JP3194624B2 - Grinding method and apparatus - Google Patents
Grinding method and apparatusInfo
- Publication number
- JP3194624B2 JP3194624B2 JP17915492A JP17915492A JP3194624B2 JP 3194624 B2 JP3194624 B2 JP 3194624B2 JP 17915492 A JP17915492 A JP 17915492A JP 17915492 A JP17915492 A JP 17915492A JP 3194624 B2 JP3194624 B2 JP 3194624B2
- Authority
- JP
- Japan
- Prior art keywords
- grinding
- work
- grindstone
- oxide film
- abrasive grains
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
- Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、ガラス、セラミックス
等の高脆性材料を電解インプロセスドレッシング研削法
により研削加工する方法と装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for grinding highly brittle materials such as glass and ceramics by electrolytic in-process dressing grinding.
【0002】[0002]
【従来の技術】従来、電解インプロセスドレッシング研
削法を用いた光学素材の球面創成の研削加工方法及び装
置としては、例えば特開平3−60973号公報に開示
されている。図5は、上記研削装置の主要部を一部断面
にして示す平面図で、回転自在なチャック1に保持され
たワーク2の回転軸心に対して、スイベル角αに配置し
たカップ状の導電性砥石4が回転自在に設けられてい
る。導電性砥石4の外周部には、ブラシ5を介して直流
電源装置6の(+)極が電気的に接続されている。直流
電源装置の(−)極は、ドレス電極7に接続されてい
る。ドレス電極7は、ワーク2の研削仕上げ曲率RA と
近似形状に形成され、導電性砥石4の研削面4aに対し
て僅かな間隙Lを有して対向配置されている。さらに、
図示しないクーラント供給装置に接続されたノズル8が
配設され、導電性砥石4の研削面4aとドレス電極7と
の間隙Lに弱電性クーラント9を供給し得るようになっ
ている。2. Description of the Related Art Conventionally, a method and an apparatus for grinding a spherical surface of an optical material using an electrolytic in-process dressing grinding method are disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 3-60973. FIG. 5 is a plan view showing a main part of the above-mentioned grinding apparatus in a partial cross section, and shows a cup-shaped conductive member arranged at a swivel angle α with respect to the rotation axis of a work 2 held on a rotatable chuck 1. The abrasive whetstone 4 is provided rotatably. The (+) pole of the DC power supply 6 is electrically connected to the outer periphery of the conductive grindstone 4 via the brush 5. The (−) pole of the DC power supply is connected to the dress electrode 7. The dress electrode 7 is formed in a shape similar to the grinding finish curvature RA of the work 2, and is arranged opposite to the grinding surface 4 a of the conductive grindstone 4 with a small gap L. further,
A nozzle 8 connected to a coolant supply device (not shown) is provided so that a weakly conductive coolant 9 can be supplied to a gap L between the grinding surface 4a of the conductive grindstone 4 and the dress electrode 7.
【0003】上記研削装置による研削方法は、チャック
1を回動してワーク2を回動しつつ、導電性砥石4を回
動し研削面4aをワーク2に当接して研削加工を行な
う。この際、弱電性クーラント9をノズル8から研削面
4aとドレス電極7との間に供給しながら、ドレス電極
7とブラシ5に直流電源装置6によって電圧を印加し、
研削面4aを常時電解ドレッシングしつつワーク2の研
削加工を行なう。In the grinding method using the above-described grinding device, the grinding is performed by rotating the conductive grindstone 4 and bringing the grinding surface 4a into contact with the work 2 while rotating the chuck 1 and rotating the work 2. At this time, a voltage is applied to the dress electrode 7 and the brush 5 by the DC power supply 6 while supplying the weakly electric coolant 9 from the nozzle 8 between the grinding surface 4 a and the dress electrode 7.
Grinding of the work 2 is performed while always performing electrolytic dressing on the grinding surface 4a.
【0004】次に、電解ドレッシングによる導電性砥石
4の研削面4aのドレッシングの進行状態を図6を用い
て説明する。Aで示すように、ワーク2の研削仕上げ面
の曲率RA に形成された研削面4aを有する導電性砥石
4を準備し、これに対して弱電性クーラントを介在させ
ながら電圧を印加して研削面4aの電解ドレッシングを
行なうと、Bで示すように、研削面4aのボンド材が電
解溶出し、砥粒10の目立てが進行すると同時に、研削
面4aにボンド材の絶縁酸化膜11が生成される。そし
て、ボンド材の電解溶出が進行し、絶縁酸化膜11の厚
さが徐々に厚くなってある厚さに達すると、絶縁状態と
なってドレス電極7と導電性砥石4との間に電流が通じ
なくなり、ボンド材の溶出が停止し、その厚さ以上に絶
縁酸化膜11は生成されなくなり、砥粒10の目立てが
完了する。生成された絶縁酸化膜11は、ボンド材より
も硬度が低いものであるために、研削加工時の研削抵抗
によって絶縁酸化膜のなくなるのが速くなり、Cに示す
ように、砥粒10の磨耗と同時に除去されて薄くなって
ゆく。そして、この絶縁酸化膜11が除去されて薄くな
ることにより、ドレス電極7と導電性砥石4との導電性
が回復し、研削面4aの電解ドレッシングが行なわれ、
ボンド材の溶出が進行することによって新たな絶縁酸化
膜11が前記の残っている絶縁酸化膜11の下側に生成
されるようにして研削面4aがワークの研削加工中に生
成され、その際にこの絶縁酸化膜の硬度がボンド材より
も低いので砥粒の保持力が弱くなることから、酸化膜中
の砥粒が脱落しやすい状態でDに示すように、導電性砥
石4の目立て状態が維持される。上記のように、ボンド
材よりも硬度が低くかつ研削抵抗によってなくなるのが
速い絶縁酸化膜11の生成と除去とが繰り返され、研削
面4aのボンド材は、絶縁酸化膜11の生成と電解溶出
によって除去されていく。従って、研削加工によって磨
耗した砥粒10は、研削抵抗によってなくなるのが速く
なった絶縁酸化膜11と共に除去される。これにより、
研削面4aは目立てられ、加工可能な状態を常に維持す
ることができる。Next, the progress of dressing of the grinding surface 4a of the conductive grindstone 4 by electrolytic dressing will be described with reference to FIG. As shown by A, a conductive grindstone 4 having a ground surface 4a formed at the curvature RA of the ground surface of the work 2 is prepared, and a voltage is applied thereto while applying a weakly electric coolant to the ground surface. When the electrolytic dressing 4a is performed, as shown by B, the bond material on the ground surface 4a is electrolytically eluted, and the dressing of the abrasive grains 10 proceeds, and at the same time, the insulating oxide film 11 of the bond material is generated on the ground surface 4a. . When the electrolytic elution of the bond material proceeds and the thickness of the insulating oxide film 11 gradually increases to a certain thickness, the insulating material is in an insulating state, and a current flows between the dress electrode 7 and the conductive grindstone 4. The connection is stopped, the elution of the bond material is stopped, the insulating oxide film 11 is not generated beyond the thickness, and the dressing of the abrasive grains 10 is completed. Since the generated insulating oxide film 11 is lower in hardness than the bond material, the insulating oxide film disappears faster due to the grinding resistance at the time of the grinding process. At the same time, it is removed and thinned. Then, by removing the insulating oxide film 11 to make it thinner, the conductivity between the dress electrode 7 and the conductive grindstone 4 is restored, and the electrolytic dressing of the ground surface 4a is performed.
As the elution of the bond material progresses, a new insulating oxide film 11 is formed below the remaining insulating oxide film 11 so that the ground surface 4a is generated during the grinding of the workpiece. Since the hardness of the insulating oxide film is lower than that of the bonding material, the holding power of the abrasive grains is weakened. As shown in FIG. Is maintained. As described above, the generation and removal of the insulating oxide film 11 having a lower hardness than the bond material and being quickly eliminated by the grinding resistance are repeated, and the bond material on the ground surface 4a is formed by the formation of the insulating oxide film 11 and the electrolytic elution. Will be removed by Therefore, the abrasive grains 10 worn by the grinding process are removed together with the insulating oxide film 11 that has been eliminated more quickly due to the grinding resistance. This allows
The grinding surface 4a is sharpened and can always maintain a processable state.
【0005】[0005]
【発明が解決しようとする課題】しかし、上記従来の研
削方法及び装置にあっては、常時、導電性砥石4とドレ
ス電極7との間に通電して電圧を印加し、溶出したボン
ド材の絶縁酸化膜11の生成によってある厚さに達した
ときにボンド材の電解溶出を停止した状態となるが、以
下のような問題が生じていた。すなわち、常に電圧を印
加している電解インプロセスドレッシング研削におい
て、使用する導電性砥石4の研削能力を十分に発揮させ
て最大の研削比を得るためには、砥粒10が摩滅による
目つぶれを起こす直前に、絶縁酸化膜11の除去によっ
て目つぶれしそうな砥粒が脱落するように加工条件を設
定することが必須である。このような加工条件を得るに
は、砥粒10の摩滅速度と絶縁酸化膜の除去速度(研削
抵抗によってなくなる速度)との関係が重要となる。し
かしながら、従来の電解インプロセスドレッシング研削
方法によると、例えば低メッシュ砥粒(粗い砥粒)にて
研削加工を行なう際、通常、砥石4をワーク2に対して
高速度で切り込むため、研削抵抗が大きくなり、ボンド
材よりも硬度が低くなった絶縁酸化膜11の除去速度は
大きくなる。絶縁酸化膜11の除去速度が早い(大き
い)と、ボンド材の溶出に伴って研削面4a側の絶縁酸
化膜11中にある砥粒10の脱落する速度も早くなり、
結果として、研削加工による砥粒10の摩滅がごく僅か
であるにもかかわらず、依然として使用可能な砥粒10
でさえ、研削面4aより脱落してしまい、前記砥粒10
の摩滅速度と絶縁酸化膜のなくなる速度との関係を考慮
する以前の課題として、砥石4を有効に使用することが
困難であった。また、ワーク2の研削加工を続けた場
合、ワーク2と当接するカップ状の導電性砥石4の内周
及び外周での加工抵抗が大きいため、当該部分における
硬度が低くなっている絶縁酸化膜11の除去速度が速く
なる。さらに、一般に球面創成加工は高速で行なわれる
ため、研削加工中に研削面4aとワーク2の接触によっ
て、硬度が低くなっている絶縁酸化膜11が除去されや
すくなる。このため、必要以上にボンド材の溶出が進行
することになり、導電性砥石4の形状くずれが速くな
り、ワーク2の研削仕上げ面の形状精度が維持できない
という欠点があった。However, in the above-mentioned conventional grinding method and apparatus, current is always applied between the conductive grinding wheel 4 and the dress electrode 7 to apply a voltage, and the eluted bonding material is removed. When the thickness reaches a certain value due to the formation of the insulating oxide film 11, the electrolytic elution of the bond material is stopped. However, the following problem has occurred. That is, in the electrolytic in-process dressing grinding in which a voltage is constantly applied, in order to sufficiently exhibit the grinding ability of the conductive grindstone 4 to be used and to obtain the maximum grinding ratio, the abrasive grains 10 have to be crushed due to abrasion. Immediately before starting, it is essential to set the processing conditions so that the abrasive grains that are likely to be crushed by the removal of the insulating oxide film 11 fall off. In order to obtain such processing conditions, the relationship between the abrasion rate of the abrasive grains 10 and the removal rate of the insulating oxide film (the rate at which the removal occurs due to grinding resistance) is important. However, according to the conventional electrolytic in-process dressing grinding method, for example, when grinding is performed with low-mesh abrasive grains (coarse abrasive grains), the grinding wheel 4 is usually cut into the work 2 at a high speed. The removal rate of the insulating oxide film 11, which has become larger and has a lower hardness than the bond material, increases. When the removal rate of the insulating oxide film 11 is high (large), the speed at which the abrasive grains 10 in the insulating oxide film 11 on the grinding surface 4a side fall off with the elution of the bonding material also increases,
As a result, the abrasive grains 10 that can still be used, although the wear of the abrasive grains 10 by grinding is negligible.
However, even the abrasive grains 10 fall off from the grinding surface 4a,
As a problem before considering the relationship between the abrasion speed and the speed at which the insulating oxide film disappears, it has been difficult to use the grinding wheel 4 effectively. Further, when the grinding of the work 2 is continued, since the processing resistance on the inner and outer circumferences of the cup-shaped conductive grindstone 4 in contact with the work 2 is large, the hardness of the insulating oxide film 11 having a low hardness in this portion is reduced. Removal speed increases. Furthermore, since the spherical surface generating processing is generally performed at a high speed, the contact between the ground surface 4a and the work 2 during the grinding processing makes it easier to remove the insulating oxide film 11 having a low hardness. For this reason, the elution of the bonding material proceeds more than necessary, and the shape of the conductive grindstone 4 is quickly deformed, so that the shape accuracy of the ground surface of the workpiece 2 cannot be maintained.
【0006】本発明は、上記従来技術の問題点に鑑みて
なされたもので、電解インプロセスドレッシング研削法
による光学素子等の球面創成加工において、導電性砥石
の形状くずれを少なく維持しながら、精度のよい光学素
子等を安定して連続的に加工し得る研削方法及び装置を
提供することを目的とする。The present invention has been made in view of the above-mentioned problems in the prior art, and has been developed in the field of spherical processing of an optical element or the like by an electrolytic in-process dressing grinding method while maintaining the shape of a conductive grindstone with a small amount of precision. It is an object of the present invention to provide a grinding method and apparatus capable of stably and continuously processing an optical element or the like with good stability.
【0007】[0007]
【課題を解決するための手段】上記目的を達成するため
に、本発明の研削方法は、研削装置に導電性砥石を装着
した後、ワークホルダに保持されたワークを回動しつつ
導電性砥石を回動して研削面をワークに当接し、ノズル
から弱電性クーラントを研削面とドレス電極との間に供
給しながらドレス電極に電源装置から(−)電圧を印加
し、導電性砥石に(+)電圧を印加して、該砥石の研削
面を電解ドレッシングしつつワークの研削加工を行う研
削方法において、前記研削装置に装着した導電性砥石の
研削面を電解ドレッシングをして該研削面のボンド材を
電解溶出し、砥粒の目立てを進行させるとともに該研削
面にボンド材の絶縁酸化膜を生成して該酸化膜で砥粒を
保持し、次いで電源装置からの通電を切りまたはドレス
電極を離して電解ドレッシングが行われない状態で前記
砥石でワークを研削加工し、前記絶縁酸化膜がなくなっ
た後も研削面に突出している砥粒で研削加工を続け、前
記砥粒が摩耗進行したところで、ワークの研削加工中に
電解ドレッシングをして砥粒の目立てを進行させるとと
もに絶縁酸化膜を生成して該酸化膜で砥粒を保持し、そ
の後、電源装置からの通電を切りまたはドレス電極を離
して電解ドレッシングが行われない状態で前記砥石でワ
ークを研削加工し、前記絶縁酸化膜がなくなった後も研
削面に突出している砥粒で研削加工をし、前記ワークの
研削加工中に砥石の電解ドレッシングと、電解ドレッシ
ングが行われない状態を交互に行うこととした。そし
て、本発明の研削装置は、ワークを保持する回転自在な
ワークホルダと、前記ワークホルダに保持されたワーク
表面に当接して回転駆動する導電性砥石と、前記導電性
砥石の研削面に対して一定距離を維持して配置したドレ
ス電極と、前記電極に(−)電圧を印加し前記砥石に
(+)電圧を印加する電源装置と、前記電極と前記砥石
との間に弱電性クーラントを供給するノズルと、を有す
る研削装置において、前記導電性砥石の研削面を、砥粒
が目立てされてボンド材の絶縁酸化膜で保持された状態
にするよう電解ドレッシングするために前記砥石と電極
とを通電させ、また前記電解ドレッシング後のワーク研
削中に電解ドレッシングが行われないようにするために
前記砥石と電極との通電を切るための、通電の切替手段
を設けて構成した。In order to achieve the above object, a grinding method according to the present invention comprises mounting a conductive grindstone on a grinding device and then rotating the work held by a work holder while rotating the conductive grindstone. The grinding surface is brought into contact with the workpiece by rotating the grinding wheel, and a weak electric coolant is supplied between the grinding surface and the dress electrode from the nozzle, and a (-) voltage is applied to the dress electrode from the power supply device to the conductive grindstone. +) In a grinding method in which a voltage is applied to grind a workpiece while electrolytically dressing the grinding surface of the grindstone, the grinding surface of the conductive grindstone mounted on the grinding device is subjected to electrolytic dressing to perform grinding of the grinding surface. The bond material is electrolytically eluted, and the dressing of the abrasive grains is advanced, and an insulating oxide film of the bond material is formed on the ground surface to hold the abrasive grains with the oxide film. Separate electrolysis Grinding the work with the grindstone in a state where the dressing is not performed, continuing the grinding with the abrasive grains protruding on the grinding surface even after the insulating oxide film has disappeared, and when the abrasive grains have progressed to abrasion, During the grinding process, electrolytic dressing is performed to advance the dressing of the abrasive grains, and at the same time, an insulating oxide film is formed to hold the abrasive grains with the oxide film. Grinding the work with the grindstone in a state where the dressing is not performed, grinding with the abrasive grains protruding from the grinding surface even after the insulating oxide film has disappeared, and electrolytically dressing the grindstone during the grinding of the work. And the state in which electrolytic dressing is not performed is alternately performed. The grinding apparatus according to the present invention includes a rotatable work holder that holds a work, a conductive grindstone that rotates and contacts the surface of the work held by the work holder, and a grinding surface of the conductive grindstone. A dress electrode arranged to maintain a constant distance between the electrodes, a power supply device for applying a (-) voltage to the electrode and applying a (+) voltage to the grindstone, and a weakly electric coolant between the electrode and the grindstone. A nozzle for supplying, and a grinding device having the grinding wheel and the electrode for electrolytic dressing such that the grinding surface of the conductive grinding stone is in a state where abrasive grains are sharpened and held by an insulating oxide film of a bonding material. And a power supply switching means for cutting off the power supply between the grindstone and the electrode in order to prevent the electrolytic dressing from being performed during the work grinding after the electrolytic dressing. .
【0008】[0008]
【作用】上記の例示した概念図で説明する研削方法によ
れば、図2のAで示す状態に作成してある導電性砥石4
を準備し、この砥石4の研削面4aに対して初期ドレッ
シング工程のために電源装置6からの通電を行うことに
よって、研削面4aの電解ドレッシングを行い、ボンド
材を電解溶出させて、Bで示すように絶縁酸化膜の生成
と砥粒10の目立てを行なう。次に、電源装置からの通
電を切り、電解ドレッシングが行われていない状態であ
る通常の砥石によるワークの研削法で加工を行なう。こ
のことにより、電解電流によるボンド材の溶出が押さえ
られ、Cに示すように砥石4によるワークの研削加工時
の研削抵抗によってボンド材により保持されている砥粒
10の磨耗と絶縁酸化膜11の除去のみが行なわれてい
く。従って、従来のように、ボンド材の溶出による末だ
使用可能な砥粒10の脱落が防止される。そして、砥粒
10の磨耗が進行したところで、電源装置からの通電を
行わせて電解インプロセスドレッシング研削を所定量行
なうことで、即ち研削面4aのボンド材を溶出すること
で摩耗した砥粒を脱落しやすくするとともに、Dに示す
ように砥粒10を突出させて研削面4aの目立てを行な
わせることにより、導電性砥石4の形状くずれが防止さ
れ、安定した研削加工が持続できるようになる。そし
て、本発明の研削装置にあっては、通電の切替手段15
の操作により、砥石の研削面を、砥粒が目立てされて絶
縁酸化膜で保持された状態と、砥粒がボンド材で保持さ
れた状態とにできるので、研削面4aの使用可能な砥粒
が目つぶれを起こすまで研削加工を行えるから砥石を有
効に使用することができ、またボンド材の溶出が少なく
なるから砥石の形状くずれも遅くなる。また、ドレス電
極7を研削面4aから退避することによっても、砥石の
研削面を、砥粒が目立てされて絶縁酸化膜を保持された
状態と、砥粒がボンド材で保持された状態とにできるの
で、前述のように、研削面4aの使用可能な砥粒が目つ
ぶれを起こすまで研削加工を行えるから、砥石を有効に
使用することができ、またボンド材の溶出が少なくなる
から砥石の形状くずれも遅くなる。According to the grinding method described with reference to the above-described conceptual diagram, the conductive grinding wheel 4 formed in the state shown in FIG.
Is supplied to the ground surface 4a of the grinding wheel 4 from the power supply device 6 for the initial dressing step, thereby performing electrolytic dressing of the ground surface 4a, and electrolytically eluting the bond material. As shown, generation of an insulating oxide film and dressing of the abrasive grains 10 are performed. Next, the power supply from the power supply device is turned off, and the workpiece is processed by a grinding method using a normal grindstone in a state where electrolytic dressing is not performed. As a result, the elution of the bond material due to the electrolytic current is suppressed, and as shown in C, the abrasion of the abrasive grains 10 held by the bond material due to the grinding resistance at the time of grinding the work by the grindstone 4 and the formation of the insulating oxide film 11. Only removal is performed. Accordingly, the useable abrasive grains 10 are prevented from falling off due to the elution of the bond material as in the related art. Then, when the wear of the abrasive grains 10 has progressed, a predetermined amount of electrolytic in-process dressing grinding is performed by energizing from a power supply device, that is, the abrasive grains worn by eluting the bond material on the grinding surface 4a are removed. By making the abrasive grains 10 protrude as shown in D to sharpen the grinding surface 4a as shown in D, the shape of the conductive grinding stone 4 is prevented from being deformed, and stable grinding can be continued. . And in the grinding device of the present invention, the switching means 15 for energization is provided.
By the above operation, the grinding surface of the grindstone can be made into a state in which the abrasive grains are sharpened and held by the insulating oxide film, and a state in which the abrasive grains are held by the bonding material. The grinding wheel can be used effectively because the grinding process can be performed until the glass is blinded. In addition, the elution of the bonding material is reduced, so that the shape of the grinding wheel is slowed down. Also, by retracting the dress electrode 7 from the grinding surface 4a, the grinding surface of the grindstone is changed to a state in which the abrasive grains are sharpened to hold the insulating oxide film and a state in which the abrasive grains are held by the bonding material. As described above, since the grinding process can be performed until the usable abrasive grains on the grinding surface 4a cause blindness as described above, the grinding wheel can be used effectively, and the elution of the bonding material is reduced, so that the grinding wheel can be used. Deformation is also slow.
【0009】[0009]
【実施例1】図3は、本発明に係る研削方法を実施する
ための研削装置の実施例1を一部切り欠いて示す平面図
である。ワーク2はチャック1に保持され、図示しない
駆動装置によって回転されるようになっている。ワーク
2の被加工面2aと当接自在に設けられた導電性砥石4
は、ワーク2の回転軸心に対してスイベル角αを有する
カップ状に形成され、図示しない駆動装置によって軸心
mを中心に回転駆動されるようになっている。導電性砥
石4の研削面4aは、ワーク2の研削仕上げ曲率RAと
同一曲率RAの形状に形成され、その研削部分4bは、
ダイヤモンド粉末等の砥粒(#400程度)とCu,S
n,Fe等の金属粉末を特殊配合して熱処理した焼結合
金により形成されている。Embodiment 1 FIG. 3 is a plan view showing a grinding apparatus for carrying out a grinding method according to the present invention, with a part cut away. The work 2 is held by the chuck 1 and is rotated by a driving device (not shown). A conductive grindstone 4 provided so as to be able to abut on the work surface 2a of the work 2
Is formed in a cup shape having a swivel angle α with respect to the rotation axis of the work 2, and is driven to rotate about the axis m by a driving device (not shown). Grinding surface 4a of the conductive grinding wheel 4 is formed in the shape of the grinding finishing curvature R A of the same curvature R A of the workpiece 2, the grinding portion 4b is
Abrasive grains such as diamond powder (about # 400) and Cu, S
It is formed of a sintered alloy that is specially blended with a metal powder such as n or Fe and heat-treated.
【0010】導電性砥石4は、その外周部において、電
源装置6の(+)極とブラシ5を介して電気的に接続さ
れている。(+)極とブラシ5との間には、電源装置6
からの電力の供給をON,OFFするための切替スイッ
チ20が設けられている。一方、電源装置6の(−)極
は、ドレス電極7に接続されている。ドレス電極7は、
ワーク2の研削仕上げ曲率RAと近似形状に形成され、
導電性砥石4の研削面4aに対して僅かな間隙Lを有し
て対向配置されている。さらに、図示しないクーラント
供給装置に接続したノズル8が配設され、研削面4aと
ドレス電極7との間隙Lに弱電性クーラント9を供給し
得るようになっている。The conductive grindstone 4 is electrically connected to the (+) pole of the power supply 6 via a brush 5 at the outer periphery. (+) A power supply 6 is provided between the pole and the brush 5.
There is provided a changeover switch 20 for turning on and off the supply of power from the power supply. On the other hand, the (−) pole of the power supply 6 is connected to the dress electrode 7. The dress electrode 7
The workpiece 2 is formed in a shape approximate to the grinding finish curvature RA ,
The conductive grindstone 4 is disposed to face the grinding surface 4 a with a small gap L. Further, a nozzle 8 connected to a coolant supply device (not shown) is provided, so that the weakly electric coolant 9 can be supplied to the gap L between the grinding surface 4a and the dress electrode 7.
【0011】次に、上記構成の装置を用いた本発明の研
削方法の実施例を説明する。まず、導電性砥石(研削面
が図2Aの状態になっている)4を研削装置に装着後、
図示しない駆動装置により導電性砥石4を回転し、弱電
性クーラント9をノズル8から供給しながら、ドレス電
極7とブラシ5を介して導電性砥石4に電源装置6から
電圧を印加して初期電解ドレッシング(初期ドレッシン
グ工程)を行う。これにより、導電性砥石4の研削面4
aが電解ドレッシングされ、砥粒が突出した状態(砥粒
の目立て状態)となり球面創成加工が可能な状態(図2
Bの状態)となる。Next, an embodiment of the grinding method of the present invention using the apparatus having the above configuration will be described. First, after attaching the conductive grindstone (the grinding surface is in the state of FIG. 2A) 4 to the grinding device,
The conductive grindstone 4 is rotated by a driving device (not shown), and while the weakly conductive coolant 9 is supplied from the nozzle 8, a voltage is applied to the conductive grindstone 4 from the power supply 6 via the dress electrode 7 and the brush 5 to perform initial electrolysis. Dressing (initial dressing step) is performed. Thereby, the grinding surface 4 of the conductive grindstone 4
a is subjected to electrolytic dressing, and the abrasive grains are projected (the abrasive grains are sharpened) so that the spherical surface can be formed (FIG. 2).
B state).
【0012】初期ドレッシングが完了した時点で、切替
スイッチ20をOFF状態とし、導電性砥石4への電源
装置6からの電力の供給を停止し、この状態で導電性砥
石4をワーク2の被加工面2aに当接するとともに、導
電性砥石4及びワーク2を回転しつつ、ワーク2の球面
創成加工を行なう。#400の砥粒を有する導電性砥石
4を用いた場合、この通常の研削工程では、すなわち、
導電性砥石4に通電することなく、この砥石4とワーク
2とを回転しつつ行う球面創成の研削加工工程では、数
百個程度のワーク2の連続加工を安定して行なうことが
できる。かかる通常の研削加工においては、砥粒の摩擦
とボンド材の絶縁酸化膜の除去が進行する。この進行中
では、砥石4の研削面は、前記図2Cの状態になって、
砥粒10は硬度の高いボンド材で保持されている。When the initial dressing is completed, the changeover switch 20 is turned off, and the supply of power from the power supply device 6 to the conductive grindstone 4 is stopped. While the conductive whetstone 4 and the work 2 are being rotated while being in contact with the surface 2a, the spherical work of the work 2 is performed. When the conductive grinding stone 4 having # 400 abrasive grains is used, in this ordinary grinding process,
In the grinding process of creating a spherical surface performed by rotating the grindstone 4 and the work 2 without supplying electricity to the conductive grindstone 4, continuous processing of about several hundred works 2 can be stably performed. In such ordinary grinding, the friction of the abrasive grains and the removal of the insulating oxide film of the bond material progress. During this progress, the grinding surface of the grindstone 4 is in the state of FIG.
The abrasive grains 10 are held by a high-hardness bonding material.
【0013】そして、この研削工程において、所定の数
量のワーク2の球面創成加工が終了、もしくは砥粒が摩
滅により目つぶれを起こす直前に、切替スイッチ20を
ON状態にして、ブラシ5と電源装置6とを接続して導
電性砥石4への電力供給を再開し、電解インプロセスド
レッシング研削(即ち、ワーク2の加工中に、砥石4を
研削装置から取り外すことなく電解ドレッシングしつつ
この砥石4でワーク2を研削加工すること)による球面
創成加工を数個のワーク2に対して行なう。そして、こ
の電解インプロセスドレッシング研削工程において、電
解ドレッシングによりボンド材が電解溶出されて導電性
砥石4の研削面4aの砥粒の目立て状態が回復する(図
2Dの状態になる)。その後、通常の研削と電解インプ
ロセスドレッシング研削を交互に行いつつ多数個のワー
ク2の研削加工を行なう。In this grinding step, the changeover switch 20 is turned on immediately before the spherical surface forming of a predetermined number of the workpieces 2 is completed, or immediately before the abrasive grains are blinded due to wear, and the brush 5 and the power supply device are turned on. 6 to restart the power supply to the conductive grindstone 4 and perform electrolytic in-process dressing grinding (that is, while processing the work 2, electrolytic grinding without removing the grindstone 4 from the grinding device, Grinding the work 2) is performed on several works 2. Then, in this electrolytic in-process dressing grinding step, the bonding material is electrolytically eluted by the electrolytic dressing, and the dressing state of the abrasive grains on the grinding surface 4a of the conductive grindstone 4 is restored (to the state shown in FIG. 2D). Thereafter, grinding of a large number of works 2 is performed while alternately performing normal grinding and electrolytic in-process dressing grinding.
【0014】本実施例においては、上記初期ドレッシン
グ工程後、通常研削工程→電解インプロセスドレッシン
グ研削工程→通常研削工程→電解インプロセスドレッシ
ング研削工程のサイクルを繰り返し、導電性砥石4を構
成するボンド材の不必要な溶出を防ぎながら安定した加
工が持続できるので、導電性砥石4の形状くずれを防止
でき多数個のワーク2のそれぞれの研削仕上げ面の形状
精度も高精度に維持することができる。さらに、砥粒が
摩滅により目つぶれを起こす前に、通常研削から電解イ
ンプロセスドレッシング研削に切り替えるため砥粒の能
力を十分に利用することができるとともに、通常研削に
よって導電性砥石4のボンド材の不必要な溶出を防ぎ、
まだ使用できる砥粒の落下を防止できるので、高い研削
比を得ることができる。In the present embodiment, after the initial dressing step, the cycle of the normal grinding step → the electrolytic in-process dressing grinding step → the normal grinding step → the electrolytic in-process dressing grinding step is repeated, and the bonding material forming the conductive grindstone 4 is formed. Since stable processing can be continued while preventing unnecessary elution, the shape of the conductive grindstone 4 can be prevented, and the shape accuracy of each of the ground surfaces of the plurality of works 2 can be maintained with high accuracy. Further, before the abrasive grains are destroyed by wear, the ability of the abrasive grains can be fully utilized to switch from normal grinding to electrolytic in-process dressing grinding. Prevent unnecessary elution,
Since a fall of the still usable abrasive grains can be prevented, a high grinding ratio can be obtained.
【0015】[0015]
【実施例2】図4は、本発明に係る研削方法を実施する
ための研削装置の実施例2を一部切り欠いて示す平面図
である。本実施例の研削装置は、上記実施例1と同様に
形成したドレス電極21をエアシリンダ22に連結し、
導電性砥石4の研削面4aと対向する配置及び研削面4
aから退避できるように進退自在(図中、矢印Y方向)
に設けられている。すなわち、エアシリンダ22は、研
削加工時にドレス電極21を退避させ、非研削加工時に
ドレス電極21を研削面4aに対向配置させ得るように
なっている。その他の構成は、切替スイッチ20を設け
ず構成した点を除いて、上記実施例1と同様である。Second Embodiment FIG. 4 is a plan view showing a second embodiment of a grinding apparatus for carrying out a grinding method according to the present invention, partially cut away. The grinding device of the present embodiment connects the dress electrode 21 formed in the same manner as in the first embodiment to the air cylinder 22,
Arrangement and grinding surface 4 of conductive grindstone 4 facing grinding surface 4a
Able to move back and forth so as to be able to evacuate from a (direction of arrow Y in the figure)
It is provided in. That is, the air cylinder 22 can retract the dress electrode 21 during the grinding process, and can arrange the dress electrode 21 to face the grinding surface 4a during the non-grinding process. The other configuration is the same as that of the first embodiment except that the configuration is not provided with the changeover switch 20.
【0016】本実施例においては、ドレス電極21と導
電性砥石4の研削面4aとの距離を遠ざけることで、研
削面4aとドレス電極21との間に電流が流れなくな
り、研削面4aが電解ドレッシングされなくなる。すな
わち、エアシリンダ22を駆動してドレス電極21を移
動することで、電圧の印加のON,OFFと同じ状態に
することを行なっている。In this embodiment, by increasing the distance between the dress electrode 21 and the grinding surface 4a of the conductive grindstone 4, no current flows between the grinding surface 4a and the dress electrode 21, and the grinding surface 4a No more dressing. That is, by driving the air cylinder 22 to move the dress electrode 21, the same state as the ON / OFF of the voltage application is performed.
【0017】次に、上記構成からなる研削装置を用いた
研削方法の実施例を説明する。なお、実施例にあって
は、導電性砥石4と曲率がほぼ等しい大きさのワーク2
を研削加工した。まず、研削装置にワーク2を装着する
前に、導電性砥石4を研削装置に装着後、導電性砥石4
を回転する。エアシリンダ22によって、ドレス電極2
1を研削面4aに接近させ、このドレス電極21と研削
面4aとの間に弱電性クーラント9を供給し、導電性砥
石4を電解ドレッシング(初期ドレッシング工程)す
る。そして、研削面4aに対する初期ドレッシングが完
了した時点で、ドレス電極21をエアシリンダ22によ
り後退する。これにより、ドレス電極21は研削面4a
から遠ざかり、ドレス電極21と導電性砥石4との通電
が停止し、研削面4aの電解ドレッシングが行われない
状態となる。Next, an embodiment of a grinding method using the grinding apparatus having the above configuration will be described. In the embodiment, a work 2 having a size approximately equal to the curvature of the conductive grindstone 4 is used.
Was ground. First, before the work 2 is mounted on the grinding device, the conductive grindstone 4 is mounted on the grinding device.
To rotate. The dress electrode 2 is formed by the air cylinder 22.
1 is brought closer to the grinding surface 4a, a weakly electric coolant 9 is supplied between the dress electrode 21 and the grinding surface 4a, and the conductive grindstone 4 is electrolytically dressed (initial dressing step). When the initial dressing for the ground surface 4a is completed, the dress electrode 21 is retracted by the air cylinder 22. As a result, the dress electrode 21 is ground
As a result, the current supply between the dress electrode 21 and the conductive grindstone 4 is stopped, and the electrolytic dressing of the grinding surface 4a is not performed.
【0018】ドレス電極21の後退が終了した後、研削
装置のワークホルダー1にワーク2を装着し、導電性砥
石4をワーク2に対して当接させ、通常研削加工を行な
う。以後、順次に研削装置のワークホルダー1に装着し
た複数のワーク2に対して研削加工を施し、所定の数量
の球面創成の研削加工を終了したのち、もしくは砥粒が
摩滅により目つぶれをおこす直前にこの通常研削加工を
終了する。通常研削加工を終了後、ワーク2を研削装置
のワークホルダー1より取り外し、エアシリンダ22に
よってドレス電極21を前進して、導電性砥石4の研削
面4aに接近させ、前記初期ドレッシングと同様に、導
電性砥石4の研削面4aを電解ドレッシングする。以
後、上記電解インプロセスドレッシング研削と通常研削
を繰り返し、多数個のワーク2を研削加工する。After the retreat of the dress electrode 21 is completed, the work 2 is mounted on the work holder 1 of the grinding device, and the conductive grindstone 4 is brought into contact with the work 2 to perform normal grinding. Thereafter, a plurality of workpieces 2 mounted on the work holder 1 of the grinding apparatus are sequentially subjected to grinding processing, and after finishing grinding processing of a predetermined number of spherical surfaces, or immediately before the abrasive grains are worn out due to abrasion. Then, the normal grinding is finished. After finishing the normal grinding, the work 2 is removed from the work holder 1 of the grinding device, the dress electrode 21 is advanced by the air cylinder 22, and is brought close to the grinding surface 4a of the conductive grindstone 4, and the same as the above-mentioned initial dressing, Electrolytic dressing of the grinding surface 4a of the conductive grindstone 4 is performed. Thereafter, the above-described electrolytic in-process dressing grinding and normal grinding are repeated to grind a large number of works 2.
【0019】本実施例においては、上記初期ドレッシン
グ以降、通常研削と電解インプロセスドレッシング研削
とを繰り返すことにより、導電性砥石4を構成する砥粒
およびボンド材の不必要な流出を防ぎながら安定した加
工が維持できるので、ワーク2の研削仕上げ面の形状精
度を高精度に維持することができる。In the present embodiment, after the initial dressing, the normal grinding and the electrolytic in-process dressing grinding are repeated to stably prevent the abrasive grains and the bond material constituting the conductive grinding stone 4 from flowing out unnecessarily. Since the processing can be maintained, the shape accuracy of the ground surface of the workpiece 2 can be maintained with high accuracy.
【0020】なお、本実施例のように導電性砥石4の大
きさと曲率がほぼ等しい大きさのワーク2を研削加工す
る場合、もしくは球面創成するワーク2の曲率が非常に
小さい場合、もしくは球面創成するワーク2の曲率が非
常に大きい場合など、実施例1のように、ワーク2の加
工中にドレス電極21を導電性砥石4の研削面4aに接
近させて予め配置しておくことが不可能となる場合があ
るが、そのような場合には、ワーク2を加工しつつ導電
性砥石4を電解ドレッシングすることができなくなる。
しかし、本実施例においては、球面創成するワークの曲
率が非常に小さい場合、あるいは導電性砥石4と比較し
て、ワーク2の形状が大きい場合、初期電解ドレッシン
グが完了した後、エアシリンダ22を駆動させ、ドレス
電極21をワーク2と干渉しない位置まで退避させるこ
とにより、ワーク2の形状に関係なく安定した球面創成
の研削加工を行なうことができる。In the case of grinding the work 2 having a curvature almost equal to the size of the conductive grindstone 4 as in the present embodiment, or when the curvature of the work 2 for forming a spherical surface is very small, or when forming a spherical surface, For example, when the curvature of the work 2 to be formed is very large, it is impossible to arrange the dress electrode 21 close to the grinding surface 4a of the conductive grindstone 4 in advance during the processing of the work 2 as in the first embodiment. However, in such a case, the conductive grindstone 4 cannot be electrolytically dressed while the work 2 is being processed.
However, in the present embodiment, when the curvature of the work for generating a spherical surface is very small, or when the shape of the work 2 is large compared to the conductive grindstone 4, the air cylinder 22 is moved after the initial electrolytic dressing is completed. By driving and retracting the dress electrode 21 to a position where the dress electrode 21 does not interfere with the work 2, it is possible to perform a stable spherical generation grinding process regardless of the shape of the work 2.
【0021】[0021]
【発明の効果】以上のように、本発明の研削方法と装置
によれば、弱電性クーラントを供給しながら、電解ドレ
ッシングにより導電性砥石の研削面の砥粒の目立てと同
時に絶縁酸化膜を生成させ、この絶縁酸化膜による砥粒
の保持状態と、ボンド材による砥粒の保持状態と、を砥
石によるワークの研削加工中に存在するようにして、電
解インプロセスドレッシング研削と通常の研削を行なう
ので、砥粒の目立てが良好に行えるとともに摩滅のごく
僅かな砥粒を研削面から除去することなく使用できるこ
とになり、必要以上のボンド材の電解溶出を防止できて
導電性砥石の形状くずれを少なくできる。これにより、
導電性砥石の研削面の形状精度とドレッシング状態を維
持しながら、研削加工を連続的に行なうことができるの
で、精度の高い光学素子等を安定して加工することがで
きる。As described above, according to the grinding method and apparatus of the present invention, while supplying a weakly electric coolant, an insulating oxide film is formed simultaneously with the dressing of the abrasive grains on the ground surface of the conductive grindstone by electrolytic dressing. Electrolytic in-process dressing grinding and normal grinding are performed such that the state of holding the abrasive grains by the insulating oxide film and the state of holding the abrasive grains by the bond material are present during the grinding of the work by the grindstone. As a result, the abrasive grains can be dressed well, and very little abrasive grains can be used without removing them from the ground surface. Can be reduced. This allows
Since the grinding can be performed continuously while maintaining the shape accuracy and the dressing state of the ground surface of the conductive grindstone, a highly accurate optical element or the like can be stably processed.
【図1】 本発明の研削方法を実施するための研削装置
を例示して示す概念図である。FIG. 1 is a conceptual view exemplifying a grinding apparatus for performing a grinding method of the present invention.
【図2】 導電性砥石の研削面の電解ドレッシング状態
を模式的に示す断面図である。FIG. 2 is a cross-sectional view schematically showing a state of electrolytic dressing of a ground surface of a conductive grindstone.
【図3】 本発明に係る研削方法を実施するための研削
装置の実施例1を示す平面図である。FIG. 3 is a plan view showing Embodiment 1 of a grinding apparatus for performing a grinding method according to the present invention.
【図4】 本発明に係る研削方法を実施するための研削
装置の実施例2を示す平面図である。FIG. 4 is a plan view showing Embodiment 2 of a grinding apparatus for performing a grinding method according to the present invention.
【図5】 従来の研削装置を示す平面図である。FIG. 5 is a plan view showing a conventional grinding device.
【図6】 導電性砥石の研削面の電解ドレッシング状態
を模式的に示す断面図である。FIG. 6 is a cross-sectional view schematically showing a state of electrolytic dressing of a ground surface of a conductive grindstone.
1 チャック 2 ワーク 4 導電性砥石 4a 研削面 6 電源装置 7 21 ドレス電極 9 クーラント 15 切替手段 20 切替スイッチ 22 エアシリンダ Reference Signs List 1 chuck 2 work 4 conductive grindstone 4a grinding surface 6 power supply device 7 21 dress electrode 9 coolant 15 switching means 20 switching switch 22 air cylinder
Claims (2)
ークホルダに保持されたワークを回動しつつ導電性砥石
を回動して研削面をワークに当接し、ノズルから弱電性
クーラントを研削面とドレス電極との間に供給しながら
ドレス電極に電源装置から(−)電圧を印加し、導電性
砥石に(+)電圧を印加して、該砥石の研削面を電解ド
レッシングしつつワークの研削加工を行う研削方法にお
いて、 前記研削装置に装着した導電性砥石の研削面を電解ドレ
ッシングをして該研削面のボンド材を電解溶出し、砥粒
の目立てを進行させるとともに該研削面にボンド材の絶
縁酸化膜を生成して該酸化膜で砥粒を保持し、 次いで電源装置からの通電を切りまたはドレス電極を離
して電解ドレッシングが行われない状態で前記砥石でワ
ークを研削加工し、前記絶縁酸化膜がなくなった後も研
削面に突出している砥粒で研削加工を続け、 前記砥粒が摩耗進行したところで、ワークの研削加工中
に電解ドレッシングをして砥粒の目立てを進行させると
ともに絶縁酸化膜を生成して該酸化膜で砥粒を保持し、 その後、電源装置からの通電を切りまたはドレス電極を
離して電解ドレッシングが行われない状態で前記砥石で
ワークを研削加工し、前記絶縁酸化膜がなくなった後も
研削面に突出している砥粒で研削加工をし、 前記ワークの研削加工中に砥石の電解ドレッシングと、
電解ドレッシングが行われない状態を交互に行うことを
特徴とする研削方法。After a conductive grindstone is mounted on a grinding device, the conductive grindstone is rotated while rotating a work held by a work holder, and a grinding surface is brought into contact with the work. While supplying between the grinding surface and the dress electrode, a (−) voltage is applied to the dress electrode from the power supply device, a (+) voltage is applied to the conductive grindstone, and the work is performed while the grinding surface of the grindstone is electrolytically dressed. In the grinding method of performing the grinding process, the grinding surface of the conductive grindstone mounted on the grinding device is subjected to electrolytic dressing, the bond material on the grinding surface is electrolytically eluted, and the abrasive grains are sharpened and the grinding surface is advanced. The insulating oxide film of the bond material is generated and the abrasive grains are held by the oxide film.Then, the power is turned off from the power supply device or the dress electrode is separated to grind the workpiece with the grindstone in a state where the electrolytic dressing is not performed. , Even after the insulating oxide film disappears, the grinding process is continued with the abrasive particles protruding from the ground surface, and when the abrasive particles have progressed to abrasion, electrolytic dressing is performed during grinding of the workpiece to advance the setting of the abrasive particles. Along with forming an insulating oxide film and holding the abrasive grains with the oxide film, thereafter, turning off the power supply or separating the dress electrode and grinding the work with the grindstone in a state where electrolytic dressing is not performed, Grinding with abrasive grains protruding on the grinding surface even after the insulating oxide film has disappeared, and electrolytic dressing of a grindstone during the grinding of the work,
A grinding method characterized by alternately performing a state in which electrolytic dressing is not performed.
ダと、前記ワークホルダに保持されたワーク表面に当接
して回転駆動する導電性砥石と、前記導電性砥石の研削
面に対して一定距離を維持して配置したドレス電極と、
前記電極に(−)電圧を印加し前記砥石に(+)電圧を
印加する電源装置と、前記電極と前記砥石との間に弱電
性クーラントを供給するノズルと、を有する研削装置に
おいて、 前記導電性砥石の研削面を、砥粒が目立てされてボンド
材の絶縁酸化膜で保持された状態にするよう電解ドレッ
シングするために前記砥石と電極とを通電させ、また前
記電解ドレッシング後のワーク研削中に電解ドレッシン
グが行われないようにするために前記砥石と電極との通
電を切るための、通電の切替手段を設けたことを特徴と
する研削装置。2. A rotatable work holder for holding a work, a conductive grindstone abutting on the surface of the work held on the work holder and rotating, and a fixed distance from a ground surface of the conductive grindstone. Dress electrode maintained and arranged,
A grinding apparatus comprising: a power supply device that applies a (−) voltage to the electrode and applies a (+) voltage to the grinding wheel; and a nozzle that supplies a weakly conductive coolant between the electrode and the grinding wheel. In order to electrolytically dress the ground surface of the abrasive whetstone so that the abrasive grains are sharpened and held by the insulating oxide film of the bond material, the whetstone and the electrode are energized, and during the work grinding after the electrolytic dressing. A grinding device, characterized in that a current-switching means is provided for turning off the current between the grindstone and the electrode in order to prevent electrolytic dressing from being performed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17915492A JP3194624B2 (en) | 1992-06-12 | 1992-06-12 | Grinding method and apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17915492A JP3194624B2 (en) | 1992-06-12 | 1992-06-12 | Grinding method and apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05345272A JPH05345272A (en) | 1993-12-27 |
JP3194624B2 true JP3194624B2 (en) | 2001-07-30 |
Family
ID=16060902
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17915492A Expired - Fee Related JP3194624B2 (en) | 1992-06-12 | 1992-06-12 | Grinding method and apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3194624B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102485421A (en) * | 2010-12-01 | 2012-06-06 | 大连新氏传动科技有限公司 | Reticulated vertical lathe grinding device |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN100443260C (en) * | 2006-11-08 | 2008-12-17 | 大连理工大学 | Scatheless grinding method for rigid, fragile crystal wafer |
-
1992
- 1992-06-12 JP JP17915492A patent/JP3194624B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102485421A (en) * | 2010-12-01 | 2012-06-06 | 大连新氏传动科技有限公司 | Reticulated vertical lathe grinding device |
Also Published As
Publication number | Publication date |
---|---|
JPH05345272A (en) | 1993-12-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP3344558B2 (en) | Electric dressing grinding method and apparatus | |
JPH0343145A (en) | Grinding device | |
JP4104199B2 (en) | Molded mirror grinding machine | |
JP3530562B2 (en) | Lens grinding method | |
JP3194624B2 (en) | Grinding method and apparatus | |
JP2838314B2 (en) | Electrolytic interval dressing grinding method | |
JPH10175165A (en) | Centerless grinding method using metal bond grinding wheel, and its device | |
JP2001062633A (en) | Curved surface machining method and device | |
JP2601750B2 (en) | Wheel side shaping method by on-machine discharge truing method | |
JP3078404B2 (en) | Electrolytic dressing grinding method | |
JP3294347B2 (en) | Electrolytic in-process dressing grinding method and apparatus | |
JP3169631B2 (en) | Method and apparatus for electrolytic dressing with semiconductor contact electrode | |
JPH07186031A (en) | Spherical surface grinding method and device | |
JPH07195261A (en) | Spherical grinding method and device thereof | |
JP3356693B2 (en) | Ultra-precision grinding method and grinding device | |
JPH07328907A (en) | Spherical surface creative processing method and device thereof | |
JP3251610B2 (en) | Mirror polishing method and apparatus using electrolytic products | |
JPH06335853A (en) | Grinding and device therefor | |
JP3477260B2 (en) | Grinding / polishing whetstone and processing method using the whetstone | |
JP3194621B2 (en) | Method and apparatus for generating spherical surface | |
JP2717438B2 (en) | Method and apparatus for truing and dressing conductive grindstone by electrolytic dressing grinding | |
JPH06170710A (en) | Method and device for grinding spherical surface | |
JPH06344254A (en) | Grinding method and apparatus | |
JPH08108364A (en) | Grinding work method | |
JPH07186029A (en) | Spherical surface formation working method and device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20010515 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080601 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090601 Year of fee payment: 8 |
|
LAPS | Cancellation because of no payment of annual fees |