JP3201336B2 - Large current substrate and manufacturing method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-current board and a method of manufacturing the same, for example, a high-current board apparatus provided with a bus bar so that a large-current circuit can be formed on a printed circuit board, and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG.
FIG. 1 is a cross-sectional view showing a large-current board using a bus bar so as to form a conventional large-current circuit described in Japanese Unexamined Patent Publication, for example, a printed circuit board device. In the figure, 1 is a bus bar,
For example, it is made of an elongated copper plate having a width of 12 mm and a thickness of 1.2 mm, and 2 is a fastener, which is formed of a conductive material such as copper or brass. Reference numeral 4 denotes a lead terminal screwed to the circuit component 3, which has a screw hole 4a near the tip.
5 is a screw and 6 is a printed circuit board.

[0003] First, a procedure for manufacturing a large-current substrate configured as described above will be described. 0.1 to 0.5 from the outer diameter of the fastener 2 at a predetermined position of the printed circuit board 6 in advance.
A hole is made so as to be larger by about mm, and the fastener 2 is inserted so as to be locked by a flange on one side. Next, it is caulked with a special tool, and the caulked portion 2a is formed as shown in the figure to fix it to the printed circuit board 6. Thereafter, the insertion hole of the bus bar 1 is aligned with the through hole of the fastener 2 and screwed into the nut portion 4a of the lead terminal 4 with the screw 5. As a result, the bus bar 1 and the circuit component 3 are fixed and attached to the printed circuit board 6 to form a large current board.

Here, the fastener 2 will be supplemented.
6 (a) and 6 (b) are cross-sectional views showing a conventional fastener 2. FIG. 6 (a) shows a caulked portion 2a before caulking, and FIG. Caulking part 2
a. The fastener 2 has a metal-made cylindrical body having the same outer diameter, and a distal end of the metal body having a flange 2b larger than the outer diameter of the cylindrical body. The thickness of this cylindrical body is formed in two steps from the flange 2b side, the first step is thinner, and the second step is thicker than the first step. Attach the fastener 2 to the printed circuit board 6 so that it is locked by the flange 2b on one side.
, And press down both ends of the fastener 2 toward the center using a special tool. Then, the first stage spreads outward to form a caulked portion 2 a and is fixed to the printed circuit board 6. As described above, in the conventional large current board, the fastener 2 is fixed to the printed board 6 by the caulking portion 2a and the flange 2b, and the bus bar 1 and the circuit component 3 are fixed to the fastener 2 by screws. Therefore, it is rich in mechanical strength.

FIG. 7 is a sectional view showing still another conventional example. In the figure, a through hole and a land portion 6a are provided in a hole into which the fastener 2 is inserted, and a printed circuit is formed so as to be appropriately connected to the land portion 6a. Further, the attachment between the bus bar 1 and the circuit component 3 is fixed to a screw hole 4 a on the upper part of the fastener 2 by a screw 5. Further, a bus bar 1a is fixed to a lower end of the fastener 2 by a flange 2b.

[0006]

The conventional high-current substrate and the method of manufacturing the same are configured as described above, and there is a problem of aging of the substrate material due to long-term continuous operation. The material of the printed circuit board 6 is, for example, glass epoxy resin. For this reason, when a large current is continuously supplied for a long period of time, the temperature of the current-carrying portion increases, and the entire or local thermal deterioration of the printed circuit board 6 progresses. And other problems occur. These phenomena are caused by the fastener 2 and the printed circuit board 6.
Causes weakening of the sticking force. In addition, since the fixing force is weakened, the bus bar 1 and the bus bar 1a and the fastener 2
Contact resistance increases, and electrical and thermal harm occur. Further, when a printed circuit is provided on the printed circuit board 6, the contact resistance between the land portion 6a and the fastener 2 is increased, resulting in electrical and thermal harm. Further, when the fastener 2 is inserted into the printed circuit board 6 and both ends are pressed to the center and fixed to the printed circuit board 6 by caulking, the first step of the fastener 2 spreads outward, and the corners of the through hole and the land portion 6a are formed. There is a danger that the through-hole and part of the land portion 6a may be destroyed once local force is applied.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and can prevent the fastening force between the fastener and the substrate from weakening even if the thermal deterioration of the substrate material progresses due to long-term continuous operation. It is an object of the present invention to provide a large current substrate capable of minimizing a change in resistance and a method of manufacturing the same.

[0008]

According to a first aspect of the present invention, there is provided a high-current board comprising: a printed board having a land portion;
A fastener which is inserted into a land portion of a printed circuit board, has a flange on one end side via the printed circuit board, and has a caulking portion on the other end side, and connects the land portion and the fastener of the printed circuit board together with the printed circuit board and the fastener. And a solder part for fixing the solder.

According to a second aspect of the present invention, there is provided a printed circuit board having a land portion, a bus bar having a through hole, a land portion of the printed circuit board and a through hole of the bus bar. A fastener having a flange on one end side via a bus bar and a caulking portion on the other end side, formed between a land portion and a bus bar of the printed board, connecting the land portion, the bus bar and the fastener, and a printed board, A bus bar and a solder portion for fixing the fastener are provided.

According to a third aspect of the present invention, in addition to the second aspect, the high-current board is formed on the bus bar on the opposite side of the printed board to connect the bus bar and the fastener and to fix the bus bar and the fastener. And a unit.

According to a fourth aspect of the present invention, there is provided a method for manufacturing a large-current board, wherein cream solder is printed on a board body facing a land portion of a printed board, and is fixed on one side by a flange. Inserting the fastener into the through hole of the printed circuit board, caulking the fastener to form a caulked portion on the other surface side of the printed circuit board, melting the cream solder, and fixing the fastener to the printed circuit board. .

According to a fifth aspect of the present invention, there is provided a method of manufacturing a large current board, wherein cream solder is printed on a portion of one surface of the bus bar, the portion being in contact with the flange of the fastener.
On the other side of the bus bar, cream solder is printed on the part facing the land part of the printed circuit board, and a fastener is inserted into the through hole of the bus bar and the printed board so as to be locked with a flange on one side, and the fastener is caulked. A caulking portion is formed on the other side of the printed circuit board, the cream solder is melted, and the fastener is fixed to the printed circuit board and the bus bar.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a large current board, wherein cream solder is printed on a portion of the bus bar in contact with a swaged portion of the fastener, and printed on the other surface of the bus bar. Print cream solder on the part facing the land part of the board, insert the fastener into the through hole of the printed board and the bus bar so that it is locked by the flange on one side, crimp the fastener and crimp the outside of the bus bar And fixing the fastener to the printed circuit board and the bus bar by melting the cream solder.

[0014]

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION

Embodiment 1 FIG. FIG. 1 is a sectional view showing a large current substrate obtained by the manufacturing method according to the first embodiment of the present invention. In the figure, the same or corresponding elements as those in the related art are denoted by the same reference numerals. In this embodiment, at the time of forming a circuit on the printed board 6, a cream solder 7c is printed on at least a part of the land portion 6a. The cream solder 7c is printed, for example, according to the diameter of the land portion 6a, and forms the caulked portion 2b on the outer fastener 2. In a normal board manufacturing process, so-called reflow soldering is performed as a soldering process when electronic components are mounted. Therefore, for example, if the cream solder 7c is melted by heating at a temperature of 200 degrees or more during the reflow soldering, the fastener 2 and the land portion 6a
Can be integrated. In this embodiment, since the fastener 2 and the land portion 6a are integrated by soldering, a reduction in the thickness of the plate due to thermal deterioration and an adverse effect can be prevented.

In the first embodiment, the bus bar 1 is fixed between the swaged portion 2a and the flange 2b of the fastener 2, but the present invention is applied to a conventional example shown in FIG. When applied, the bus bar 1 is fixed to the outside of the caulking portion 2a.

Embodiment 2 FIG. Next, Embodiment 2 is described with reference to FIG.
It will be described based on. In this embodiment, the bus bar 1
At the time of production, the fastener 2
The solder paste 7d is printed on the surface around the hole contacting the flange 2b, and the solder paste 7d is printed on the other surface according to the portion facing the land portion 6a. The fastener 2 is inserted into the bus bar 1 and the through hole of the printed circuit board 6 so as to be locked by the flange 2b on one side. Next, the fastener 2 is swaged to form a swaged portion 2 a on the other surface side of the printed circuit board 6. Thereafter, similarly to the above-described embodiment, the cream solder 7d is melted at the time of reflow soldering, and the fastener 2 and the land portion 6a are integrated. Since the fastener 2, the bus bar 1, and the land portion 6a are integrated as described above, it is possible to prevent a decrease in the thickness of the plate due to thermal deterioration and an adverse effect.

Embodiment 3 Further, a third embodiment will be described with reference to FIG. In this embodiment, when manufacturing the bus bar 1, cream solder 7e is printed on the surface of the bus bar 1 around the hole around which the fastener 2 is inserted and which comes into contact with the caulking portion 2a. On the other surface of the bus bar 1, a cream solder 7e is printed on a portion facing the land portion 6a according to the land diameter. The fastener 2 is inserted into the printed circuit board 6 and the through hole of the bus bar 1 so as to be locked by the flange on one side, and the fastener 2 is swaged. After the caulking portion 2a is formed outside the bus bar 1, the cream solder 7e is melted to integrate the fastener 2 and the land portion 6a. When reflow soldering is performed in the same manner as in the first embodiment, the cream solder
When the bus bar 1 and the land portion 6a are integrated with each other, it is possible to efficiently prevent a reduction in thickness and adverse effects due to thermal deterioration. In the second and third embodiments, the cream solder 7e is printed according to the land diameter. However, the cream solder 7e may not be printed according to the land diameter, and may be printed on at least a part of the portion facing the land portion 6a. It should be left.

Embodiment 4 Next, a fourth embodiment will be described with reference to FIG. In the fourth embodiment, when the fastener 2 is manufactured, the fastener 2 is plated with solder 7f, and the fastener 2 is inserted into the through hole of the printed circuit board 6 so as to be locked by the flange 2b on one surface side.
Is formed on the other surface side of the printed circuit board 6. After caulking the fastener 2, the fastener 2 and the land 6a are soldered at the time of flow soldering,
Integrate. Since the fastener 2 and the land portion 6a are integrated, it is possible to prevent a reduction in thickness and adverse effects due to thermal deterioration.

[0020]

As described above, according to the first aspect of the present invention, there is provided a printed circuit board having a land portion and a flange inserted into the land portion of the printed circuit board and having a flange at one end via the printed circuit board. The other end includes a fastener having a caulked portion, and a solder portion for connecting the land portion and the fastener of the printed circuit board and fixing the printed circuit board and the fastener. There is an effect that a large current substrate that can be integrated and that can prevent the adverse effects due to thermal deterioration can be obtained.

According to the second aspect of the present invention, a printed circuit board having a land portion, a bus bar having a through hole, and a land portion of the printed circuit board and the bus bar are inserted into the through hole of the bus bar. A fastener having a flange on one end side and a caulking portion on the other end side is formed between the land portion and the bus bar of the printed circuit board via the bus bar, and connects the land portion, the bus bar and the fastener. And the printed circuit board, the bus bar, and a solder portion for fixing the fastener, so that the printed circuit board, the bus bar, and the fastener can be integrated, and an effect of obtaining a large current board that can prevent adverse effects due to thermal deterioration can be obtained. is there.

According to the third aspect of the present invention, since the bus bar is formed on the opposite side of the printed circuit board, the bus bar and the fastener are connected, and the solder portion for fixing the bus bar and the fastener is provided. The bus bar and the fastener can be integrated, and there is an effect that a large current board that can prevent the adverse effects due to thermal deterioration can be obtained.

According to the invention of claim 4, cream solder is printed on at least a part of the land portion of the printed circuit board, and the fastener is inserted into the through hole of the printed circuit board so as to be locked by a flange on one surface side. And caulking the fastener to form a caulked part on the other side of the printed circuit board,
Since the solder is melted and the fastener is fixed to the printed circuit board, the printed circuit board and the fastener can be integrated, and there is an effect that a method for manufacturing a large current board that can prevent the adverse effects due to thermal deterioration can be obtained.

According to the fifth aspect of the present invention, cream solder is printed on one surface of the bus bar in contact with the flange of the fastener, and the other surface of the bus bar is opposed to the land portion of the printed circuit board. A solder paste is printed on the printed circuit board, and the fastener is inserted into the bus bar and the through hole of the printed board so as to be locked by the flange on one side, and the fastener is swaged to form a swaged part on the other side of the printed board, Since the fastener is fixed to the printed circuit board and the bus bar by melting the cream solder, the printed circuit board and the fastener can be integrated, and there is an effect that a method of manufacturing a large current board that can prevent the adverse effects due to thermal deterioration can be obtained.

According to the sixth aspect of the present invention, cream solder is printed on one surface of the bus bar in contact with the swaged portion of the fastener, and faces the land portion of the printed circuit board on the other surface of the bus bar. Print the cream solder on the part, insert the fastener into the printed circuit board and the through hole of the bus bar so that it is locked by the flange on one side, crimp the fastener to form the crimped part on the outside of the bus bar, and paste the cream solder Since the fastener is melted and fixed to the printed circuit board and the bus bar, the printed circuit board and the fastener can be integrated, and there is an effect that a method for manufacturing a large current board that can prevent the adverse effects due to thermal deterioration can be obtained.

[0026]

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing a large current substrate according to a first embodiment of the present invention.

FIG. 2 is a cross-sectional view illustrating a high-current substrate according to a second embodiment of the present invention.

FIG. 3 is a cross-sectional view illustrating a large current substrate according to a third embodiment of the present invention.

FIG. 4 is a cross-sectional view illustrating a large current substrate according to a fourth embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a conventional printed circuit board device that is a large current board.

FIG. 6 is a cross-sectional view showing a fastener used in a conventional printed circuit board device.

FIG. 7 is a cross-sectional view showing a printed circuit board device using a conventional bus bar.

[Explanation of symbols]

 Reference Signs List 1 bus bar 2 fastener 2a caulking 2b flange 6 printed circuit board 6a land 7c-7e cream solder 7f solder plating

──────────────────────────────────────────────────続 き Continuation of front page (72) Inventor Satoru Hayashi 5-1-1, Yataminami, Higashi-ku, Nagoya-shi Nagoya Works, Mitsubishi Electric Corporation (56) References JP-A-2-159787 (JP, A) 53-79273 (JP, A) Japanese Utility Model 3-24268 (JP, U) Japanese Utility Model 56-158083 (JP, U) Japanese Utility Model 54-13551 (JP, Y2) (58) Int.Cl. ⁷ , DB name) H01R 12/06 H05K 1/02 H05K 1/18

Claims (6)

(57) [Claims] 1. A printed circuit board having a land portion having a through hole, and a bus bar having a through hole and capable of conducting a large current.
And a through hole in the land portion of the printed circuit board and the bus.
Is inserted into the through hole of bus bar, the printing via the substrate has a flange at one end, the printed together at the other end for connecting the fastener having a caulking portion, the land portion and the fastener of said printed circuit board A substrate and a solder portion for fixing the fastener, wherein the solder
The part is formed according to the diameter of the land part,
In order to reach the hole, cover the land and the fastener.
A large-current board characterized by integrating the crevice portion . A printed circuit board having a wherein a land portion, a bus bar have a through-hole can a large current, is inserted into the through hole of the land portion and the bus bar of the printed circuit board, the printed circuit board and the bus bar A fastener having a flange at one end side and a caulking portion at the other end, and formed between a land portion and a bus bar of the printed circuit board, connecting the land portion, the bus bar and the fastener, and A high-current board comprising: a printed board; a bus bar; and a solder portion for fixing the fastener. 3. The large current according to claim 2, further comprising a solder portion formed on a side of the bus bar opposite to the printed circuit board to connect the bus bar and the fastener and to fix the bus bar and the fastener. substrate. 4. A cream solder is printed on at least a part of a land portion of the printed circuit board, a fastener is inserted into a through hole of the printed circuit board so as to be locked by a flange on one surface side, and the fastener is caulked to perform the printing. A method for manufacturing a large current substrate, comprising: forming a caulked portion on the other surface of the substrate; dissolving the cream solder; and fixing the fastener to the printed substrate. 5. A cream solder is printed on one surface of the bus bar in contact with the flange of the fastener, and a cream solder is printed on the other surface of the bus bar facing a land portion of the printed circuit board. Inserting the fastener into the bus bar and the through hole of the printed circuit board so as to be locked by the flange on one surface side, caulking the fastener to form a caulked portion on the other surface side of the printed circuit board, and forming the cream solder And fixing the fastener to the printed circuit board and the bus bar. 6. A cream solder is printed on a portion of one surface of the bus bar which comes into contact with the swaged portion of the fastener,
On the other surface of the bus bar, cream solder is printed on a portion facing the land portion of the printed circuit board, and the fastener is inserted into the through hole of the printed circuit board and the bus bar so as to be locked by a flange on one surface side. Forming a caulked portion outside the bus bar by caulking the fastener, melting the cream solder, and fixing the fastener to the printed circuit board and the bus bar.