JP3102761U - Circuit board assembly - Google Patents

Abstract

Provided is a circuit board assembly that can use a surface printed wiring board and can shorten or eliminate the interval between the printed wiring board and the light emitting unit main body of the light emitting element. In a circuit board assembly, a printed wiring board includes a first conductive pattern formed on a first surface of an insulating substrate and a second conductive pattern formed on a second surface. And a through hole 10 for electrically connecting the first conductor pattern 7 and the second conductor pattern 8, and an insertion hole 11 for inserting the lead 5 of the LED 3 is formed. The light emitting portion main body 4 of the LED 3 is disposed in contact with the printed wiring board 2 on the first surface 9a side, and the lead 5 of the LED 3 is inserted through the insertion hole 11 and soldered to the second conductor pattern 8 on the second surface 2b side. I have. Since the lead 5 is not soldered on the first surface 2a side and no conductor is provided on the inner surface 11a of the insertion hole 11, the LED 3 is not affected by the heat at the time of soldering.
[Selection diagram] Fig. 1

Description

  The present invention relates to a circuit board assembly used for, for example, electric equipment.

Some circuit board assemblies include a light emitting element, for example, a light emitting diode (also referred to as an LED) and a printed wiring board, and the LED is mounted on the printed wiring board.
Printed wiring boards include double-sided printed wiring boards that have conductor patterns on both sides, and double-sided printed wiring boards have through holes that penetrate both sides and have conductors inside that connect the conductor patterns on both sides. There is.

Some LEDs have a light emitting unit main body in which a light emitting diode chip is sealed with a resin member or the like, and a lead led out from the light emitting unit main body.
In order to mount an LED of the type from which such leads are derived on a double-sided printed wiring board, the leads of the LED are inserted into through holes having conductors attached to the inner surface, and the leads and the conductor pattern are formed at the edges of the through holes. And were connected by soldering.

  However, at the time of soldering, even when soldering is performed from the surface opposite to the light emitting unit main body of the LED, the high-temperature molten solder travels along the conductor on the inner surface of the through hole toward the light emitting unit main body of the LED. Therefore, it is necessary to secure a long distance between the surface of the printed wiring board on which the light emitting unit main body of the LED is arranged and the light emitting unit main body so that the heat of the molten solder is not transmitted to the light emitting unit main body of the LED. there were. For example, a spacer is required between the light emitting unit main body and the surface of the printed wiring board on which the light emitting unit main body is mounted, and the number of components has increased.

In addition, when using an LED having a lead with a stopper for securing the above-mentioned interval at a predetermined amount, the spacer can be omitted, but since the above-mentioned interval is long and the LED lead is easily deformed, The positioning accuracy of the direction of the light emitting unit body of the LED is reduced.
When the LED is mounted on a single-sided printed wiring board, the above-mentioned problem does not occur, but the degree of freedom in the layout design of the conductive pattern of the printed wiring board is low. Jumper wires for connecting required parts must be used frequently, which increases the number of parts and the number of assembly steps.

  Therefore, an object of the present invention is to provide a circuit board assembly which can use a double-sided printed wiring board and can shorten or eliminate the interval between the printed wiring board and the light emitting portion main body of the light emitting element.

  A circuit board assembly according to the present invention includes an insulating substrate made of an insulating material, a first conductor pattern formed on a first surface of the insulating substrate, and a second conductor pattern formed on a second surface of the insulating substrate. A through hole that penetrates the insulating substrate and electrically connects the first conductor pattern and the second conductor pattern, and an insertion hole for inserting a lead of the light emitting element is formed penetrating the insulating substrate. A printed wiring board; a light emitting unit main body disposed on the first surface side of the printed wiring board; a light emitting unit main body extending from the light emitting unit main body and inserted through the insertion hole; And a lead soldered to the light emitting element.

  According to this invention, since the first and second conductor patterns are connected to each other via the through hole, the lead does not have to be soldered on the first surface side. Further, since it is not necessary to provide a conductor on the inner surface of the insertion hole, when soldering on the second surface, the molten solder is prevented from entering the insertion hole and does not reach the first surface. Therefore, there is no possibility that the light emitting element is adversely affected by the heat of soldering. As a result, the distance between the light emitting portion main body and the printed wiring board can be shortened or eliminated while using the double-sided printed wiring board. Therefore, for example, the spacer interposed between the light emitting unit main body and the printed wiring board can be eliminated to reduce the number of components.

In the present invention, the light emitting unit body may be in contact with the surface of the printed wiring board on the first surface side. In this case, the light emitting section main body can be easily positioned. In addition, the number of components can be reduced by eliminating the spacer interposed between the light emitting section main body and the printed wiring board.
In the present invention, the first conductor pattern may be provided so as to avoid the light emitting portion main body of the light emitting element. In this case, since the first conductor pattern is not covered with the light emitting portion main body, the first conductor pattern can be easily inspected.

  In the present invention, the light emitting device includes a pair of the leads, the second conductor pattern includes a first portion and a second portion that are insulated from each other, and One of the pair of leads is soldered to the first portion, the other of the pair of leads is soldered to the second portion, and the through hole is formed between the first portion and the first portion. In some cases, the conductive pattern is electrically connected to the conductive pattern. In this case, a structure for mounting a light emitting element having a pair of leads can be configured practically.

  In the present invention, the inner surface of the insertion hole may be an insulating material surface on which the insulating material constituting the insulating substrate is exposed. In this case, the molten solder at the time of soldering can hardly enter the insertion hole, and the structure of the insertion hole can be simplified.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a partial cross-sectional front view of a circuit board assembly according to an embodiment of the present invention, showing a cross section taken along line II of FIG. FIG. 2 is a plan view of the circuit board assembly shown in FIG. FIG. 3 is an exploded perspective view of the circuit board assembly shown in FIG.
The circuit board assembly 1 includes one printed wiring board 2 and a plurality of LEDs 3 (only one is shown) as light emitting elements mounted on the printed wiring board 2.

The LED 3 includes a light emitting unit main body 4 and a plurality of, for example, two leads 5 and 6 vertically extending from the bottom surface 4a of the light emitting unit main body 4 in the same direction. The light emitting section main body 4 is formed by resin-molding a light emitting diode chip (not shown). The LED 3 is mechanically connected to and electrically connected to the printed wiring board 2 by soldering.
It is sufficient that at least one LED 3 is mounted on one printed wiring board 2, and the circuit board assembly 1 may include at least one printed wiring board 2. In the present embodiment, one LED 3 will be described, but the remaining LEDs 3 are similarly configured.

  The printed wiring board 2 has an insulating substrate 9 made of an insulating material. The insulating substrate 9 has a first surface 9a and a second surface 9b arranged on the front and back. The printed wiring board 2 penetrates through the first conductive pattern 7 formed on the first surface 9 a of the insulating substrate 9, the second conductive pattern 8 formed on the second surface 9 b of the insulating substrate 9, and the insulating substrate 9. And a through hole 10 for electrically connecting the first conductor pattern 7 and the second conductor pattern 8. A plurality of, for example, two insertion holes 11 for inserting the leads 5 and 6 of the LED 3 penetrate the insulating substrate 9. It is formed. The insulating substrate 9 electrically insulates the first conductor pattern 7 and the second conductor pattern 8 from each other.

  The printed wiring board 2 has a first surface 2a as a front surface arranged on the front and back, and a second surface 2b as a back surface. The first surface 2a of the printed wiring board 2 includes a surface 7a of the first conductive pattern 7 and a portion of the first surface 9a of the insulating substrate 9 where the first conductive pattern 7 is not formed. The second surface 2b includes a surface 8a of the second conductor pattern 8 and a portion of the second surface 9b of the insulating substrate 9 where the second conductor pattern 8 is not formed.

In the present embodiment, the light emitting unit main body 4 is disposed on the first surface 2a side of the printed wiring board 2, and the bottom surface 4a of the light emitting unit main body 4 is in contact with the first surface 2a. Each lead 5, 6 is inserted through the corresponding insertion hole 11, and is soldered to the second conductor pattern 8 on the second surface 2b side.
The first conductor pattern 7 is provided so as to avoid the light emitting portion main body 4 of the LED 3.
The second conductor pattern 8 has a first portion 12 connected to one lead 5 and a second portion 13 connected to the other lead 6. The first and second portions 12 and 13 of the second conductor pattern 8 are respectively penetrated by the corresponding insertion holes 11, and the portions surrounding the insertion holes 11 connect the corresponding leads 5 and 6 to the corresponding solder connection portions 14. Connected through. Further, the first portion 12 is connected to the first conductor pattern 7 via the through hole 10.

  The through hole 10 is disposed in a portion where the first portion 12 of the first conductor pattern 7 and the first portion 12 of the second conductor pattern 8 overlap, avoiding the light emitting portion main body 4 of the LED 3 in plan view. The through-hole 10 penetrates the first conductor pattern 7 and penetrates the first portion 12 of the second conductor pattern 8, and is formed in a hole shape in the insulating substrate 9, and the first conductor pattern 7 and the second conductor pattern 8 are formed. A conductor 15 that conducts through the first portion 12 is provided on the inner surface of the hole.

The insertion holes 11 are provided according to the number and arrangement of the leads 5 and 6 of the LED 3. The two insertion holes 11 are formed similarly to each other. No conductor is provided on the inner surface 11a of each insertion hole 11, and the insulating material forming the insulating substrate 9 is exposed.
The thickness of the printed wiring board 2 is a required length required to prevent the heat generated during soldering from adversely affecting the light emitting unit main body 4, and is between the soldering unit 14 and the bottom surface 4a of the light emitting unit main body 4. Is equal to or longer than the required length.

  According to the present embodiment, the area of the double-sided printed wiring board 2 in the vicinity of the mounting portion of the LED 3 is a single-sided printed wiring area, and the second conductor pattern 8 to be soldered and connected to the lead 5 in this single-sided printed wiring area. The first portion 12 is connected to the first conductor pattern 7 via the through hole 10. Therefore, the leads 5 and 6 are soldered only on the second surface 2b side, and the conductor patterns 7 and 8 are distributed to both surfaces 2a and 2b of the printed wiring board 2 without soldering on the first surface 2a side. Layout.

  Also, no conductor is provided on the inner surface 11a of the insertion hole 11, and since the inner surface 11a is an insulating material surface having lower solder wettability than the conductor surface, the inner surface 11a is not used for soldering on the second surface 2b side. The molten solder does not reach the first surface 2a through the insertion hole 11. Therefore, there is no possibility that the LED 3 is adversely affected by the heat of soldering. As a result, while using the double-sided printed wiring board 2, the distance between the bottom surface 4 a of the light emitting section main body 4 and the first surface 2 a of the printed wiring board 2 is reduced. Can be shortened or eliminated.

  In the present embodiment, the bottom surface 4a of the light emitting section main body 4 is in contact with the first surface 2a of the printed wiring board 2. Thereby, the light emitting section main body 4 can be easily and accurately positioned on the first surface 2a. For example, when assembling the LED 3 with the bottom surface 4a of the light emitting unit main body 4 along the first surface 2a of the printed wiring board 2, a conventional structure in which the LED 3 is interposed between the light emitting unit main body 4 and the printed wiring board 2 is used. Since the used spacer can be eliminated to reduce the number of components and the direction of the light emitting unit main body 4 can be regulated, the angle adjustment of the mounted LED 3 can be unnecessary.

Further, since the first conductor pattern 7 is provided so as to avoid the light emitting unit main body 4, the first conductor pattern 7 does not need to be covered with the light emitting unit main body 4. As a result, for example, the first conductor pattern 7 can be easily traced, and the first conductor pattern 7 can be easily inspected.
A pair of leads 5 and 6 are soldered to the first and second portions 12 and 13 of the second conductor pattern 8 which are insulated from each other, and the through hole 10 is formed between the first portion 12 and the first conductor pattern 7. And make an electrical connection. In this case, a structure for mounting a light emitting element such as the LED 3 having the pair of leads 5 and 6 can be practically configured.

Further, since the inner surface 11a of the insertion hole 11 is used as the surface of the insulating material of the insulating substrate 9, it is difficult for molten solder to enter the insertion hole 11 at the time of soldering, and the structure of the insertion hole 11 can be simplified.
Furthermore, even if the LED 3 is not recommended to be directly mounted on the printed wiring board 2, it can be used by directly mounting the LED 3 on the printed wiring board 2, thereby increasing the degree of freedom in component selection. Can be.

Further, since the number of jumpers required for the above-described conventional spacer and single-sided printed wiring board can be reduced or eliminated, the number of components can be reduced, and the labor for mounting components can be reduced. it can.
Further, in the conventional circuit board assembly, the solder connection part is also on the first surface side, and is covered with the light emitting part main body, so that the inspection is difficult. On the other hand, in the embodiment of the present invention, the solder connection portion 14 is provided only on the second surface 2b side and does not need to be covered with the light emitting portion main body 4, so that the solder connection portion 14 can be easily inspected.

  In the circuit board assembly 1 of each embodiment of the present invention, for example, a large number of LEDs 3 are arranged in a matrix on the first surface 2a as one surface of the printed wiring board 2, and any LED 3 emits light or turns off. The present invention can be applied to various electric devices such as a display device, a signboard, a lighting device, and the like that display information such as predetermined characters and figures. According to the circuit board assembly 1 of the present embodiment, the distance between the LED 3 and the first surface 2a of the printed wiring board 2 can be shortened, and the light emitting section main body 4 can be positioned with high accuracy. The light is regularly and evenly emitted, and it looks good.

Further, with respect to the above-described embodiment, the following modified examples can be considered. In the following description, the points different from the above-described embodiment will be mainly described, and the description of the same components will be omitted, and the same reference numerals will be used in the drawings.
For example, the printed wiring board 2 in the embodiment described above may have one or a plurality of through holes 10. The through-hole 10 has been described as the through-hole 10. However, the through-hole 10 may or may not have a component mounted thereon, and may be filled with a conductor. It is also conceivable that an insulating material different from the insulating substrate 9 is provided on the inner surface 11a of the insertion hole 11.

The printed wiring board is not limited to a double-sided printed wiring board having a conductor pattern only on the first surface and the second surface of the insulating substrate. For example, the first conductor pattern on the first surface and the second It may be a multilayer printed wiring board (not shown) including at least one layer of a conductive pattern formed insulated from each other between the conductive pattern and the conductive pattern.
In each of the above-described embodiments, the first conductor pattern 7 is provided so as to avoid the light emitting unit main body 4, but is not limited thereto. For example, the first conductor pattern 7 may include a portion covered by the light emitting unit main body 4.

It is also conceivable that the light emitting element has three leads.
In each of the embodiments described above, the light emitting unit main body 4 is in contact with the first surface 2a of the printed wiring board 2, but is not limited thereto. For example, referring to FIG. 4, the thickness of the printed wiring board 2 is a required length for preventing an adverse effect of heat at the time of soldering. When the length is shorter than the required length, a predetermined amount of gap is provided between the first surface 2a of the printed wiring board 2 and the bottom surface 4a of the light emitting section main body 4 so as to secure the required length. You may. Further, the present invention is not limited to such a case, and the above-described gap may be provided. Since this gap can be made smaller, the light emitting section main body 4 is less likely to be inclined with respect to the first surface 2a of the printed wiring board 2, and even if there is a gap, the positioning accuracy of the light emitting section main body 4 is kept high while the above-described conventional technique is maintained. Can be omitted. It is also conceivable to close the gap and interpose a heat-dissipating member (not shown) or the like between the bottom surface 4a of the light emitting unit main body 4 and the first surface 2a of the printed wiring board 2. In addition, various design changes can be made within the scope of the matters described in the utility model registration claims.

FIG. 2 is a partial cross-sectional front view of the circuit board assembly according to the embodiment of the present invention, showing a cross section taken along line II of FIG. 2. FIG. 2 is a plan view of the circuit board assembly shown in FIG. 1. FIG. 2 is an exploded perspective view of the circuit board assembly shown in FIG. FIG. 2 is a partial cross-sectional front view of a circuit board assembly showing a modification of the embodiment of the present invention, showing a cross section corresponding to the II cross section in FIG. 1.

Explanation of reference numerals

DESCRIPTION OF SYMBOLS 1 Circuit board assembly 2 Printed wiring board 2a 1st surface (front surface)
3 LED (light emitting element)
4 Light emitting unit main body 5 Lead (one lead)
6 lead (the other lead)
7 First Conductor Pattern 8 Second Conductor Pattern 9 Insulating Substrate 9a First Surface 9b Second Surface 10 Through Hole 11 Insert Hole 11a Inner Surface (of Insert Hole) 12 First Part 13 Second Part

Claims (5)

An insulating substrate made of an insulating material; a first conductor pattern formed on a first surface of the insulating substrate; a second conductor pattern formed on a second surface of the insulating substrate; A printed wiring board comprising: a through hole for electrically connecting the first conductive pattern and the second conductive pattern; and an insertion hole for inserting a lead of the light emitting element formed through the insulating substrate; and the printed wiring board. A light emitting portion main body disposed on the first surface side, and a lead extending from the light emitting portion main body, inserted through the insertion hole, and soldered to the second conductor pattern on the second surface side. A circuit board assembly comprising a light emitting device.   2. The circuit board assembly according to claim 1, wherein the light emitting unit main body is in contact with a surface of the printed wiring board on the first surface side. 3.   3. The circuit board assembly according to claim 1, wherein the first conductor pattern is provided so as to avoid a light emitting portion main body of the light emitting element. 4. The circuit board assembly according to any one of claims 1 to 3,
The light emitting element includes a pair of the leads,
The second conductor pattern has a first portion and a second portion that are insulated from each other,
One of the pair of leads is soldered to the first portion, and the other of the pair of leads is soldered to the second portion,
The circuit board assembly, wherein the through hole electrically connects the first portion and the first conductor pattern.   5. The circuit board assembly according to claim 1, wherein an inner surface of the insertion hole is an insulating material surface on which an insulating material forming the insulating substrate is exposed.

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