JP3110467U - Mating type power semiconductor package equipment - Google Patents

Abstract

A fitting type power semiconductor package device is capable of fitting a spacer material on an upper part of a semiconductor element into the inside thereof, preventing detachment, and mitigating impact at the same time of fitting. Provides excellent protection.
A cup body 30 includes a body 31 of a cup body, an inner wall 32 of the cup body, a groove portion 33 and a heat conducting seat 34, and an annular bang 35 in which the heat conducting seat projects in the vertical direction and a fixed wall projecting in the lateral direction. A buffer bush that contacts the inner wall of the cup body is installed inside the groove, an insulating material is applied around the semiconductor element and the lead body, and an area that does not contact the semiconductor element is insulated, and the body of the cup body Spacer material is injected into the substrate. The fixed wall makes it possible to hold the spacer material in the cup body.
[Selection] Figure 2

Description

  The present invention relates to a fitting type power semiconductor package device, and particularly to a fitting type and applied to an automobile or an industrial diode rectifier.

  The fitting type power semiconductor package device is a fitting type and is applied to an automobile or an industrial diode rectifier. Normally installed in a generator, the AC current is rectified into a DC current. In order to be located in a hot generator, especially the automotive industry, its internal structure requires a high degree of safety. Moreover, since it fits in a rectifier by a close_contact | adherence system, it receives a considerably big stress at the time of fitting.

  The present applicant has already applied for a patent separately, and has obtained a Chinese patent No. 529768 under the name of “fitting type power semiconductor package device”, and its publication date is April 21, 2003. FIG. 1 is a cross-sectional view of a fitting type power semiconductor package device of the technology. This apparatus includes a lead body 10a, a semiconductor element 20a, a cup body 30a, an insulating material 50a, and a spacer material 60a. The semiconductor element 20a is connected to the lead body 10a. Inside the cup body 30a, a cup body body 31a, an inner wall 32a of the cup body, a groove portion 33a and a heat conducting seat 34a are formed, and an annular bang 35a is formed on the upper portion of the heat conducting seat 34a. The heat conducting seat 35a is connected to the semiconductor element 20a. The insulating material 50a is applied to the top of the semiconductor element 20a and the heat conducting seat 34a, and the portion that does not contact the semiconductor element 20a is insulated. The spacer material 60a is coated on the outside of the insulating material 50a.

  In the related art described above, the force generated when fitting is changed, and the changing force generated in the cup body is concentrated in the groove 33a of the cup body 30a, and the semiconductor element 20a located on the heat conducting seat 35a can be protected. . In this way, the problem of impact at the time of fitting of the fitting type power semiconductor package device is solved, the yield at the time of assembling is secured, and the insulating material 50a and the spacer material 60a provide the insulating effect of the semiconductor element 20a and the water vapor isolating effect. We were able to.

  However, the above-described fitting type power semiconductor package apparatus may inject the hard synthetic resin (molding component) 70a into the cup body 31a to protect the semiconductor element 20a. The hard synthetic resin 70a has a property of becoming hard after injection. When fitted into the fitting-type power semiconductor package device, the hard synthetic resin 70a is subjected to force and easily separated from the cup body 31a. On the other hand, since it is a hard material, stress is easily transmitted to the semiconductor element 20a, and it may be broken.

  Therefore, it can be seen from the above description that when the fitting type power semiconductor package device is manufactured and assembled, it is clearly inventive when applied to a product injected with a hard synthetic resin. Therefore, the present applicant has found the present invention that efficiently improves the above-mentioned drawbacks with a rational design based on the idea of pursuing advancement, especially after serious research and the operation of theory.

  The main object of the present invention is to provide a fitting type power semiconductor package device that ensures the protective effect of the semiconductor element and the product yield by engaging the inside of the spacer material on the upper part of the semiconductor element and avoiding the detachment when assembling the fitting. There is to do.

  Another object of the present invention is to provide a fitting type power semiconductor package device capable of simultaneously mitigating the impact at the time of fitting and providing an excellent protective action to the semiconductor element.

  In order to achieve such an object, the fitting type power semiconductor package device of the present invention includes a lead (lead body), a semiconductor element, a cup body, a buffer bush, an insulating material, and a spacer material. The semiconductor element is connected to the lead body. The cup body forms a body of the cup body, an inner wall of the cup body, a groove portion, and a heat conducting seat. The heat-conducting seat forms an annular bang projecting in the longitudinal direction and a fixed wall projecting in the lateral direction. Further, the heat conducting seat is connected to the semiconductor element. The buffer bush surrounds the inside of the groove and contacts the inner wall of the cup body. The insulating material is applied to the upper part of the semiconductor element and the heat conduction seat to insulate the part that does not contact the semiconductor element. The spacer material is poured into the body of the cup body and coated on the insulating material.

  Preferred embodiments of the invention are described in detail below with reference to the drawings. However, these descriptions are for explaining the present invention and do not limit the scope of the present invention.

  2 and 2A are respectively a cross-sectional view of a part of the fitting type power semiconductor package device of the present invention and an enlarged view of a part of A in FIG. The fitting type power semiconductor package device of the present invention provides fitting into the inside of the plate 2, and includes a lead body 10, a semiconductor element 20, and a cup body 30. The bottom portion of the lead body 10 is connected to the semiconductor element 20, and the top portion is connected to other elements. The semiconductor element 20 is a power semiconductor and is installed in the cup body 30.

  FIG. 3 is a cross-sectional view of the cup body of the fitting type power semiconductor package device of the present invention. Inside the cup body 30, a body 31 of the cup body, an inner wall 32 of the cup body, an annular groove portion 33 and a heat conducting seat 34 are formed. The heat-conducting seat 34 protrudes upward inside the cup body 30 at the bottom portion of the cup body 30, and installs the semiconductor element 20 on the flat top portion. The groove portion 33 has an annular shape and is formed around the heat conducting seat 34. The heat conducting seat 34 forms an annular bang 35 projecting in the vertical direction and a fixed wall 36 projecting in the lateral direction. A concave portion 37 is provided at the bottom portion of the cup body 30, and a plurality of slits 38 are formed outside the cup body 30 so as to be in close contact with the mounting holes of the plate 2.

  The heat-conducting seat 34, the cup body 31, and the groove 33 are symmetrically installed inside the cup body 30. The annular bang 35 makes it easy to install the semiconductor element 20 in the center of the heat conducting seat 34.

  The fitting type power semiconductor package device of the present invention further includes a buffer bush 40, is placed so as to surround the inside of the groove 33, and contacts the inner wall 32 of the cup body. No adhesive is used between the buffer bush 40 and the inner wall 32 of the cup body. Therefore, a small gap exists between the inner wall 32 of the cup body. The material of the buffer bush 40 is an elastic material, which can reduce and weaken the external stress during the fitting process. Since the temperature rises to about 200 ° C. at the time of molding, the material of the buffer bush 40 is preferably a material that can withstand 200 ° C. or more.

  An insulating material 50 is applied to the peripheral surfaces of the semiconductor element 20 and the lead body 10. Thereby, the annular bang 35 of the heat conducting seat 34 can prevent the insulating material 50 from flowing into the groove portion 33 of the cup body 30, and the semiconductor element 20 is sealed on the heat conducting seat 34 and is in contact with the semiconductor element 20. Insulate areas that will not. The material of the insulating material 50 may be polyimide, and the polyimide has characteristics of high temperature resistance and high insulation. When the semiconductor element 20 is heated to a high temperature, the heat resistance and insulation characteristics of polyimide are such that the non-contact area between the semiconductor element 20 and the heat conducting seat 34 is insulated, and the non-contact area between the semiconductor element 20 and the lead body 10. To the insulation state. Thereby, when operating the semiconductor element 20 in a high temperature and low temperature state, the amount of electric leakage can be reduced.

  A spacer member 60 is injected into the cup body 31. The spacer material 60 is used to cover the insulating material 50 and the bottom portion of the lead body 10 and protect moisture permeation during the operation of the semiconductor element 20. The material of the spacer material may be epoxy, and the epoxy resin has an excellent moisture-proof effect, and even if the spacer material 60 is in a high or low temperature state, the original moisture-proof characteristics can be exhibited, and the fitting type power semiconductor package The operation of the apparatus can be maintained normally. The fixing wall 36 of the heat-conducting seat 34 meshes with the sbaser 60 of the cup body 31 so that the cup 30 can be prevented from falling off due to pressure during close contact.

  An engagement portion 42 that engages with the spacer member 60 is further formed inside the buffer bush 40 of the present invention, and thereby the buffer bush 40 can be prevented from falling off when fitted. As shown in FIG. 2A, the engaging portion 42 of the buffer bush 40 protrudes toward the cup body 31, and the engaging portion 42 engages in the spacer material 60. The engagement portion of the buffer bush 40 may be concave, and the buffer bush 40 inside the body portion 31 of the cup body is fixed by engaging the spacer member 60 in the engagement.

[Features and features of the present invention]
When the fitting type power semiconductor package device of the present invention is engaged with the mounting hole of the plate 2 by the close contact method, the plate 2 applies a lateral force toward the cup body 30. Since the hardness of the bottom part of the cup body 30 from the heat-conducting seat 34 is larger than the hardness from the bottom part of the groove part 33 to the bottom part of the cup body 30, the curvature variation is concentrated in the groove part 33 and the cup body 30 bottom part. As a result, the bending variation of the heat conducting seat 34 can be reduced, the semiconductor element 20 above the heat conducting seat 34 can be protected so as not to be damaged, and the original effect of the fitting type power semiconductor package device can be maintained.

  Furthermore, the fitting type power semiconductor package device receives an impact from the top to the bottom when fitting into the plate 2. In the present invention, the buffer bushing 40 can reduce and reduce the impact transmitted to the spacer material 60 first, and can prevent the spacer material from being pushed, and the spacer material 60 further reduces the impact applied to the semiconductor element 20. To do. This simultaneously protects the efficacy of the semiconductor element 20.

  A further feature of the present invention is that the spacer member 60 is engaged and fixed by a fixing wall 36 protruding in the lateral direction of the heat conducting seat 34. Even if the cup body 30 is deformed and the spacer material 60 is pushed out, the spacer material 60 is held in the body 31 of the cup body and is not detached. Thereby, the yield of the product after assembling can be ensured.

  As described above, the present invention conforms to the requirements of the utility model and is filed in accordance with the provisions. However, these postings are only examples of the present invention, and are not limited to the scope of the utility model registration request. Uniform changes or amendments according to the utility model registration request are within the full scope of the present invention. Belongs.

It is sectional drawing of the fitting type power semiconductor package apparatus which concerns on a prior art. It is a fragmentary sectional view of the fitting type power semiconductor package device of the present invention. FIG. 3 is an enlarged view of a portion A in FIG. 2. It is a cup body sectional view of the fitting type power semiconductor package device of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fitting type power semiconductor package apparatus 10 Lead body 20 Semiconductor element 30 Cup body 31 Body of cup body 32 Inner wall 33 of cup body 33 Groove part 34 Heat conduction seat 35 Annular bang 36 Fixed wall 37 Recessed part 38 Slit 40 Buffer bushing 42 Engagement part 50 Insulation Material 60 Spacer material 2 Plate

Claims (8)

Lead and
A semiconductor element connected to the lead;
The cup body is formed to have a body of the cup body, an inner wall of the cup body, a groove portion, and a heat conducting seat, and the heat conducting seat forms an annular bang protruding in the vertical direction and a fixed wall projecting in the lateral direction and is connected to the semiconductor element. And a cup body
A buffer bush placed around the groove and in contact with the inner wall of the cup body;
An insulating material that is applied to the semiconductor element and the heat conducting seat and insulates a region that does not contact the semiconductor element;
And a spacer material that is injected into the body of the cup body and covers the insulating material. The heat conducting seat, the cup body and the groove are symmetrically installed inside the cup body,
2. The fitting type power semiconductor package device according to claim 1, wherein the annular bang facilitates placing the semiconductor element on the heat conducting seat when the semiconductor element is placed on the center of the heat conducting seat. 3.   2. The fitting type power semiconductor package device according to claim 1, wherein the material of the insulating material is polyimide.   The fitting type power semiconductor package device according to claim 1, wherein the spacer material is an epoxy resin.   2. The fitting type power semiconductor package device according to claim 1, wherein the buffer bush is elastic and made of a plastic material having a resistance of 200 [deg.] C. or more.   2. The fitting type power semiconductor package device according to claim 1, wherein an inner side of the buffer bush is further engaged with the spacer material.   7. The fitting type power semiconductor package device according to claim 6, wherein an engaging portion that engages with the spacer material in the buffer bush protrudes toward the body of the cup body.   The fitting type power semiconductor package device according to claim 6, wherein a concave portion is provided in a bottom portion of the cup body.

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