[go: up one dir, main page]
More Web Proxy on the site http://driver.im/

JP3133922U - Collective diffusion type LED lamp - Google Patents

Collective diffusion type LED lamp Download PDF

Info

Publication number
JP3133922U
JP3133922U JP2007003586U JP2007003586U JP3133922U JP 3133922 U JP3133922 U JP 3133922U JP 2007003586 U JP2007003586 U JP 2007003586U JP 2007003586 U JP2007003586 U JP 2007003586U JP 3133922 U JP3133922 U JP 3133922U
Authority
JP
Japan
Prior art keywords
cover
led
led lamp
surface side
diffusion type
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
JP2007003586U
Other languages
Japanese (ja)
Inventor
俊次 松本
Original Assignee
光電気通信システム有限会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 光電気通信システム有限会社 filed Critical 光電気通信システム有限会社
Priority to JP2007003586U priority Critical patent/JP3133922U/en
Application granted granted Critical
Publication of JP3133922U publication Critical patent/JP3133922U/en
Priority to KR1020080096548A priority patent/KR20080101832A/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/70Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F21V29/74Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades
    • F21V29/76Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section
    • F21V29/763Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks with fins or blades with essentially identical parallel planar fins or blades, e.g. with comb-like cross-section the planes containing the fins or blades having the direction of the light emitting axis
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2105/00Planar light sources
    • F21Y2105/10Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Landscapes

  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)

Abstract

【課題】光源の近距離範囲を照射するため、LEDランプの光拡散を簡単に行う。
【解決手段】この考案は、基板2の表面側の空間に多数のLED1を突設し、該LED1の表面側を透光性のカバー3で覆う集合型ランプにおいて、上記カバー3をその内面でLED1の突出端を密着状態で埋入させるように形成し、該カバー3断面内でLED1の光を表面側に拡散させるものである。
またカバー3の内面側の一部又は全部をプラスチック材をモールドすることにより形成することもできる。
【選択図】図3
To irradiate a short range of a light source, light diffusion of an LED lamp is easily performed.
In this collective lamp, a large number of LEDs 1 are projected in a space on the surface side of a substrate 2 and the surface side of the LEDs 1 is covered with a translucent cover 3. The protruding end of the LED 1 is formed so as to be embedded in a close contact state, and the light of the LED 1 is diffused to the surface side in the cross section of the cover 3.
Moreover, a part or all of the inner surface side of the cover 3 can be formed by molding a plastic material.
[Selection] Figure 3

Description

この考案は屋外スポット照明、看板照明、建物の壁照明、庭園灯、作業灯(室内外)、集魚灯、水中照明等に用いられる集合拡散型LEDランプに関する。   The present invention relates to a collective diffusion type LED lamp used for outdoor spot lighting, signboard lighting, building wall lighting, garden lights, work lights (indoors and outdoors), fish collection lights, underwater lighting, and the like.

従来上記のような用途で多数のLEDを基盤上に配設し、防水性、放熱性を重視した主として屋外用の集合型LEDランプとして特許文献1が公知である。また一般にLEDランプは光の直進性(集光性)が強いものが多いため、近距離範囲を照射するために光を拡散させる構造としては図5(B)に示すように、透光用のカバー3の内面に凹レンズ状の突起3dを一体的に突設したものや、同図(C)に示すようにカバー3の内面に光を拡散させて透過させるようにリフレクター状又は表面に微細な凹凸を付して拡散透過させるシート状等の拡散部材3eを貼着したものが知られている。
実用新案登録第3129693号
Conventionally, Patent Document 1 is known as a collective LED lamp mainly for outdoor use in which a large number of LEDs are arranged on a base for the above-described uses and importance is attached to waterproofness and heat dissipation. In general, many LED lamps have a strong light straightness (light condensing property). Therefore, as shown in FIG. 5B, a structure for diffusing light to irradiate a short distance range is used. A concave lens-shaped projection 3d is integrally projected on the inner surface of the cover 3, or a reflector or a minute surface on the surface so that light is diffused and transmitted through the inner surface of the cover 3 as shown in FIG. The thing which stuck the diffusion member 3e of the sheet form etc. which attaches unevenness and permeate | transmits and permeate | transmits is known.
Utility model registration No. 3129693

しかし、図5(B)の凹レンズ状突起を設けたものは、各突起毎に円形の光のリングが形成されるため照射面や光源の明るさが不自然に不均一になるほか、凹レンズ状突起形成のための型が必要となるという欠点がある。
また図5(B)のものは拡散部材内面で乱反射が生じ透光量が少なくなるほか、カバー内面に拡散部材を貼付け又はその他の方法で、しかも耐熱条件下で固定する必要がある。
However, in the case where the concave lens-shaped protrusions shown in FIG. 5B are provided, a circular light ring is formed for each protrusion, so that the brightness of the irradiation surface and the light source becomes unnatural and uneven, and a concave lens shape There is a drawback that a mold for forming the protrusion is required.
5 (B) requires diffuse reflection on the inner surface of the diffusing member to reduce the light transmission amount, and it is necessary to attach the diffusing member to the inner surface of the cover or to fix it under other heat-resistant conditions.

上記課題を解決するための本考案のLEDランプは、第1に基板2の表面側の空間に多数のLED1を突設し、該LED1の表面側を透光性のカバー3で覆う集合型ランプにおいて、上記カバー3をその内面でLED1の突出端を密着状態で埋入させるように形成し、該カバー3断面内でLED1の光を表面側に拡散させることを特徴としている。   The LED lamp of the present invention for solving the above problem is a collective lamp in which a number of LEDs 1 are first projected in a space on the surface side of a substrate 2 and the surface side of the LED 1 is covered with a translucent cover 3. The cover 3 is formed so that the protruding end of the LED 1 is embedded in a close contact state on the inner surface thereof, and the light of the LED 1 is diffused to the surface side in the cross section of the cover 3.

第2に、カバー3の内面側の一部又は全部をプラスチック材をモールドすることにより形成したことを特徴としている。   Second, it is characterized in that a part or all of the inner surface side of the cover 3 is formed by molding a plastic material.

第3に、カバー3を予め板状又は皿状に成形し、基板2側に直接又は間接的に固定される外カバー3aと、外カバー3aの内面側でモールドによって成形され、LED1の突出端を埋入させる内カバー3bとで構成することを特徴としている。   Thirdly, the cover 3 is formed in a plate shape or a dish shape in advance, and is formed by molding on the inner surface side of the outer cover 3a and the outer cover 3a that is directly or indirectly fixed to the substrate 2 side. And an inner cover 3b for embedding the material.

第4に、カバー3がLED1の先端及び少なくとも周面の一部と一体的に密着するようにモールド成形されたことを特徴としている。   Fourth, the cover 3 is molded so as to be in close contact with the tip of the LED 1 and at least a part of the peripheral surface.

第5に、カバー3の少なくとも正面側が均一な厚みに形成され、LED1がカバー3の肉厚内に埋入されたことを特徴としている。   Fifth, at least the front side of the cover 3 is formed to have a uniform thickness, and the LED 1 is embedded in the thickness of the cover 3.

第6に、カバー3が透明なプラスチック材よりなることを特徴としている。   Sixth, the cover 3 is made of a transparent plastic material.

第7に、内カバー3bを基板2側の表面に至るまでモールド形成し、LED1の全体を埋入させてなることを特徴としている。   Seventh, the inner cover 3b is molded to reach the surface on the substrate 2 side, and the entire LED 1 is embedded.

以上のように構成される本考案のLEDランプは、照明施工者等において光量及び集光性共に優れた小品種のLEDを備えておけば、LED正面側のカバーへのLEDの埋没深さやカバーの厚み、カバー材料を調節又は選択することにより、任意な光量や拡散率の光源を得ることができる。したがって拡散率や光量の異なる予め多品種のLEDを準備(在庫)する必要がなく経済的である。
また従来のLED光拡散技術のようにカバー側に凹レンズ状の突起を設ける必要もなく、カバー内面に拡散板を介挿する必要もない他、透明カバーを用いた時は最大限の光量で近距離範囲を照射できる利点がある。
If the LED lamp of the present invention configured as described above is equipped with a small-type LED that is excellent in both light quantity and light condensing by the lighting installer, etc., the depth of the LED embedded in the cover on the LED front side and the cover By adjusting or selecting the thickness and the cover material, it is possible to obtain a light source having an arbitrary light amount and diffusivity. Therefore, it is economical because it is not necessary to prepare (stock) various types of LEDs with different diffusivities and light amounts in advance.
Moreover, unlike the conventional LED light diffusion technology, there is no need to provide a concave lens-like protrusion on the cover side, and there is no need to insert a diffusion plate on the inner surface of the cover. There is an advantage that a distance range can be irradiated.

以下図示する本考案の実施形態につき説明すると、図面はいずれも本考案の集合拡散型LEDランプの一実施形態を表し、図1はランプLの配置面(表面)を、図2は正面断面を、図3は部分拡大正面断面をそれぞれ表す。   DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention shown in the drawings will be described below. Each of the drawings represents an embodiment of the collective diffusion type LED lamp of the present invention. FIG. 1 shows an arrangement surface (surface) of the lamp L, and FIG. FIG. 3 shows a partially enlarged front section.

この例ではランプL全体は154×154×40程度の直方体を形成しており、表面に多数(18×18個)のLED1を装着し、裏面にプリント配線された(図示しない)ガラスエポキシ製の樹脂製の基板2が透明なアクリル樹脂製の箱状又は角皿状の外カバー3aの周壁端縁内に収容固定されている。外カバー3aの設置時下方になる位置には、カバー内の圧力解放及び水抜き孔5が設けられている。   In this example, the entire lamp L forms a rectangular parallelepiped of about 154 × 154 × 40, and a large number (18 × 18) of LEDs 1 are mounted on the front surface and printed wiring is provided on the back surface (not shown). A resin substrate 2 is accommodated and fixed in the edge of the peripheral wall of a transparent acrylic resin box-shaped or square dish-shaped outer cover 3a. A pressure release and drainage hole 5 in the cover is provided at a position which is located downward when the outer cover 3a is installed.

前記外カバー3aの内面のLED対向面には、例えばエポキシ樹脂等のプラスチック材を所定の厚みでプレート状にモールドして(流動性のあるプラスチックを流し込んだ(注入した)後硬化させて)なる内カバー3bが形成されている。上記カバー3aと内カバー3bとでカバー3が構成される。   For example, a plastic material such as an epoxy resin is molded into a plate shape with a predetermined thickness on the LED facing surface of the inner surface of the outer cover 3a (flowing plastic is poured (injected) and then cured). An inner cover 3b is formed. The cover 3 is constituted by the cover 3a and the inner cover 3b.

上記内カバー3bのモールド材は次に述べるようにLED1の光を外に向かって拡散透過させるもので、無色透明なものや黄色等任意なものが選択でき、必要に応じ濁りのある白色又はその他の着色をして透過光量を調節することもできる。そしてこの外カバー3aと内カバー3bとは密着接合されるので同色系の材料の場合は両者の接合面は接着状態となって境界線(面)は形成されることはなく、境界面により光の透過が妨げられることはない。   The molding material of the inner cover 3b diffuses and transmits the light of the LED 1 outward as described below, and can be selected from any material such as colorless and transparent, yellow, or turbid white or others as necessary. The amount of transmitted light can be adjusted by coloring. Since the outer cover 3a and the inner cover 3b are tightly joined, in the case of materials of the same color, the joint surfaces of the two are bonded and no boundary line (surface) is formed. The permeation of is not hindered.

また上記内カバー3bの内面側には、モールド時にLEDの突出端が所定の深さS(図5(A)参照)だけ埋入(没)して密着しており、ここでもLED1と内カバー3bとの接合面での境界線は表れず、両者は一体的に接合されている。   Further, the protruding end of the LED is embedded (submerged) by a predetermined depth S (see FIG. 5A) at the time of molding and is in close contact with the inner surface side of the inner cover 3b. The boundary line at the joint surface with 3b does not appear, and both are integrally joined.

この構造により各LED1の埋入部分から放射される光は、内カバー3b及び外カバー3aの断面内で全方向に拡散され、この拡散度合(率)は前記埋没深さSの大小により異なり、Sが大きい程拡散度合も大きくなる。   With this structure, the light emitted from the embedded portion of each LED 1 is diffused in all directions within the cross section of the inner cover 3b and the outer cover 3a, and the degree of diffusion (rate) varies depending on the size of the buried depth S. The greater the S, the greater the degree of diffusion.

外カバー3aの周壁の開口端内側には切欠状の段部4が全周にわたって形成され、該段部4内に若干のクリアランスを介して基板2が収容されている。上記段部4に基板2が押圧挿入されると、段部4の各辺の内周の複数箇所に突設された小突起からなる球面状の係合突起6の下方に入って係止固定され、基板2の反り返りが防止される。   A notch-shaped step 4 is formed on the entire inner periphery of the opening end of the peripheral wall of the outer cover 3a, and the substrate 2 is accommodated in the step 4 with a slight clearance. When the substrate 2 is pressed and inserted into the stepped portion 4, it enters below the spherical engaging projections 6 formed of small projections projecting at a plurality of locations on the inner periphery of each side of the stepped portion 4 and is fixed. Thus, warping of the substrate 2 is prevented.

基板2の背面側には放熱性(熱伝導性)に富んだシリコン樹脂と防水性に優れたシリコン樹脂を混合した外カバー3a及び基板2側と接着力のある樹脂が2mm程度の厚みでモールド等によって充填され、放熱層7が形成されている。この放熱層7は基板2の背面に接着するとともにその外周と段部4内周とのクリアランス部分にも浸入して接着することにより、基板2を固定しカバーの防水性も高める。   On the back side of the substrate 2, an outer cover 3a in which a silicone resin having excellent heat dissipation (thermal conductivity) and a silicone resin having excellent waterproof properties are mixed and a resin having an adhesive force with the substrate 2 side is molded with a thickness of about 2 mm. Etc., and the heat radiation layer 7 is formed. The heat radiation layer 7 is bonded to the back surface of the substrate 2 and also enters and adheres to a clearance portion between the outer periphery and the inner periphery of the step portion 4, thereby fixing the substrate 2 and improving the waterproofness of the cover.

さらに上記放熱層7の背面には、アルミ押出成形材等よりなるヒートシンク(放熱板)8の底面が押接状態で接着固定され、放熱層7はLEDによって過熱した基板2の熱を高い熱伝導によってヒートシンク8に伝導し、放熱を促進する。ヒートシンク8の側面にはランプ取付用の金具(図示しない)を締着するためのボルト孔9が穿設されている。   Further, the bottom surface of a heat sink (heat radiating plate) 8 made of an aluminum extrusion molding material or the like is bonded and fixed to the back surface of the heat radiating layer 7 in a pressed state, and the heat radiating layer 7 conducts heat of the substrate 2 heated by the LED with high heat conduction. Is conducted to the heat sink 8 to promote heat dissipation. Bolt holes 9 are formed in the side surfaces of the heat sink 8 for fastening a lamp mounting bracket (not shown).

また前記基板2は、LED1を装着し且つその背面でプリント配線に接続された状態で、表面側及び裏面側共に耐熱性・耐水性を備えた防水塗料又は接着剤で予めコーティングされた防水膜11が形成されており、LEDの基端部や基板背面のハンダ付部や端子部分からの浸水が防止される。12はカバー3内への配線孔である。   The substrate 2 has a waterproof film 11 that is pre-coated with a waterproof paint or adhesive having heat resistance and water resistance on both the front side and the back side, with the LED 1 mounted and connected to the printed wiring on the back side. Is formed, so that water from the base end portion of the LED, the soldered portion on the back surface of the substrate, and the terminal portion is prevented. Reference numeral 12 denotes a wiring hole into the cover 3.

本実施形態ではDC11〜13.5V、平均1.6A下でLED全体の消費電力は平均19.6Wのものが使用されているが、上記放熱層7がない場合の基板2表面温度80℃に対し、放熱層7を設けたものでは約50℃に低下させることができた。   In this embodiment, the average LED power consumption is 19.6 W under DC 11 to 13.5 V, average 1.6 A, but the surface temperature of the substrate 2 when the heat dissipation layer 7 is not provided is 80 ° C. On the other hand, when the heat dissipation layer 7 was provided, the temperature could be lowered to about 50 ° C.

なお、図示する実施形態では基板2と内カバー3bとの間に空間が形成され、LED1の先端側のみが内カバー3b内に埋入されたものを示したが、前述した埋入深さSを最大限にすると上記空間はなくなり、光の拡散性及び放熱性も向上する。   In the illustrated embodiment, a space is formed between the substrate 2 and the inner cover 3b, and only the front end side of the LED 1 is embedded in the inner cover 3b. When the maximum is set, the above space is eliminated, and the light diffusibility and heat dissipation are improved.

図4(A),(B)は本実施例の場合と内カバー3bを設けない特許文献1の場合の光の拡散状態のイメージの比較図である。本発明の光拡散状態図(A)ではランプLからの光の届く距離は短い(最先端のP2点約1.5m)代わりに、このP2点での照度は約20Luxあり、最大照射面積位置での中心P1点(約0.8m)での照度は約1200Luxある。 4A and 4B are comparison diagrams of images of light diffusion states in the case of the present embodiment and in Patent Document 1 in which the inner cover 3b is not provided. In the light diffusion state diagram (A) of the present invention, the distance that the light from the lamp L reaches is short (the most advanced P 2 point is about 1.5 m), but the illuminance at this P 2 point is about 20 Lux, and the maximum irradiation Illuminance at the center P 1 point (about 0.8 m) at the area position is about 1200 Lux.

これに対し、同図(B)に示す内カバー3bを設けないものでは、P2点(約15.0m)での照度が約5.0Luxで光軸回りの最大照射面積位置での中心P1点(約3.0m)での照度は約700Luxであり、図5(A)の方が明らかにランプL前方の近距離位置が明るいことが判る。 In contrast, those of not provided cover 3b among shown in FIG. (B), the center P of the maximum illumination area position of the optical axis by the illuminance of about 5.0Lux at P 2 point (about 15.0 m) The illuminance at one point (about 3.0 m) is about 700 Lux, and it can be seen that the near distance position in front of the lamp L is clearly brighter in FIG.

本考案のランプの表面を表す平面図である。It is a top view showing the surface of the lamp | ramp of this invention. 本考案のランプの正面断面図である。It is front sectional drawing of the lamp | ramp of this invention. 本考案のランプの部分拡大側面断面図である。It is a partial expanded side sectional view of the lamp of the present invention. (A),(B)は本考案のランプと内カバーを設けないランプの光の照射範囲のイメージ図である。(A), (B) is an image figure of the irradiation range of the light of the lamp | ramp of this invention and the lamp | ramp which does not provide an inner cover. (A)は本考案のランプ、(B),(C)は従来のランプの光拡散構造を示す部分断面図である。(A) is the lamp | ramp of this invention, (B), (C) is a fragmentary sectional view which shows the light-diffusion structure of the conventional lamp | ramp.

符号の説明Explanation of symbols

1 LED
2 基板
3 カバー
3a 外カバー
3b 内カバー
L ランプ
1 LED
2 Board 3 Cover 3a Outer cover 3b Inner cover L Lamp

Claims (7)

基板(2)の表面側の空間に多数のLED(1)を突設し、該LED(1)の表面側を透光性のカバー(3)で覆う集合型ランプにおいて、上記カバー(3)をその内面でLED(1)の突出端を密着状態で埋入させるように形成し、該カバー(3)断面内でLED(1)の光を表面側に拡散させる集合拡散型LEDランプ。   In the collective lamp in which a large number of LEDs (1) are protruded in the space on the surface side of the substrate (2) and the surface side of the LEDs (1) is covered with a translucent cover (3), the cover (3) Is formed so that the protruding end of the LED (1) is embedded in a close contact state on the inner surface thereof, and the light of the LED (1) is diffused to the surface side in the cross section of the cover (3). カバー(3)の内面側の一部又は全部をプラスチック材をモールドすることにより形成した請求項1の集合拡散型LEDランプ。   The collective diffusion type LED lamp according to claim 1, wherein a part or all of the inner surface side of the cover (3) is formed by molding a plastic material. カバー(3)を予め板状又は皿状に成形し、基板(2)側に直接又は間接的に固定される外カバー(3a)と、外カバー(3a)の内面側でモールドによって成形され、LED(1)の突出端を埋入させる内カバー(3b)とで構成する請求項1又は2の集合拡散型LEDランプ。   The cover (3) is previously formed into a plate shape or a dish shape, and is molded by a mold on the inner surface side of the outer cover (3a) and the outer cover (3a) fixed directly or indirectly to the substrate (2) side, The collective diffusion type LED lamp according to claim 1 or 2, comprising an inner cover (3b) for embedding the protruding end of the LED (1). カバー(3)がLED(1)の先端及び少なくとも周面の一部と一体的に密着するようにモールド成形された請求項1又は2又は3の集合拡散型LEDランプ。   The collective diffusion type LED lamp according to claim 1, wherein the cover (3) is molded so as to be in close contact with the tip of the LED (1) and at least a part of the peripheral surface. カバー(3)の少なくとも正面側が均一な厚みに形成され、LED(1)がカバー(3)の肉厚内に埋入された請求項1又は2又は3又は4の集合拡散型LEDランプ。   The collective diffusion type LED lamp according to claim 1, 2 or 3 or 4, wherein at least the front side of the cover (3) is formed to have a uniform thickness, and the LED (1) is embedded in the thickness of the cover (3). カバー(3)が透明なプラスチック材よりなる請求項1又は2又は3又は4又は5の集合拡散型LEDランプ。   The collective diffusion type LED lamp according to claim 1, wherein the cover (3) is made of a transparent plastic material. 内カバー(3b)を基板(2)側の表面に至るまでモールド形成し、LED(1)の全体を埋入させてなる請求項3又は4又は5又は6の集合拡散型LEDランプ。   The collective diffusion type LED lamp according to claim 3, 4, 5, or 6, wherein the inner cover (3 b) is molded to reach the surface on the substrate (2) side, and the entire LED (1) is embedded.
JP2007003586U 2007-05-17 2007-05-17 Collective diffusion type LED lamp Ceased JP3133922U (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2007003586U JP3133922U (en) 2007-05-17 2007-05-17 Collective diffusion type LED lamp
KR1020080096548A KR20080101832A (en) 2007-05-17 2008-10-01 Set diffusion mold led lamp

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007003586U JP3133922U (en) 2007-05-17 2007-05-17 Collective diffusion type LED lamp

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2009246948A Continuation JP4505544B2 (en) 2009-10-27 2009-10-27 Collective diffusion type LED lamp

Publications (1)

Publication Number Publication Date
JP3133922U true JP3133922U (en) 2007-07-26

Family

ID=40287899

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007003586U Ceased JP3133922U (en) 2007-05-17 2007-05-17 Collective diffusion type LED lamp

Country Status (2)

Country Link
JP (1) JP3133922U (en)
KR (1) KR20080101832A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011510455A (en) * 2008-01-16 2011-03-31 ライツ、 キャメラ、 アクション エルエルシイ High light source assembly that can be used underwater

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8974077B2 (en) 2012-07-30 2015-03-10 Ultravision Technologies, Llc Heat sink for LED light source

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011510455A (en) * 2008-01-16 2011-03-31 ライツ、 キャメラ、 アクション エルエルシイ High light source assembly that can be used underwater

Also Published As

Publication number Publication date
KR20080101832A (en) 2008-11-21

Similar Documents

Publication Publication Date Title
JP4505543B2 (en) Collective LED lamp
JP5661455B2 (en) Lighting apparatus and lighting device
EP1705421A2 (en) Led illumination lamp
US9857069B2 (en) Spherical lamp with easy heat dissipation
US20160334066A1 (en) Lighting device and luminaire
JP2008078015A (en) Luminaire
JP2009199958A (en) Illuminating device
KR101079279B1 (en) Round down light using LED
JP4505544B2 (en) Collective diffusion type LED lamp
KR100810149B1 (en) search light using LED
TWM547700U (en) Light module and illuminant mouse pad
JP3133922U (en) Collective diffusion type LED lamp
KR101078850B1 (en) Illumination device using light guide panel
KR200443110Y1 (en) Street lamp
KR101826260B1 (en) Advanced LED lamp apparatus
KR101436366B1 (en) Ceiling light
JP2017021919A (en) Luminaire
CN210717342U (en) LED car lamp
JP2009252451A (en) Cover and illuminating device equipped with this cover
KR20140068517A (en) Led fish-luring lamp
US20110085340A1 (en) LED recessed light with reflection board
KR20140076390A (en) Led fish-luring lamp
JP2014072077A (en) Illumination device
JP2002202740A (en) Signboard of light-emitting diode
KR102471646B1 (en) LED lighting

Legal Events

Date Code Title Description
R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100704

Year of fee payment: 3

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100704

Year of fee payment: 3

S801 Written request for registration of abandonment of right

Free format text: JAPANESE INTERMEDIATE CODE: R321801

ABAN Cancellation of abandonment
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20100704

Year of fee payment: 3

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350