JP3294313B2 - Solder plating method on the inner surface of metal plate hole - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for solder plating on the inner surface of a metal plate suitable for forming a solder plating layer on the inner surface of a long hole or a small hole formed in a metal plate. .

[0002]

2. Description of the Related Art Dip soldering, in which a metal plate is immersed in a molten solder bath, when solder plating is applied to the inner surface of a through hole formed in a metal plate, is widely used. However, when the diameter of the through hole is small or long, a film due to the surface tension of the molten solder is easily formed in the through hole in the dip soldering process, and therefore, there is a problem that the through hole is easily clogged with solder.

[0003] Conventionally, when a solder plating layer is formed on the inner surface of a through hole such as a long hole or a small hole formed in a metal plate, excess solder in the through hole is removed as a step subsequent to the dip soldering step. It was removed using an air knife or vacuum nozzle. That is, the solder removal method using an air knife is
It is a method of scraping the solder clogged in the through-hole by blowing compressed air from obliquely above and below the metal plate toward the through-hole. Is a method of sucking the solder clogged in the through hole by pressing the nozzle against the through hole and performing vacuum suction.

[0004]

However, the above-mentioned air knife method has a disadvantage that the surface is difficult to obtain smoothness due to the formation of solder holes when the solder is scraped off, and the reliability as a solder plating layer is impaired. Was. On the other hand, in the above-mentioned vacuum method, there is a problem in that the sucked solder is liable to be clogged in the vacuum nozzle or the filter, thereby lowering the work efficiency and impairing productivity.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and has as its object to provide an inner surface of a metal plate capable of efficiently forming a desired solder plating layer on the inner surface of a through hole such as a long hole. An object of the present invention is to provide a solder plating method for a semiconductor device.

[0006]

In order to achieve the above object, the present invention provides a method for forming a plurality of through-holes by drilling a metal plate.
And located between two adjacent through-holes
After providing a narrow bar in the thickness direction, insulating resin is
Some of the supplied rollers are arranged side by side
Into the through hole, and the upper edge of the through hole is insulated.
Forming a solder resist layer on a part of the inner surface of the through hole scraped sexual resin, thereafter, by immersing the metal plate in the molten solder bath, the solder resist layer of the inner surface of the through hole It was decided to form a solder plating layer in a place where it was not formed.

[0007]

[Function] A width in the thickness direction between two adjacent through holes of a metal plate.
A roller with a narrow crossbar and an insulating resin supplied to the outer peripheral surface
By inserting a part of the hole into these holes,
If the upper edge scrapes the insulating resin to form a solder resist layer on a part of the inner surface of the through- hole, the solder wettability is poor at that location, so that the molten solder does not adhere, and thus the dip soldering process causes A molten solder film that blocks the through hole is not formed, and the solder plating layer can be formed only at a desired location on the inner surface of the through hole.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. Here, FIG. 1 is a manufacturing process diagram of the jumper chip according to the embodiment, FIG. 2 is a perspective view of a completed product of the jumper chip, FIG. 3 is a flowchart showing the operation contents of the manufacturing process of the jumper chip, and FIG. It is sectional drawing which shows the insulating resin application process in the manufacturing process of a jumper chip.

The jumper chip 10 shown in FIG. 2 is based on a rectangular parallelepiped metal substrate 11 formed by plating the upper and lower surfaces of an iron plate with nickel, and the entire surface of the metal substrate 11 except for both sides is made of epoxy resin or the like. An insulating film 12 made of an insulating resin is applied and formed, and the metal substrate 1
1 are plated with solder plating layers 13 on both sides, and serve as electrodes for soldering to a pattern to be short-circuited. That is, when mounting the jumper chip 10 on a printed board (not shown), the jumper chip 10 is placed on the printed board at a position bridging a pair of patterns facing each other with a gap therebetween. The solder plating layer 13 of each part is soldered to each pattern. As a result, the two patterns on the printed circuit board are short-circuited via the jumper chip 10,
The other patterns located in the gap between these two patterns face the insulating film 12 so that an undesired short circuit can be prevented.

Next, a method of manufacturing the jumper chip 10 will be described.

First, a metal hoop material 14 having nickel plating on both sides is prepared, and the metal hoop material 14 is mounted on a reel stand (not shown) and drilled while supplying the hoop, and is vertically 1.2 mm long. , 1.1 mm wide square hole 1
5 and a long hole 16 having a width of 0.6 mm and a length of 2 mm are shown in FIG.
Many holes are drilled in the arrangement shown in FIG. Note that the reference numeral 17 in FIG.
The chip region 17 is sandwiched between two rectangular holes 15 on the left and right sides and between two long holes 16 on the upper and lower sides.

Next, a narrow bar 18 located between two adjacent square holes 15, 15 is inserted into the metal hoop member 14.
Is crushed in the thickness direction by about 0.1 mm to facilitate insertion of a relief roller described later into the square holes 15, and both sides of the metal hoop material 14 are removed by a deburring machine (not shown).
Grinding by about 5 mm removes the sagging during drilling, and thereafter, the metal hoop material 14 is washed to remove machining oil and shavings.

The next step is the application and curing of an insulating resin by letterpress printing, and as shown in FIG. 1B, a row of square holes 15 and a group of long holes 16 on both surfaces of the metal hoop material 14. , The inner surface (the right inner surface or the left inner surface) of each square hole 15 on the side to be the end surface of the chip region 17, and the right inner surface and the left inner surface of each long hole 16 are coated with the insulating film 12. These insulating films 12 are formed by curing an insulating resin applied by a roller coating method in a UV curing furnace (not shown).
As shown in FIG. 4, a part of the relief roller 21 to which the insulating resin 20 is supplied to the outer peripheral surface by the transfer roller 19 is arranged side by side with the rail 18 interposed therebetween, as shown in FIG.
In this case, the upper left edge of the square hole 15 on the left side is the insulating resin 2 of the letterpress roller 21 in the case of FIG.
0, and the insulating resin 20
Is applied. Then, while feeding the metal hoop material 14, the insulating resin 20 is sequentially placed on the left inner surface of the square hole 15.
Is applied to a UV curing furnace as it is to cure the insulating resin 20 and form the insulating film 12.

In FIG. 4, if the right upper edge of the square hole 15 on the right side is set so as to scrape the insulating resin 20 of the letterpress roller 21, an insulating film is formed on the right inner surface of the square hole 15 after curing. 12 can be formed, and similarly, the insulating film 12 can be formed on the right inner surface and the left inner surface of each slot 16. Thus, the insulating film 12 can be formed on the square hole 15 and the required portion of the slot 16. After that, the insulating film 12 is formed by applying and curing the insulating resin of the letterpress roller to both necessary portions on both surfaces of the metal hoop material 14, respectively.

Since the size of the square hole 15 along the feeding direction of the metal hoop material 14 is as small as 1.1 mm, if the letterpress roller 21 is to be inserted into one square hole 15, the insulating resin 20 In this embodiment, the bar 18 is crushed in advance so that the relief roller 21 can be inserted deeply by using the two square holes 15. Also, if the edges of the square holes 15 and the long holes 16 disappear due to the sagging during the drilling process, the insulating resin 20 may not be sufficiently removed and the coating amount may be insufficient. As a result, the square resin 15 is removed from the insulating resin
An edge that is easy to scrape is secured. Therefore, in the present embodiment, an insufficient amount of the insulating resin 20 applied to the inner surface of the hole hardly occurs, and the insulating film 12 having a sufficient thickness can be reliably formed.

When the insulating film 12 has been applied to a predetermined portion of the metal hoop material 14 in this manner, dip soldering is performed by supplying the hoop to a molten solder bath (not shown) and immersing the same in FIG. 1 (c). As shown, the insulating film 12
A solder plating layer 13 is formed on a metal surface that is not covered with the solder plating layer. By performing such dip soldering, the chip region 17 of the metal hoop material 14 is solder-plated on both sides adjacent to the long hole 16 including the end face (the inner surface of the long hole 16). Further, the slit-shaped long hole has a disadvantage that the solder is easily clogged because the molten solder easily forms an undesired film due to the surface tension.
Since the insulating film 12 is formed in advance on a part of the inner surface of the 6 mm long hole 16, the insulating film 12 becomes a solder resist layer and no molten solder film is formed in the long hole 16. It is not necessary to remove excess solder in the long hole 16 using an air knife or a vacuum nozzle. That is,
On the inner surface of the slit-shaped long hole 16, an insulating film 12 formed by applying an insulating resin 20 to both end portions in the longitudinal direction in advance.
Are formed, the elongated hole 1 is formed after the dip soldering process.
In No. 6, the solder plating layer 13 is formed only on the upper inner surface and the lower inner surface on the side to be the end surface of the chip region 17 in FIG. 1C, and there is no fear that the long holes 16 are closed by the solder.

After the flux is washed after the dip soldering, the metal hoop material 14 is sent to a press (not shown), and as shown in FIG.
A single jumper chip 10 is pulled out of the metal hoop material 14 by cutting a portion connecting the square hole 15 and the long hole 16 around the metal hoop material 14. As described above with reference to FIG. 2, the jumper chip 10 obtained as described above has a rectangular parallelepiped metal substrate 11 formed by punching out the chip region 17 of the metal hoop material 14, and a whole except for both side portions of the metal substrate 11. It is composed of an insulating film 12 provided on the surface and a solder plating layer 13 as an electrode provided on both sides of the metal substrate 11, and after being dropped from the metal hoop material 14, can be taped and packaged as it is.

As described above, in the above embodiment, the metal hoop material 1
Since the insulating film 12 is previously applied to a part of the inner surface of the narrow elongated hole 4 of FIG. 4, even if the metal hoop material 14 is dip-soldered, a molten solder film that blocks the elongated hole 16 is formed. Instead, the solder plating layer 13 can be formed only at a desired position on the inner surface of the long hole 16. That is, since no extra solder remains in the long hole 16 after the dip soldering, there is no need to remove such extra solder using an air knife or a vacuum nozzle. Deterioration of work efficiency which is feared when sucking by the nozzle can be prevented, and a desired solder plating layer 13 can be efficiently formed on the inner surface of the long hole 16.

In the above embodiment, the case where the inner surface of the narrow elongated hole is plated with solder has been described. However, in the case of another through hole where an undesired film of the molten solder is likely to be formed at the time of dip soldering, the same applies. By forming a solder resist layer made of an insulating resin on a part of the inner surface in advance, clogging of the solder can be prevented beforehand.

[0020]

As described above, the metal plate is sandwiched between the bars.
Insulating resin on the outer peripheral surface in the two through holes arranged side by side
Insert a part of the roller to be supplied, and insert the upper edge of the through hole.
Scrapes the insulating resin to form a solder resist layer on part of the inner surface of the through- hole, and then immerses this metal plate in a molten solder bath.
According to soak the present invention that perform dip soldering, the molten solder layer such as to close the translucent hole is not formed, it is not necessary to remove the excess solder with an air knife or vacuum nozzle after dip soldering Therefore, a desired solder plating layer can be efficiently formed on the inner surface of the through hole.

[Brief description of the drawings]

FIG. 1 is a manufacturing process diagram of a jumper chip according to an embodiment.

FIG. 2 is a perspective view of a completed product of the jumper chip.

FIG. 3 is a flowchart showing work contents of a manufacturing process of the jumper chip.

FIG. 4 is a cross-sectional view showing an insulating resin coating step in the process of manufacturing the jumper chip.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Jumper chip 12 Insulation film (solder resist layer) 13 Solder plating layer 14 Metal hoop material 16 Slot 20 Insulating resin

──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Teruo Nishikawa 1-7 Yukitani Otsuka-cho, Ota-ku, Tokyo Alps Electric Co., Ltd. (56) References JP-A-54-36566 (JP, A) 6-296929 (JP, A) JP-A-3-213177 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H01R 43/02 H05K 1/11 H01R 11/01

Claims (1)

(57) [Claims] 1. A plurality of through-holes formed by making a hole in a metal plate.
And located between two adjacent through-holes
After providing a narrow bar in the thickness direction, insulating resin is
Some of the supplied rollers are arranged side by side
Into the through hole, and the upper edge of the through hole is insulated.
Forming a solder resist layer on a part of the inner surface of the through hole scraped sexual resin, thereafter, by immersing the metal plate in the molten solder bath, the solder resist layer of the inner surface of the through hole A solder plating method for forming an inner surface of a hole in a metal plate, wherein a solder plating layer is formed at a portion where the solder plating is not formed.