JP3126062U - Printed board - Google Patents
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- JP3126062U JP3126062U JP2006006136U JP2006006136U JP3126062U JP 3126062 U JP3126062 U JP 3126062U JP 2006006136 U JP2006006136 U JP 2006006136U JP 2006006136 U JP2006006136 U JP 2006006136U JP 3126062 U JP3126062 U JP 3126062U
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Abstract
【課題】 基板同士を繋いでいるミシン目で割ったときにミシン目のバリの度合いを少なくでき、割った基板を筐体に取り付けるときにバリが邪魔になる度合いを減らすことができるプリント基板を提供する。
【解決手段】 基板１、１同士を繋いでいるミシン目２で基板１を割るようにしたプリント基板において、ミシン目２の端部２ａ、２ｂがＶ字形に形成され、対向するミシン目２、２間の中央に小円穴３が形成されると共に、この小円穴３の両側位置に小円穴３より大径の円穴４が形成され、円穴４には両側に細長の穴５、６が形成され、細長の穴５、５は小円穴の近傍まで形成されると共に細長の穴６、６の外側の端部はミシン目２の端部２ａ、２ｂより若干離れた位置まで形成されてその端部６ａ、６ａが小Ｖ字形に形成されている。
【選択図】 図１PROBLEM TO BE SOLVED: To provide a printed circuit board capable of reducing the degree of perforation burr when divided by perforations connecting the boards, and reducing the degree of burr getting in the way when attaching the divided board to a housing. provide.
In a printed circuit board in which a substrate 1 is divided by a perforation 2 that connects the substrates 1, 1 to each other, ends 2a, 2b of the perforation 2 are formed in a V shape, and the perforations 2, A small circular hole 3 is formed in the center between the two circular holes 4, and circular holes 4 having a diameter larger than that of the small circular hole 3 are formed at both side positions of the small circular hole 3. 6 is formed, and the elongated holes 5 and 5 are formed to the vicinity of the small circular holes, and the outer ends of the elongated holes 6 and 6 are slightly separated from the ends 2a and 2b of the perforation 2. The ends 6a, 6a are formed in a small V shape.
[Selection] Figure 1
Description
本考案は、基板同士を繋いでいるミシン目で基板を割るようにしたプリント基板に関するものである。 The present invention relates to a printed circuit board in which the substrate is divided by the perforation connecting the substrates.
従来、複数のミシン目が形成された基板を割ったときにできるバリは基板を割るときの力加減によって割れ方にバラツキが生じ、バリの突出度合いがひどいと筐体に取り付ける際に筐体に接触して基板を止めるビスを正しく締めることができない場合があるという問題があった。 Conventionally, burrs that can be generated when a substrate with a plurality of perforations is broken cause variations in cracking due to the force applied when breaking the substrate. There has been a problem that the screw that contacts and stops the substrate may not be correctly tightened.
第１の従来技術を図５、図６（ａ）（ｂ）に示す。この従来のプリント配線板構造は、図５、図６（ａ）（ｂ）に示すように、プリント配線板１０１と捨て板１０２とをつなぐための保持部を、プリント配線板１０１の端部と交差する部分が最もくびれ、捨て板１０１側の幅が広いＶ字形に形成するとともに、捨て板１０２側の幅を最もくびれた部分の幅の２〜５倍としている。スリット１０３に設けられた保持形状１０７は、プリント配線板１０１と捨て板１０２を、電子部品１０４の実装及び工程内搬送の間一時的につなぎ合わせておき、組立完了後に、ニッパの刃１０８により切断し分割するようにしている。（例えば、特許文献１参照）。 The first prior art is shown in FIGS. 5 and 6A and 6B. In this conventional printed wiring board structure, as shown in FIGS. 5, 6 (a) and 6 (b), a holding portion for connecting the printed wiring board 101 and the discarding board 102 is provided as an end portion of the printed wiring board 101. The intersecting portion is narrowest and formed in a V shape having a wide width on the discard plate 101 side, and the width on the discard plate 102 side is 2 to 5 times the width of the narrowest portion. The holding shape 107 provided in the slit 103 temporarily connects the printed wiring board 101 and the discard board 102 during mounting of the electronic component 104 and in-process conveyance, and is cut by the nipper blade 108 after the assembly is completed. And then try to split. (For example, refer to Patent Document 1).
ところが、これにおいては、スリット１０３の長さが長いために弱くて不用意に割れやすくて弱いという問題があった。 However, in this case, there is a problem that the slit 103 is long because it is weak and is easily broken easily and is weak.
第２の従来技術を図７（ａ）（ｂ）に示す。この従来の印刷配線板は、図７（ａ）（ｂ）に示すように、対向する基板端部の板厚方向に設けた一対の切り欠き部２２４と、この切り欠き２２４を基準として形成した切断溝２２５とを有するものである。（例えば、特許文献２参照）。 The second prior art is shown in FIGS. 7 (a) and 7 (b). As shown in FIGS. 7A and 7B, the conventional printed wiring board is formed with a pair of notch portions 224 provided in the thickness direction of the opposite substrate end portions and the notch 224 as a reference. And a cutting groove 225. (For example, refer to Patent Document 2).
ところが、これにおいては、切断溝２２５を形成するために特殊加工を施さなければならないという問題があった。 However, in this case, there is a problem that special processing must be performed to form the cutting groove 225.
第３の従来技術を図８に示す。この従来の印刷配線板は、図８に示すように、基板３０２に端部にＶ字状の切り欠け３０４が設けられているものである。（例えば、特許文献３参照）。 A third prior art is shown in FIG. In this conventional printed wiring board, as shown in FIG. 8, a V-shaped cutout 304 is provided at an end portion of a substrate 302. (For example, refer to Patent Document 3).
ところが、これにおいては、基板３０２の端部にＶ字状の切り欠け３０４が設けられているだけであるから、基板３０２を切り欠け３０４の部分から割るときに、基板３０２の切り欠きを除く部分にバリが生じ、このバリの突出度合いがひどい場合があるという問題があった。
本考案は、上記従来の問題に鑑みてなされたものであって、基板同士を繋いでいるミシン目で割ったときにミシン目のバリの度合いを少なくすることができ、割った基板を筐体に取り付けるときにバリが邪魔になる度合いを減らすことができるプリント基板を提供することを目的としている。 The present invention has been made in view of the above-described conventional problems, and can reduce the degree of perforation burrs when divided by perforations connecting the substrates to each other. An object of the present invention is to provide a printed circuit board that can reduce the degree of the burr getting in the way when it is attached.
本考案は、上記課題を解決するために提案されたものであって、請求項１に記載の考案は、基板同士を繋いでいるミシン目で基板を割るようにしたプリント基板において、ミシン目の端部がＶ字形に形成され、対向する前記ミシン目間の中央に小円穴が形成されると共に、この小円穴の両側位置に前記小円穴より大径の円穴が形成され、前記円穴には両側に細長の穴が形成され、これらの細長の穴は前記小円穴の近傍まで形成されると共に細長の穴の外側の端部は前記ミシン目の端部より若干離れた位置まで形成されてその端部が小Ｖ字形に形成されていることを特徴としている。 The present invention has been proposed in order to solve the above problems, and the device according to claim 1 is a printed circuit board in which a substrate is divided by a perforation connecting the substrates, and the perforation is An end is formed in a V shape, and a small circular hole is formed in the center between the perforations facing each other, and a circular hole having a larger diameter than the small circular hole is formed at both side positions of the small circular hole, In the circular hole, elongated holes are formed on both sides, and these elongated holes are formed to the vicinity of the small circular hole, and the outer end of the elongated hole is located slightly away from the end of the perforation. And its end is formed in a small V-shape.
請求項２に記載の考案は、基板同士を繋いでいるミシン目で基板を割るようにしたプリント基板において、ミシン目の端部がＶ字形に形成され、対向する前記ミシン目間の中央に小穴が形成されると共に、この小穴の両側位置に前記小穴より大径の穴が形成され、前記大径の穴には両側に細長の穴が形成され、これらの細長の穴は前記小穴の近傍まで形成されると共に細長の穴の外側の端部は前記ミシン目の端部より若干離れた位置まで形成されてその端部が小Ｖ字形に形成されていることを特徴としている。 The invention according to claim 2 is a printed circuit board in which the substrates are divided by perforations connecting the substrates, and the end portion of the perforation is formed in a V shape, and a small hole is formed in the center between the opposing perforations. Are formed on both sides of the small hole, and elongated holes are formed on both sides of the large diameter hole. These elongated holes extend to the vicinity of the small hole. In addition, the outer end of the elongated hole is formed to a position slightly apart from the end of the perforation, and the end is formed in a small V shape.
請求項３に記載の考案は、請求項２に記載の考案において、前記対向するミシン目の間には、対向するミシン目の両端まで半田付け可能な導電パターンが両側位置にそれぞれ形成されている。 According to a third aspect of the present invention, in the second aspect of the present invention, between the opposing perforations, conductive patterns that can be soldered to both ends of the opposing perforations are respectively formed at both side positions. .
請求項４に記載の考案は、請求項２又は３に記載の考案において、前記小穴は縦長の小長穴に形成されている。 The device described in claim 4 is the device described in claim 2 or 3, wherein the small hole is formed as a vertically long small hole.
請求項１に記載の考案によれば、基板を割る際に割る力が作用すると、小円穴と細長の穴との間が割れて次に細長の穴とミシン目の間が割れると共に、小円穴の両側に大径の円穴が形成されているから、基板に度合いのひどいバリが発生することなく、バリを少なくすることができる。また、ミシン目の端部がＶ字形に形成され、これと対向する細長の穴の外側の端部が小Ｖ字形に形成されているから、このミシン目の端部と細長の穴との間を割りやすく、このことにより、割った基板のバリの度合いを減らすことができる。このことにより、割った基板を筐体に取り付けるときにバリが邪魔になる度合いを減らすことができる。また、小円穴と大径の円穴を形成しているので、基板に穴を形成しやすい利点がある。 According to the invention described in claim 1, when a breaking force is applied when the substrate is cracked, the small circular hole and the elongated hole are cracked, and then the elongated hole and the perforation are broken. Since large-diameter circular holes are formed on both sides of the circular hole, burrs can be reduced without causing severe burrs on the substrate. Further, since the end of the perforation is formed in a V shape and the outer end of the elongated hole facing the perforation is formed in a small V shape, the gap between the end of the perforation and the elongated hole is formed. This makes it possible to reduce the degree of burrs on the broken substrate. As a result, it is possible to reduce the degree to which the burr becomes an obstacle when the divided substrate is attached to the housing. Moreover, since the small circular hole and the large diameter circular hole are formed, there is an advantage that the hole is easily formed in the substrate.
請求項２に記載の考案によれば、基板を割る際に割る力が作用すると、小穴と細長の穴との間が割れて次に細長の穴とミシン目の間が割れると共に、小穴の両側に大径の穴が形成されているから、基板に度合いのひどいバリが発生することなく、バリを少なくすることができる。また、ミシン目の端部がＶ字形に形成され、これと対向する細長の穴の外側の端部が小Ｖ字形に形成されているから、このミシン目の端部と細長の穴との間を割りやすく、このことにより、割った基板のバリの度合いを減らすことができる。このことにより、割った基板を筐体に取り付けるときにバリが邪魔になる度合いを減らすことができる。 According to the invention described in claim 2, when a breaking force is applied when the substrate is cracked, the small hole and the elongated hole are cracked, and then the elongated hole and the perforation are broken, and both sides of the small hole are formed. Since the large-diameter hole is formed in the substrate, burrs can be reduced without causing severe burrs on the substrate. Further, since the end of the perforation is formed in a V shape and the outer end of the elongated hole facing the perforation is formed in a small V shape, the gap between the end of the perforation and the elongated hole is formed. This makes it possible to reduce the degree of burrs on the broken substrate. As a result, it is possible to reduce the degree to which the burr becomes an obstacle when the divided substrate is attached to the housing.
請求項３に記載の考案によれば、導電パターンを形成したから、基板を割ったときに、バリの発生がこの導電パターンより基板の内側まで入り込むことを阻止することができ、バリの度合いをより一層減らすことができる。 According to the third aspect of the present invention, since the conductive pattern is formed, when the substrate is cracked, it is possible to prevent the generation of burrs from the conductive pattern to the inside of the substrate. It can be further reduced.
請求項４に記載の考案によれば、小穴が縦長の小長穴に形成されているから、基板を割ったときに、この縦長の小長穴より基板の内側までバリが入り込むことを防ぐことができ、度合いのひどいバリの発生を防止することができる。 According to the invention described in claim 4, since the small hole is formed in the vertically long and small hole, when the substrate is broken, the burr is prevented from entering from the vertically long and small hole to the inside of the substrate. And the occurrence of severe burrs can be prevented.
以下、本考案に係るプリント基板の実施の形態について、図を参照しつつ説明する。 Hereinafter, embodiments of a printed circuit board according to the present invention will be described with reference to the drawings.
図１は本考案の第１実施形態のプリント基板の平面図である。 FIG. 1 is a plan view of a printed circuit board according to a first embodiment of the present invention.
この第１実施形態のプリント基板は、図１に示すように、基板１に横方向に向けて複数のミシン目２が形成され、これらのミシン目２の両端部２ａ、２ｂが横向きＶ字形に形成されている。また、基板１の端部にはミシン目２の端部２ａ、２ｂと対向する箇所にＶカット２ｃが形成されている。更に、対向するミシン目２、２間の中央に小円穴３が形成されると共に、この小円穴３の両側位置に小円穴３より大径の円穴４、４が形成されている。円穴４には両側に細長の穴５、６が形成され、内側の細長の穴５は小円穴３の近傍まで形成されると共に外側の細長の穴６の端部６ａはミシン目２より若干離れた位置まで形成されてその端部６ａが小Ｖ字形に形成されている。 In the printed circuit board according to the first embodiment, as shown in FIG. 1, a plurality of perforations 2 are formed in the substrate 1 in the lateral direction, and both end portions 2a and 2b of these perforations 2 are formed in a lateral V-shape. Is formed. Further, a V-cut 2c is formed on the end portion of the substrate 1 at a location facing the end portions 2a and 2b of the perforation 2. Further, a small circular hole 3 is formed at the center between the opposing perforations 2, 2, and circular holes 4, 4 having a diameter larger than that of the small circular hole 3 are formed at both side positions of the small circular hole 3. . The circular hole 4 is formed with elongated holes 5 and 6 on both sides, the inner elongated hole 5 is formed up to the vicinity of the small circular hole 3, and the end 6a of the outer elongated hole 6 is formed from the perforation 2. It is formed to a position slightly apart, and its end 6a is formed in a small V shape.
従って、基板１を割る際に割る力が作用すると、小円穴３と細長の穴５との間が割れて次に外側の細長の穴６とミシン目２の間が割れる。これと共に、小円穴３の両側に大径の円穴４、４が形成されているから、基板１に度合いのひどいバリが発生することなく、バリを少なくすることができる。また、ミシン目２の端部２ａ、２ｂがＶ字形に形成され、これと対向する細長の穴６の外側の端部６ａが小Ｖ字形に形成されているから、このミシン目２の端部２ａ、２ｂと細長の穴６との間を割りやすい。このことにより、割った基板１、１のバリの度合いを減らすことができる。このことにより、割った基板１、１を筐体に取り付けるときにバリが邪魔になる度合いを減らすことができる。また、小円穴３と大径の円穴４、４を形成しているので、基板１に穴を形成しやすい利点がある。 Accordingly, when a breaking force is applied when the substrate 1 is cracked, the small circular hole 3 and the elongated hole 5 are cracked, and the outer elongated hole 6 and the perforation 2 are then broken. At the same time, since the large-diameter circular holes 4 and 4 are formed on both sides of the small circular hole 3, the burrs can be reduced without causing severe burrs on the substrate 1. Further, since the end portions 2a and 2b of the perforation 2 are formed in a V shape and the outer end portion 6a of the elongated hole 6 facing the perforation 2 is formed in a small V shape, the end portion of the perforation 2 is formed. It is easy to split between 2a, 2b and the elongated hole 6. As a result, the degree of burrs on the divided substrates 1 and 1 can be reduced. As a result, it is possible to reduce the degree to which the burr becomes an obstacle when the divided substrates 1 and 1 are attached to the housing. Further, since the small circular hole 3 and the large-diameter circular holes 4 and 4 are formed, there is an advantage that the hole can be easily formed in the substrate 1.
図２は第２実施形態のプリント基板の平面図である。尚、上記した第１実施形態と同一箇所には同一符号を付してその説明を省略する。
この第２実施形態のプリント基板は、図２に示すように、両側のミシン目２、２の間の中央に縦長の小長穴７が形成されている。従って、縦長の小長穴７が形成されているから、基板１を割ったときに、この縦長の小長穴７より基板１の内側までバリが入り込むことを防ぐことができ、度合いのひどいバリの発生を防止することができる。
FIG. 2 is a plan view of the printed circuit board according to the second embodiment. In addition, the same code | symbol is attached | subjected to the same location as above-mentioned 1st Embodiment, and the description is abbreviate | omitted.
In the printed circuit board according to the second embodiment, as shown in FIG. 2, a vertically long small slot 7 is formed at the center between the perforations 2 and 2 on both sides. Accordingly, since the vertically long small holes 7 are formed, it is possible to prevent burrs from entering the inside of the substrate 1 from the vertically long small holes 7 when the substrate 1 is broken. Can be prevented.
図３は第３実施形態のプリント基板の平面図である。尚、上記した第１実施形態と同一箇所には同一符号を付してその説明を省略する。
この第３実施形態のプリント基板は、図３に示すように、対向するミシン目２、２の間には、対向するミシン目２、２の両端部２ａ、２ｂまで半田付け可能な導電パターン８、８が両側位置に形成されている。即ち、これらの導電パターン８、８は小円穴３と大径の円穴４、４の両側位置（図にて上下位置）に形成されている。従って、導電パターン８、８を形成したから、基板１を割ったときに、バリの発生がこの導電パターン８、８より基板１の内側まで入り込むことを阻止することができ、バリの度合いをより一層減らすことができる。
FIG. 3 is a plan view of the printed circuit board according to the third embodiment. In addition, the same code | symbol is attached | subjected to the same location as above-mentioned 1st Embodiment, and the description is abbreviate | omitted.
As shown in FIG. 3, the printed circuit board according to the third embodiment has a conductive pattern 8 that can be soldered between the opposing perforations 2, 2 up to both ends 2a, 2b of the opposing perforations 2, 2. , 8 are formed at both side positions. That is, these conductive patterns 8 and 8 are formed at both side positions (vertical positions in the figure) of the small circular hole 3 and the large diameter circular holes 4 and 4. Therefore, since the conductive patterns 8 and 8 are formed, when the substrate 1 is broken, the generation of burrs can be prevented from entering the substrate 1 from the conductive patterns 8 and 8, and the degree of burrs can be further increased. It can be further reduced.
図４は第４実施形態のプリント基板の平面図である。尚、上記した第２実施形態と同一箇所には同一符号を付してその説明を省略する。 FIG. 4 is a plan view of the printed circuit board according to the fourth embodiment. In addition, the same code | symbol is attached | subjected to the same location as above-mentioned 2nd Embodiment, and the description is abbreviate | omitted.
この第４実施形態のプリント基板は、図４に示すように、対向するミシン目２、２の間には、対向するミシン目２、２の両端部２ａ、２ｂまで半田付け可能な導電パターン８、８が両側位置に形成されている。即ち、これらの導電パターン８、８は縦長の小長穴７と大径の円穴４、４の両側位置（図にて上下位置）に形成されている。従って、導電パターン８、８を形成したから、基板１を割ったときに、バリの発生がこの導電パターン８、８より基板１の内側まで入り込むことを阻止することができ、バリの度合いをより一層減らすことができる。 As shown in FIG. 4, the printed circuit board of the fourth embodiment has a conductive pattern 8 between the opposing perforations 2, 2 that can be soldered to both ends 2 a, 2 b of the opposing perforations 2, 2. , 8 are formed at both side positions. That is, these conductive patterns 8 and 8 are formed at both side positions (vertical positions in the figure) of the vertically long small hole 7 and the large diameter circular holes 4 and 4. Therefore, since the conductive patterns 8 and 8 are formed, when the substrate 1 is broken, the generation of burrs can be prevented from entering the substrate 1 from the conductive patterns 8 and 8, and the degree of burrs can be further increased. It can be further reduced.
尚、上記した各実施形態では、基板１に小円穴３と大径の円穴４が形成されたものについて説明したが、これに限らず、例えば、菱形の穴等の他の形状の穴も適用できることは勿論である。 In each of the above-described embodiments, the substrate 1 is described in which the small circular hole 3 and the large-diameter circular hole 4 are formed. However, the present invention is not limited to this, and for example, a hole having another shape such as a diamond-shaped hole. Of course, it is applicable.
１ 基板
２ ミシン目
２ａ 端部
２ｂ 端部
２ｃ Ｖカット
３ 小円穴
４ 大径の円穴
５ 細長の穴
６ 細長の穴
６ａ 端部
７ 縦長の小長穴
８ 導電パターン
DESCRIPTION OF SYMBOLS 1 Board | substrate 2 Perforation 2a End part 2b End part 2c V cut 3 Small circular hole 4 Large diameter circular hole 5 Elongated hole 6 Elongated hole 6a End part 7 Long elongate small hole 8 Conductive pattern
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006006136U JP3126062U (en) | 2006-07-31 | 2006-07-31 | Printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006006136U JP3126062U (en) | 2006-07-31 | 2006-07-31 | Printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP3126062U true JP3126062U (en) | 2006-10-12 |
Family
ID=43475894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006006136U Expired - Fee Related JP3126062U (en) | 2006-07-31 | 2006-07-31 | Printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3126062U (en) |
-
2006
- 2006-07-31 JP JP2006006136U patent/JP3126062U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A623 | Registrability report |
Free format text: JAPANESE INTERMEDIATE CODE: A623 Effective date: 20060731 |
|
| LAPS | Cancellation because of no payment of annual fees |