JP3283026B2 - Ball-shaped terminal suction device and ball-shaped terminal mounting method - Google Patents
Ball-shaped terminal suction device and ball-shaped terminal mounting methodInfo
- Publication number
- JP3283026B2 JP3283026B2 JP2000000658A JP2000000658A JP3283026B2 JP 3283026 B2 JP3283026 B2 JP 3283026B2 JP 2000000658 A JP2000000658 A JP 2000000658A JP 2000000658 A JP2000000658 A JP 2000000658A JP 3283026 B2 JP3283026 B2 JP 3283026B2
- Authority
- JP
- Japan
- Prior art keywords
- suction
- ball
- plate
- terminal
- mask plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims description 15
- 239000004065 semiconductor Substances 0.000 claims description 107
- 239000000758 substrate Substances 0.000 claims description 23
- 230000002093 peripheral effect Effects 0.000 claims description 19
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 230000005611 electricity Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 55
- 230000006837 decompression Effects 0.000 description 12
- 230000015572 biosynthetic process Effects 0.000 description 7
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000004020 conductor Substances 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000003796 beauty Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004891 communication Methods 0.000 description 2
- 238000007667 floating Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000002507 cathodic stripping potentiometry Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/10—Bump connectors ; Manufacturing methods related thereto
- H01L24/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/11—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/742—Apparatus for manufacturing bump connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/04—Soldering or other types of metallurgic bonding
- H05K2203/041—Solder preforms in the shape of solder balls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manipulator (AREA)
- Wire Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
【０００１】[0001]
【発明の属する技術分野】本発明はボール状端子の吸着
装置及びボール状端子の搭載方法に関し、更に詳細には
多数個の半導体素子等の電子部品が形成された半導体ウ
ェハ等の基板を複数の区分に分け、前記区分の各々に形
成された複数個の電子部品から成る一群の電子部品の各
端子搭載パッドにボール状端子を搭載する搭載装置に用
いられるボール状端子の吸着装置及び前記吸着装置を用
いたボール状端子の吸着方法に関する。The present invention relates to relates to a method for mounting the suction <br/> instrumentation 置及 beauty ball-shaped terminals of the ball-shaped terminals, the semiconductor wafer which is formed the electronic components of many such pieces of semiconductor devices and more And the like are divided into a plurality of sections, and a ball-shaped terminal used in a mounting device for mounting a ball-shaped terminal on each terminal mounting pad of a group of electronic components formed of a plurality of electronic components formed in each of the sections. adsorption processes of the ball-shaped terminals with suction instrumentation 置及 beauty the suction device relates.
【０００２】[0002]
【従来の技術】半導体装置には、図９に示す様に、回路
基板１０２の一面に設けられた、外部接続用端子搭載パ
ッドとしてのボール状端子搭載パッド１０８、１０８・
・・に、外部接続用端子用のボール状端子としてのはん
だボール１１０、１１０・・・が配設された半導体装
置、いわゆるＢＧＡ(Ball Grid Array) 型半導体装置１
００がある。このＢＧＡ型半導体装置１００において
は、ボール状端子搭載パッド１０８、１０８・・・は、
搭載された半導体素子１０４とワイヤボンディングされ
て電気的に接続された導体パターン１０６、１０６の端
部に形成されている。かかるＢＧＡ型半導体装置１００
の回路基板１０２に形成された、ボール状端子搭載パッ
ド１０８、１０８・・・の各々に、はんだボール１１
０、１１０・・・を工業的に搭載する手段としては、米
国特許第５２８４２８７号明細書において、図１０に示
すボール状端子の吸着装置が提案されている。この吸着
装置は、回路基板１０２の各ボール状端子搭載パッド１
０８と対応する位置に、はんだボール１１０よりも小径
の吸着孔１１２、１１２・・が穿設された吸着板１１４
と、はんだボール１１０を吸着孔１１２の開孔口に吸着
するとき、吸着孔１１２内を減圧状態とする吸引装置と
を具備するものである。かかる吸着装置によれば、吸着
板１１４に形成された吸着孔１１２内を減圧状態とし、
図１０に示す収納容器１１６に収納されているはんだボ
ール１１０を、図１１に示す様に、各吸着孔１１２の開
孔口に１個づつ吸着した後、回路基板１０２に形成され
た各ボール状端子搭載パッド１０８の直上で各吸着孔１
１２の減圧状態を破ることによって、所定のボール状端
子搭載パッド１０８にはんだボール１１０を搭載でき
る。2. Description of the Related Art As shown in FIG. 9, ball-shaped terminal mounting pads 108 as external connection terminal mounting pads provided on one surface of a circuit board 102 are provided in a semiconductor device.
··· A semiconductor device in which solder balls 110, 110... As ball-shaped terminals for external connection terminals are provided, a so-called BGA (Ball Grid Array) type semiconductor device 1
00. In the BGA type semiconductor device 100, the ball-shaped terminal mounting pads 108,
The conductive patterns are formed at the ends of the conductor patterns 106, 106 which are electrically connected to the mounted semiconductor element 104 by wire bonding. Such a BGA type semiconductor device 100
Each of the ball-shaped terminal mounting pads 108, 108... Formed on the circuit board 102 of FIG.
As a means for industrially mounting 0, 110..., U.S. Pat. No. 5,284,287 proposes a ball-shaped terminal suction device shown in FIG. The suction device is provided with each ball-shaped terminal mounting pad 1 on the circuit board 102.
08, a suction plate 114 having suction holes 112, 112,... Smaller in diameter than the solder balls 110.
And a suction device for reducing the pressure inside the suction hole 112 when the solder ball 110 is sucked into the opening of the suction hole 112. According to the suction device, the inside of the suction hole 112 formed in the suction plate 114 is set in a reduced pressure state,
As shown in FIG. 11, the solder balls 110 stored in the storage container 116 shown in FIG. 10 are sucked one by one into the opening holes of the suction holes 112, and then each ball formed on the circuit board 102 is sucked. Each suction hole 1 immediately above the terminal mounting pad 108
By breaking the reduced pressure state of 12, the solder ball 110 can be mounted on a predetermined ball-shaped terminal mounting pad.
【０００３】ところで、最近、パッケージの大きさが半
導体素子と略同一サイズの半導体装置、いわゆるＣＳＰ
(Chip Size Package) が注目されている。かかるＣＳＰ
の一例を図１２に示す。図１２に示すＣＳＰ２００で
は、半導体素子２０２の一面側に形成された電極端子２
０４に一端部が電気的に接続された導体パターン２０６
の他端部の端子搭載パッドに外部接続端子であるボール
状端子としてのはんだボール２０８が搭載されている。
この導体パターン２０６は、樹脂フィルム２１０の一面
側に形成されているものである。かかる導体パターン２
０６と半導体素子２０２の電極端子２０４が形成された
面との間には、弾性樹脂層２１０が設けられている。Ｃ
ＳＰ２００を実装基板に装着した際に、実装基板と半導
体素子２０２との熱膨張率差等に起因する応力を吸収す
るためである。更に、電極端子２０４と電気的に接続さ
れた導体パターン２０６の一端部は、樹脂フィルム２１
０の端縁から突出してリード部に形成されており、封止
樹脂２１４によって電極端子２０４と共に封止されてい
る。この様な、図１２に示すＣＳＰ２００は、図９に示
すＢＧＡ型半導体装置１００に比較して小形であるた
め、図１３に示す様に、半導体ウェハ３００に作り込ま
れた多数個の半導体素子２０２，２０２・・を個別に切
断することなく製造される。このため、はんだボール２
０８,２０８・・を、半導体ウェハ３００の作り込んだ
半導体素子２０２,２０２・・の各端子搭載パッドに搭
載した後に、半導体ウェハ３００にダイジングを施して
個々のＣＳＰ２００とする。Recently, a semiconductor device having a package having substantially the same size as a semiconductor element, that is, a so-called CSP
(Chip Size Package) is attracting attention. Such CSP
Is shown in FIG. In the CSP 200 shown in FIG. 12, the electrode terminal 2 formed on one surface side of the semiconductor element 202 is formed.
04 is electrically connected to one end of the conductive pattern 206
A solder ball 208 as a ball-shaped terminal, which is an external connection terminal, is mounted on a terminal mounting pad at the other end.
This conductor pattern 206 is formed on one surface side of the resin film 210. Such a conductor pattern 2
An elastic resin layer 210 is provided between the semiconductor element 202 and the surface of the semiconductor element 202 on which the electrode terminals 204 are formed. C
This is because when the SP 200 is mounted on the mounting board, stress caused by a difference in thermal expansion coefficient between the mounting board and the semiconductor element 202 is absorbed. Further, one end of the conductor pattern 206 electrically connected to the electrode terminal 204 is connected to the resin film 21.
The projections are formed on the lead portions protruding from the edge of the first electrode, and are sealed together with the electrode terminals 204 by the sealing resin 214. Since the CSP 200 shown in FIG. 12 is smaller than the BGA type semiconductor device 100 shown in FIG. 9, a large number of semiconductor elements 202 formed in the semiconductor wafer 300 are formed as shown in FIG. , 202... Without being individually cut. Therefore, the solder balls 2
., Are mounted on the respective terminal mounting pads of the semiconductor elements 202, 202,... Formed in the semiconductor wafer 300, and then the semiconductor wafer 300 is diced into individual CSPs 200.
【０００４】[0004]
【発明が解決しようとする課題】図１３に示す半導体ウ
ェハ３００に形成された個々のＣＳＰ２００を構成する
半導体素子２０２の各端子搭載パッドにはんだボール２
０８、２０８・・を搭載する際には、はんだボール２０
８を迅速に搭載すべく、図１０及び図１１に示す吸着装
置が使用される。しかし、図１０及び図１１に示す吸着
装置を使用する場合には、図１３に示す様に、半導体ウ
ェハ３００を複数の区分３０２に区分し、各区分に形成
した半導体素子２０２，２０２・・の各端子搭載パッド
にはんだボール２０８を搭載する。区分３０２の一個の
大きさは、図１０及び図１１に示す吸着板１１４の大き
さと略等しい。吸着板１１４の加工の際に、その吸着面
の平坦性等を確保しつつ、多数の吸着孔１１２を穿設す
るには、吸着板１１４の大きさに限界があるからであ
る。A solder ball 2 is attached to each terminal mounting pad of a semiconductor element 202 constituting an individual CSP 200 formed on a semiconductor wafer 300 shown in FIG.
08, 208... When mounting the solder balls 20
In order to mount 8 quickly, the suction device shown in FIGS. 10 and 11 is used. However, when the suction device shown in FIGS. 10 and 11 is used, as shown in FIG. 13, the semiconductor wafer 300 is divided into a plurality of sections 302, and the semiconductor elements 202, 202,. A solder ball 208 is mounted on each terminal mounting pad. The size of one section 302 is substantially equal to the size of the suction plate 114 shown in FIGS. This is because there is a limit to the size of the suction plate 114 in forming a large number of suction holes 112 while ensuring the flatness of the suction surface when processing the suction plate 114.
【０００５】一方、図１３においては、半導体ウェハ３
００を１２個の区分３０２ａ〜３０２ｌに区分した。か
かる１２個の区分のうち、４個の区分３０２ｃ、３０２
ｄ、３０２ｉ、３０２ｊは、半導体素子２０２，２０２
・・が半導体ウェハ３００に形成された形成範囲、すな
わちはんだボール２０８を搭載する端子搭載パッドは、
実質的に区分の全面に亘って形成されている。このた
め、区分内の端子搭載パッドの形成パターンは１種類で
ある。これに対し、８個の区分３０２ａ、３０２ｂ、３
０２ｅ、３０２ｆ、３０２ｇ、３０２ｈ、３０２ｋ、３
０２ｌにおいては、半導体素子２０２が形成されない部
分（端子搭載パッドが形成されない部分）が存在し、そ
の部分が区分毎に異なる。このため、端子搭載パッドの
形成パターンは８種類である。従って、図１０及び図１
１に示す吸着装置を用い、半導体ウェハ３００の各端子
搭載パッドにはんだボール２０８を搭載するには、区分
３０２ａ〜３０２ｌの各々に形成された端子搭載パッド
の形成パターンに対応するように、吸着孔１１２の形成
パターンが異なる９種類の吸着板１１４を準備する必要
がある。On the other hand, in FIG.
00 was divided into 12 sections 302a to 302l. Of the twelve sections, four sections 302c and 302
d, 302i, and 302j are the semiconductor elements 202, 202
Is formed on the semiconductor wafer 300, that is, the terminal mounting pad for mounting the solder ball 208 is
It is formed substantially over the entire surface of the section. For this reason, the formation pattern of the terminal mounting pads in the section is one type. On the other hand, eight sections 302a, 302b, 3
02e, 302f, 302g, 302h, 302k, 3
In 021, there is a portion where the semiconductor element 202 is not formed (a portion where the terminal mounting pad is not formed), and the portion differs for each section. Therefore, there are eight types of formation patterns of the terminal mounting pads. Therefore, FIG. 10 and FIG.
In order to mount the solder balls 208 on the respective terminal mounting pads of the semiconductor wafer 300 using the suction device shown in FIG. 1, the suction holes are formed so as to correspond to the formation patterns of the terminal mounting pads formed in each of the sections 302a to 302l. It is necessary to prepare nine types of suction plates 114 having different formation patterns of 112.
【０００６】しかしながら、複数個の吸着孔１１２が穿
設されている吸着板１１４の製造コストは高価であり、
予め複数枚の吸着板１１４を準備しておくことは、最終
的に得られる半導体装置の製造コストを上昇させるおそ
れがある。また、図１０及び図１１に示す吸着装置で
は、吸着板１１４を交換することを意図しておらず、吸
着装置を構成する部材に吸着板１１４が固着されてい
る。このため、吸着板１１４を迅速に交換しつつ、はん
だボール２０８、２０８・・を半導体ウェハ３００に形
成された所定の端子搭載パッドに迅速に搭載することは
至難のことである。そこで、本発明の課題は、半導体ウ
ェハ等の基板に形成された多数個の電子部品の各端子搭
載パッドに、一枚の吸着板によってボール状端子を容易
に搭載し得るボール状端子の吸着装置及びボール状端子
の搭載方法を提供することにある。However, the manufacturing cost of the suction plate 114 having a plurality of suction holes 112 is expensive.
Preparing a plurality of suction plates 114 in advance may increase the manufacturing cost of the finally obtained semiconductor device. Further, in the suction device shown in FIGS. 10 and 11, the suction plate 114 is fixed to a member constituting the suction device without intending to replace the suction plate 114. Therefore, it is extremely difficult to quickly mount the solder balls 208, 208... On the predetermined terminal mounting pads formed on the semiconductor wafer 300 while quickly replacing the suction plate 114. Therefore, an object of the present invention is to provide a ball-shaped terminal suction device that can easily mount a ball-shaped terminal on each terminal mounting pad of a large number of electronic components formed on a substrate such as a semiconductor wafer by a single suction plate. and to provide a 置及 beauty mounting method of ball-shaped terminals.
【０００７】[0007]
【課題を解決するための手段】本発明者は、前記課題を
解決すべく検討したところ、図１３に示す区分３０２ａ
〜３０２ｌの区分間では、形成された半導体素子２０
２，２０２・・の端子搭載パッドのピッチ等は互いに等
しく、端子搭載パッドの形成範囲が異なるのみである。
このため、前記課題を解決するには、端子搭載パッドが
形成される範囲が最大である区分３０２ｃ、３０２ｄ、
３０２ｉ、３０２ｊの各区分に形成された端子搭載パッ
ドに対応する吸着孔を吸着板に形成し、他の区分に対し
ては、区分３０２ｃ、３０２ｄ、３０２ｉ、３０２ｊに
用いる吸着板に、当該区分の端子搭載パッドの形成範囲
と対応する開口部が形成されたマスク板を装着すること
が有効と考え検討した結果、本発明に到達した。すなわ
ち、本発明は、多数個の半導体素子等の電子部品が形成
された半導体ウェハ等の基板を複数の区分に分け、前記
区分の各々に形成された複数個の電子部品から成る一群
の電子部品の各端子搭載パッドにボール状端子を搭載す
る搭載装置に用いられるボール状端子の吸着装置であっ
て、該吸着装置を構成するヘッド部に装着される前記ボ
ール状端子の吸着板には、前記基板を区分する複数の区
分のうち、形成された電子部品の個数が最大となる区分
に属する各電子部品に対応して形成された凹部の底部
に、前記凹部に対応する電子部品の各端子搭載パッドに
搭載するボール状端子を吸着する吸着孔から成る吸着孔
群が穿設され、且つ前記吸着板に穿設された吸着孔のう
ち、前記複数の区分から選ばれた所定の区分に形成され
た一群の電子部品の各端子搭載パッドに対応する吸着孔
のみに前記ボール状端子が吸着されるように、前記所定
の区分の外周形状に倣って開口部が形成されて成るマス
ク板が、前記吸着板の片面側に装着されていることを特
徴とするボール状端子の吸着装置にある。The inventor of the present invention has studied to solve the above-mentioned problems, and has found that a section 302a shown in FIG.
The semiconductor element 20 formed between the sections
The pitches and the like of the terminal mounting pads of 2,202... Are equal to each other, and only the formation ranges of the terminal mounting pads are different.
For this reason, in order to solve the above-mentioned problem, the sections 302c, 302d,
The suction holes corresponding to the terminal mounting pads formed in each of the sections 302i and 302j are formed in the suction plate, and for the other sections, the suction plates used for the sections 302c, 302d, 302i, and 302j are attached to the suction plates. The present inventors have arrived at the present invention as a result of considering that it is effective to mount a mask plate in which an opening corresponding to a formation area of a terminal mounting pad is formed. That is, the present invention divides a substrate such as a semiconductor wafer on which a large number of electronic components such as semiconductor elements are formed into a plurality of sections, and forms a group of electronic components including a plurality of electronic components formed in each of the sections. A ball-shaped terminal suction device used in a mounting device for mounting a ball-shaped terminal on each of the terminal mounting pads, wherein the ball-shaped terminal suction plate mounted on a head portion constituting the suction device includes Among the multiple sections that divide the board, the section with the largest number of formed electronic components
Bottom of the recess formed corresponding to each electronic component belonging to
In each of the terminal mounting pads of the electronic component corresponding to the concave portion,
Suction hole consisting of a suction hole for sucking the mounted ball-shaped terminal
A group is bored, and among the suction holes formed in the suction plate, only suction holes corresponding to each terminal mounting pad of a group of electronic components formed in a predetermined section selected from the plurality of sections. A mask plate having an opening formed in accordance with the outer peripheral shape of the predetermined section so that the ball-shaped terminal is sucked onto the one side of the suction plate. In the suction device for the terminal.
【０００８】或いは、本発明は、多数個の半導体素子等
の電子部品が形成された半導体ウェハ等の基板を複数の
区分に分け、前記区分の各々に形成された複数個の電子
部品から成る一群の電子部品の各端子搭載パッドにボー
ル状端子を搭載する搭載装置に用いられるボール状端子
の吸着装置であって、該吸着装置を構成するヘッド部に
装着され、前記基板を区分する複数の区分のうち、形成
された電子部品の個数が最大となる区分の端子搭載パッ
ドに対応して、前記ボール状端子を吸着する吸着孔が穿
設された吸着板と、収納容器に収納された前記ボール状
端子に、前記吸着板が接離動可能となるように前記ヘッ
ド部を移動する移動手段と、前記吸着板に穿設された吸
着孔のうち、前記区分から選ばれた所定の区分に形成さ
れた一群の電子部品の各端子搭載パッドに対応する吸着
孔のみに前記ボール状端子が吸着されるように、前記所
定の区分の外周形状に倣って開口部が形成されて成るマ
スク板とを具備し、前記ヘッド部が前記収納容器に収納
されたボール状端子に近接した際に、前記マスク板が吸
着板の外面側に当接するように、前記マスク板が収納容
器に着脱可能に設けられていることを特徴とするボール
状端子の吸着装置にある。Alternatively, according to the present invention, a substrate such as a semiconductor wafer on which a large number of electronic components such as semiconductor elements are formed is divided into a plurality of sections, and a group of a plurality of electronic components formed in each of the sections is provided. A ball-shaped terminal suction device used in a mounting device for mounting a ball-shaped terminal on each terminal mounting pad of an electronic component, wherein the plurality of sections are mounted on a head portion constituting the suction device and divide the substrate. A suction plate having a suction hole for sucking the ball-shaped terminal corresponding to a terminal mounting pad in a section in which the number of formed electronic components is the largest, and the ball stored in a storage container. Moving means for moving the head part so that the suction plate can be moved toward and away from the terminal, and formed in a predetermined section selected from the sections among the suction holes formed in the suction plate. Group of electronic parts A mask plate having an opening formed in accordance with the outer peripheral shape of the predetermined section so that the ball-shaped terminal is sucked only in the suction hole corresponding to each terminal mounting pad; The mask plate is detachably provided in the storage container so that the mask plate comes into contact with the outer surface side of the suction plate when approaching the ball-shaped terminal stored in the storage container. Ball-shaped terminal suction device.
【０００９】[0009]
【００１０】更に、本発明は、多数個の半導体素子等の
電子部品が形成された半導体ウェハ等の基板を複数の区
分に分け、前記区分の各々に形成された複数個の電子部
品から成る一群の電子部品の各端子搭載パッドにボール
状端子を搭載する際に、該ボール状端子を吸着する吸着
装置として、前記吸着装置を構成するヘッド部に装着さ
れる前記ボール状端子の吸着板には、前記基板を区分す
る複数の区分のうち、形成された電子部品の個数が最大
となる区分に属する各電子部品に対応して形成された凹
部の底部に、前記凹部に対応する電子部品の各端子搭載
パッドに搭載するボール状端子を吸着する吸着孔から成
る吸着孔群が穿設され、且つ前記吸着板に穿設された吸
着孔のうち、前記複数の区分から選ばれた所定の区分に
形成された一群の電子部品の各端子搭載パッドに対応す
る吸着孔のみに前記ボール状端子が吸着されるように、
前記所定の区分の外周形状に倣って開口部が形成されて
成るマスク板が、前記吸着板の片面側に装着されている
吸着装置を用い、前記吸着板の片面側に着脱可能に装着
されたマスク板を、形状及び／又は位置が異なる開口部
が形成された他のマスク板と交換しつつ、各区分に形成
された一群の電子部品の各端子搭載パッドにボール状端
子を搭載することを特徴とするボール状端子の搭載方法
にある。Further, the present invention divides a substrate such as a semiconductor wafer on which a large number of electronic components such as semiconductor elements are formed into a plurality of sections, and comprises a group of a plurality of electronic parts formed in each of the sections. When a ball-shaped terminal is mounted on each terminal mounting pad of an electronic component, the ball-shaped terminal is sucked.
As a device, it is attached to the head unit that constitutes the suction device.
The substrate is divided into suction plates for the ball-shaped terminals to be separated.
Out of multiple categories, the largest number of formed electronic components
The concave formed corresponding to each electronic component belonging to the category
At the bottom of the part, mounting each terminal of the electronic component corresponding to the recess
It consists of a suction hole that sucks the ball-shaped terminal mounted on the pad.
And a suction hole group formed in the suction plate.
Of the holes, the predetermined section selected from the plurality of sections
It corresponds to each terminal mounting pad of the formed group of electronic components.
So that the ball-shaped terminal is sucked only by the suction hole.
An opening is formed according to the outer peripheral shape of the predetermined section.
Is mounted on one side of the suction plate
Removably mounted on one side of the suction plate using a suction device
The formed mask plate into openings having different shapes and / or positions.
Formed in each section while replacing with another mask plate with
Ball-shaped ends on each terminal mounting pad of a group of electronic components
And a method of mounting a ball-shaped terminal, characterized by mounting a terminal.
【００１１】或いは、本発明は、多数個の半導体素子等
の電子部品が形成された半導体ウェハ等の基板を複数の
区分に分け、前記区分の各々に形成された複数個の電子
部品から成る一群の電子部品の各端子搭載パッドに、ボ
ール状端子を吸着する吸着装置を用いて搭載する際に、
該吸着装置として、前記基板を区分する複数の区分のう
ち、形成された電子部品の個数が最大となる区分の端子
搭載パッドに対応して、前記ボール状端子を吸着する吸
着孔が穿設された吸着板と、前記吸着板がボール状端子
の吸着面に装着されたヘッド部と、収納容器に収納され
た前記ボール状端子に、前記吸着板が接離動可能となる
ように前記ヘッド部を移動する移動手段と、前記吸着板
に穿設された吸着孔のうち、前記複数の区分から選ばれ
た所定の区分に形成された一群の電子部品の各端子搭載
パッドに対応する吸着孔のみに前記ボール状端子が吸着
されるように、前記所定の区分毎の外周形状に倣って開
口部が形成されている複数枚のマスクとを備え、前記ヘ
ッド部が前記収納容器に収納されたボール状端子に近接
した際に、前記マスク板が吸着板の外面側に当接するよ
うに、前記マスク板が収納容器に着脱可能に設けられて
いる吸着装置を用い、且つ前記収納容器に設けられてい
るマスク板を、形状及び／又は位置が異なる開口部が形
成された他のマスク板と交換しつつ、各区分に形成され
た一群の電子部品の各端子搭載パッドにボール状端子を
搭載することを特徴とするボール状端子の搭載方法でも
ある。Alternatively, according to the present invention, a substrate such as a semiconductor wafer on which a large number of electronic components such as semiconductor elements are formed is divided into a plurality of sections, and a group of a plurality of electronic components formed in each of the sections is provided. When mounting using a suction device that suctions ball-shaped terminals to each terminal mounting pad of the electronic component,
As the suction device, a suction hole for sucking the ball-shaped terminal is formed in correspondence with a terminal mounting pad in a section in which the number of formed electronic components is largest among a plurality of sections for dividing the substrate. A suction unit, a head unit on which the suction plate is mounted on a suction surface of a ball-shaped terminal, and the head unit such that the suction plate can be moved toward and away from the ball-shaped terminal stored in a storage container. Moving means for moving, and among the suction holes formed in the suction plate, only suction holes corresponding to the respective terminal mounting pads of a group of electronic components formed in a predetermined section selected from the plurality of sections. A plurality of masks each having an opening formed in accordance with an outer peripheral shape of each of the predetermined sections so that the ball-shaped terminals are attracted, wherein the head portion is stored in the storage container. When approaching the terminal, The mask plate is attached to and detached from the storage container using a suction device such that the suction plate contacts the outer surface of the suction plate, and the mask plate provided on the storage container is shaped and / or Mounting a ball-shaped terminal on each terminal mounting pad of a group of electronic components formed in each section while exchanging with another mask plate having an opening at a different position; It is also a method.
【００１２】かかる本発明において、吸着板とマスク板
とを、ヘッド部に着脱可能とし、前記ヘッド部に装着し
た吸着板の内面側に、前記マスク板を装着すること、或
いはヘッド部に固着した吸着板の内面側又は外面側に、
マスク板を着脱可能に装着することによって、マスク板
を容易に交換できる。ここで、外周形状及び面積が互い
に等しく、且つ形状が互いに異なる開口部が形成されて
いる複数枚のマスク板を準備しておくことによって、吸
着装置に装着されたマスク板を所望のマスク板と迅速に
交換しつつ、ボール状端子を半導体ウェハに形成された
所定の端子搭載パッドに迅速に搭載できる。更に、吸着
板及び／又はマスク板をヘッド部に着脱可能に装着する
ように、前記吸着板及び／又はマスク板の周縁部をヘッ
ド部に真空吸着することによって、吸着板及び／又はマ
スク板の着脱を更に容易に行うことができる。In the present invention, the suction plate and the mask plate are detachable from the head portion, and the mask plate is mounted on the inner surface of the suction plate mounted on the head portion, or is fixed to the head portion. On the inner side or outer side of the suction plate,
By detachably mounting the mask plate, the mask plate can be easily replaced. Here, by preparing a plurality of mask plates in which the outer peripheral shape and the area are equal to each other, and the openings having the different shapes are formed, the mask plate mounted on the suction device can be used as a desired mask plate. The ball-shaped terminals can be quickly mounted on predetermined terminal mounting pads formed on the semiconductor wafer while being quickly replaced. Further, the peripheral portion of the suction plate and / or the mask plate is vacuum-adsorbed to the head portion so that the suction plate and / or the mask plate can be detachably attached to the head portion. The attachment and detachment can be performed more easily.
【００１３】本発明に係る吸着装置に装着された吸着板
には、この吸着板に穿設された吸着孔のうち、多数個の
半導体素子等の電子部品が形成された半導体ウェハ等の
基板を複数の区分に分け、この複数の区分から選ばれた
所定の区分内に形成された複数個の電子部品から成る一
群の電子部品の各端子搭載パッドに対応する吸着孔のみ
にボール状端子が吸着されるように、所定の区分の外周
形状に倣って開口部が形成されて成るマスク板が装着さ
れている。このため、半導体ウェハ等の基板を複数の区
分に分け、区分の各々に形成された一群の電子部品の各
端子搭載パッドにボール状端子を搭載する際に、吸着装
置を構成するヘッド部に装着したマスク板を、開口部の
形状が異なる他のマスク板と交換することによって、同
一の吸着板を用いて各区分に形成された一群の電子部品
の各端子搭載パッドにボール状端子を搭載できる。ま
た、マスク板を吸着板の片面側に着脱可能に装着又は当
接することによって、マスク板の交換を更に容易に行う
ことができる。The suction plate mounted on the suction device according to the present invention includes, among suction holes formed in the suction plate, a substrate such as a semiconductor wafer on which electronic components such as a large number of semiconductor elements are formed. The ball-shaped terminals are divided into a plurality of sections, and the ball-shaped terminals are sucked only into the suction holes corresponding to the respective terminal mounting pads of a group of electronic parts formed of a plurality of electronic parts formed in a predetermined section selected from the plurality of sections. As a result, a mask plate having an opening formed following the outer peripheral shape of a predetermined section is mounted. For this reason, a substrate such as a semiconductor wafer is divided into a plurality of sections, and when a ball-shaped terminal is mounted on each terminal mounting pad of a group of electronic components formed in each section, the substrate is mounted on a head part constituting an adsorption device. The ball-shaped terminal can be mounted on each terminal mounting pad of a group of electronic components formed in each section by using the same suction plate by replacing the mask plate with another mask plate having a different opening shape. . Further, by detachably mounting or abutting the mask plate on one side of the suction plate, the replacement of the mask plate can be performed more easily.
【００１４】[0014]
【発明の実施の形態】本発明に係るボール状端子の吸着
装置の一例を図１に示す。図１に示す吸着装置は、図１
３に示す半導体ウェハ３００に作り込まれた多数個の半
導体素子２０２，２０２・・の各端子搭載パッドに、ボ
ール状端子としてのはんだボール２０８を搭載するため
の吸着装置である。図１の吸着装置は、内部に減圧室１
０が設けられたヘッド部１２に、吸着板１４が装着され
ている。この吸着板１４は、減圧室１０の壁面の一部を
形成すると共に、ボール状端子の吸着面も形成する。か
かる吸着板１４には、半導体ウェハ３００に形成された
半導体素子２０２の各々に対応する凹部２０が形成され
ており、この凹部２０の底部に半導体素子２０２の各端
子搭載パッドに対応する吸着孔２２ａ、２２ａ・・から
成る吸着孔群２２が形成されている。この吸着板１４に
形成された吸着孔群２２，２２・・は、半導体ウェハ３
００を区分した区分３０２ａ〜３０２ｌのうち、形成さ
れた半導体素子２０２の個数が最大となる区分３０２
ｃ、３０２ｄ、３０２ｉ、３０２ｊの各々に形成された
各半導体素子２０２に対応する。更に、減圧室１０の壁
部に形成された孔１８、１８は、吸着装置の外部に設け
られた吸引装置に接続されている。このため、吸引装置
を駆動することによって、孔１８、１８から空気が吸引
された減圧室１０は減圧状態となり、吸着板１４に形成
された各吸着孔群２２の吸着孔２２ａの各々には、はん
だボール２０８が吸着される。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows an example of a ball-shaped terminal suction device according to the present invention. The adsorption device shown in FIG.
3 is a suction device for mounting a solder ball 208 as a ball-shaped terminal on each terminal mounting pad of a large number of semiconductor elements 202 formed on a semiconductor wafer 300 shown in FIG. The adsorption device of FIG.
The suction plate 14 is mounted on the head section 12 provided with the “0”. The suction plate 14 forms a part of a wall surface of the decompression chamber 10 and also forms a suction surface of a ball-shaped terminal. A concave portion 20 corresponding to each of the semiconductor elements 202 formed on the semiconductor wafer 300 is formed in the suction plate 14, and a suction hole 22 a corresponding to each terminal mounting pad of the semiconductor element 202 is formed at the bottom of the concave portion 20. , 22a... Are formed. The suction hole groups 22, 22,... Formed in the suction plate 14 are
Out of the sections 302a to 302l in which the number of semiconductor elements 202 formed is the largest among the sections 302a to 302l
It corresponds to each semiconductor element 202 formed in each of c, 302d, 302i, and 302j. Further, the holes 18 formed in the wall of the decompression chamber 10 are connected to a suction device provided outside the suction device. For this reason, by driving the suction device, the decompression chamber 10 in which the air has been sucked from the holes 18, 18 is in a decompressed state, and each of the suction holes 22 a of each of the suction hole groups 22 formed in the suction plate 14 has: The solder balls 208 are sucked.
【００１５】図１に示す吸着装置では、ヘッド部１２に
装着された吸着板１４の内面側に、マスク板２４が密着
されて装着されている。このマスク板２４は、図２に示
す様に、吸着板１４に形成された所定範囲の一群の吸着
孔群２２，２２・・が減圧室１０に臨むように開口部２
６が形成されている。かかる開口部２６は、半導体ウェ
ハ３００を区分した区分３０２ａ〜３０２ｌから選択さ
れた所定の区分に形成された半導体素子２０２，２０２
・・に対応する吸着孔群２２，２２・・の各吸着孔２２
ａのみにはんだボール２０８が吸着されるように、所定
の区分に対応する位置に、所定の区分の外周形状に倣っ
て形成されている。この様に、開口部２６が形成されて
いるマスク板２４は、ヘッド部１２の壁部に形成された
真空吸着孔１６ａによって真空吸引されてヘッド部１２
に装着されている。更に、吸着板１４も、ヘッド部１２
の壁部に形成された真空吸着孔１６ｂ及びマスク板２４
に穿設された穿設孔２８によって真空吸引されてマスク
板２４の外面側に密着されて装着されている。従って、
真空吸着孔１６ａ、１６ｂの真空状態を破ることによっ
て、吸着板１４及びマスク板２４を容易にヘッド部１２
から取り外すことができ、真空吸着孔１６ｂのみの真空
状態を破ることによって、吸着板１４をマスク板２４か
ら取り外すことができる。尚、真空吸着孔１６ａ、１６
ｂを吸引する吸引装置と、減圧室１０を吸引する吸引装
置とは、同一装置であってもよく、別々に設けた装置で
あってもよい。In the suction device shown in FIG. 1, a mask plate 24 is mounted in close contact with the inner surface of a suction plate 14 mounted on the head unit 12. As shown in FIG. 2, the mask plate 24 has openings 2 such that a group of suction holes 22 formed in the suction plate 14 face the decompression chamber 10.
6 are formed. The openings 26 are formed in the semiconductor elements 202 formed in predetermined sections selected from the sections 302 a to 302 l of the semiconductor wafer 300.
Each of the suction holes 22 of the suction hole group 22, 22 corresponding to.
The solder ball 208 is formed at the position corresponding to the predetermined section so as to be attracted only to the a, following the outer peripheral shape of the predetermined section. In this manner, the mask plate 24 in which the opening 26 is formed is vacuum-sucked by the vacuum suction holes 16 a formed in the wall of the head 12, and
It is attached to. Furthermore, the suction plate 14 also
Vacuum holes 16b and mask plate 24 formed in the wall of
The vacuum suction is performed by a perforation hole 28 formed in the mask plate 24 and the mask plate 24 is attached in close contact with the outer surface of the mask plate 24. Therefore,
By breaking the vacuum state of the vacuum suction holes 16a and 16b, the suction plate 14 and the mask plate 24 can be easily moved to the head section 12.
The suction plate 14 can be removed from the mask plate 24 by breaking the vacuum state of only the vacuum suction holes 16b. The vacuum suction holes 16a, 16
The suction device for sucking b and the suction device for sucking the decompression chamber 10 may be the same device or may be separately provided devices.
【００１６】図１及び図２に示す吸着装置を用いて図１
３に示す半導体ウェハ３００に作り込まれた多数個の半
導体素子２０２，２００・・の各端子搭載パッドに、ボ
ール状端子としてのはんだボール２０８を搭載する際に
は、図３に示す搭載装置を使用する。図３に示す搭載装
置において、ヘッド部１２の移動手段として、三軸ロボ
ット３０を用いる。この三軸ロボット３０は、Ｘ軸３２
に直角に組み合わされたＹ軸３４には、Ｙ軸３４に対し
て垂直にＺ軸（図示せず）が組み合わされている。かか
る三軸ロボット３０のＹ軸３４は、Ｘ軸３２に沿って平
行にスライド可能であると共に、Ｘ軸３２に対し直角方
向にもスライド可能に設けられている。更に、Ｚ軸もＹ
軸３４に対し垂直方向にスライド可能に設けられてい
る。この様な三軸ロボット３０のＺ軸に、吸着装置のヘ
ッド部１２が装着されており、吸着装置はＸ軸３２、Ｙ
軸３４、Ｚ軸に沿って移動可能である。尚、三軸ロボッ
ト３０のＸ軸３２に沿って移動可能に設けられたθ軸に
Ｙ軸３４を装着し、θ軸を中心としてＹ軸３４の端部を
回動可能としてもよい。FIG. 1 shows an example of the structure shown in FIG.
When mounting the solder balls 208 as ball-shaped terminals on the respective terminal mounting pads of a large number of semiconductor elements 202, 200,... Formed on the semiconductor wafer 300 shown in FIG. use. In the mounting device shown in FIG. 3, a three-axis robot 30 is used as a moving unit of the head unit 12. The three-axis robot 30 has an X-axis 32
The Z-axis (not shown) is combined perpendicularly to the Y-axis 34 with the Y-axis 34 combined at right angles. The Y axis 34 of the three-axis robot 30 is slidable in parallel along the X axis 32 and slidable in a direction perpendicular to the X axis 32. Furthermore, the Z axis is also Y
It is provided so as to be slidable in a direction perpendicular to the shaft 34. The head unit 12 of the suction device is mounted on the Z-axis of such a three-axis robot 30, and the suction device has an X-axis 32 and a Y-axis.
The axis 34 is movable along the Z axis. Note that the Y-axis 34 may be attached to the θ-axis provided movably along the X-axis 32 of the three-axis robot 30, and the end of the Y-axis 34 may be rotatable around the θ-axis.
【００１７】かかる三軸ロボット３０を用いて図１３に
示す半導体ウェハ３００に作り込まれた多数個の半導体
素子２０２，２０２・・の各端子搭載パッドにはんだボ
ール２０８を搭載する際には、所定位置に図１に示す吸
着板１４、形状及び位置が異なる開口部２６が形成され
た複数枚のマスク板２４ａ〜２４ｉ、半導体ウェハ３０
０、及び多数個のはんだボール２０８が収納された収納
容器２１０を載置する。このマスク板２４ａ〜２４ｉの
うち、マスク板２４ｃには、半導体ウェハ３００の区分
３０２ｃ、３０２ｄ、３０２ｉ、３０２ｊの形状に対応
して開口部２６が形成されている。更に、マスク板２４
ａと区分３０２ａ、マスク板２４ｂと区分３０２ｂ、マ
スク板２４ｄと区分３０２ｅ、マスク板２４ｆと区分３
０２ｇ、マスク板２４ｇと区分３０２ｈ、マスク板２４
ｈと区分３０２ｋ、及びマスク板２４ｉと区分３０２ｌ
が各々対応し、各マスク板には、各々の対応する区分の
外周形状に倣って開口部２６が形成されている。また、
収納容器２１０では、はんだボール２０８を振動又は浮
遊等させて分散させている。When the solder ball 208 is mounted on each terminal mounting pad of a large number of semiconductor elements 202, 202,... Formed on a semiconductor wafer 300 shown in FIG. 1, a plurality of mask plates 24 a to 24 i in which openings 26 having different shapes and positions are formed, and a semiconductor wafer 30.
0, and a storage container 210 in which a large number of solder balls 208 are stored. Of the mask plates 24a to 24i, the mask plate 24c has openings 26 corresponding to the shapes of the sections 302c, 302d, 302i, and 302j of the semiconductor wafer 300. Further, the mask plate 24
a and section 302a, mask plate 24b and section 302b, mask plate 24d and section 302e, mask plate 24f and section 3
02g, mask plate 24g and section 302h, mask plate 24
h and section 302k, and mask plate 24i and section 302l
Each mask plate has an opening 26 formed in accordance with the outer peripheral shape of each corresponding section. Also,
In the storage container 210, the solder balls 208 are dispersed by vibrating or floating.
【００１８】ここで、半導体ウェハ３００の区分３０２
ａに形成された半導体素子２０２，２００・・の各端子
搭載パッドにはんだボール２０８を搭載する場合には、
先ず、区分３０２ａに対応する位置に、区分３０２ａに
倣った外周形状の開口部２６が形成されているマスク板
２４ａをヘッド部１２に装着する。この装着は、Ｘ軸３
２及びＹ軸３４をスライドさせてヘッド部１２をマスク
板２４ａの上方に移動させた後、Ｚ軸をスライドさせて
ヘッド部１２をマスク板２４ａに当接させ、ヘッド部１
２の壁部に形成された真空吸着孔１６ａを真空状態と
し、マスク板２４ａの周縁部を真空吸着することによっ
て行うことができる。更に、マスク板２４ａを吸着した
ヘッド部１２を、図１に示す吸着板１４が載置されてい
る上方に移動し、マスク板２４ａと吸着板１４とを当接
させて装着する。かかる吸着板１４の装着も、ヘッド部
１２の壁部に形成された真空吸着孔１６ｂを真空状態と
する真空吸着によって、吸着板１４の周縁部を真空吸着
することによって行うことができる。Here, section 302 of semiconductor wafer 300
When the solder balls 208 are mounted on the respective terminal mounting pads of the semiconductor elements 202, 200,.
First, a mask plate 24a having an opening 26 having an outer peripheral shape following the section 302a is mounted on the head section 12 at a position corresponding to the section 302a. This installation is X axis 3
2 and the Y axis 34 are slid to move the head unit 12 above the mask plate 24a, and then the Z axis is slid to bring the head unit 12 into contact with the mask plate 24a.
The vacuum suction hole 16a formed in the second wall portion is evacuated and the peripheral portion of the mask plate 24a is vacuum-sucked. Further, the head unit 12 that has sucked the mask plate 24a is moved upward where the suction plate 14 shown in FIG. 1 is placed, and the mask plate 24a and the suction plate 14 are abutted and mounted. The attachment of the suction plate 14 can also be performed by vacuum-suctioning the peripheral portion of the suction plate 14 by vacuum suction in which the vacuum suction holes 16b formed in the wall of the head 12 are evacuated.
【００１９】この様に、マスク板２４ａと吸着板１４と
を装着したヘッド部１２を、はんだボール２０８が収納
された収納容器２１０の上方に移動し、吸引装置を駆動
してヘッド部１２の減圧室１０を減圧状態として吸着板
１４の各吸着孔２２ａにはんだボール２０８を吸着させ
る。この際に、マスク板２４ａの開口部２６に臨む吸着
孔２２ａのみにはんだボール２０８が吸着される。更
に、吸着板１４の所定の吸着孔２２ａにはんだボール２
０８を吸着させた状態を保持しつつ、ヘッド部１２を半
導体ウェハ３００の区分３０２ａの上方に移動させる。
その後、吸着板１４の吸着孔２２ａに吸着されたはんだ
ボール２０８を区分３０２ａの各端子搭載パッドに当接
させた状態で減圧室１０の減圧状態を破ることによっ
て、各端子搭載パッドにはんだボール２０８を搭載でき
る。吸着板１４に吸着したはんだボール２０８を各端子
搭載パッドに搭載した後、ヘッド部１２を所定位置まで
移動させて真空吸着孔１６ｂの真空を破り、吸着板１４
をマスク板２４ａから取り外す。更に、ヘッド部１２を
所定位置に移動させて真空吸着孔１６ａの真空を破り、
マスク板２４ａをヘッド部１２から取り外すことによっ
て、はんだボール２０４を搭載する１サイクルが終了す
る。この様に、マスク板２４ａ〜２４ｉを順次使用する
ことによって、半導体ウェハ３００の各区分に形成され
た半導体素子２０２，２０２・・の各端子搭載パッドに
はんだボール２０８を搭載できる。尚、半導体ウェハ３
００の半導体素子２０２，２０２・・各端子搭載パッド
には、予めスクリーン印刷等によってフラックスを塗布
しておくことが好ましい。As described above, the head unit 12 on which the mask plate 24a and the suction plate 14 are mounted is moved above the storage container 210 in which the solder balls 208 are stored, and the suction device is driven to reduce the pressure of the head unit 12. With the chamber 10 in a reduced pressure state, the solder balls 208 are sucked into the suction holes 22a of the suction plate 14. At this time, the solder ball 208 is sucked only in the suction hole 22a facing the opening 26 of the mask plate 24a. Further, the solder balls 2 are inserted into predetermined suction holes 22a of the suction plate 14.
The head unit 12 is moved above the section 302a of the semiconductor wafer 300 while maintaining the state where 08 is sucked.
Thereafter, the solder balls 208 sucked into the suction holes 22a of the suction plate 14 are brought into contact with the respective terminal mounting pads of the section 302a and the decompression state of the decompression chamber 10 is broken. Can be installed. After mounting the solder ball 208 adsorbed on the suction plate 14 on each terminal mounting pad, the head unit 12 is moved to a predetermined position to break the vacuum of the vacuum suction hole 16b, and the suction plate 14
Is removed from the mask plate 24a. Further, the head unit 12 is moved to a predetermined position to break the vacuum of the vacuum suction hole 16a,
By removing the mask plate 24a from the head section 12, one cycle of mounting the solder balls 204 is completed. In this manner, by sequentially using the mask plates 24a to 24i, the solder balls 208 can be mounted on the respective terminal mounting pads of the semiconductor elements 202 formed in each section of the semiconductor wafer 300. The semiconductor wafer 3
It is preferable that flux is applied to the semiconductor device 202, 202... Each terminal mounting pad in advance by screen printing or the like.
【００２０】図１及び図２に示す吸着装置では、比較的
小径のはんだボール２０８を吸着すべく、ヘッド部１２
に真空吸着したマスク板２４の外面側に、吸着板１４を
装着しているが、比較的大形のはんだボール２０８を吸
着する場合には、図４に示す吸着装置を使用できる。図
４に示す吸着装置では、ヘッド部１２に固着した吸着板
１４の外面側に、マスク板２４を密着させて装着してい
る。かかる吸着装置では、マスク板２４の周縁部のみを
真空吸着孔１６ａによって真空吸着することで足り、そ
の構造を簡単化できる。ところで、図４に示す吸着装置
では、ヘッド部１２に固着した吸着板１４の外面側にマ
スク板２４を着脱可能に装着しているが、ヘッド部１２
に固着した吸着板１４の内面側にマスク板２４を着脱可
能に装着するようにしてもよい。この場合、ヘッド部１
２の横壁に形成した開口部からマスク板２４をスライド
させて吸着板１４の内面側に装着することができる。
尚、マスク板２４を吸着板１４の内面側に装着したと
き、マスク板２４の一部がヘッド部１２の横壁に形成し
た開口部から外方に突出するようにマスク板２４を形成
することによって、マスク板２４の着脱を容易に行うこ
とができる。In the suction device shown in FIGS. 1 and 2, the head unit 12 is used to suction the solder ball 208 having a relatively small diameter.
The suction plate 14 is mounted on the outer surface side of the mask plate 24 that has been vacuum-sucked. When a relatively large solder ball 208 is sucked, the suction device shown in FIG. 4 can be used. In the suction device shown in FIG. 4, a mask plate 24 is attached in close contact with the outer surface of a suction plate 14 fixed to the head unit 12. In such a suction device, it is sufficient to vacuum-suction only the peripheral portion of the mask plate 24 with the vacuum suction holes 16a, and the structure can be simplified. In the suction device shown in FIG. 4, the mask plate 24 is detachably mounted on the outer surface of the suction plate 14 fixed to the head unit 12.
The mask plate 24 may be removably mounted on the inner surface side of the suction plate 14 fixed to the surface. In this case, the head 1
The mask plate 24 can be mounted on the inner surface side of the suction plate 14 by sliding the mask plate 24 through the opening formed in the side wall of the suction plate 2.
When the mask plate 24 is mounted on the inner surface side of the suction plate 14, the mask plate 24 is formed so that a part of the mask plate 24 protrudes outward from an opening formed in the lateral wall of the head unit 12. The attachment and detachment of the mask plate 24 can be easily performed.
【００２１】図４に示す吸着装置では、マスク板２４を
吸着板１４に着脱可能に装着しているが、図５に示す様
に、はんだボール２０８を収納している収納容器２１０
の開口部にマスク板２４を載置するようにしてもよい。
この場合、ヘッド部１２に装着された吸着板１４は、収
納容器２１０の開口部に載置されたマスク板２４に当接
し、マスク板２４の開口部２６に臨む吸着孔２２ａのみ
にはんだボール２０８を吸着することができる。この様
に、ヘッド部１２にマスク板２４を吸着することを要し
ない場合、マスク板２４をヘッド部１２に吸着する吸着
時間を省略でき、はんだボール２０８の搭載に要する搭
載時間を短縮できる。図５において、マスク板１２は、
収納容器２１０の内壁面に沿って形成された載置台２５
上に着脱可能に載置される。このため、図１３に示す半
導体ウェハ３００に作り込まれた半導体素子２０２，２
０２・・の各端子搭載パッドに、はんだボール２０８を
搭載する際には、図６に示す様に、吸着装置のヘッド部
１２の移動手段として用いる三軸ロボット３０の他に、
複数枚のマスク板２４ａ〜２４ｉの各々を収納容器２１
０の載置台２５に順次搭載するマスク板搭載装置５０が
必要となる。In the suction device shown in FIG. 4, the mask plate 24 is detachably mounted on the suction plate 14, but as shown in FIG.
The mask plate 24 may be placed in the opening of the above.
In this case, the suction plate 14 mounted on the head portion 12 comes into contact with the mask plate 24 placed on the opening of the storage container 210, and the solder ball 208 is provided only in the suction hole 22 a facing the opening 26 of the mask plate 24. Can be adsorbed. In this manner, when it is not necessary to adsorb the mask plate 24 to the head portion 12, the adsorbing time for adhering the mask plate 24 to the head portion 12 can be omitted, and the mounting time required for mounting the solder balls 208 can be reduced. In FIG. 5, the mask plate 12
The mounting table 25 formed along the inner wall surface of the storage container 210
It is removably mounted on the top. For this reason, the semiconductor elements 202 and 2 formed in the semiconductor wafer 300 shown in FIG.
When the solder ball 208 is mounted on each of the terminal mounting pads 02..., As shown in FIG. 6, in addition to the three-axis robot 30 used as the moving means of the head unit 12 of the suction device,
Each of the plurality of mask plates 24a to 24i is stored in the storage container 21.
The mask plate mounting device 50 that is mounted sequentially on the mounting table 25 is required.
【００２２】図６に示すマスク板搭載装置５０は、はん
だボール２０８の搭載装置として用いる三軸ロボット３
０と同様の三軸ロボットである。この三軸ロボットは、
Ｘ軸５２に直角に組み合わされたＹ軸５４には、Ｙ軸５
４に対して垂直にＺ軸（図示せず）が組み合わされてい
る。かかる三軸ロボットのＹ軸５４は、Ｘ軸５２に沿っ
て平行にスライド可能であると共に、Ｘ軸５２に対して
直角方向にもスライド可能に設けられている。更に、Ｚ
軸もＹ軸５４に対して垂直方向にスライド可能に設けら
れている。かかる三軸ロボットのＺ軸に、マスク板を着
脱自在に把持する把持装着５６が設けられており、把持
装置５６はＸ軸５２、Ｙ軸５４、Ｚ軸に沿って移動可能
である。尚、把持装置５６には、マスク板を着脱可能に
吸着する真空吸着手段等の把持手段が設けられている。The mask plate mounting device 50 shown in FIG. 6 is a three-axis robot 3 used as a mounting device for the solder balls 208.
A three-axis robot similar to 0. This three-axis robot
The Y axis 54 combined at right angles to the X axis 52 includes a Y axis 5
4 are combined with a Z axis (not shown) perpendicularly. The Y-axis 54 of the three-axis robot is slidable in parallel along the X-axis 52 and slidable in a direction perpendicular to the X-axis 52. Furthermore, Z
The axis is also provided so as to be slidable in the direction perpendicular to the Y axis 54. On the Z axis of such a three-axis robot, there is provided a grip mounting 56 for gripping the mask plate in a detachable manner, and the gripping device 56 is movable along the X axis 52, the Y axis 54, and the Z axis. The holding device 56 is provided with holding means such as a vacuum suction means for detachably holding the mask plate.
【００２３】図６に示す装置を用いて図１３に示す半導
体ウェハ３００に形成された半導体素子２０２，２０２
・・の各端子搭載パッドに、はんだボール２０８を搭載
する際には、形状及び位置が異なる開口部が形成された
複数枚のマスク板２４ａ〜２４ｉ、半導体ウェハ３０
０、及び収納された多数個のはんだボール２０８を振動
又は浮遊等によって分散している収納容器２１０を載置
する。かかるマスク板２４ａ〜２４ｉの各々と半導体ウ
ェハ３００の各区分との対応は、図１に示す場合と同様
であるため、詳細な説明を省略する。ここで、半導体ウ
ェハ３００の区分３０２ａに形成された半導体素子２０
２，２０２・・の各端子搭載パッドにはんだボール２０
８を搭載する場合について説明すると、先ず、区分３０
２ａに対応する位置に、区分３０２ａの外周形状に倣っ
て開口部２６が形成されているマスク板２４ａを、マス
ク板搭載装置５０によって収納容器２１０の開口部に載
置する。かかるマスク板２４ａの載置は、マスク板搭載
装置５０のＹ軸５４をスライドし、把持装置５６に設け
られた真空吸着手段をマスク板２４ａの上方に移動させ
た後、Ｚ軸をスライドさせて把持装置５６の真空吸着手
段をマスク板２４ａに当接させて真空吸着し、マスク板
２４ａを把持する。Semiconductor devices 202, 202 formed on a semiconductor wafer 300 shown in FIG. 13 using the apparatus shown in FIG.
When mounting the solder balls 208 on the respective terminal mounting pads, a plurality of mask plates 24 a to 24 i having openings having different shapes and positions are formed, and the semiconductor wafer 30.
0, and a container 210 in which a large number of the stored solder balls 208 are dispersed by vibration or floating is placed. The correspondence between each of the mask plates 24a to 24i and each section of the semiconductor wafer 300 is the same as that shown in FIG. Here, the semiconductor element 20 formed in the section 302a of the semiconductor wafer 300
Solder balls 20 on each terminal mounting pad
8 will be described first.
The mask plate 24a having the opening 26 formed at the position corresponding to 2a according to the outer peripheral shape of the section 302a is placed on the opening of the storage container 210 by the mask plate mounting device 50. The placement of the mask plate 24a is performed by sliding the Y axis 54 of the mask plate mounting device 50, moving the vacuum suction means provided on the gripping device 56 above the mask plate 24a, and then sliding the Z axis. The vacuum suction means of the gripping device 56 is brought into contact with the mask plate 24a to perform vacuum suction and grip the mask plate 24a.
【００２４】更に、マスク板２４ａを把持した把持装置
５６を、Ｘ軸５２、Ｙ軸５４、Ｚ軸に沿って移動し、は
んだボール２０８が収納された収納容器２１０の上方に
移動する。収納容器２１０の上方に移動したマスク板２
４ａを、収納容器２１０の内壁面に沿って設けられた載
置台２５に当接した後、把持装置５６の真空吸着手段の
真空を破ることによって、マスク板２４ａを載置台２５
に載置できる。次いで、図５に示す吸着装置のヘッド部
１２がＺ軸に装着された三軸ロボット３０を用い、Ｙ軸
３４及びＺ軸をスライドさせることによって、ヘッド部
１２に装着された吸着板１４を、収納容器２１０の開口
部に載置したマスク板２４ａに当接せしめ、マスク板２
４ａの開口部２６に臨む吸着孔２２ａのみにはんだボー
ル２０８を吸着する。その後、吸着板１４の所定の吸着
孔２２ａにはんだボール２０８を吸着させた状態を保持
しつつ、ヘッド部１２を半導体ウェハ３００の区分３０
２ａの上方に移動させる。更に、吸着板１４の吸着孔２
２ａに吸着されたはんだボール２０８を区分３０２ａの
半導体素子２０２，２０２の各端子搭載パッドに当接さ
せた状態で減圧室１０の減圧状態を破ることにより、各
端子搭載パッドにはんだボール２０８を搭載できる。Further, the holding device 56 holding the mask plate 24a is moved along the X-axis 52, the Y-axis 54, and the Z-axis, and is moved above the storage container 210 in which the solder balls 208 are stored. Mask plate 2 moved above storage container 210
4a is brought into contact with the mounting table 25 provided along the inner wall surface of the storage container 210, and then the vacuum of the vacuum suction means of the gripping device 56 is broken.
Can be placed on Next, by using the three-axis robot 30 in which the head unit 12 of the suction device shown in FIG. 5 is mounted on the Z axis, the suction plate 14 mounted on the head unit 12 is moved by sliding the Y axis 34 and the Z axis. The mask plate 24a placed on the opening of the storage container 210 is brought into contact with the
The solder ball 208 is sucked only into the suction hole 22a facing the opening 26 of the solder hole 4a. Thereafter, while maintaining the state where the solder balls 208 are sucked into the predetermined suction holes 22 a of the suction plate 14, the head unit 12 is moved to the section 30 of the semiconductor wafer 300.
2a. Furthermore, the suction holes 2 of the suction plate 14
The solder ball 208 adsorbed on the terminal 2a is brought into contact with the terminal mounting pads of the semiconductor elements 202, 202 in the section 302a, and the decompression state of the decompression chamber 10 is broken to mount the solder ball 208 on each terminal mounting pad. it can.
【００２５】吸着板１４に吸着したはんだボール２０８
を各端子搭載パッドに搭載した後、マスク板２４ａを収
納容器２１０の開口部に搭載した場合の手順と逆の手順
でマスク板搭載装置５０を動作せしめ、収納容器２１０
の開口部に載置されたマスク板２４ａを取り外し所定位
置に移動させることによって、はんだボール２０４を搭
載する１サイクルが終了する。この様に、マスク板２４
ａ〜２４ｉを順次使用することによって、半導体ウェハ
３００の各区分に形成された半導体素子２０２，２０２
・・の各端子搭載パッドにはんだボール２０８を搭載で
きる。尚、半導体ウェハ３００に形成された半導体素子
２０２，２０２・・の各端子搭載パッドには、予めスク
リーン印刷等によってフラックスを塗布しておくことが
好ましい。The solder balls 208 adsorbed on the adsorbing plate 14
Is mounted on each terminal mounting pad, and then the mask plate mounting device 50 is operated in a procedure reverse to the procedure when the mask plate 24a is mounted on the opening of the storage container 210, and the storage container 210
One cycle of mounting the solder balls 204 is completed by removing the mask plate 24a placed on the opening of the solder ball 204 and moving it to a predetermined position. Thus, the mask plate 24
a to 24i, the semiconductor elements 202, 202 formed in each section of the semiconductor wafer 300 are sequentially used.
The solder ball 208 can be mounted on each terminal mounting pad. It is preferable that a flux is applied to the terminal mounting pads of the semiconductor elements 202 formed on the semiconductor wafer 300 in advance by screen printing or the like.
【００２６】ところで、最近、図９に示すＢＧＡ型半導
体装置でも、半導体素子１０４の高集積化等が進展し、
多数個の外部接続端子を装着することが必要となってき
た。このため、外部接続端子としてのはんだボール１１
０を、端子搭載パッド１０８、１０８・・に搭載する際
に、吸着装置を採用することが多くなってきた。かかる
ＢＧＡ型半導体装置に用いられる吸着装置の一例を図７
に示す。図７の吸着装置では、内部に減圧室１０が設け
られたヘッド部１２に固着されたマスク板２４に、吸着
板１４が固着されており、マスク板２４と吸着板１４と
は、減圧室１０の壁面の一部を形成する。かかる吸着板
１４には、ＢＧＡ型半導体装置の各々に対応する吸着孔
群２２が形成されており、吸着孔群２２を形成するマト
リックス状に開口された吸着孔２２ａの各々は、ＢＧＡ
型半導体装置の端子搭載パッド１０８に対応している。Recently, even in the BGA type semiconductor device shown in FIG.
It has become necessary to mount a large number of external connection terminals. Therefore, solder balls 11 as external connection terminals
When mounting the “0” on the terminal mounting pads 108, 108..., A suction device is often used. FIG. 7 shows an example of an adsorption device used for such a BGA type semiconductor device.
Shown in In the suction device of FIG. 7, a suction plate 14 is fixed to a mask plate 24 fixed to a head portion 12 in which a decompression chamber 10 is provided. The mask plate 24 and the suction plate 14 are A part of the wall surface. A group of suction holes 22 corresponding to each of the BGA type semiconductor devices is formed in the suction plate 14, and each of the suction holes 22a opened in a matrix forming the group of suction holes 22 is a BGA type semiconductor device.
Corresponding to the terminal mounting pad 108 of the semiconductor device.
【００２７】更に、マスク板２４には、ＢＧＡ型半導体
装置に形成された端子搭載パッド１０８の形成範囲に倣
って、吸着板１４側の面に開口されている凹溝４０が形
成されている。図７に示すマスク板２４には、図８に示
す様に、吸着板１４側の面に「ロ」字状に開口されてい
る凹溝４０が形成されている。この凹溝４０の底部に
は、減圧室１０に連通する連通孔４２、４２・・が穿設
されており、凹溝４０内を減圧できる。かかるマスク板
２４が装着された吸着板１４では、図７に示す様に、マ
スク板２４に形成された凹溝４０が開口されている部分
の吸着孔２２ａ、２２ａ・・のみが減圧室１０に連通さ
れ、はんだボール１１０を吸着できる。尚、図７に示す
吸着板１４には、三個のＢＧＡ型半導体装置を形成す
る、三個の樹脂回路基板が連接されて成る基板の各ボー
ル状端子搭載パッドに、はんだボール１１０を同時に搭
載可能とすべく、吸着孔２２ａ、２２ａ・・から成る吸
着孔群２２を所定間隔を介して三群形成してある。Further, the mask plate 24 is formed with a concave groove 40 which is opened on the surface on the side of the suction plate 14 so as to follow the formation range of the terminal mounting pad 108 formed on the BGA type semiconductor device. In the mask plate 24 shown in FIG. 7, as shown in FIG. 8, a concave groove 40 which is opened in a “B” shape is formed on the surface on the suction plate 14 side. At the bottom of the groove 40, communication holes 42, 42,... Communicating with the decompression chamber 10 are formed, so that the pressure inside the groove 40 can be reduced. As shown in FIG. 7, in the suction plate 14 on which the mask plate 24 is mounted, only the suction holes 22a, 22a,. The solder balls 110 can be adsorbed and communicated. The solder balls 110 are simultaneously mounted on the ball-shaped terminal mounting pads of the substrate formed by connecting three resin circuit boards, which form three BGA type semiconductor devices, on the suction plate 14 shown in FIG. In order to make it possible, three groups of suction holes 22 formed of suction holes 22a are formed at predetermined intervals.
【００２８】図７に示す吸着装置では、ヘッド部１２に
マスク板２４及び吸着板１４を固着したが、図１に示す
様に、両者を真空吸着等によってヘッド部１２に着脱可
能に装着してもよい。また、図４に示す様に、ヘッド部
１２に固着した吸着板１４に、マスク板２４を真空吸着
等によって着脱可能に装着してもよい。また、図１〜６
においては、半導体ウェハに形成された多数個の半導体
素子の各端子搭載パッドにボール状端子を搭載するボー
ル状端子の吸着装置、ボール状端子の吸着装置用マスク
板、及びボール状端子の搭載方法について説明してきた
が、本発明は図９に示されるＢＧＡ型半導体装置に用い
られる回路着基板等の電子部品が多数個形成されてなる
成る基板に対しても、その基板に形成された各電子部品
の端子搭載パッドにボール状端子を搭載する際にも適用
できる。In the suction device shown in FIG. 7, the mask plate 24 and the suction plate 14 are fixed to the head portion 12, but as shown in FIG. 1, both are detachably mounted on the head portion 12 by vacuum suction or the like. Is also good. Further, as shown in FIG. 4, a mask plate 24 may be detachably mounted on the suction plate 14 fixed to the head portion 12 by vacuum suction or the like. 1 to 6
, A ball-shaped terminal suction device for mounting a ball-shaped terminal on each terminal mounting pad of a large number of semiconductor elements formed on a semiconductor wafer, a mask plate for the ball-shaped terminal suction device, and a mounting method of the ball-shaped terminal Although the present invention has been described, the present invention is also applicable to a substrate formed with a large number of electronic components such as a circuit mounting substrate used in the BGA type semiconductor device shown in FIG. The present invention can also be applied to mounting a ball-shaped terminal on a terminal mounting pad of a component.
【００２９】[0029]
【発明の効果】本発明に係る吸着装置によれば、多数個
の半導体素子や回路基板等の電子部品が形成された半導
体ウェハ等の基板を複数の区分に分け、区分の各々に形
成された電子部品の各端子搭載パッドにボール状端子を
搭載する際に、吸着装置を構成するヘッド部に各区分に
適合するマスク板を選択して装着することによって、同
一の吸着板を用いて基板に形成された多数個の電子部品
の各端子搭載パッドにボール状端子を搭載できる。この
ため、各区分毎に形成された電子部品の各端子搭載パッ
ドに適合する吸着孔を形成した吸着板を形成する場合に
比較して、半導体装置等の最終製品の製造コストを低減
可能である。According to the suction apparatus of the present invention, a substrate such as a semiconductor wafer on which electronic components such as a large number of semiconductor elements and circuit boards are formed is divided into a plurality of sections, and each of the sections is formed in each section. When mounting the ball-shaped terminals on each terminal mounting pad of the electronic component , select and mount a mask plate suitable for each category on the head part constituting the suction device, and use the same suction plate to mount it on the board. A ball-shaped terminal can be mounted on each terminal mounting pad of a large number of formed electronic components . For this reason, it is possible to reduce the manufacturing cost of a final product such as a semiconductor device as compared with a case of forming a suction plate having suction holes that are adapted to each terminal mounting pad of an electronic component formed for each section. .
【図１】本発明に係る吸着装置の一例を説明するための
断面図である。FIG. 1 is a cross-sectional view for explaining an example of an adsorption device according to the present invention.
【図２】図１に示す吸着装置に用いたマスク板２４を説
明するための平面図である。FIG. 2 is a plan view for explaining a mask plate 24 used in the suction device shown in FIG.
【図３】図１に示す吸着装置を用いたボール状端子の搭
載装置を説明するための概略図である。FIG. 3 is a schematic diagram for explaining a mounting device for a ball-shaped terminal using the suction device shown in FIG. 1;
【図４】本発明に係る吸着装置の他の例を説明するため
の断面図である。FIG. 4 is a cross-sectional view for explaining another example of the suction device according to the present invention.
【図５】本発明に係る吸着装置の他の例を説明するため
の断面図である。FIG. 5 is a cross-sectional view for explaining another example of the suction device according to the present invention.
【図６】図６に示す吸着装置を用いたボール状端子の搭
載装置を説明するための概略図である。FIG. 6 is a schematic diagram for explaining a mounting device for a ball-shaped terminal using the suction device shown in FIG. 6;
【図７】ＢＧＡ型半導体装置の端子搭載パッドにボール
状端子を装着する吸着装置を説明するための断面図であ
る。FIG. 7 is a cross-sectional view for explaining a suction device for mounting a ball-shaped terminal on a terminal mounting pad of a BGA type semiconductor device.
【図８】図７に示す吸着装置に用いたマスク板２４を説
明する部分平面図である。8 is a partial plan view illustrating a mask plate 24 used in the suction device shown in FIG.
【図９】半導体装置の一例を説明するための断面図であ
る。FIG. 9 is a cross-sectional view illustrating an example of a semiconductor device.
【図１０】ボール状端子としてのはんだボールを吸着す
る吸着装置の動作を説明するための説明図である。FIG. 10 is an explanatory diagram for explaining an operation of a suction device for suctioning a solder ball as a ball-shaped terminal.
【図１１】ボール状端子としてのはんだボールを吸着す
る吸着装置の動作を説明するための説明図である。FIG. 11 is an explanatory diagram for explaining an operation of a suction device for suctioning a solder ball as a ball-shaped terminal.
【図１２】半導体装置の他の例を説明するための断面図
である。FIG. 12 is a cross-sectional view for explaining another example of the semiconductor device.
【図１３】半導体ウェハではんだボールを搭載する際
に、はんだボールを一度に搭載する範囲を説明する平面
図である。FIG. 13 is a plan view illustrating a range in which the solder balls are mounted at a time when the solder balls are mounted on the semiconductor wafer.
１０ 減圧室 １２ ヘッド部 １４ 吸着板 １６ａ、１６ｂ 真空吸着孔 １８ 孔 ２０ 凹部 ２２ａ 吸着孔 ２２ 吸着孔群 ２４ マスク板 ２６ 開口部 ２８ 穿設孔 ３０ 三軸ロボット ３２、５２ Ｘ軸 ３４、５４ Ｙ軸 ４０ 凹溝 ４２ 連通孔 ５０ マスク板搭載装置 ５６ 把持装置 ２０２ 半導体素子 ３００ 半導体ウェハ ３０２ 区分 DESCRIPTION OF SYMBOLS 10 Decompression chamber 12 Head part 14 Suction plate 16a, 16b Vacuum suction hole 18 hole 20 Depression 22a Suction hole 22 Suction hole group 24 Mask plate 26 Opening 28 Drilling hole 30 Triaxial robot 32, 52 X axis 34, 54 Y axis Reference Signs List 40 concave groove 42 communication hole 50 mask plate mounting device 56 gripping device 202 semiconductor element 300 semiconductor wafer 302 classification
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 平８−18209（ＪＰ，Ａ) 特開 平７−251263（ＪＰ，Ａ) 特開 平８−288288（ＪＰ，Ａ) 特開2000−269257（ＪＰ，Ａ) 特開2000−269253（ＪＰ，Ａ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01L 23/12 B23K 3/06 H01L 21/60 H05K 3/34 ────────────────────────────────────────────────── ─── Continuation of front page (56) References JP-A-8-18209 (JP, A) JP-A-7-251263 (JP, A) JP-A-8-288288 (JP, A) JP-A-2000-269257 (JP, A) JP-A-2000-269253 (JP, A) (58) Fields investigated (Int. Cl. 7 , DB name) H01L 23/12 B23K 3/06 H01L 21/60 H05K 3/34
Claims (10)
された半導体ウェハ等の基板を複数の区分に分け、前記
区分の各々に形成された複数個の電子部品から成る一群
の電子部品の各端子搭載パッドにボール状端子を搭載す
る搭載装置に用いられるボール状端子の吸着装置であっ
て、 該吸着装置を構成するヘッド部に装着される前記ボール
状端子の吸着板には、前記基板を区分する複数の区分の
うち、形成された電子部品の個数が最大となる区分に属
する各電子部品に対応して形成された凹部の底部に、前
記凹部に対応する電子部品の各端子搭載パッドに搭載す
るボール状端子を吸着する吸着孔から成る吸着孔群が穿
設され、 且つ前記吸着板に穿設された吸着孔のうち、前記複数の
区分から選ばれた所定の区分に形成された一群の電子部
品の各端子搭載パッドに対応する吸着孔のみに前記ボー
ル状端子が吸着されるように、前記所定の区分の外周形
状に倣って開口部が形成されて成るマスク板が、前記吸
着板の片面側に装着されていることを特徴とするボール
状端子の吸着装置。A substrate such as a semiconductor wafer on which a large number of electronic components such as semiconductor elements are formed is divided into a plurality of sections, and a group of electronic components including a plurality of electronic components formed in each of the sections is provided. A ball-shaped terminal suction device used in a mounting device for mounting ball terminals on each terminal mounting pad, wherein the ball-shaped terminal suction plate mounted on a head part constituting the suction device includes the substrate among the plurality of sections dividing the genus into sections the number of electronic components formed is maximum
At the bottom of the recess formed for each electronic component
Mount on each terminal mounting pad of the electronic component corresponding to the recess.
And a group of suction holes formed in a predetermined section selected from the plurality of sections among the suction holes formed in the suction plate. A mask plate having an opening formed in accordance with the outer shape of the predetermined section so that the ball-shaped terminal is sucked only in the suction hole corresponding to each terminal mounting pad of the electronic component, A suction device for a ball-shaped terminal, which is mounted on one side.
可能であって、前記ヘッド部に装着された吸着板の内面
側に、前記マスク板が装着されている請求項１記載のボ
ール状端子の吸着装置。2. The ball according to claim 1, wherein the suction plate and the mask plate are detachable from the head unit, and the mask plate is mounted on an inner surface side of the suction plate mounted on the head unit. Terminal suction device.
は外面側に、マスク板が着脱可能に装着されている請求
項１記載のボール状端子の吸着装置。3. The ball-shaped terminal suction device according to claim 1, wherein a mask plate is detachably mounted on an inner surface or an outer surface of the suction plate fixed to the head portion.
に着脱可能に装着されるように、前記吸着板及び／又は
マスク板の周縁部がヘッド部に真空吸着されている請求
項１〜３のいずれか一項記載のボール状端子の吸着装
置。4. A peripheral portion of the suction plate and / or the mask plate is vacuum-adsorbed to the head portion so that the suction plate and / or the mask plate is detachably mounted on the head portion. 4. The suction device for a ball-shaped terminal according to claim 3.
された半導体ウェハ等の基板を複数の区分に分け、前記
区分の各々に形成された複数個の電子部品から成る一群
の電子部品の各端子搭載パッドにボール状端子を搭載す
る搭載装置に用いられるボール状端子の吸着装置であっ
て、 該吸着装置を構成するヘッド部に装着され、前記基板を
区分する複数の区分のうち、形成された電子部品の個数
が最大となる区分の端子搭載パッドに対応して、前記ボ
ール状端子を吸着する吸着孔が穿設された吸着板と、 収納容器に収納された前記ボール状端子に、前記吸着板
が接離動可能となるように前記ヘッド部を移動する移動
手段と、 前記吸着板に穿設された吸着孔のうち、前記区分から選
ばれた所定の区分に形成された一群の電子部品の各端子
搭載パッドに対応する吸着孔のみに前記ボール状端子が
吸着されるように、前記所定の区分の外周形状に倣って
開口部が形成されて成るマスク板とを具備し、 前記ヘッド部が前記収納容器に収納されたボール状端子
に近接した際に、前記マスク板が吸着板の外面側に当接
するように、前記マスク板が収納容器に着脱可能に設け
られていることを特徴とするボール状端子の吸着装置。5. A substrate, such as a semiconductor wafer, on which a large number of electronic components such as semiconductor elements are formed, is divided into a plurality of sections, and a group of electronic components including a plurality of electronic components formed in each of the sections is provided. A ball-shaped terminal suction device used in a mounting device for mounting a ball-shaped terminal on each terminal mounting pad, the device being mounted on a head part constituting the suction device and forming a plurality of sections for dividing the substrate. A suction plate having a suction hole for sucking the ball-shaped terminal corresponding to a terminal mounting pad in a section where the number of electronic components obtained is the largest, and the ball-shaped terminal stored in a storage container, Moving means for moving the head portion so that the suction plate can move toward and away from the head, and a group of suction holes formed in the suction plate formed in a predetermined section selected from the sections. Electronic component mounting terminals A mask plate having an opening formed in accordance with the outer peripheral shape of the predetermined section so that the ball-shaped terminal is sucked only in the suction hole corresponding to the head. A ball-shaped terminal, wherein the mask plate is removably provided in the storage container so that the mask plate comes into contact with the outer surface of the suction plate when approaching the ball-shaped terminal stored in the container. Terminal suction device.
された半導体ウェハ等の基板を複数の区分に分け、前記
区分の各々に形成された複数個の電子部品から成る一群
の電子部品の各端子搭載パッドにボール状端子を搭載す
る際に、 該ボール状端子を吸着する吸着装置として、前記吸着装
置を構成するヘッド部に装着される前記ボール状端子の
吸着板には、前記基板を区分する複数の区分のうち、形
成された電子部品の個数が最大となる区分に属する各電
子部品に対応して形成された凹部の底部に、前記凹部に
対応する電子部品の各端子搭載パッドに搭載するボール
状端子を吸着する吸着孔から成る吸着孔群が穿設され、 且つ前記吸着板に穿設された吸着孔のうち、前記複数の
区分から選ばれた所定の区分に形成された一群の電子部
品の各端子搭載パッドに対応する吸着孔のみに前記ボー
ル状端子が吸着されるように、前記所定の区分の外周形
状に倣って開口部が形成されて成るマスク板が、前記吸
着板の片面側に装着されている吸着装置を用い、 前記吸着板の片面側に着脱可能に装着されたマスク板
を、形状及び／又は位置が異なる開口部が形成された他
のマスク板と交換しつつ、各区分に形成された一群の電
子部品の各端子搭載パッドにボール状端子を搭載する こ
とを特徴とするボール状端子の搭載方法。6. A substrate such as a semiconductor wafer on which a large number of electronic components such as semiconductor elements are formed is divided into a plurality of sections, and a group of electronic components formed of a plurality of electronic components formed in each of the sections is provided. when mounting the ball-shaped terminals in each terminal mounting pads, as an adsorption device for adsorbing the ball-shaped terminal, said suction instrumentation
Of the ball-shaped terminal attached to the head portion constituting the device
The suction plate has a shape among a plurality of sections for dividing the substrate.
Each electronic device belonging to the category with the largest number of electronic components
At the bottom of the recess formed corresponding to the child part,
Ball mounted on each terminal mounting pad of the corresponding electronic component
And a plurality of suction holes formed in the suction plate, the suction holes being formed of suction holes for sucking the terminal.
A group of electronic parts formed in a predetermined section selected from the sections
Only the suction hole corresponding to each terminal mounting pad of the product
Peripheral shape of the predetermined section so that the
A mask plate having an opening formed in a shape similar to the shape of
A mask plate removably mounted on one side of the suction plate using a suction device mounted on one side of the mounting plate.
Other than those having openings formed in different shapes and / or positions
While replacing the mask plate, a group of electricity
A method for mounting a ball-shaped terminal, wherein a ball-shaped terminal is mounted on each terminal mounting pad of a child component .
可能に装着すると共に、前記ヘッド部に装着した吸着板
の内面側に前記マスク板を装着し、前記マス ク板を交換
する際に、前記吸着板を取り外す請求項６記載のボール
状端子の搭載方法。7. An attachment plate and a mask plate are attached to and detached from a head portion.
Attachment plate attached to the head while being attached as possible
The mask plate is mounted on the inner surface side of, replacing the mask plate
7. The method for mounting a ball-shaped terminal according to claim 6 , wherein the suction plate is removed when performing .
の内面側又は外面側にマスク板を着脱可能に装着し、前
記マスク板を交換する際に、前記吸着板を取り外すこと
なくマスク板を取り外す請求項６又は請求項７記載のボ
ール状端子の搭載方法。8. A suction plate is fixed to a head portion, and said suction plate is
Removably attach the mask plate to the inner or outer surface of the
When replacing the mask plate, remove the suction plate
The method for mounting a ball-shaped terminal according to claim 6 or 7, wherein the mask plate is removed without using the mask plate .
に着脱可能に装着すべく、前記吸着板及び／又はマスク
板の周縁部をヘッド部に真空吸着する請求項６〜８のい
ずれか一項記載のボール状端子の搭載方法。9. A head unit comprising:
The suction plate and / or the mask so as to be detachably attached to the
9. The method according to claim 6, wherein the peripheral portion of the plate is vacuum-adsorbed to the head portion.
The method for mounting a ball-shaped terminal according to any one of claims 1 to 4 .
成された半導体ウェハ等の基板を複数の区分に分け、前
記区分の各々に形成された複数個の電子部品から成る一
群の電子部品の各端子搭載パッドに、ボール状端子を吸
着する吸着装置を用いて搭載する際に、 該吸着装置として、前記基板を区分する複数の区分のう
ち、形成された電子部品の個数が最大となる区分の端子
搭載パッドに対応して、前記ボール状端子を吸着する吸
着孔が穿設された吸着板と、前記吸着板がボール状端子
の吸着面に装着されたヘッド部と、収納容器に収納され
た前記ボール状端子に、前記吸着板が接離動可能となる
ように前記ヘッド部を移動する移動手段と、 前記吸着板に穿設された吸着孔のうち、前記複数の区分
から選ばれた所定の区分に形成された一群の電子部品の
各端子搭載パッドに対応する吸着孔のみに前記ボール状
端子が吸着されるように、前記所定の区分毎の外周形状
に倣って開口部が形成されている複数枚のマスクとを備
え、 前記ヘッド部が前記収納容器に収納されたボール状端子
に近接した際に、前記マスク板が吸着板の外面側に当接
するように、前記マスク板が収納容器に着脱可能に設け
られている吸着装置を用い、 前記収納容器に設けられているマスク板を、形状及び／
又は位置が異なる開口部が形成された他のマスク板と交
換しつつ、各区分に形成された一群の電子部品の各端子
搭載パッドにボール状端子を搭載することを特徴とする
ボール状端子の搭載方法。10. A plurality of electronic components such as semiconductor elements are formed.
Divide the formed substrate such as semiconductor wafer into
A plurality of electronic components formed in each of the sections
A ball-shaped terminal is sucked into each terminal mounting pad of the group of electronic components.
When mounting using a suction device to be attached , as the suction device, a plurality of compartments for dividing the substrate are used.
That is, the terminal of the category where the number of formed electronic components is the largest
The suction that absorbs the ball-shaped terminals corresponding to the mounting pads
A suction plate having a hole formed therein, wherein the suction plate is a ball-shaped terminal;
The head mounted on the suction surface of the
The suction plate can be moved toward and away from the ball-shaped terminal.
Moving means for moving the head portion, and the plurality of sections among suction holes formed in the suction plate.
Of a group of electronic components formed in a predetermined section selected from
Only the suction hole corresponding to each terminal mounting pad has the ball shape
The outer peripheral shape for each of the predetermined sections so that the terminals are attracted
A plurality of masks with openings formed
For example, the ball-shaped terminal, wherein the head portion is received in the receiving container
The mask plate abuts the outer surface of the suction plate when approaching
The mask plate is detachably provided in the storage container so that
The mask plate provided in the storage container is shaped and / or
Or, intersect with another mask plate with openings formed at different positions.
In other words, each terminal of a group of electronic components formed in each section
A method of mounting a ball-shaped terminal, wherein the ball-shaped terminal is mounted on a mounting pad .
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000000658A JP3283026B2 (en) | 1999-04-30 | 2000-01-06 | Ball-shaped terminal suction device and ball-shaped terminal mounting method |
| US09/559,039 US6186389B1 (en) | 1999-04-30 | 2000-04-27 | Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| TW089108125A TW466641B (en) | 1999-04-30 | 2000-04-28 | Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| KR1020000022922A KR100583653B1 (en) | 1999-04-30 | 2000-04-28 | Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
| US09/663,720 US6279816B1 (en) | 1999-04-30 | 2000-09-15 | Apparatus and process for mounting conductor balls on terminal pads of semiconductor devices |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12460699 | 1999-04-30 | ||
| JP11-124606 | 1999-04-30 | ||
| JP2000000658A JP3283026B2 (en) | 1999-04-30 | 2000-01-06 | Ball-shaped terminal suction device and ball-shaped terminal mounting method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001015642A JP2001015642A (en) | 2001-01-19 |
| JP3283026B2 true JP3283026B2 (en) | 2002-05-20 |
Family
ID=26461264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000000658A Expired - Fee Related JP3283026B2 (en) | 1999-04-30 | 2000-01-06 | Ball-shaped terminal suction device and ball-shaped terminal mounting method |
Country Status (4)
| Country | Link |
|---|---|
| US (2) | US6186389B1 (en) |
| JP (1) | JP3283026B2 (en) |
| KR (1) | KR100583653B1 (en) |
| TW (1) | TW466641B (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6268275B1 (en) | 1998-10-08 | 2001-07-31 | Micron Technology, Inc. | Method of locating conductive spheres utilizing screen and hopper of solder balls |
| FR2785140B1 (en) * | 1998-10-27 | 2007-04-20 | Novatec Sa Soc | DEVICE FOR PROVIDING BALLS OR PREFORMS FOR THE MANUFACTURE OF BALL CONNECTIONS |
| SG83210A1 (en) * | 1999-06-03 | 2001-09-18 | Shibuya Kogyo Co Ltd | Ball suction head |
| JP4598240B2 (en) * | 1999-06-24 | 2010-12-15 | アスリートＦａ株式会社 | Ball mounting apparatus and ball mounting method |
| KR100430580B1 (en) * | 2001-06-28 | 2004-05-12 | 동부전자 주식회사 | Ball mount module for semiconductor process |
| US6838012B2 (en) * | 2002-10-31 | 2005-01-04 | Lam Research Corporation | Methods for etching dielectric materials |
| JP5080090B2 (en) * | 2007-01-15 | 2012-11-21 | リンテック株式会社 | Holding device and holding method |
| US7506792B1 (en) * | 2007-05-04 | 2009-03-24 | Manfroy John V | Solder sphere placement apparatus |
| JP5056491B2 (en) * | 2007-11-02 | 2012-10-24 | イビデン株式会社 | Solder ball mounting device |
| KR101393334B1 (en) * | 2013-08-26 | 2014-05-12 | 주식회사 포스텔 | Jig for solder ball setting |
| KR20240005424A (en) * | 2022-07-05 | 2024-01-12 | 주식회사 프로텍 | Head Assembly for Mounting Conductive Ball |
Family Cites Families (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0313528A (en) | 1989-06-12 | 1991-01-22 | Nippon Steel Corp | Manufacture of hot rolled steel sheet having excellent workability |
| US5114878A (en) * | 1989-09-11 | 1992-05-19 | Nippon Steel Corporation | Method of bonding bumps to leads of tab tape and an apparatus for arranging bumps used for the same |
| US5284287A (en) * | 1992-08-31 | 1994-02-08 | Motorola, Inc. | Method for attaching conductive balls to a substrate |
| JP3303109B2 (en) * | 1993-05-31 | 2002-07-15 | シチズン時計株式会社 | Solder ball supply device and supply method |
| US5680984A (en) * | 1994-05-13 | 1997-10-28 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting soldering balls onto surfaces of electronic components |
| US5861323A (en) * | 1994-06-06 | 1999-01-19 | Microfab Technologies, Inc. | Process for manufacturing metal ball electrodes for a semiconductor device |
| US5540377A (en) * | 1994-07-15 | 1996-07-30 | Ito; Carl T. | Solder ball placement machine |
| JP3528264B2 (en) * | 1994-08-19 | 2004-05-17 | ソニー株式会社 | Solder ball mounting device |
| US5620927A (en) * | 1995-05-25 | 1997-04-15 | National Semiconductor Corporation | Solder ball attachment machine for semiconductor packages |
| US5839641A (en) * | 1995-08-30 | 1998-11-24 | Industrial Technology Research Institute | Apparatus for placing and aligning solder balls onto solder pads on a substrate for manufacturing IC devices |
| JPH09134923A (en) | 1995-11-10 | 1997-05-20 | Hitachi Ltd | Solder ball feeding device |
| US5749614A (en) * | 1995-12-04 | 1998-05-12 | Motorola, Inc. | Vacuum pickup tool for placing balls in a customized pattern |
| KR100262844B1 (en) * | 1996-04-01 | 2000-09-01 | 모리시타 요이찌 | Loading apparatus of conductive balls and its method |
| US6056190A (en) * | 1997-02-06 | 2000-05-02 | Speedline Technologies, Inc. | Solder ball placement apparatus |
| US6003753A (en) * | 1997-07-14 | 1999-12-21 | Motorola, Inc. | Air-blow solder ball loading system for micro ball grid arrays |
| US6126063A (en) * | 1997-08-14 | 2000-10-03 | Lsi Logic Corporation | Integrated circuit packaging apparatus and method |
| US6107181A (en) * | 1997-09-08 | 2000-08-22 | Fujitsu Limited | Method of forming bumps and template used for forming bumps |
| US6139079A (en) * | 1997-10-20 | 2000-10-31 | Motorola, Inc. | Universal transport apparatus |
| US6100175A (en) * | 1998-08-28 | 2000-08-08 | Micron Technology, Inc. | Method and apparatus for aligning and attaching balls to a substrate |
-
2000
- 2000-01-06 JP JP2000000658A patent/JP3283026B2/en not_active Expired - Fee Related
- 2000-04-27 US US09/559,039 patent/US6186389B1/en not_active Expired - Lifetime
- 2000-04-28 KR KR1020000022922A patent/KR100583653B1/en not_active IP Right Cessation
- 2000-04-28 TW TW089108125A patent/TW466641B/en not_active IP Right Cessation
- 2000-09-15 US US09/663,720 patent/US6279816B1/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001015642A (en) | 2001-01-19 |
| KR20000071865A (en) | 2000-11-25 |
| KR100583653B1 (en) | 2006-05-26 |
| TW466641B (en) | 2001-12-01 |
| US6186389B1 (en) | 2001-02-13 |
| US6279816B1 (en) | 2001-08-28 |
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