wherein the mounting head is positioned above the work positioned at the positioning portion, and the hole at the bottom of the mounting head is aligned with the electrode of the work, and the opening and closing means is used. A method of mounting a conductive ball, comprising: opening and closing these holes to drop conductive balls stored in a mounting head from the holes and mounting the conductive balls on electrodes of the work. . 3. The method according to claim 2, wherein said conductive balls are solder balls. 4. An apparatus for mounting a conductive ball according to claim 1,
A method of generating bumps, wherein flux is applied to a plurality of electrodes on a substrate, a mounting head is positioned above the substrate, and a hole at the bottom of the mounting head is aligned with the electrodes. By opening and closing these holes by the opening and closing means, the solder balls stored in the mounting head are dropped from these holes and mounted on the electrode coated with the flux, and then the solder balls are heated. Melting and solidifying the bumps.