JP3200880B2 - Combination structure of semiconductor device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device, and more particularly, to a semiconductor device manufactured by exposing a plurality of semiconductor devices by one projection in a semiconductor device manufactured by a projection exposure method.

[0002]

2. Description of the Related Art In a conventional semiconductor device, when a pattern is printed by reduced projection exposure, a plurality of identical patterns as long as they fall within a projection area in one exposure are simultaneously printed.

[0003] For example, the area of reduced projection exposure is 16 mm.
When the area of one semiconductor device is 7 mm square, four identical patterns are imposed on one reticle, and
Two identical semiconductor devices were exposed.

A semiconductor wafer manufactured by the above-described imposition exposure method is cut off after completion of the wafer, and is assembled into a package as a separate semiconductor device regardless of the imposition position. There was no way to know where it was.

[0005]

In a semiconductor device manufactured by such a conventional imposition exposure method, if there is a defect in one portion of a reticle, after the semiconductor device is completed, it is actually subjected to collective exposure. Although only one of the semiconductor devices is exposed to the defect, there is a problem that it is difficult to distinguish between the semiconductor device that has exposed the defect and the semiconductor device that is not exposed.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device which solves the above-mentioned problem and enables an imposition position to be immediately determined.

[0007]

A feature of the present invention is that a semiconductor provided with a means for electrically determining an imposition position at the time of exposure is provided.
Using a plurality of devices, the halves at different imposition positions are used.
Combination structure of semiconductor devices combining multiple conductor devices
It is in construction.

[0008]

FIG. 1 is a plan view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 1 shows a fourth embodiment of the present invention.
The imposed semiconductor device 1 comprises four independent semiconductor devices 2, 3, 4, and 5. These semiconductor devices 2, 3, 4, and 5 have registers 6, 7, 8, 9 respectively.
And these registers 6, 7, 8, and 9 have [11], [10], [01],

The data of [00] is printed by photolithography.

After these semiconductor devices are separated and sealed in a package, the data of the registers 6, 7, 8, and 9 are electrically read out, so that the imposition position when the semiconductor devices are subjected to the reduced projection exposure. You can know.

FIG. 2 is a block diagram of a semiconductor device according to a second embodiment of the present invention.

In FIG. 2, a semiconductor device 1 according to this embodiment
The semiconductor device 0 and the semiconductor device 11 are manufactured by two imposition exposures, and are manufactured at different imposition positions. The register 12 and the register 13 each have [1] in the register 12 as data indicating the imposition position.

[0] is printed by the photolithography technique.

Each of the semiconductor devices 10 and 11 has an exclusive OR 14. The exclusive OR 14 is connected to a register output of the semiconductor device and a register output of another semiconductor device. The output of the exclusive OR 14 is [1] only when semiconductor devices having different imposition positions are connected. The semiconductor devices 10 and 11 operate only when the output of the exclusive OR 14 is [1].

The present embodiment is used when two semiconductor devices are provided with the same function and used while confirming that the outputs of the two semiconductor devices match.

[0015]

As described above, according to the present invention, the imposition position at the time of projection exposure can be electrically determined. Therefore, for example, two microcomputers are required for applications requiring high reliability. In applications where the two microcomputers are used while checking the coincidence of the outputs of the two microcomputers, even if an accidental defect of the reticle or dust is present on the reticle, the two microcomputers do not perform the same malfunction. Thus, there is an effect that microcomputers having different imposition positions can be used.

[Brief description of the drawings]

FIG. 1 is a plan view showing a semiconductor device according to a first embodiment of the present invention.

FIG. 2 is a plan view showing a semiconductor device according to a second embodiment of the present invention.

[Explanation of symbols]

 1 4 Semiconductor devices with imposition 2,3,4,5 Semiconductor devices 6,7,8,9 Registers 10,11 Semiconductor devices 12,13 Registers 14 Exclusive OR

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/027 H01L 21/66

Claims (2)

(57) [Claims] A plurality of semiconductor devices provided with means for electrically determining an imposition position at the time of exposure;
A plurality of the semiconductor devices in the imposition positions
And a combination structure of a semiconductor device. 2. The method according to claim 1, wherein the means for electrically discriminating is an imposition position.
A register storing data and an exclusive OR, and
The exclusive OR of the first semiconductor device is added to the exclusive OR of the first semiconductor device.
Between the output of the register and the output of the register of the second semiconductor device.
The second semiconductor device to the exclusive OR of the second semiconductor device.
Output of register of body device and register of first semiconductor device
And the output of
The first and second semiconductor devices have different imposition positions.
The first and second half only at this time.
2. The combination structure of a semiconductor device according to claim 1, wherein the conductor device operates .