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JP3100692B2 - Method for manufacturing CuInSe2-based photoelectric conversion element - Google Patents

Method for manufacturing CuInSe2-based photoelectric conversion element

Info

Publication number
JP3100692B2
JP3100692B2 JP03230912A JP23091291A JP3100692B2 JP 3100692 B2 JP3100692 B2 JP 3100692B2 JP 03230912 A JP03230912 A JP 03230912A JP 23091291 A JP23091291 A JP 23091291A JP 3100692 B2 JP3100692 B2 JP 3100692B2
Authority
JP
Japan
Prior art keywords
cuinse
film
photoelectric conversion
etching
conversion element
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP03230912A
Other languages
Japanese (ja)
Other versions
JPH0548141A (en
Inventor
克夫 菅野
典也 石田
裕 光根
和人 伊藤
英治 菊地
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dowa Holdings Co Ltd
Original Assignee
Dowa Holdings Co Ltd
Dowa Mining Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dowa Holdings Co Ltd, Dowa Mining Co Ltd filed Critical Dowa Holdings Co Ltd
Priority to JP03230912A priority Critical patent/JP3100692B2/en
Publication of JPH0548141A publication Critical patent/JPH0548141A/en
Application granted granted Critical
Publication of JP3100692B2 publication Critical patent/JP3100692B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02EREDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00Energy generation through renewable energy sources
    • Y02E10/50Photovoltaic [PV] energy
    • Y02E10/541CuInSe2 material PV cells

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  • Photovoltaic Devices (AREA)
  • Weting (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、薄膜作製が可能で、か
つ広い波長範囲にわたって光吸収係数が大きい直接遷移
半導体であるカルコパイライト型CuInSe2 を用い
た光電変換素子の作製方法に関し、さらに詳しくは、p
n接合を形成する前に、CuInSe2 層の表面処理を
行って該素子の光起電力を向上させることを特徴とする
上記光電変換素子の作製方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a photoelectric conversion device using chalcopyrite type CuInSe 2 which is a direct transition semiconductor capable of forming a thin film and having a large light absorption coefficient over a wide wavelength range. Is p
The present invention relates to a method for manufacturing the photoelectric conversion element, wherein a surface treatment of a CuInSe 2 layer is performed before an n-junction is formed to improve photovoltaic power of the element.

【0002】[0002]

【従来の技術】従来公知のCuInSe2 系光電変換素
子作製方法においても、p形CuInSe2 層にn形半
導体層を積層してpn接合する際に、前処理として 2%
の臭素を含む臭素−メタノール溶液でエッチング[Solar
Cells, 16, 529 (1986)] 処理することや、特性の面内
均一化を目的として臭素水溶液でエッチング [米国特許
第 4,909,863号] 処理することなどが行われていた。
2. Description of the Related Art In a conventionally known method for manufacturing a CuInSe 2 -based photoelectric conversion element, when an n-type semiconductor layer is laminated on a p-type CuInSe 2 layer and pn junction is performed, 2%
Etching with bromine-methanol solution containing bromine [Solar
Cells, 16 , 529 (1986)], and etching with an aqueous bromine solution [US Pat. No. 4,909,863] for the purpose of in-plane uniformity of characteristics.

【0003】しかしながら、臭素−メタノール溶液での
エッチングは、エッチング速度が大きいためエッチング
量の制御が困難で、CuInSe2 薄膜のエッチングに
は適さないものであった。
However, the etching with a bromine-methanol solution is difficult to control the etching amount due to the high etching rate, and is not suitable for etching a CuInSe 2 thin film.

【0004】また、特性の面内均一化を目的とするCu
InSe2 膜表面の平滑化のために臭素水溶液でエッチ
ングを行う場合には、エッチングを 0.1〜1.5 μm程度
の厚さで行わなければならないことから、この処理を、
たとえば 0.1μm以下という薄い膜を対象として行うこ
とは全く考えられていなかった。
[0004] Further, Cu for the purpose of uniforming the characteristics in the plane is used.
When performing etching with a bromine aqueous solution for smoothing the surface of the InSe 2 film, the etching must be performed with a thickness of about 0.1 to 1.5 μm.
For example, it has never been considered to perform the method for a thin film having a thickness of 0.1 μm or less.

【0005】さらに、 0.1〜1.5 μmの厚さのエッチン
グを比較的短時間で行うためには、臭素水溶液の臭素濃
度を 0.02 mol/l 以上とすることが必要であることか
ら、前記表面平滑化のためのエッチング処理においては
比較的多量の臭素を使用しなければならず安全性・経済
性の点で問題があった。
Further, in order to perform etching of a thickness of 0.1 to 1.5 μm in a relatively short time, the bromine concentration of the aqueous bromine solution needs to be 0.02 mol / l or more. In the etching process, a relatively large amount of bromine must be used, and there is a problem in terms of safety and economy.

【0006】[0006]

【発明が解決しようとする課題】上述のように従来の臭
素水溶液によるエッチング法は、十分な膜厚のあるCu
InSe2 膜を対象としてその表面の平滑化を図ること
を目的として行われたものであるため、たとえば 0.1μ
m以下というような極薄膜には使用できなかった。
As described above, the conventional etching method using an aqueous bromine solution requires a Cu film having a sufficient film thickness.
The purpose of this is to smooth the surface of the InSe 2 film.
m or less could not be used for ultra-thin films.

【0007】これに対し、本発明においては、CuIn
Se2 系光電変換素子の作製に際し、 0.1μm以下のC
uInSe2 薄膜に対してエッチング処理を行うもので
あり、しかもこの処理は、従来よりも安全かつ経済的に
実施できるエッチング方法でなければならない。
On the other hand, in the present invention, CuIn
When producing a Se 2 -based photoelectric conversion element, C
The uInSe 2 thin film is subjected to an etching process, and this process must be an etching method that can be performed more safely and economically than before.

【0008】[0008]

【課題を解決するための手段】本発明者等は、斯る課題
を解決するため鋭意研究し、CuInSe2 膜のエッチ
ング前後のサンプルに対してフォトルミネセンス測定を
したところ、CuInSe2 膜の表面を極薄くエッチン
グするのみで表面の不純物準位濃度が実質的に減少する
ことを見い出し本発明を提供することができた。
The present inventors have SUMMARY OF THE INVENTION The intensive research to solve the斯Ru problem, was the photoluminescence measurement for a sample before and after etching of the CuInSe 2 film, the surface of the CuInSe 2 film It has been found that the impurity level concentration on the surface is substantially reduced only by etching very thinly, thereby providing the present invention.

【0009】すなわち本発明は、基板上のp形CuIn
Se2薄膜層にn形半導体層を積層してpn接合を形成
する光電変換素子の作製において、該n形半導体層を積
層する前に臭素濃度が0.01mol/l以下の臭素水溶液を用
い該p形CuInSe2薄膜層表面を100〜500Å(オン
グストローム)の極微小な厚さでエッチング除去するこ
とにより該素子の光起電力を向上させることを特徴とす
るCuInSe2系光電変換素子の作製方法に関するも
のである。
That is, the present invention provides a p-type CuIn
In manufacturing a photoelectric conversion element in which an n-type semiconductor layer is laminated on a Se 2 thin film layer to form a pn junction, a bromine aqueous solution having a bromine concentration of 0.01 mol / l or less is used before laminating the n-type semiconductor layer. The present invention relates to a method for producing a CuInSe 2 -based photoelectric conversion element, characterized in that the photoelectromotive force of the element is improved by etching away the surface of the CuInSe 2 thin film layer with a very small thickness of 100 to 500 ° (angstrom). It is.

【0010】[0010]

【作用】一般に、p形CuInSe2 とCdSやZnO
のようなn形半導体とでpn接合を形成して光電変換素
子を作製する場合、p形CuInSe2 の表面不純物準
位濃度が大きいと、pn接合界面でも界面準位濃度が大
きくなると考えられている。この場合、界面準位濃度が
大きいと、例えば光エネルギーなどの吸収で発生した電
子と正孔が界面準位を介して再結合してしまう場合が多
くなり、結果的に光起電力の発生が小さく、光電変換素
子の感度が不良となっていた。したがって、CuInS
2 系光電変換素子の感度向上のために、CuInSe
2 の表面不純物準位濃度を減少させることが一つの課題
となっていた。
Generally, p-type CuInSe 2 and CdS or ZnO
When a photoelectric conversion element is manufactured by forming a pn junction with an n-type semiconductor such as described above, it is considered that if the surface impurity level concentration of p-type CuInSe 2 is large, the interface state concentration also increases at the pn junction interface. I have. In this case, if the interface state concentration is high, electrons and holes generated by absorption of light energy, for example, often recombine via the interface state, and as a result, generation of photovoltaic power occurs. And the sensitivity of the photoelectric conversion element was poor. Therefore, CuInS
to improve the sensitivity of e 2 based photoelectric conversion element, CuInSe
One of the problems was to reduce the surface impurity level concentration of No. 2 .

【0011】本発明者等は、CuInSe2 の表面不純
物準位濃度低減のための方法を種々に検討したところ、
エッチング速度が比較的遅い臭素水溶液によるエッチン
グが有効であることが判明した。
The present inventors have studied various methods for reducing the surface impurity level concentration of CuInSe 2 .
It has been found that etching with an aqueous bromine solution having a relatively low etching rate is effective.

【0012】そこで、ガラス基板上に作製した厚さ 0.5
μmのCuInSe2 膜を、臭素濃度 0.005 mol/lの臭
素水溶液で約 200Aエッチングし、エッチング前後にお
けるフォトルミネセンスの変化を調べた。この試験にお
いて、励起光として波長 647mmのKrレーザー光を用い
た場合の測定結果を図1に示した。図1からわかるよう
に、エッチングを行うことによって 0.9eV(波長で約
1.35μm)付近のピーク位置が長波長側に移動すること
が認められた。
Therefore, a thickness of 0.5 formed on a glass substrate is required.
A μm CuInSe 2 film was etched at about 200 A with an aqueous bromine solution having a bromine concentration of 0.005 mol / l, and changes in photoluminescence before and after etching were examined. FIG. 1 shows the measurement results when a Kr laser beam having a wavelength of 647 mm was used as the excitation light in this test. As can be seen from FIG. 1, 0.9 eV (approximately
It was recognized that the peak position near 1.35 μm) shifted to the longer wavelength side.

【0013】0.9eV付近のピークは、ドナーとアクセ
プター間の遷移によるルミネセンスと考えられており
[例えば、Solid State Communications, 18, 395 (197
6)参照]、ルミネセンスのエネルギーhνと各不純物準
位との間には次式が成立する。 式: hν=Eg−(Ed+Ea)+e2 /εr Eg:半導体の禁制帯幅 Ed:伝導帯下端とドナー準位間のエネルギー差 Ea:価電子帯上端とアクセプター準位間のエネルギー
差 e: 電子電荷 ε: 誘電率 r: ドナーとアクセプターの間隔
The peak near 0.9 eV is considered to be the luminescence due to the transition between the donor and the acceptor [see, for example, Solid State Communications, 18 , 395 (197
6)], the following equation holds between the luminescence energy hν and each impurity level. Formula: hν = Eg− (Ed + Ea) + e 2 / εr Eg: Forbidden band width of semiconductor Ed: Energy difference between bottom of conduction band and donor level Ea: Energy difference between top of valence band and acceptor level e: Electron Charge ε: Dielectric constant r: Distance between donor and acceptor

【0014】この場合、ドナーやアクセプターが多いと
きは、平均的にrが短くなりhνが大きくなるが、ドナ
ーやアクセプターが相対的に少ないときは、平均的にr
が長くなりhνは小さくなる。
In this case, when the number of donors and acceptors is large, r is short and hν is large on average, but when the number of donors and acceptors is relatively small, r is averaged.
Becomes longer and hν becomes smaller.

【0015】したがって、上記のように、エッチングを
行ったCuInSe2 のスペクトルを見た場合、 0.9e
V付近のピーク位置が長波長側、すなわち低エネルギー
側に移動したということは、CuInSe2 膜の成膜
時、CuInSe2 膜の内部よりも膜表面近傍に多量に
存在していたと考えられるドナーやアクセプターが、エ
ッチングによって除去されたことによるものと推定され
る。
Therefore, when the spectrum of the etched CuInSe 2 is observed as described above, 0.9e
Peak position long wavelength side in the vicinity of V, i.e. that has moved to a lower energy side, CuInSe 2 When film deposition of, Ya donor believed to have been present in a large amount on the film surface near than the interior of the CuInSe 2 film It is presumed that the acceptor was removed by etching.

【0016】すなわち、低濃度の臭素水溶液を使用した
CuInSe2 膜表面の穏やかなエッチングによってC
uInSe2 膜の表面不純物準位濃度を減少させること
ができたものと考えられる。実際、このようなエッチン
グ処理したCuInSe2 膜にCdS膜を積層して作製
した光電変換素子を用いたところ、処理しない従来品に
比較し光起電力の大幅な向上が確認できた。
That is, the CInSe 2 film surface is gently etched using a low-concentration aqueous solution of bromine to form C
It is considered that the surface impurity level concentration of the uInSe 2 film could be reduced. Actually, when a photoelectric conversion element manufactured by laminating a CdS film on a CuInSe 2 film subjected to such etching treatment was used, a significant improvement in photovoltaic power was confirmed as compared with a conventional product without treatment.

【0017】以下、実施例をもって詳細に説明する。Hereinafter, the present invention will be described in detail with reference to embodiments.

【0018】[0018]

【実施例1】膜厚約 0.1μmのMoスパッター膜付きガ
ラス板を基板として、この基板上にCuを 600A、In
を 1,400A蒸着で順次積層した。次いで、このCu、I
n積層膜をSeガス雰囲気下で 400℃で加熱処理する気
相セレン化法により、基板上に厚さ 0.5μmのp形Cu
InSe2 膜を作製した。
Example 1 A glass plate with a Mo sputtered film having a thickness of about 0.1 μm was used as a substrate, and Cu was applied on the substrate at 600 A and In.
Were sequentially laminated by 1,400 A vapor deposition. Then, the Cu, I
A 0.5 μm-thick p-type Cu film is formed on a substrate by vapor-phase selenization in which the n-layered film is heated at 400 ° C.
An InSe 2 film was produced.

【0019】一方、Br2 濃度 0.005 mol/l、KBr濃
度 150 g/lの水溶液を予め用意し、この溶液中に前記p
形CuInSe2 膜を10秒間浸漬して、CuInSe2
膜表面を 200Aエッチング除去した。次いで、純水にて
洗浄して乾燥した後、CuInSe2 膜にノンドープC
dSを 2,000A、さらにその上にInドープCdSを8,
000Aそれぞれ蒸着して光電変換素子を作製した。
On the other hand, an aqueous solution having a Br 2 concentration of 0.005 mol / l and a KBr concentration of 150 g / l is prepared in advance, and the p
The CuInSe 2 film is immersed for 10 seconds to obtain CuInSe 2
The film surface was etched away by 200A. Next, after washing with pure water and drying, the non-doped C is added to the CuInSe 2 film.
dS of 2,000A, and further In-doped CdS of 8,
Each of 000 A was vapor-deposited to produce a photoelectric conversion element.

【0020】得られた光電変換素子にハロゲンランプ光
を照射して光起電力を測定したところ、CuInSe2
膜のエッチングを行わずに作製した光電変換素子に比
べ、開放電圧が約3倍、短絡電流が約2倍増加し、結
局、光起電力としては約6倍増加したことが確認され
た。
[0020] The resulting photoelectric conversion element is irradiated with a halogen lamp light was measured photovoltaic, CuInSe 2
It was confirmed that the open-circuit voltage and the short-circuit current were increased about 3 times and about 2 times, respectively, as compared with the photoelectric conversion element manufactured without etching the film, and as a result, the photovoltaic power was increased about 6 times.

【0021】[0021]

【比較例1】実施例1と同様な手段で、Mo膜付きガラ
ス基板上に厚さ 0.5μmのp形CuInSe2 膜を作製
した。
Comparative Example 1 A p-type CuInSe 2 film having a thickness of 0.5 μm was formed on a glass substrate having a Mo film by the same means as in Example 1.

【0022】一方、Br2 濃度 0.02 mol/l 、KBr濃
度 150 g/lを含有する水溶液を予め準備し、この液中に
前記p形CuInSe2 膜を10秒間浸漬して、CuIn
Se2 膜表面を 0.1μm除去した。次いで、純水にて洗
浄して乾燥した後、実施例1に示すようにCuInSe
2 膜上にCdSを積層して光電変換素子を作製した。
On the other hand, an aqueous solution containing a Br 2 concentration of 0.02 mol / l and a KBr concentration of 150 g / l is prepared in advance, and the p-type CuInSe 2 film is immersed in this solution for 10 seconds to obtain CuIn.
The surface of the Se 2 film was removed by 0.1 μm. Next, after washing with pure water and drying, CuInSe was
CdS was laminated on the two films to produce a photoelectric conversion element.

【0023】得られた光電変換素子にハロゲンランプ光
を照射して光起電力を測定したところ、CuInSe2
のエッチングを行わずに作製した光電変換素子と開放電
圧や短絡電流がほとんど同じであり、結局光起電力の向
上は認められなかった。
When the obtained photoelectric conversion element was irradiated with a halogen lamp light and the photoelectromotive force was measured, CuInSe 2
The open-circuit voltage and the short-circuit current were almost the same as those of the photoelectric conversion element manufactured without performing the above etching, and no improvement in the photovoltaic power was observed after all.

【0024】実施例1のエッチングに比べて、光起電力
向上に対する効果が現われなかった原因として、以下の
ことが考えられる。 (1) エッチング速度が速すぎることによるCuInSe
2 膜表面のエッチングによる劣化。 (2) エッチング量が多すぎるために、CuInSe2
に部分的に薄いところがある場合、そこのエッチングが
下地のMoまで達してしまい、CdS積層時にMoとC
dSが直接接触して短絡する。
The following can be considered as the reasons why the effect of improving the photovoltaic power did not appear as compared with the etching of the first embodiment. (1) CuInSe due to too high etching rate
2 Deterioration due to etching of the film surface. (2) If the CuInSe 2 film has a partly thin portion due to an excessive amount of etching, the etching there reaches Mo as a base, and Mo and C are stacked during CdS lamination.
dS is in direct contact and short-circuited.

【0025】以上の結果から、本発明法においては、エ
ッチング量の制御性および過剰エッチング防止の面か
ら、臭素水溶液の臭素濃度は 0.01 mol/l 以下とし、エ
ッチング量は 100〜500 Aの厚さの微小量とする必要の
あることが確かめられた。
From the above results, in the method of the present invention, from the viewpoint of controllability of the etching amount and prevention of excessive etching, the bromine concentration of the bromine aqueous solution is set to 0.01 mol / l or less, and the etching amount is 100 to 500 A in thickness. It was confirmed that it was necessary to use a very small amount.

【0026】[0026]

【発明の効果】従来、CuInSe2 膜を用いてpn接
合を形成する場合、CuInSe2 膜の前処理として比
較的高濃度の臭素含有液を用いてエッチングを行うこと
があったが、安全性や経済性の点で問題があったほか、
エッチング速度が大きいために薄膜の処理には適さなか
った。しかしながら本発明法は、低濃度の臭素水溶液を
用いてCuInSe2 膜の表面を極薄くエッチング除去
するだけであるため、上記の問題を解決でき、良好なC
uInSe2 系光電変換素子の作製が可能となった。
Effect of the Invention Conventionally, when forming a pn junction with the CuInSe 2 film, there was be etched using relatively high concentrations of bromine-containing solution as a pretreatment for CuInSe 2 film, Ya safety There were problems with economics,
Due to the high etching rate, it was not suitable for processing thin films. However, the method of the present invention can solve the above problem by only etching the surface of the CuInSe 2 film very thinly using a low-concentration aqueous bromine solution.
A uInSe 2 -based photoelectric conversion element can be manufactured.

【図面の簡単な説明】[Brief description of the drawings]

【図1】エッチング処理の効果を示すCuInSe2
フォトルミネセンスのスペクトル図である。
FIG. 1 is a spectrum diagram of photoluminescence of CuInSe 2 showing the effect of an etching process.

フロントページの続き (72)発明者 伊藤 和人 東京都千代田区丸の内1丁目8番2号 同和鉱業株式会社内 (72)発明者 菊地 英治 東京都千代田区丸の内1丁目8番2号 同和鉱業株式会社内 (56)参考文献 特開 平2−177572(JP,A) 特開 昭64−7526(JP,A) 米国特許4909863(US,A) (58)調査した分野(Int.Cl.7,DB名) H01L 31/04 - 31/078 H01L 21/306 - 21/308 Continued on the front page. (72) Inventor Kazuto Ito 1-8-2 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd. (72) Eiji Kikuchi 1-8-2 Marunouchi, Chiyoda-ku, Tokyo Dowa Mining Co., Ltd. (56) References JP-A-2-177572 (JP, A) JP-A-64-7526 (JP, A) US Pat. No. 4,099,863 (US, A) (58) Fields investigated (Int. Cl. 7 , DB Name) H01L 31/04-31/078 H01L 21/306-21/308

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 基板上のp形CuInSe2 薄膜層にn
形半導体層を積層してpn接合を形成する光電変換素子
の作製において、n形半導体層を積層する前に臭素濃
度が0.01mol/l以下の臭素水溶液を用い該p形CuIn
Se2 薄膜層表面を100〜500Å(オングストローム)の
極微小な厚さでエッチング除去することにより該素子の
光起電力を向上させることを特徴とするCuInSe2
系光電変換素子の作製方法。
1. A p-type CuInSe 2 thin film layer on a substrate has n
In by stacking type semiconductor layer for manufacturing a photoelectric conversion element to form a pn junction, concentrated bromine before stacking the n-type semiconductor layer
Using a bromine aqueous solution having a degree of 0.01 mol / l or less
By etching away the surface of the Se 2 thin film layer with a very small thickness of 100 to 500 ° (angstrom) ,
CuInSe 2 characterized by improving photovoltaic power
Method for manufacturing a photoelectric conversion element.
JP03230912A 1991-08-19 1991-08-19 Method for manufacturing CuInSe2-based photoelectric conversion element Expired - Fee Related JP3100692B2 (en)

Priority Applications (1)

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JP3100692B2 true JP3100692B2 (en) 2000-10-16

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