JP3202718B2 - Display device manufacturing jig and display device manufacturing method using the same - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jig for manufacturing a display device and a method for manufacturing a display device using the same, and more particularly to a liquid crystal display (hereinafter referred to as an LCD) using a glass substrate.
liquid Crystal Display) or P
The present invention relates to a display device manufacturing jig for reinforcing the strength of a glass substrate for a DP (Plasma Display Panel) product, and a display device manufacturing method using the same.

[0002]

2. Description of the Related Art An LCD or PDP to which the present invention is applied is used as a monitor of a personal computer or a screen of a television.

In general, this LCD or PDP manufacturing method is, as shown in the process chart of FIG.
TFT (Thin Film Transistor)
TFT driving transistors 7 are formed on the glass substrate 1 for use (the actual number of TFT driving transistors is, for example, 300
A TFT glass substrate 1 on which a TFT drive transistor 7 is formed and a color filter 4 for coloring light with an Ag paste 5, and a device electric field on the TFT glass substrate 1. Inject and sandwich liquid crystal agent 6 that can control light transmission with Ag
Seal with paste 5. Further, a driving driver 8 for driving the TFT driving transistor 7 and a fluorescent lamp 9 for generating light are incorporated, and a color liquid crystal display 10 is completed.

According to the present invention, the TF of the LCD or PDP is
Glass substrate for T, glass substrate for color filter or P
The present invention relates to a manufacturing jig for reinforcing the strength of a DP glass substrate and a method for manufacturing an LCD or PDP using the same.

In a conventional method of manufacturing an LCD or PDP,
Glass substrates were manufactured from a single substrate. But,
The environment surrounding a glass substrate changes gradually, and taking an LCD as an example, first of all, one glass substrate is replaced by one L
Since manufacturing CDs was expensive, multiple LCDs were gradually replaced from one substrate in a price competition.
Was manufactured at one time, and the size of the glass substrate was increased. In addition, the size of the LCD itself has increased, and the size of the LCD has further increased. Second, LCDs for notebook computers
In recent years, the need to reduce the weight of glass substrates has been required. As a result of these two factors, it has been necessary to satisfy the requirements for a large and thin glass substrate.

[0008] This will be described in detail with respect to a conventional glass substrate. As shown in an explanatory view of FIG. 8, the size of the conventional glass substrate is 300 × 350 × 1.
1 tmm is standard, and the glass substrate cracking defect rate (hereinafter, referred to as
The substrate cracking defect rate) was 0.02%. If the glass substrate is made thinner (lighter) or larger in size, the glass substrate will bend more, lowering the manufacturing yield or, in the worst case, breaking the glass substrate.
When the glass substrate size is shifted to 360 × 465 × 0.7 tmm, the substrate cracking defect rate increases to 0.7%, and further, the glass substrate size is changed to 360 × 465 × 0.65 tm.
At the time of shifting to m, the in-process manufacturing equipment was remodeled to cope with it, but the substrate cracking defect rate increased to 2.0%. And finally, the glass substrate size is 700x800x0.5t
mm, the amount of deflection of the glass substrate becomes 20 mm or more,
It was broken by its own weight and production was impossible at present.

In other words, although the strength of the glass substrate is constant, the glass substrate is becoming thinner and larger in order to reduce the weight of LCD and PDP products and to obtain multiple (multiple) products at a reduced cost. . Therefore, if the strength exceeds the intrinsic strength of the glass substrate, the glass substrate bends or breaks, and the defect rate of the glass substrate becomes high.

[0008]

In order to solve this problem, for example, JP-A-9-105896 (conventional example 1), JP-A-8-86993 (conventional example 2), and No. 54316 (conventional example 3) discloses a jig for manufacturing a liquid crystal display element and a method for manufacturing a liquid crystal display element using the same (conventional example 1), a jig for transporting a substrate, and a jig shown in the schematic diagram of FIG. And a method of manufacturing a liquid crystal display device (Conventional Example 3). In each of these conventional examples, a glass substrate 11 for a product is replaced with a support (a reinforcing substrate) which is a glass substrate or a plastic substrate.
12 shows a production jig, a transportation jig, and a production method using the same, which are adhered and reinforced with an adhesive 13 and flow through the production process of a liquid crystal display element or a liquid crystal display device in a state where the adhesive 13 is reinforced. Have been.

In each of the conventional examples, a glass substrate 11 for a product is used.
Is adhered to a support (reinforcing substrate) 12, which is a glass substrate or a plastic substrate, with an adhesive 13, and the glass substrate 1
In order to prevent the glass substrate 11 from being bent or broken in the manufacturing process of the liquid crystal display element or the liquid crystal display device even when the glass substrate 11 is thinned and increased in size by reinforcing the strength of (1). It has an effect.

However, in each of these conventional examples, two problems occur. First, since the adhesive 13 is used for attaching the glass substrate 11 and the support (reinforcing substrate) 12, the adhesive 13 is used in the manufacturing process due to particles, released gas, and dissolution in liquid during the manufacturing process. The contamination lowers the production yield of the liquid crystal display element or the liquid crystal display device due to the contamination. Also,
There is a problem that the adhesive 13 is peeled off by heat treatment, vacuum treatment, and etching treatment during the manufacturing process. Secondly, when a plastic substrate is used as the support (reinforcement substrate) 12, the support (reinforcement substrate) 12
However, there is a problem that thermal deformation occurs in the manufacturing process.

Accordingly, an object of the present invention is to provide a glass substrate which can be reinforced even if the glass substrate is thinned and enlarged, preventing the glass substrate from being bent or broken in a manufacturing process, and An object of the present invention is to provide a display device manufacturing jig which does not cause a problem when a plastic substrate is used as an adhesive and a reinforcing substrate as in each conventional example, and a method for manufacturing a display device using the same.

[0012]

According to the present invention, there is provided a display device manufacturing jig for manufacturing a display device using a glass substrate.
The glass substrate for the product is bonded and integrated, and the strength of the glass substrate for the product is reinforced, and in a jig for manufacturing the display device, the manufacturing jig includes a glass substrate of the same material as the product. The reinforcing substrate used, and O used for bonding the glass substrate for the product and the reinforcing substrate
Ring and is removed from the display device after manufacture
Characterized in that that.

The display device may be a liquid crystal display or a P display.
DP.

Further, the O-ring is a fluorine-based high-temperature curing resin printed or patterned on the reinforcing glass substrate.

According to a method of manufacturing a display device of the present invention, there is provided a method of manufacturing a display device using a glass substrate, comprising: a reinforcing substrate using a glass substrate of the same material as the product; a glass substrate for the product; Using an O-ring used for bonding the glass substrates for use, the glass substrate for the product is bonded to the reinforcing glass substrate and integrated using the electrostatic attraction force and vacuum suction force between the glass substrates, A display device using the glass substrate for the product is manufactured by reinforcing the strength of the glass substrate for the product.

The display device may be a liquid crystal display or a P display.
DP.

Further, a glass substrate for the product is used as the reinforcing glass substrate, and the glass substrates for the product are bonded to each other, and the product is manufactured on both surfaces on both surfaces of the bonded glass substrate for the product. .

Further, a plurality of products glass substrates are arranged on one or both sides of the reinforcing glass substrate, and the product glass substrates are bonded to the reinforcing glass substrate, respectively, to produce a plurality of products. I do.

According to the present invention, by using the reinforcing glass substrate, the strength of the product glass substrate can be reinforced even if the product glass substrate is made thinner and larger, and the liquid crystal display is provided. Alternatively, it is possible to prevent a glass substrate for a product from being bent or broken in a PDP manufacturing process.

[0020]

Next, a first embodiment of a display device manufacturing jig and a display device manufacturing method using the same according to the present invention will be described in detail with reference to the drawings. Here, the manufacture of the LCD will be described. FIG. 1 is a process diagram for explaining a first embodiment of the present invention in the order of manufacturing steps, and FIG. 2 is a schematic diagram for explaining a partial manufacturing process of the first embodiment of FIG. 1 in the order of steps. (A) to (i) in FIG. 1 and (a) to (d) in FIG. 2 show respective manufacturing steps, and (a) to (d) in FIG. 1 and FIG. (A) to (d) show the same manufacturing steps, and (a) and the like in the following description show the respective manufacturing steps.

As shown in FIG. 1 and FIG. 7 showing the prior art, a color liquid crystal display 10 which is an LCD according to the present embodiment is reinforced by bonding to a glass substrate 1 for a product TFT and a glass substrate 1 for a TFT. A glass substrate for reinforcement 2, an O-ring 3 for bonding the glass substrate for TFT 1 to the glass substrate 2 for reinforcement, a TFT driving transistor 7 formed on the glass substrate 1 for TFT, for coloring light. Ag paste 5 for sealing the color filter 4, the glass substrate 1 for TFT and the color filter 4 and sealing them, and injecting and sandwiching between the glass substrate 1 for TFT and the color filter 4 for bonding by the device electric field on the glass substrate 1 for TFT. A liquid crystal agent 6 that can control the transmission of light, a driving driver 8 that drives a TFT driving transistor 7, and a light emitting device. And a fluorescent lamp 9.

Then, it constitutes a part of the configuration of the present embodiment,
The reinforcing glass substrate 2 and the O-ring 3, which constitute a display device manufacturing jig and are different from those of the conventional example, will be further described.

The reinforcing glass substrate 2 is bonded to the TFT glass substrate 1 for a product to form a single substrate.
To satisfy the two conditions. The first is to make the material of the reinforcing glass substrate 2 the same as that of the TFT glass substrate 1 and adjust the expansion coefficient, the dielectric constant, the magnetic permeability, etc., and to make the thermal stress in the manufacturing process and the influence of plasma in the film forming apparatus. To the glass substrate 1
The conditions were made the same as in the case of a single sheet, and scratches were not formed when the glass substrates were rubbed in the manufacturing process. Second, the length and width of the reinforcing glass substrate 2 are aligned with the TFT glass substrate 1 so as to prevent chipping of the glass substrate edge after bonding. In each of the conventional examples, the material of the reinforcing glass substrate is not the same as that of the glass substrate for the product. In the conventional example 1, it is not polished glass but inexpensive glass. In the conventional example 2, soda glass is used. A flat plate material such as a float glass having a shape capable of sufficiently supporting the substrate is used.

Further, two conditions for bonding the glass substrates are satisfied. When the glass substrate for TFT 1 and the glass substrate for reinforcement 2 are bonded to each other, they are washed and dried so that foreign matter does not enter the bonding surface. As a result, in the first case, when the laminated glass substrate is peeled off later, foreign substances are prevented from adhering to the TFT glass substrate 1. Second, foreign substances mixed in the film forming apparatus under vacuum do not generate impurity gas or contaminate the manufacturing process.

The O-ring 3 is used for bonding the TFT glass substrate 1 and the reinforcing glass substrate 2, and the O-ring 3 satisfies the two conditions for bonding like the glass substrate. Used. The first is that the dust such as the adhesive of the O-ring 3 does not adhere to the TFT glass substrate 1 as a foreign substance when the laminated glass substrate is peeled off later. The second is that the O-ring 3 does not generate impurity gas or contaminate the manufacturing process in the vacuum deposition apparatus. Specifically, for example, Kalrez (trade name, manufactured by DuPont), which is a bar fluoroelastomer (polymer material) used in a vacuum apparatus, is used as the O-ring 3 and has a thickness of 20%.
The one having a size of μm or less is used. O-ring 3 of this Kalrez
Is an apparatus which does not emit an impurity gas in a sputtering (PVD) or CVD apparatus having a degree of vacuum of 0.1 Pa when film formation or dry etching is performed in a vacuum apparatus in a manufacturing process of an LCD. When the thickness of the O-ring 3 is 20 μm or less, the maximum deflection required for the product substrate (TFT glass substrate 1) by the exposure apparatus which is the least bent in the manufacturing process is 20 μm, and the thickness is determined from that. The O-ring 3 is attached TF
It is also used to prevent an impurity gas, a contaminant, or particles from entering between the T glass substrate 1 and the reinforcing glass substrate 2 in the manufacturing process.

Here, the method of manufacturing the LCD of this embodiment is as follows.
First, as shown in FIGS. 1 and 2, two glass substrates made of, for example, silicon dioxide are used. One is a glass substrate 1 for a product TFT, and the other is a glass substrate 1 for the TFT. This is a reinforcing glass substrate 2 for reinforcement.

First, the TFT glass substrate 1 and the reinforcing glass substrate 2 are washed and dried so that foreign matter does not adhere between the laminated glass substrates.

Then, (a) and (b) the reinforcing glass substrate 2
An O-ring 3 processed to a size corresponding to the end of the reinforcing glass substrate 2 is placed thereon. At this time, as shown in (b) to (d) of FIG.
It is arranged so that it does not protrude to the periphery and after lamination, and that there is no twist or slack. This is O
When the ring 3 is placed inside the reinforcing glass substrate 2, a gap is formed between the bonded TFT glass substrate 1 and the substrate at the end of the reinforcing glass substrate 2. This is because a substance that pollutes another manufacturing apparatus is caught in a post process such as the above.
Conversely, when the O-ring 3 protrudes from the reinforcing glass substrate 2, the O-ring 3 is rubbed in the manufacturing process, and the O-ring 3 itself becomes a source of particles.

Next, (c) when the glass substrate for TFT 1 is placed in alignment with the glass substrate for reinforcement 2, the glass substrates are originally easily attracted to each other due to the electrostatic attraction force. The glass substrates are gradually adhered to each other from the central portion by the electrostatic attraction force A, and adhere to the vicinity of the O-ring 3 in about 30 seconds, for example. At this time, under normal pressure, the glass substrate for TFT 1 and the glass substrate for reinforcement 2 are not integrated and peeled off, and can be transported.

Then, both the glass substrate for TFT 1 and the glass substrate for reinforcement 2 which are bonded and integrated are flowed to the manufacturing process. (D) When entering the Cr sputtering device for forming the first layer in the TFT drive transistor manufacturing process, the gas (air) inside the O-ring 3 is used in the vacuum device reduced to 1 × 10 −3 Pa due to the TFT. The pressure between the glass substrates of the glass substrate for reinforcement 1 and the glass substrate for reinforcement 2 becomes positive pressure, and the gas between the glass substrates is exhausted, and the space between the glass substrates naturally becomes a high vacuum state. Infinitely, the two glass substrates are attracted by the vacuum suction force B. This makes the bonding even stronger. That is, the O-ring 3 not only prevents the contaminants of other manufacturing apparatuses from entering between the glass substrates, but also has the effect of increasing the attraction force by evacuating the glass substrates. Similar effects are obtained in the subsequent manufacturing steps.

In this state, the two glass substrates 1 for TFT and the glass substrate 2 for reinforcement can be handled as one glass substrate 1 for TFT. (E) The TFT driving transistor manufacturing process is performed to form the TFT driving transistor 7 on the TFT glass substrate 1. (F) The TFT glass substrate 1 and the color filter 4 are bonded together with an Ag paste 5. Then, a liquid crystal agent 6 is injected and sandwiched between the TFT glass substrate 1 on which the TFT drive transistor 7 is formed and the color filter 4, and sealed with an Ag paste 5.

Here, the glass substrate for TFT 1 and the glass substrate for reinforcement 2 are made of the same material, have the same hardness, are not damaged, and have the same expansion coefficient, dielectric constant, and magnetic permeability in the manufacturing process. Thus, there is no problem at all in adaptability to a manufacturing apparatus and influence on product device characteristics.

When the color filter 4 is attached to the TFT glass substrate 1, the strength of the TFT glass substrate 1 is increased. Here, since the reinforcing glass substrate 2 becomes unnecessary, (g) after injecting the liquid crystal agent 6 between the TFT glass substrate 1 and the color filter 4, the product substrate T
A portion is cut at a portion C so as not to affect the display characteristics of the FT glass substrate 1 and to reach the inside of the O-ring 3, and the vacuum state is first released. Then, 0.5K is applied in a direction in which the electrostatic attraction between the TFT glass substrate 1 and the reinforcing glass substrate 2 is removed.
When heat is applied by a drier or the like from one of the upper and lower surfaces of the reinforcing glass substrate 2 while being pulled with a weak force of about g / cm ² , the reinforcing glass substrate 2 peels off gradually as it expands.

(H) The semi-finished product such as the peeled TFT glass substrate 1 is sent to the next step, and (i) the remaining reinforcing glass substrate 2
The O-ring 3 is reused if it is not damaged in the manufacturing process.

Finally, as shown in FIG. 7, similarly to the conventional LCD manufacturing method, a drive driver 8 and a fluorescent lamp 9 are further incorporated into the peeled TFT glass substrate 1 and other semi-finished products to form a color liquid crystal display 10. Is completed.

Further, in this embodiment, the electrostatic attraction between the TFT glass substrate 1 and the reinforcing glass substrate 2 is removed.
While pulling with a weak force of about 0.5 kg / cm ² , heat was applied from one of the upper and lower surfaces of the back surface of the reinforcing glass substrate 2 by a drier or the like, and peeled off little by little as the reinforcing glass substrate 2 expanded. The invention is not limited thereto, and the reinforcing glass substrate 2 may be gradually peeled off while blowing dry air or nitrogen gas between the electrostatically adsorbed glass substrates.

FIG. 3 is a process chart showing a second embodiment of the present invention. In place of the O-ring 3 in the first embodiment, a fluorine-based high-temperature curing resin 11 is used for reinforcing the glass substrate 2.
It is used after printing or patterning. As a result, the fluorine-based high-temperature curing resin 11 can be disposed on the glass substrate more accurately than the O-ring 3, so that the vacuum area adsorbed to the outer shape of the glass substrate increases, and the gap between the bonded glass substrates at the end of the glass substrate Decrease. As a result, particles and impurities deposited and adhered to this portion are reduced. In addition, fluorine-based high-temperature curing resin 11
Can be uniformly formed to have a thickness of 1 to 2 μm.
Can be reduced as compared with the case of using.

Here, as shown in FIG. 3, the manufacturing method of the fluorine-based high-temperature curing resin 11 by patterning is to drop the liquefied fluorine-based high-temperature curing resin 11 onto the reinforcing glass Rotate to spread evenly using centrifugal force. Then, the reinforcing glass substrate 2 is subjected to a high-temperature treatment to cure the fluorine-based high-temperature curing resin 11. Next, a photosensitive resist material 12 is uniformly applied on the cured fluorine-based high-temperature curing resin 11, and is exposed using a pattern mask (not shown). Then, the photosensitive resist material 12 is developed to leave only a portion corresponding to the O-ring 3. And then
Unnecessary fluorine-based high-temperature curing resin 11 is etched. Then, the photosensitive resist material 12 left at the end is peeled off, and O
Only the necessary fluorine-based high-temperature curing resin 11 remains in the portion corresponding to the ring 3. The LCD manufacturing method other than this step is the same as that of the first embodiment.

FIG. 4 is a schematic view showing a third embodiment of the present invention, in which both surfaces of the TFT glass substrate 1 are manufactured at one time. First, a line capable of manufacturing both sides of a glass substrate at one time is constructed, and a glass substrate for TFT 1 for a product is used as a reinforcing glass substrate 2. Then, two TFT glass substrates 1 bonded by the manufacturing method described in the first embodiment or the second embodiment are used, and both surfaces of the bonded TFT glass substrates 1 and 2 (two unbonded surfaces) are used. Product), and manufacture both sides of the TFT glass substrate 1 at a time.

FIG. 5 is a schematic view showing a fourth embodiment of the present invention, in which multiple (multiple) TFT glass substrates 1 for products are formed. When a large-sized glass substrate is to be formed on a new line, only the reinforcing glass substrate 2 is enlarged, and a manufacturing process is constructed with the substrate size. Then, a plurality of TFT glass substrates 1 for a conventional size product are placed on the reinforcing glass substrate 2, and the TFT glass substrate 1 is manufactured by the manufacturing method shown in the first embodiment or the second embodiment. Each is bonded to the reinforcing glass substrate 2, and the manufacturing process is performed. Thereby, the glass substrate for TFT 1 for the product
Can be multi-faceted. And TF for products
There is no need to newly construct or change the manufacturing process in response to changing market needs such as the size or thickness of the glass substrate 1 for T.

FIG. 6 is a schematic view showing a fifth embodiment of the present invention, in which a TFT glass substrate 1 for a product is formed on both sides of a reinforcing glass substrate 2 through a reinforcing glass substrate 2. Mass production). this is,
In the manufacturing process on both sides of the glass substrate as in the third embodiment shown in FIG. 4 and the manufacturing process in which only the reinforcing glass substrate 2 as in the fourth embodiment shown in FIG. Of the TFT glass substrate 1 described above. This is achieved by arranging a plurality of TFT glass substrates 1 for a product of the conventional size on both surfaces of the reinforcing glass substrate 2 such that the production surfaces of the respective products are facing each other. In the manufacturing method shown in the second embodiment, T
The FT glass substrate 1 is bonded to the reinforcing glass substrate 2 and the manufacturing process is performed. Thereby, through the reinforcing glass substrate 2, it is possible to mass-produce a multi-sided TFT glass substrate 1 for a product on both sides.

As described above, as the embodiment of the present invention, the manufacturing of the LCD, particularly the manufacturing jig in which the strength of the glass substrate for the TFT is reinforced, and the manufacturing method using the same have been described. Substrate or PD
Regarding the P PDP glass substrate, the manufacturing jig and the manufacturing method using the same are the same.

[0043]

As described above, according to the present invention, the difference between the manufacturing method and the conventional example is that, first, all of these conventional examples are affixed to a glass substrate for a product and a reinforcing substrate. Second, the adhesive substrate is not used while the adhesive is used. The second is to use a glass substrate made of the same material as the product for the reinforcing substrate, That is, they are stuck together using the suction force and the vacuum suction force. As a result, the following effects can be obtained.

The first effect is that by using the reinforcing substrate, the strength of the glass substrate for the product can be reinforced, and the glass substrate for the product can be prevented from being bent or broken in the manufacturing process. Glass substrates can be made thinner and larger.

The second effect is that the reinforcing substrate and the glass substrate for the product are made of the same material and have the same hardness even when the reinforcing substrate is used. , Dielectric constant, and magnetic permeability, there is no problem at all in adaptability to a manufacturing apparatus and influence on device characteristics of a product.

The third effect is that the O-ring is used for bonding the reinforcing substrate and the glass substrate for the product, and the adhesive is not used unlike the conventional example. Contamination in the process can be prevented.
Further, since no impurity gas is released in the vacuum apparatus, it is possible to prevent the film forming apparatus from being polluted and the film quality from being deteriorated.

The fourth effect is that when a substrate or film made of a material different from that of a glass substrate for a product is adhered with an adhesive as a reinforcing substrate as in the conventional example, a difference in thermal expansion coefficient occurs, and A space is created between the glass substrate and the reinforcing substrate, and when heat is applied or placed in a vacuum, this space expands, leading to cracks in the glass substrate for the product and separation of the attached substrate in the manufacturing process. As a cause, in the present invention, this problem does not occur because the reinforcing substrate and the glass substrate for the product are made of the same material and are adsorbed by vacuum.

The fifth effect is that the glass substrates for the reinforcing glass substrate and the glass substrate for the product are bonded to each other. Therefore, if the glass substrate for the product is used as the glass substrate for the reinforcing material, the product surface is formed on both surfaces of the glass substrate. Can be manufactured on both sides.

The sixth effect is that, when mass production of multiple substrates (multiple substrates) is performed on a large substrate, if only the reinforcing substrate is enlarged, the conventional glass substrate for the product can be used as it is. It can be produced by arranging a plurality of sheets on a reinforcing substrate and bonding them together. In response to changing market needs such as the size or thickness of glass substrates for products,
There is no need to build or change the manufacturing process.

The seventh effect is that, when a product is manufactured on both sides of a large-sized substrate, a plurality of glass substrates for a product of the conventional size are arranged on both sides of the enlarged reinforcing substrate and bonded to each other. Multi-sided and mass production of both sides is possible.

The eighth effect is that since the reinforcing substrate and the O-ring can be reused, the cost does not increase and there is no cost risk.

[Brief description of the drawings]

FIG. 1 is a process chart for explaining a first embodiment of the present invention in the order of manufacturing steps.

FIG. 2 is a schematic diagram illustrating a partial manufacturing process of the first embodiment of FIG. 1 in the order of processes.

FIG. 3 is a process chart showing a second embodiment of the present invention.

FIG. 4 is a schematic diagram showing a third embodiment of the present invention.

FIG. 5 is a schematic diagram showing a fourth embodiment of the present invention.

FIG. 6 is a schematic diagram showing a fifth embodiment of the present invention.

FIG. 7 is a process diagram illustrating a conventional technique.

FIG. 8 is an explanatory diagram for explaining the prior art of FIG. 7;

FIG. 9 is a schematic diagram illustrating another conventional technique.

[Explanation of symbols]

 Reference Signs List 1 glass substrate for TFT 2 glass substrate for reinforcement 3 O-ring 4 color filter 5 Ag paste 6 liquid crystal agent 7 TFT drive transistor 8 drive driver 9 fluorescent lamp 10 color liquid crystal display 11 fluorine high temperature curing resin 12 photosensitive resist material A electrostatic Suction force B Vacuum suction force

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) G02F 1/1333 500 G02F 1/13 101 G02F 1/1339 G09F 9/00 H01J 17/16

Claims (9)

(57) [Claims] 1. A jig for manufacturing a display device using a glass substrate, wherein the glass substrate for the product is laminated and integrated to reinforce the strength of the glass substrate for the product in manufacturing the display device using the glass substrate. a reinforcing substrate for the manufacturing jig has a glass substrate of the product the same material, it is constituted by an O-ring used bonding of the reinforcing substrate and a glass substrate for the product, from the display device after manufacturing Taking
A jig for manufacturing a display device, wherein the jig is removed . 2. The display device according to claim 1, wherein the display device is a liquid crystal display or a PDP.
The jig for manufacturing a display device according to claim 1, wherein: 3. The jig for manufacturing a display device according to claim 1, wherein the O-ring is a fluorine-based high-temperature curing resin printed or patterned on the reinforcing glass substrate. 4. A method for manufacturing a display device using a glass substrate, comprising: a reinforcing substrate using a glass substrate of the same material as the product; and an O substrate used for bonding the glass substrate for the product and the reinforcing glass substrate. Using a ring, utilizing the electrostatic attraction force between the glass substrates, the glass substrate for the product is bonded to the reinforcing glass substrate and integrated,
A method of manufacturing a display device, comprising manufacturing a display device using the glass substrate for a product by reinforcing the strength of the glass substrate for the product. 5. A method for manufacturing a display device using a glass substrate, comprising: a reinforcing substrate using a glass substrate of the same material as the product; and an O substrate used for bonding the glass substrate for the product and the reinforcing glass substrate. Using a ring, utilizing the vacuum suction force between the glass substrates, the glass substrate for the product is bonded to the reinforcing glass substrate and integrated,
A method of manufacturing a display device, comprising manufacturing a display device using the glass substrate for a product by reinforcing the strength of the glass substrate for the product. 6. The display device according to claim 1, wherein the display device is a liquid crystal display or a PDP.
The method for manufacturing a display device according to claim 4 or 5, wherein 7. A glass substrate for the product is used as the glass substrate for reinforcement, and the glass substrates for the product are bonded to each other, and the product is manufactured on both surfaces on both surfaces of the bonded glass substrate for the product. A method for manufacturing a display device according to claim 4. 8. A plurality of products are manufactured by arranging a plurality of product glass substrates on one side of the reinforcing glass substrate and laminating the product glass substrates to the reinforcing glass substrate, respectively. Item 6. The method for manufacturing a display device according to item 4 or 5. 9. A plurality of product glass substrates are arranged on both sides of the reinforcing glass substrate, and the product glass substrates are bonded to the reinforcing glass substrate, respectively.
The method for manufacturing a display device according to claim 4, wherein a plurality of products are manufactured.