JP3121971B2 - Adhesive application method and apparatus and component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface mounting technique in which a chip component is fixed on an electronic circuit board using an adhesive and then soldered to make an electrical connection. The present invention relates to a method and an apparatus for applying an adhesive for fixing, and more particularly to a technique for applying an adhesive to a chip component.

[0002]

2. Description of the Related Art Conventionally, a method of applying a fixing adhesive to prevent falling during flow soldering is to apply a paste-like adhesive to a mounting electrode portion of a chip component so that the adhesive is not applied. In general, a dispenser is used to supply an appropriate amount to the chip component mounting part on the electronic circuit board, mount the chip component in accordance with the electrode part of the chip component, and then heat it collectively with a curing furnace etc. to cure the supplied adhesive. It is a target.

With respect to such a technique, Japanese Patent Application Laid-Open Nos. 3-65920 and 3-217099 disclose a method of inspecting coating quality after supplying an adhesive in order to ensure the quality of bonding of chip components. Have been.

Further, as disclosed in Japanese Patent Application Laid-Open No. Hei 3-201496, there has been proposed a method of mounting a chip component to which an adhesive has been applied in advance at a predetermined position on an electronic circuit board.

[0005]

SUMMARY OF THE INVENTION Among the above prior arts,
In the method of supplying the adhesive onto the electronic circuit board with the dispenser, the gap between the discharge nozzle of the dispenser and the electronic circuit board is not constant due to the warpage of the electronic circuit board, and when the gap is large, the adhesive is applied to the electronic circuit board. Only a small amount is applied and remains on the discharge nozzle. In addition, when the amount of the adhesive is small, dropping of chip components occurs at the time of flow soldering. On the other hand, the adhesive remaining in the discharge nozzle is applied to the portion to be applied in the next step, so that the amount of the adhesive becomes excessive, the adhesive protrudes to the electrode portion of the chip component, and the insulating material is formed at the time of flow soldering. The adhesive which is not used causes soldering non-contact failure.

[0006] As described above, the conventional adhesive application method is as follows.
There has been a problem that it is difficult to control the application of an appropriate amount of adhesive stably on an electronic circuit board. For this reason, Japanese Patent Application Laid-Open No. 3-65
In the technology described in Japanese Patent Application Publication No. 920 and Japanese Patent Application Laid-Open No. Hei 3-217099, the application quality is inspected after the adhesive is supplied to ensure the quality, but the inspection man-hour and the correction man-hour are required. There was a problem that the price became expensive.

Therefore, as described above, a method of directly applying an adhesive to a chip component is desirable. The technique described in Japanese Patent Application Laid-Open No. Hei 3-201496 relates to such a method, but there is a problem in that the application parts are limited because chip parts to which an adhesive is applied in advance are used.

Further, the miniaturization of chip components has progressed.
There is a problem that it is difficult to stably supply an appropriate amount for a part having a size of 0 mm × 0.5 mm, particularly an amount that does not protrude the adhesive to the electrode portion. Therefore, it is restricted at the time of design, it is a situation where it is necessary to collectively mount on one side of the electronic circuit board and connect it by soldering by reflow method,
At present, the degree of freedom in designing when arranging components on a substrate is significantly impaired.

As described above, according to the prior art, a large amount of minute chip components are quickly and quickly bonded.
Checking for that was not considered.

This is because, in general, Japanese Patent Application Laid-Open No. Hei.
No. 6, as described in Japanese Patent Application Laid-Open Publication No. 6 (1994), when the chip component is mounted on the substrate, the position is corrected. There is a problem that two steps of determining whether the shape of the agent is good or not are required, and thus it is not possible to mount components quickly.

Also, as in the above, the technique of simultaneously performing the position correction and the application of the adhesive is indispensable. In this case, too, two steps are required, and it is not possible to meet the demand for quick mounting of components. There was a problem.

Further, since the chip component is very small, there is a problem that it is difficult to keep the distance between the adhesive discharge nozzle and the component flat and constant.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned conventional problems, and an object of the present invention is to apply an adhesive to chip components to mount various types of chip components on an electronic circuit board. It is another object of the present invention to provide an adhesive supply method and a component mounting method for quickly supplying an appropriate amount of adhesive to a chip component stably even if the chip component is minute.

[0014]

[0015]

In order to achieve the above-mentioned object, according to the present invention, there is provided an adhesive applying method for applying an adhesive to a component, comprising: A correction block provided with a means for applying an adhesive to a part, wherein the correction block corrects a positional relationship between the means for transporting the part and the part, and the component included in the correction block. The adhesive is applied by means for applying the adhesive to the surface.

Further, in order to achieve the above object, according to the present invention, there is provided an adhesive applying apparatus, wherein the correcting block in the adhesive applying method is such that the correcting block is in contact with one side surface of the component. And a component presser which is in contact with another side surface of the component and which is left and right at a fixed interval, and a nozzle for applying an adhesive to an intermediate portion between the left and right component pressers, and the left and right component pressers and the adhesive are provided. The nozzle to be applied forms an E-shaped head portion.
Are arranged so that the head portions of the letter "C" face each other.

According to another aspect of the present invention, there is provided an adhesive applying method for applying an adhesive to a part, comprising: a conveying belt having a flat surface; Means for transporting the components, and means for applying an adhesive to the flat surface of the transport belt, and (1) means for applying the adhesive to the flat surface of the transport belt, thereby providing a flat surface of the transport belt. A step of applying an adhesive to the surface,
(2) a step in which the transport belt transports the adhesive applied to the flat surface of the transport belt in the step (1);
(3) a step of transporting the adhesive applied to the flat surface of the transport belt to the upper side by using the means for transporting the component, and (4) placing the adhesive on the transported adhesive. And transferring the adhesive, and performing the steps (1) to (4) in this order, or performing these steps in the order of (1), (3), (2), and (4). Or, after (1), (2) and (3) are performed simultaneously, and then these steps are performed in the order of (4).

More specifically, in the above-mentioned adhesive applying method, there is provided a means for image-recognizing the shape of the adhesive applied to the flat surface of the conveyor belt, and after the step (1), (1 ′) a step of judging the shape of the applied adhesive by means for recognizing the shape of the adhesive applied to the flat surface of the transport belt by image recognition;
(4 ′) a step of placing the component on the conveyed adhesive and transferring the adhesive when the determined shape of the adhesive is good; And the step (4 ′) is performed after the step (1 ′).

Further, in order to achieve the above-mentioned object, another configuration of the invention according to the adhesive application method of the present invention is to apply an adhesive to a component by the above-mentioned adhesive application method, and then to apply the adhesive to a substrate. A component mounting method for adhering to a component, comprising: means for image-recognizing the state of the component; means for transporting the component and means for recognizing the positional relationship between the component and controlling the transport of the component. A) a step of recognizing the positional relationship between the means for transporting the part and the part by means of image recognition of the state of the part, and determining the quality of the shape of the adhesive bonded to the part; In the step (a), when it is determined that the shape of the adhesive is good, the part is removed based on the means for transporting the part recognized in the step (a) and the positional relationship of the part. Control the means of transport Using means for transporting said parts,
In addition to the step of transporting to the substrate and then bonding, the steps (a) and (b) are performed in this order after the step (4).

More specifically, in a component mounting method in which an adhesive is applied to a component by the above-described adhesive application method and then bonded onto a substrate, means for image-recognizing the state of the component, and transporting the component Means for recognizing the positional relationship between the component and the component, and controlling the transport of the component, and (a) means for transporting the component by means of image recognition of the state of the component and the component. And (b) determining whether the shape of the adhesive is good in the step (a). ,
Controlling the means for transporting the component based on the means for transporting the component recognized in the step (a) and the positional relationship of the component, and transporting the component to the substrate using the means for transporting the component; Then, a bonding step is added, and the above (4)
After the step (1), the steps (a) and (b) are performed in this order.

[0021]

According to the first aspect of the invention, the position correction when mounting the bonded components and the determination of the quality of the bonded shape are simultaneously performed, so that the number of steps is reduced, and the efficiency of mounting the components is reduced. Will be improved.

According to the second aspect of the invention, when the position of the component is corrected using the correction block, the application of the adhesive is performed simultaneously, so that the number of steps is reduced. Further, since the gap between the adhesive discharge nozzle and the component is constant, it is possible to supply the adhesive stably.

According to the third aspect of the invention, since the adhesive placed on the flat conveyor belt is transferred and applied, a fixed amount of adhesive can be quickly supplied to the chip component. is there.

Further, a common operation of these inventions is that the adhesive is applied directly to the chip component instead of the electronic circuit board on which the chip component is mounted. It is possible, and since there is no variation in the application amount due to the warpage of the electronic circuit board, an appropriate amount of adhesive can be stably supplied, and a highly reliable electronic circuit board with few defects can be supplied. .

[0025]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments according to the present invention will be described below with reference to FIGS.

Embodiment 1 An embodiment according to the present invention will be described below with reference to FIGS. 5, 1 and 2. FIG. First, referring to FIG. 5, an adhesive application method according to an embodiment of the present invention,
An adhesive application / component mounting device for chip components used in the component mounting method will be described. FIG. 5 is a perspective view showing the appearance of an adhesive applying / part mounting apparatus for chip components used in an adhesive applying method and a mounting method according to one embodiment of the present invention.

The adhesive application / mounting apparatus 11 includes an adhesive application section 12, a component suction robot 13, a component storage section 14, and a defective component discharge section 15.

The adhesive applying / mounting device 11 sucks the chip component 1 from the component storage section 14 by the suction nozzle 5 of the component suction robot 13, and then moves the chip component 1 onto the dispenser device 3, and the discharge nozzle 4 Adhesive 2 is applied to a predetermined portion of the substrate mounting surface of chip component 1.

Here, the substrate mounting surface of the chip component 1 is flat, and the gap between the chip component 1 and the discharge nozzle 4 is controlled by the component suction robot 13 so that the amount of the adhesive 2 is not varied.
It should be noted that an appropriate amount can be supplied stably.

A plurality of discharge nozzles 4 are mounted according to the shape of the chip component 1. Therefore, it is possible to cope with chip components having different sizes by using a dispenser having an appropriate nozzle diameter for applying the adhesive.

After the adhesive is applied to the chip component, the chip component 1 is moved onto the television camera 6, the shape of the chip component 1 is imaged, the positional relationship between the chip component 1 and the suction nozzle 5 is recognized, and The position is corrected and the shape of the adhesive 2 is determined.

Then, the suction nozzle 5 sucking the chip component 1 is moved to a predetermined position on the electronic circuit board 16 which has been transported and positioned at a predetermined position in advance, and the chip component 1 coated with the adhesive 2 is mounted. . If the shape of the adhesive 2 is defective, the chip component 1 is discharged to the defective component discharge unit 15. The present adhesive application / mounting apparatus 11 performs position correction at the time of mounting the chip component 1 and performs imaging for determining the shape of the adhesive 2 with one television camera 6, thereby reducing recognition operation and miniaturizing the apparatus. I'm trying.

Next, an adhesive applying method and a component mounting method according to an embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows an adhesive application method according to an embodiment of the present invention, an adhesive application for chip components used in a component mounting method, an adhesive application and a position correction of a component mounting apparatus, and a determination as to whether or not the adhesive shape is good. Part. FIG. 2 is a front view and a side view of the appearance of the chip component to which the adhesive has been applied.

In the adhesive application / component mounting apparatus for chip components, the chip component 1 is sucked by a suction nozzle 5 from a component storage unit (not shown) and then moved to the dispenser device 3. I do. Then, the adhesive 2 is applied to a predetermined portion of the substrate mounting surface of the chip component 1 between the electrodes 1a and 1b by the ejection nozzle 4 while paying attention so that the adhesive 2 does not adhere to the electrodes 1a and 1b. I do.

Here, since the substrate mounting surface of the chip component 1 is flat and the gap between the chip component 1 and the discharge nozzle 4 can be fixed, the amount of the adhesive 2 can be supplied stably without variation. Keep in mind that you can.

Thereafter, the chip component 1 is moved onto the television camera 6, the shape of the chip component 1 is imaged, the positional relationship between the chip component 1 and the suction nozzle 5 is recognized, and the mounting position is corrected. . Specifically, the position correction is performed by recognizing the relative positional relationship between the chip component 1 and the suction nozzle 5 by the television camera 6 and determining which part of the chip component 1 the suction nozzle 5 is suctioning. Is calculated. Although not shown, this data is used for controlling the movement of the suction nozzle 5 when the chip component 1 is mounted on an electronic circuit board by means for controlling the suction nozzle 5. .

Then, together with the position correction, it is determined whether the shape of the adhesive 2 applied to the chip component 1 is good or not.

When the determination is good, the suction nozzle 5 that has sucked the chip component 1 is moved to a predetermined position on the electronic circuit board (not shown) based on the calculated data, and The chip component 1 to which the agent 2 has been applied is mounted.

Second Embodiment Next, a second embodiment according to the present invention will be described with reference to FIG. FIG. 3 is a perspective view and a top view of a correction block used in the adhesive application method according to the present invention.

The adhesive application / component mounting device for chip components picks up the chip component 1 from the component storage unit (not shown) by the suction nozzle 5 and then applies the chip component 1
The center of the chip part 1 is centered by the correction block 7 so that the center of the chip part 1 is sucked by the suction nozzle 5, and the mounting accuracy is improved. This centering operation is performed by mechanically adjusting the suction nozzle 5 to the center of the chip component 1 when the correction block 7 holds the chip component 1.

At the same time as the centering operation, the adhesive 2 is applied to the electrodes 1a and 1b by the adhesive discharge nozzle 4 attached to the correction block 7 so that the adhesive 2 does not adhere to the electrodes 1a and 1b. Is applied to a predetermined portion sandwiched between the. The place 1c where the adhesive is applied is a corner portion between the bottom surface and the side surface of the chip component 1.

Here, as shown in FIG. 3 (b), the contact surface 7a of the correction block 7 which comes into contact with the chip component 1 during the centering operation, and the adhesive discharge nozzle 4 attached to the correction block 7 Is fixed, and the gap between the side surface of the chip component 1 to which the adhesive 2 is applied and the adhesive discharge nozzle 4 can be fixed, so that the amount of the adhesive 2 is stable and stable. Can be supplied.

Thereafter, the adhesive application / part mounting apparatus for the chip part is moved to the suction nozzle 5 which has sucked the chip part 1.
Is moved to a predetermined position on an electronic circuit board (not shown), and the chip component 1 to which the adhesive 2 is applied is mounted.

Embodiment 3 Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 4 is a perspective view of a main part of an apparatus for applying an adhesive using the flat belt according to the present invention.

In this apparatus, an adhesive 2 is applied onto the flat belt 8 from a discharge nozzle 4 by a dispenser device 3 mounted above a flat belt 8 made of rubber or the like. Here, since the flat belt 8 is flat and the gap between the flat belt 8 and the discharge nozzle 4 can be constant, the amount of the adhesive 2 can be stably supplied without variation.

Next, the adhesive 2 applied on the flat belt 8 is moved by feeding the flat belt 8 by the drive unit 9, and the adhesive 2 is applied by the television camera 6 mounted above the flat belt 8. The shape of the applied adhesive 2 is determined.

Further, the flat belt 8 is fed, and the adhesive 2 is moved.
The chip component 1 is sucked by the suction nozzle 5. Then, the substrate mounting surface of the chip component 1 whose position has been corrected by the centering operation by the correction block is placed on the adhesive 2 applied on the flat belt 8, and the adhesive 2 is applied to the electrodes 1 a and 1 b.
Is transferred to a predetermined portion between the electrodes 1a and 1b on the substrate mounting surface of the chip component 1 while being careful not to adhere.

Here, the adhesive 2 determined to be defective in shape by the television camera 6 is not transferred to the chip component 1, is conveyed as it is, and is removed by the adhesive removing squeegee 10 attached to the surface of the flat belt 8. .

Thereafter, the apparatus moves the suction nozzle 5 sucking the chip component 1 to a predetermined position on an electronic circuit board (not shown) and mounts the chip component 1 coated with the adhesive 2. I do.

It should be noted that the TV camera 6 uses the chip part 1
When the method of recognizing the positional relationship between the chip component 1 and the suction nozzle 5 and correcting the position at the time of mounting is performed by imaging the shape of the chip component 1, the adhesive 2 is transferred to the chip component 1, and then the television camera 6 As in the first embodiment, it is possible to reduce the shape recognition operation by correcting the position at the time of mounting and determining whether or not the shape of the adhesive 2 is good.

[0051]

According to the present invention, when an adhesive is applied to a chip component and various types of chip components are mounted on an electronic circuit board, even if the chip components are minute, they can be quickly removed. In addition, it is possible to provide an adhesive supply method and a component mounting method for stably supplying an appropriate amount of adhesive to a chip component without variation.

[Brief description of the drawings]

FIG. 1 shows a method for applying an adhesive according to an embodiment of the present invention, an adhesive application for chip components used in a component mounting method, an adhesive application and a position correction of a component mounting apparatus, and a determination as to whether or not the shape of the adhesive is good. Part.

2A and 2B are a front view and a side view of the appearance of a chip component to which an adhesive has been applied.

FIG. 3 is a perspective view and a top view of a correction block used in the adhesive application method according to the present invention.

FIG. 4 is a perspective view of a main part of an apparatus for applying an adhesive using a flat belt according to the present invention.

FIG. 5 is a perspective view showing the appearance of an adhesive applying / part mounting apparatus for chip components used in an adhesive applying method and a mounting method according to an embodiment of the present invention.

[Explanation of symbols]

Reference numeral 1 denotes a chip component, 1a, 1b: an electrode of the chip component, 1c
... Place where the adhesive is applied, 2 ... Adhesive, 3 ... Dispenser device, 4 ... Discharge nozzle, 5 ... Suction nozzle, 6 ... TV camera, 7 ... Correcting block, 7a ... Contact surface of the correcting block, 8 ... Flat belt , 9 drive unit, 10 adhesive squeegee, 11 adhesive application and component mounting device, 12
Adhesive application section, 13: component suction robot, 14: component storage section, 15: defective component discharge section, 16: electronic circuit board.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification code FI H05K 13/04 H05K 13/04 Z 13/08 13/08 (72) Inventor Hideki Ono 216 Totsukacho, Totsuka-ku, Yokohama-shi, Kanagawa-ken Hitachi, Ltd. Information and Communication Division (72) Inventor Mitsuhiro Zhang, 216 Totsuka-cho, Totsuka-ku, Yokohama-shi, Kanagawa Prefecture, Hitachi, Ltd. Information and Communication Division (56) References JP-A-3-36788 (JP, A JP-A-3-217099 (JP, A) (58) Fields investigated (Int. Cl. ⁷ , DB name) H05K 3/34 504 B05C 5/00 B05C 13/00 B05D 1/26 B05D 7/24 301 H05K 13/04 H05K 13/08

Claims (6)

(57) [Claims] 1. An adhesive application method for applying an adhesive to a part, comprising: means for transporting the part; and a correction block having means for applying the adhesive to the part, wherein the correction block is used to control the part. An adhesive applying method for applying an adhesive to the component included in the correction block when correcting a positional relationship between the transporting unit and the component. 2. The method for applying an adhesive according to claim 1, wherein said correction block comprises: an opposing component press in contact with one side of a component; and a component press at a fixed left and right distance in contact with another side of the component. And a nozzle for applying an adhesive to an intermediate portion between the left and right component holders, and the left and right component holders and the nozzle for applying the adhesive form an E-shaped head portion. An adhesive coating device, wherein a head portion of a letter E is opposed to the head portion. 3. An adhesive applying method for applying an adhesive to a part, comprising: a conveying belt having a flat surface; means for conveying the part; and means for applying the adhesive to the flat surface of the conveying belt. (1) a step of applying an adhesive to the flat surface of the transport belt by means for applying an adhesive to the flat surface of the transport belt; and (2) a step of applying the adhesive to the flat surface of the transport belt in the step (1). Transporting the adhesive applied to the flat surface of the transport belt; (3) transporting the adhesive applied to the flat surface of the transport belt upward using the means for transporting the component; (4) placing the component on the transported adhesive;
The step of transferring the adhesive, wherein the steps (1) to (4) are performed in this order, or these steps are performed in the order of (1), (3), (2), and (4). Or after (1)
An adhesive application method, wherein (2) and (3) are performed simultaneously, and then these steps are performed in the order of (4). 4. A adhesive application method according to claim 3, wherein includes an image recognizing means the shape of the applied adhesive on a flat surface of the conveyor belt, steps of claim 3, wherein (1) And (1 ') a step of judging the shape of the applied adhesive by means for recognizing an image of the shape of the adhesive applied to the flat surface of the transport belt by adding an image. 3 wherein the (4) process, (4 ') when the shape of the determination adhesives is good, puts on the adhesive which has been conveyed to the component, transferring the adhesive A method of applying an adhesive, wherein the step (4 ') is performed after the step (1') instead of the step. 5. A component mounting method for applying an adhesive to a component by the adhesive applying method according to claim 3 , and then bonding the component to a substrate. Means for recognizing the positional relationship between the means for transporting and the component and controlling the transport of the component, and (a) means for transporting the component by means for image-recognizing the state of the component and the component (B) determining whether the shape of the adhesive adhered to the component is good or not, and (b) determining that the shape of the adhesive is good in the step (a). And controlling the means for transporting the component based on the means for transporting the component recognized in the step (a) and the positional relationship of the component, and transporting the component to the substrate using the means for transporting the component. And then glue Adding extent, after the claim 3, wherein the step of (4), (a), (b)
A component mounting method, wherein the steps are performed in this order. 6. A component mounting method for applying an adhesive to a component by the adhesive applying method according to claim 4 and thereafter bonding the component to a substrate. Means for recognizing the positional relationship between the means for transporting and the component and controlling the transport of the component, and (a) means for transporting the component by means for image-recognizing the state of the component and the component (B) determining whether the shape of the adhesive adhered to the component is good or not, and (b) determining that the shape of the adhesive is good in the step (a). And controlling the means for transporting the component based on the means for transporting the component recognized in the step (a) and the positional relationship of the component, and transporting the component to the substrate using the means for transporting the component. And then glue Adding extent, after the step of claim 4, wherein (4'), (a),
A component mounting method characterized by performing the steps (b) in this order.