JP3194518B2 - Semiconductor device manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a semiconductor device manufacturing apparatus, and more particularly to a semiconductor device manufacturing apparatus for manufacturing a semiconductor device having a structure in which a magnetic metal film is disposed on a resin protrusion formed on a resin package. In recent years, with the miniaturization of electronic devices, resin-sealed semiconductor devices have also been reduced in size, and thus the pitch of external connection terminals provided in the semiconductor device has been decreasing. In recent years, high reliability has been required for semiconductor devices. Therefore, a semiconductor device manufacturing apparatus capable of realizing both miniaturization and high reliability is required.

[0002]

2. Description of the Related Art FIG. 26 is a sectional view showing an example of a conventional resin-encapsulated semiconductor device. In the figure, 1 is a resin package, 2 is a semiconductor element, 3 is an outer lead, 4 is a bonding wire, and 5 is a die pad. This semiconductor device is a SSOP (Shrink Small Outoline Package)
The outer lead 3 is bent in a gull-wing shape and is mounted on a mounting board.

[0003] This type of semiconductor device is manufactured through a number of manufacturing steps. In particular, a resin-sealed type semiconductor device has a resin-sealing step of forming the resin package 1 in the manufacturing process, and this resin-sealing step is usually formed by a transfer molding method using a mold. Therefore, when the resin package 1 is formed, a gate portion serving as a resin passage is formed together.

For this reason, the mold is released and the resin package 1 is released.
When the resin package 1 is taken out, the resin package 1 and the gate portion are continuously formed. Since the gate portion is unnecessary for the semiconductor device, a process of separating the resin package 1 from the gate portion is performed by performing a gate break process. Conventionally, this gate breaking step has been performed manually (operator). In the gate breaking step, the resin package 1 and the gate portion are cut and separated, so that resin dust is inevitably generated. Therefore, resin dust generated in the gate breaking step has been manually removed in the same step.

[0005] In addition, various tests are performed on individual semiconductor devices singulated by performing the gate break process in order to improve reliability at the time of shipment. This test is, in brief, an external measurement for performing an external inspection of a semiconductor device using an image processing technique, and an operation for connecting a probe connected to a tester to an outer lead 3 of the semiconductor device to perform an operation inspection of the semiconductor element 2. Measurement is classified into two. In addition, usually, the operation is measured after the appearance is measured.

In performing each of these measurements, the singulated semiconductor device is transported to an appearance measuring unit and an operation measuring unit.
Of the outer lead 3
Is slid on a rail by a guide serving as a conveyance path, and thereby conveyed to an appearance measurement unit and an operation measurement unit.

However, in the SSOP type semiconductor device shown in FIG. 26, the area of the lead portion 9 in the resin 1 from the inner lead 8 to the outer lead 3 and the area occupied by the outer lead 3 itself are large, and the mounting area is small. There was a problem of becoming large. Therefore, the applicant has previously disclosed Japanese Patent Application Laid-Open No. Hei 9-162348 (Japanese Patent Application No. 7-322803) as a semiconductor device capable of solving the above-mentioned problems.
Suggested. FIG. 27 shows a semiconductor device 21 according to the above application.
0 is shown. As shown in FIG.
Reference numeral 10 denotes an extremely simple configuration including a semiconductor element 211, a resin package 212, a metal film 213, and the like. The resin protrusion 217 integrally formed on the mounting surface 216 of the resin package 212 is coated with the metal film 213. It is characterized by being formed.

In the semiconductor device 210 having the above-described structure, the inner lead and the outer lead as in the conventional SSOP are not required, and the area for leading from the inner lead to the outer lead and the area of the outer lead itself are not required. Thus, the size of the semiconductor device 210 can be reduced. Further, since it is not necessary to use a mounting substrate for forming a solder ball like a conventional BGA, the cost of the semiconductor device 210 can be reduced. Further, the resin protrusion 217 and the metal film 213 cooperate to form a BGA (Bal
l Grid Array) type semiconductor devices have the same function as the solder bumps, so that the mountability can be improved.

[0009]

Here, the separating step (the resin package 21) of the semiconductor device 210 having the above-described structure is performed.
Attention is paid to the manufacturing process (that is, the gate breaking process and the inspection process) after the process of separating the lead frame 2 from the lead frame.
First, focusing on the gate break process, the semiconductor device 2
In the state where the resin encapsulation step has been completed, since the resin packages 212 have a configuration in which they are connected by a gate portion, the gate portion needs to be removed. This removal of the gate portion is the same as that of the semiconductor device having the SSOP structure described with reference to FIG. 26, and has been performed manually (operator).

For this reason, there is a problem that the removal of the gate portion is slower than the other processes, and the manufacturing efficiency of the semiconductor device is reduced due to this. Also,
Since the resin dust generated in the gate breaking step has also been manually removed as in the related art, there is a problem that it takes time to remove the resin dust and the manufacturing efficiency of the semiconductor device 210 is low. .

Further, there is a possibility that the cut surface of the gate becomes non-uniform (that is, a gate remains with a part of the gate remaining), and the shape of the resin package 212 may vary. Thus, the resin package 21
2. If there is a variation in the shape of the semiconductor device 21, even if all other configurations are normal, the semiconductor device 21 is merely defective due to an outer shape defect.
0 is determined to be defective, and the throughput is reduced.

Further, the manufacturing process of the semiconductor device 210 includes a plating process of the metal film 213 as disclosed in the above-mentioned Japanese Patent Application Laid-Open No. 9-162348. Also plating dust is generated. Therefore, the plating dust is manually removed together with the resin dust removal processing. However, it is difficult to completely remove the plating debris by hand. I was

[0013] Focusing on the transport mechanism, the semiconductor device 210 is a so-called chip-size package (CSP), and is therefore downsized. In addition, since the external connection terminal has a configuration in which the metal film 213 is formed on the resin protrusion 217, the external connection terminal does not extend to the side of the resin package 212. Therefore, it is difficult to transport the semiconductor device 210 using the same rail as in the related art.
In addition, since the metal film 213 is coated on the resin protrusion 217, the metal film 213 is easily peeled. Therefore, the miniaturized semiconductor device 210 can be stably used and the metal film 2 can be formed.
A transport mechanism capable of performing transport so that 13 does not peel off is required.

Further, in the semiconductor device 210, since the external connection terminals do not extend to the side of the resin package 212,
At the time of the test, the test cannot be performed by bringing the probe of the tester into contact with the outer lead 3 as in the related art. For this reason, there is a problem that the same test method as that of the related art cannot be used. The present invention has been made in view of the above points, and has as its object to provide a semiconductor device manufacturing apparatus capable of manufacturing a miniaturized semiconductor device with high reliability.

[0015]

The above-mentioned object can be attained by taking the following means. According to the first aspect of the present invention, when manufacturing a semiconductor device having an asymmetric resin package and having an external connection terminal having a configuration in which a magnetic metal film is disposed on a resin protrusion formed on the resin package. A gate break portion for separating and removing the gate portion from the resin package, wherein the semiconductor package is supplied from the gate break portion. A first alignment unit for aligning the devices in a certain direction; and a visual inspection unit for supplying the semiconductor device in an aligned state from the first alignment unit and performing a visual inspection on the semiconductor device. In the semiconductor device manufacturing apparatus, the first alignment unit includes a transfer path having an inclined surface, and a stopper provided in the middle of the transfer path. The inclined surface is set at an inclination angle at which the conductor device is dropped from the transport path when the semiconductor device in which the resin package is asymmetrically shaped is transported in an inappropriate direction with respect to the front and back directions, The stopper may be configured to contact the semiconductor device when the semiconductor device in which the resin package has an asymmetric shape is transported in an inappropriate direction in the vertical and horizontal directions, and to drop the semiconductor device from the transport path. It is a feature.

According to a second aspect of the present invention, in the apparatus for manufacturing a semiconductor device according to the first aspect, the transfer passage provided in the first alignment portion with respect to a flow direction of the transfer of the semiconductor device. A direction changing portion for performing a direction changing process such that the metal film of the semiconductor device faces outward is provided downstream of the position where the inclined surface and the stopper are provided.

According to a third aspect of the present invention, in the semiconductor device manufacturing apparatus according to the first or second aspect, the gate break is located downstream of the gate break portion with respect to a flow direction of the semiconductor device. And a dust removing section comprising a blow device for blowing up the magnetic metal scrap generated in the section and a magnet for attracting the blown-up magnetic metal scrap by magnetic force.

According to a fourth aspect of the present invention, in the semiconductor device manufacturing apparatus according to any one of the first to third aspects, the gate break portion is formed of a bending jig, a punching jig, or a cutting jig. Any one of the jigs is provided, and the gate unit and the resin package integrated by using the one jig are automatically separated from each other.

According to a fifth aspect of the present invention, in the apparatus for manufacturing a semiconductor device according to any one of the first to fourth aspects, the magnetic metal film disposed in the semiconductor device at the gate break portion. Is provided, and the gate portion and the semiconductor device are sorted by adsorbing the magnetic metal film on the magnet.

According to a sixth aspect of the present invention, in the apparatus for manufacturing a semiconductor device according to any one of the first to fifth aspects, a ball feeder is used as the first alignment portion, and the inclined surface and the inclined surface are formed. A return passage is provided for returning the semiconductor device dropped from the transfer passage by a stopper to an intermediate position in the transfer passage.

According to a seventh aspect of the present invention, there is provided a semiconductor having an asymmetrical resin package and having an external connection terminal having a configuration in which a magnetic metal film is disposed on a resin protrusion formed on the resin package. A transport path used for manufacturing the device, for transporting the semiconductor device by its own weight, a second alignment unit for aligning the semiconductor device supplied through the transport path in a predetermined direction, and
And a measuring section for performing an operation test by mounting the semiconductor device supplied from the aligning section on a measuring substrate, wherein the measuring section mounts the semiconductor device and mounts the semiconductor device. A moving device for moving toward the measurement substrate is provided.

Further, in the invention according to claim 8, in the semiconductor device manufacturing apparatus according to claim 7, the moving device includes: a positioning mechanism for positioning the semiconductor device falling by its own weight at a standby position; The semiconductor device at the standby position includes a mounting portion to be mounted by falling under its own weight, and a moving mechanism for mounting the semiconductor device to the measurement substrate by moving the mounting portion toward the measurement substrate. It is characterized by the following.

According to a ninth aspect of the present invention, in the semiconductor device manufacturing apparatus according to the seventh or eighth aspect, the semiconductor device is fixed to the mounting portion by vacuum-suctioning the mounting portion. A mechanism is provided. According to a tenth aspect of the present invention, in the semiconductor device manufacturing apparatus according to the seventh or eighth aspect, the semiconductor device is fixed to the mounting portion by magnetically attracting the magnetic metal film to the mounting portion. And a magnetic force attracting mechanism.

According to an eleventh aspect of the present invention, in the apparatus for manufacturing a semiconductor device according to any one of the seventh to tenth aspects, the semiconductor device manufacturing apparatus further comprises: A cover member is provided to cover a mounting portion of the semiconductor device and to open when the mounting portion moves to allow the mounting portion to move.

According to a twelfth aspect of the present invention, in the semiconductor device manufacturing apparatus according to any one of the seventh to tenth aspects, the transfer path from the second alignment section to the measurement section is provided. A separation unit is provided at an intermediate position for separating the semiconductor device continuously supplied from the second alignment unit and sending the semiconductor device to the measurement unit at a constant timing.

Each of the above means operates as follows.
According to the first aspect of the present invention, when the semiconductor device is transported in an inappropriate direction with respect to the front and back directions, the conductor device falls from the transport path on the inclined surface provided in the transport path of the first alignment section. When the semiconductor device is transported in an inappropriate direction with respect to the vertical and horizontal directions, the stopper provided in the transport path of the first alignment portion is brought into contact with the semiconductor device. By adopting a configuration in which the semiconductor device is dropped from the transport path, a semiconductor device transported in an inappropriate direction in the transport path can be accurately removed with a simple configuration.

According to the second aspect of the present invention, the position of the inclined surface of the transfer passage provided in the first alignment portion and the position of the stopper are determined with respect to the flow direction of the transfer of the semiconductor device. By providing a direction changing unit on the downstream side for performing a direction changing process so that the metal film of the semiconductor device faces outward, the metal film can be prevented from slidingly contacting the wall of the transport passage, and thus the metal film can be separated. And damage can be prevented.

According to the third aspect of the present invention, a blow device for blowing magnetic metal chips generated in the gate break portion downstream of the gate break portion with respect to the flow direction of transport of the semiconductor device, and the blow-up device. By providing the dust removing unit including the magnet that attracts the magnetic metal waste by the magnetic force, the magnetic metal waste can be easily and reliably removed. Due to the magnetic metal scrap,
It is possible to prevent clogging of the semiconductor device being transported.

According to the fourth aspect of the present invention, the gate break and the resin package are integrated by using any one of a bending jig, a punching jig, and a cutting jig in the gate break portion. Is automatically separated from each other, so that the manufacturing efficiency can be improved as compared with the conventional configuration in which the gate break is manually performed. In addition, it is possible to perform the gate break process under optimized and uniform conditions, thereby suppressing the generation of resin dust, thereby facilitating the process of removing the resin dust, and thereby also manufacturing the semiconductor device. Efficiency can be improved.

According to the fifth aspect of the present invention, a magnet for magnetically attracting a magnetic metal film provided in the semiconductor device is provided at the gate break portion, and the magnetic metal film is attracted to the magnet. With the configuration in which the gate portion and the semiconductor device are sorted, the process of sorting the gate portion and the semiconductor device can be automated, and erroneous recognition of the gate portion and the semiconductor device can be prevented.

According to the sixth aspect of the present invention, the first
The use of a ball feeder as an alignment part of the semiconductor device and the provision of a return passage for returning the semiconductor device dropped from the transfer passage to the middle position of the transfer passage by the inclined surface and the stopper reduce the remaining amount of the semiconductor device in the ball feeder. Even in such a case, the semiconductor device that has fallen from the transport path is returned to an intermediate position in the transport path via the return path, and thus can be immediately returned to the transport path.

Thus, the semiconductor device can be immediately returned to the transport passage even when the semiconductor device in the ball feeder has a small remaining amount and the semiconductor device takes a long time to reach the entrance of the transport passage. Therefore, the work efficiency can be improved. According to the seventh aspect of the present invention, the moving unit for moving the mounted semiconductor device toward the measuring substrate is provided in the measuring unit, so that the magnetic metal film is provided on the resin protrusion (that is, the package side). Even in the case of a semiconductor device having an external connection terminal (without a lead extending to the other side), it is possible to securely mount the semiconductor device on a measurement substrate and perform an operation test. In addition, since it becomes possible to perform automatic mounting on the measurement substrate, measurement efficiency can be improved.

According to the eighth aspect of the present invention, the positioning mechanism constituting the moving device once positions the semiconductor device falling by its own weight to the standby position. Then, the semiconductor device at the standby position is mounted on the mounting portion by dropping under its own weight. In this way, by positioning the semiconductor device that falls under its own weight once at the standby position and then mounting it on the mounting portion, the semiconductor device can be mounted on the mounting portion with high positional accuracy. This makes it possible to accurately mount the semiconductor device on the measurement substrate when the mounting mechanism is moved toward the measurement substrate by the moving mechanism to mount the semiconductor device on the measurement substrate.

According to the ninth aspect of the present invention, since the mounting portion is provided with the vacuum suction mechanism for vacuum-sucking and fixing the semiconductor device to the mounting portion, the semiconductor device is displaced when the mounting portion moves. The semiconductor device can be accurately mounted on the measurement substrate. According to the tenth aspect of the present invention, a magnetic force attracting mechanism for fixing the semiconductor device to the mounting portion is provided by attracting the magnetic metal film to the mounting portion by magnetic force. The semiconductor device can be prevented from being displaced, so that the semiconductor device can be accurately mounted on the measurement substrate.

According to the eleventh aspect of the present invention, before the mounting portion is moved, the semiconductor device is detached from the mounting portion by covering the mounting portion of the mounting portion of the semiconductor device with the cover member. Can be prevented. Further, since the cover member is opened when the mounting portion moves and the mounting portion is allowed to move, the cover member does not interfere with the mounting of the semiconductor device on the measurement substrate.

According to the twelfth aspect of the present invention, the semiconductor device continuously supplied from the second alignment unit is separated in the separation unit and sent to the measurement unit at a fixed timing. The semiconductor devices are supplied to the measuring unit one by one at a predetermined timing, and it is possible to prevent the semiconductor device from being erroneously mounted on the measuring unit.

[0037]

Next, embodiments of the present invention will be described with reference to the drawings. 1 and 2 show a schematic configuration of an apparatus for manufacturing a semiconductor device according to an embodiment of the present invention. The manufacturing apparatus 10A shown in FIG. 1 includes, in the order of the manufacturing steps of the semiconductor device, a gate breaking step performed after a separating step of separating a resin package from a lead frame;
And an apparatus for performing a visual inspection step of performing a visual inspection of a resin package.

Further, the manufacturing apparatus 10B shown in FIG.
Is an apparatus for performing an electrical operation test on the semiconductor device after the appearance inspection step performed by the manufacturing apparatus 10A shown in FIG. Hereinafter, each of the manufacturing apparatuses 10A and 10B
Will be described in detail. First, the overall configuration of the manufacturing apparatuses 10A and 10B will be schematically described with reference to FIGS. 1 and 2, and then the respective components constituting the manufacturing apparatuses 10A and 10B will be described in detail.

As shown, the manufacturing apparatus 10A includes a supply unit 12, a gate break unit 14, a gate unit discharge box 16, an alignment unit 18 (first alignment unit), and a visual inspection unit 2.
0, a defective product discharge box 22, a storage unit 24, and the like. In the supply unit 12, the resin package 42 separated from the lead frame in the etching apparatus used in the separation step (previous step) is transported and temporarily stored therein. As shown in FIG. 4, the resin package 42 immediately after being molded in the molding device is in a state where the gate portion 52 is integrally connected. Therefore, to form an individual semiconductor device 40, the gate portion 5
2 needs to be separated from the resin package 42. Therefore, it is necessary to cut the gate portion 52 from the resin package 42 at the position indicated by the arrow C in FIG.

Then, the resin package 42 housed in the supply section 12 and connected to the gate section 52 shown in FIG. 4 is conveyed to the gate break section 14. This transfer processing is performed by horizontal transfer using, for example, a handling device. In the gate break section 14, the cutting process is performed by the arrow C in FIG. 4B, and the gate section 52 and the resin package 42 are separated. The semiconductor device 40 is formed by performing the gate break processing.

Here, the shape characteristics of the semiconductor device 40 manufactured in this embodiment will be described. FIG.
Indicates a separated semiconductor device 40. As shown in the figure, the semiconductor device 40 has a configuration in which a bump 44 is provided in a resin package 42 in which a semiconductor element (not shown) is provided.

The bump 44 functions as an external connection terminal, and has a configuration in which a metal film is provided on a resin protrusion formed on the resin package 42. The metal film is made of a magnetic metal having conductivity, so that the bumps 44 are attracted by magnetic force. The bumps 44 are formed collectively on the bottom surface of the resin package 42, and therefore, unlike the conventional semiconductor device shown in FIG. 26, the external connection terminals do not extend from the side surfaces of the resin package 42.

Also, paying attention to the shape of the resin package 42, the resin package 42 has an asymmetric shape. Specifically, first, as shown in FIG. 5A, the length W1 of the first and second sides 46, 48 is longer than the length W2 of the other side 50 ( W1> W2). Further, as shown in FIG. 5D, the shape of the first side 46 (the shape in the circle indicated by the arrow A) is the shape of the second side 48 (the shape in the circle indicated by the arrow B). Shape). That is, the inclination angle θ1 of the first side 46 is
(Θ1>).
θ2).

Further, focusing on a plurality of bumps 44 provided on the bottom surface of the resin package 42, as shown in FIG. 5C, bumps 44A formed on one of four corners of the bottom surface are formed. (Hereinafter, the first bump 44 </ b> A) has a shape different from the shape of the other bumps 44. Specifically, the first bumps 44A have a nearly square bump shape, while the other bumps 44 have a rectangular shape.

As described above, the resin package 42 of the semiconductor device 40 is not symmetrical in the front, back, vertical and horizontal directions, so that the configuration of the resin package 42 can be recognized from the asymmetric shape. Here, returning to FIG. 1 again, the description of the manufacturing apparatus 10A will be continued. As mentioned above,
When the gate section 52 and the resin package 42 are separated from each other in the gate break section 14, a process of identifying the gate section 52 and the resin package 42 is performed, and the unnecessary gate section 52 is discharged to the gate section discharge box 16. You. On the other hand, the resin package 42 (semiconductor device 40) is sent to the alignment unit 18.

The aligning section 18 uses the asymmetrical shape of the resin package 42 to perform a process of aligning the direction (front / back / vertical / horizontal). As described above, the resin package 4 in the alignment section 18
The two orientations are arranged so that the appearance inspection performed in the appearance inspection unit 20 can be easily performed.

The semiconductor devices 40 aligned in a predetermined direction by the alignment unit 18 are subsequently conveyed to the visual inspection unit 20 and subjected to visual inspection. In the appearance inspection, the quality is determined by, for example, capturing an image of the surface on which the bumps 44 are formed by an imaging camera and comparing the captured image with a previously captured image in a normal state. If it is determined that the semiconductor device 40 is defective, the defective semiconductor device 40 is discharged to the defective product discharge box 22. on the other hand,
The semiconductor device 40 determined to be non-defective is stored in the storage unit 24.
And stored in a storage jig.

The non-defective semiconductor device 40 transferred to the storage section 24 is transferred to the manufacturing apparatus 10B shown in FIG. 2 while being stored in the storage jig. Then, the semiconductor device 40 taken out of the storage jig is connected to the manufacturing apparatus 1
0B. At this time, the semiconductor device 40 is transported by its own weight in the manufacturing apparatus 10B. In the case of the self-weight transfer, unlike the horizontal transfer, a handling device or the like is not required, so that the configuration of the manufacturing apparatus 10B can be simplified.

As shown in FIG. 2, the manufacturing apparatus 10B includes a direction aligning section 26 (second aligning section), a separating section 28,
It comprises a measuring unit 30, a visual inspection unit 32 and the like. The direction alignment unit 26 performs vertical and horizontal alignment processing. Here, the reason why the direction alignment unit 26 performs the alignment processing only in the vertical and horizontal directions and does not perform the alignment processing in the front-back direction is as follows.
Since the semiconductor devices 40 are aligned in the front and back directions in the state of being stored in the storage jig, the semiconductor devices 40 are already aligned in the front and back directions in the state where the semiconductor devices 40 are supplied from the storage jig to the manufacturing apparatus 10B. Because it is.

In the separating section 28, the semiconductor device 40, which is irregularly transported from the direction aligning section 26, is sent to the measuring section 30 at a constant timing. Specifically, the semiconductor device 40 conveyed from the direction alignment unit 26 is temporarily stopped, and the semiconductor device 40 is sent to the measuring unit 30 at regular intervals. The reason for providing the separation unit 28 is that there is a difference between the time when the semiconductor device 40 is transported in the proper direction and the case where the semiconductor device 40 is transported in the incorrect direction in the direction alignment unit 26. Depending on what happens. That is, when the semiconductor device 40 is transported in an improper direction, the direction alignment unit 26 performs the process of turning the semiconductor device 40 upside down, so that it takes more time than when the semiconductor device 40 is transported in an appropriate direction. For this reason, the intervals between the semiconductor devices 40 sent out from the direction alignment unit 26 are random.

On the other hand, as described later, the measuring section 30 moves the semiconductor device 40 toward the measurement printed board 122 (see FIG. 20), mounts the semiconductor device 40 thereon, and performs the test. In order to perform the measurement, it is desirable to perform the measurement process at regular intervals. Therefore, a configuration is provided in which the separating unit 28 is provided, and the semiconductor device 40 is sent to the measuring unit 30 at regular intervals.

As described above, the measuring unit 30 moves the semiconductor device 40 toward the measurement printed board 122 (see FIG. 20) and mounts the semiconductor device 40 on the semiconductor device 40 to determine whether or not the internal semiconductor element operates properly. A test is performed to determine whether the element and the bump 44 are properly connected. In addition, an appearance inspection unit 32 disposed next to the measurement unit 30 performs an inspection using the imaging camera 138 to determine whether the bumps 44 are damaged or peeled. After the above processing is completed, the semiconductor device 40 determined to be appropriate is packed and shipped.

Next, the manufacturing apparatus 10A having the above configuration,
3B and FIG. 6 to FIG.
This will be described with reference to FIG. In FIGS. 3 and 6 to 11, components corresponding to the components shown in FIG. 1 are denoted by the same reference numerals and described. FIG. 3 is a diagram showing a detailed configuration of the manufacturing apparatus 10A shown in FIG. As described above, the supply unit 12 houses the resin package 42 to which the gate unit 52 is connected, and the resin package 42 is supplied to the gate break unit 14. The gate break unit 14 is provided with a gate break device.
(B) The resin package 42 and the gate portion 5 indicated by the arrow C.
2 and a resin package 42 and a gate 52
Is performed.

FIGS. 6 to 9 show this gate break unit 1.
4 shows gate break devices 80A to 80D applicable to the fourth embodiment. The gate breaking device 80A shown in FIG. 6 is configured to separate the resin package 42 and the gate portion 52 using rubber rollers 74A to 74C (bending jig). As shown in the figure, a pair of tapes 76A and 76B is adhered to the resin package 42 in a state where the gate portion 52 is connected, so that the resin package 42 and the gate portion 52 are separated after separation. Are configured not to fall apart. A pair of tapes 76A, 76 to which the gate 52 and the resin package 42 are adhered.
B travels from left to right in the figure, and separation processing is performed by rubber rollers 74A to 74C provided in the middle of the travel.

The rubber roller 74A is a large-diameter roller (hereinafter, referred to as a roller).
The other rubber rollers 74B and 74C have a smaller diameter than the rubber roller 74A (hereinafter, the rubber rollers 74B and 74C are referred to as small-diameter rubber rollers 74B and 74C). Also, a large-diameter rubber roller 74A
Is disposed above the traveling path of the pair of tapes 76A, 76B, and the small-diameter rubber rollers 74B, 74C are disposed below the traveling path of the pair of tapes 76A, 76B. Further, each of the rubber rollers 74A to 74C
In the arrangement position, the traveling path of the pair of tapes 76A and 76B is configured to be largely bent substantially in a V-shape.

Therefore, in this bent position, the large-diameter rubber roller 74A is connected to the resin package 42 or the gate 52.
, And the small diameter rubber rollers 74B, 74C urge the resin package 42 or the gate 52 upward. Therefore, the bending force concentrates on the boundary portion between the resin package 42 and the gate portion 52 (portion where the mechanical strength is reduced), which is indicated by an arrow C in FIG. The gate section 52 is separated.

The gate breaker 80B shown in FIG.
Using the comb-shaped projections 78A and 78B (punching jig),
The configuration is such that the difference between the thickness of the resin package 42 and the thickness of the gate 52 is used to separate them. In this embodiment, a pair of tapes 76A and 76B are adhered to the gate portion 52 and the resin package 42, respectively. As shown, the thickness of the resin package 42 is
It is set to be larger than the thickness. Therefore, when the bump 44 is mounted on the fixed block 82 with the surface on which the bump 44 is formed facing upward (the side facing the comb-shaped projections 78A and 78B), a gap is formed between the gate portion 52 and the fixed block 82.

Further, the comb-shaped projection 78A is formed in the gate portion 52.
, And the comb-shaped projection 78B is configured to face the vicinity of the position where the gate portion 52 is joined to the resin package 42. In this state, as shown by arrows in the figure, the comb-shaped projections 78A,
When 78B is pressed toward the fixed block 82, FIG.
(B) The resin package 42 and the gate portion 5 indicated by the arrow C.
A shearing force is generated at the boundary between the gate portion 52 and the gate portion 52, so that the gate portion 52 is punched out at this portion and the resin package 42 and the gate portion 52 are separated.

The gate breaker 80C shown in FIG.
The laser generator 84 (cutting jig) is used to cut the boundary between the resin package 42 and the gate section 52 by laser light. Further, the gate breaker 80D shown in FIGS. 9A and 9B
6 (cutting jig) and the resin package 42 and the gate 5
2 is cut off.

As described above, in the gate break portion 14, the bending jig (rubber rollers 74A to 74C), the punching jig (comb-shaped projections 78A and 78B), or the cutting jig (laser generator 84, cutter 86). The gate breaker 80A-80D provided with any one of the jigs is used to automatically separate the integrated gate portion 52 and the resin package 42. The manufacturing efficiency can be improved as compared with the configuration for performing the above.

Further, the gate break process can be performed under the optimized and uniform conditions, so that the generation of resin dust at the time of the break can be suppressed. This facilitates the process of removing resin dust, and can improve the manufacturing efficiency of the semiconductor device 40. On the other hand, when the semiconductor device 40 is formed by separating the resin package 42 and the gate section 52 as described above, the gate section 52 and the semiconductor device 40 (the resin package 4
2) is performed. As a method of this sorting operation, as described above, since the thickness of the resin package 42 and the gate portion 52 is different, this is utilized, and a sorting hole smaller than the semiconductor device 40 and larger than the gate portion 52 is provided. The semiconductor device 40 is formed by the sorting holes.
And the gate portion 52 may be sorted. However, according to this method, when a plurality of gate portions 52 are overlapped, the gate portions 52 remain, and a reliable sorting process cannot be performed.

In the present embodiment, attention is paid to the fact that the metal film forming the bumps 44 provided on the semiconductor device 40 is a magnetic metal, and a magnet 15 is provided in the gate break portion 14. The gate portion 52 and the semiconductor device 40 are sorted by adsorbing the magnetic metal film. Note that the gate portion 52 is made of only resin and is not attracted to the magnet 15.

The magnet 15 is an electromagnet, and is configured to be movable toward the alignment section 18. Therefore, the semiconductor device 40 attracted to the magnet 15 is transported to the transport path 35 connected to the alignment unit 18 while being attracted. The power to the magnet 15 is turned off in the state of being transported to the transport path 35, so that the semiconductor device 40 is supplied to the alignment unit 18 via the transport path 35. On the other hand, the gate portion 52 that is not attracted to the magnet 15 is discharged to the gate portion discharge box 16.

As described above, the bumps 44 (magnetic metal film) provided on the semiconductor device 40 are attracted by the magnets 15 to thereby separate the gate portion 52 and the semiconductor device 40 from each other. False recognition between the semiconductor device 52 and the semiconductor device 40 can be reliably prevented.
Further, the process of sorting the gate unit 52 and the semiconductor device 40 can be automated, and the manufacturing efficiency of the semiconductor device 40 can be improved.

Next, the alignment section 18 will be described. The alignment unit 18 includes a ball feeder 36 and a plating waste removing unit 38.
(Dust removing unit), a direction discriminating unit 54, a return passage 56, and the like. The ball feeder 36 is well known as a device for aligning and transporting chip components and the like, and has a built-in vibration device. Then, the supply port 34 of the transport passage 35
The semiconductor devices 40 supplied to the storage section 36a are sequentially sent to the transport path 88 by vibration, and an alignment process is performed while passing through the transport path 88.

The plating debris removing section 38 is disposed in the gate break section 14 with respect to the flow direction of the transport of the semiconductor device 40.
It is provided further downstream. In this embodiment, the plating debris removing unit 38 is provided at an intermediate position in the transport path 88. The plating debris removing section 38 is provided in the gate break section 14.
And a magnet for attracting the blown-up magnetic metal chips by magnetic force.

The blow device is configured to inject compressed air toward the storage section 36a, and thereby the semiconductor device 4
The magnetic metal scraps present in the storage portion 36a together with 0 can be blown up. The magnet is disposed at an appropriate position where the blown-up magnetic metal dust can be collected. As a specific arrangement position of the magnet, the vicinity of the outlet of the compressed air of the blowing device can be considered.

With this configuration, the magnetic metal chips can be easily and reliably removed, and the clogging of the semiconductor device 40 to be conveyed due to the magnetic metal chips can be prevented. Thus, the semiconductor device 40 can be smoothly transported, and the throughput can be improved. The direction determination unit 54 performs a process of aligning the direction of the semiconductor device 40 conveyed in the conveyance path 88 to a predetermined direction. In the present embodiment, the direction discrimination processing is performed by using the inclined surface 90 provided in the transport path 88 and the stopper 94.
It is done by. Hereinafter, a specific configuration of the direction determination unit 54 will be described with reference to FIGS. 10 and 11.

In the direction determination of the semiconductor device 40, three types of determination processing, that is, determination of front and back, determination of length and width, and determination of right and left are performed. FIG. 10 shows the discrimination between the front and back sides, and FIG. 11 shows the discrimination between the vertical and horizontal directions. The left and right determination is made by a visual inspection device 66 described later.
First, determination of the front and back of the semiconductor device 40 shown in FIG. 10 will be described. In the present embodiment, the discrimination between the front and back is made by the conveyance path 8.
8 is performed by the inclined surface 90 provided. A flange 92 is provided at a lower portion of the inclined surface 90, and the semiconductor device 40 is configured to be transported along the transport path 88 by engaging the lower portion with the flange 92. In this embodiment, the bumps 4 shown in FIG.
It is assumed that the state where 4 is in contact with the inclined surface 90 is proper front and back.

As shown in FIG. 10A, the bump 4
In a state in which the resin package 4 is in contact with the inclined surface 90, that is, in a proper state, the bottom side edge of the resin package 42 is in sliding contact with the flange 92 and is supported by the flange 92. In contrast,
When the resin package 42 is transported upside down to the transport path 88, the surface of the resin package 42 comes into contact with the inclined surface 90. However, as described above, the side portions 46, 48,
50 are formed, and each side 46, 48, 50 is an inclined surface or a surface having a curvature.

Here, when the semiconductor device 40 is improperly (upside down) transferred to the transfer passage 88, the flange 90 may be formed of resin. It does not engage with the package 42. Therefore,
When the semiconductor device 40 is improperly transferred (upside down) to the transfer passage 88, as shown in FIG.
The semiconductor devices 40, 48, and 50 are not locked by the flange 92, so that the semiconductor device 40 falls off the inclined surface 90 and falls from the transport passage 88. As a result, only the semiconductor device 40 transported in an appropriate direction with respect to the front and back sides proceeds to the next processing.

Next, the vertical / horizontal determination of the semiconductor device 40 shown in FIG. 11 will be described. In this embodiment, the vertical and horizontal discrimination is performed by the stopper 94 provided in the transport path 88. As shown in FIG. 5, the semiconductor device 40 is
And the length W1 of the second side 46, 48 is different from that of the other side 50.
Is longer than the length W2 (W1> W2). Therefore, it is possible to determine the length and width of the semiconductor device 40 based on the shape difference of the resin package 42. In the present embodiment, the direction along the inclined surface 90 (the direction indicated by the arrow D in the figure) shown in FIG.
When it is 2, it is determined that the orientation is proper.

The stopper 94 described above is connected to the semiconductor device 4.
When 0 is conveyed in an appropriate direction in the vertical and horizontal directions, it is configured not to abut on the resin package 42. Therefore, as shown in FIG.
Is properly transported, the stopper 94 allows the semiconductor device 40 to pass. On the other hand, when the resin package 42 is transported to the transport path 88 vertically and horizontally in reverse, FIG.
As shown in (B), the resin package 42 comes into contact with the stopper 94, so that the semiconductor device 40 falls off the inclined surface 90 and falls from the transport path 88.
As a result, only the semiconductor device 40 transported in an appropriate direction in the vertical and horizontal directions proceeds to the next processing. By configuring the direction determining unit 54 as described above, the semiconductor device 40 that is transported in the transport path 88 in an inappropriate direction
Can be accurately removed with a simple configuration.

By the way, the above-mentioned direction discriminating section 54 includes:
A return passage 56 is provided. This return passage 56
The semiconductor device 40 that has been dropped from the transport path 88 by the inclined surface 90 and the stopper 94 due to being transported in an incorrect direction has a function of returning to the intermediate position in the transport path 88. Now, if the semiconductor device 40 dropped from the transfer passage 88 returns to the start point (the position indicated by the arrow E in FIG. 3) of the transfer path of the bowl feeder 36 and restarts from there, especially the storage portion 36a When the remaining amount of the semiconductor device 40 becomes small, the transfer efficiency becomes very poor.

On the other hand, by providing the return passage 56 for returning the semiconductor device 40 dropped from the transfer passage 88 to an intermediate position of the transfer passage 88, the remaining amount of the semiconductor device 40 in the ball feeder 36 becomes smaller. Even
The semiconductor device 40 that has fallen from the transfer passage 88 is returned to the return passage 5.
Since it is returned to a position in the middle of the transport passage 88 via 6, it can immediately return to the transport passage 88. Thereby, the work efficiency of the alignment processing can be improved.

In order to further improve the working efficiency, when the semiconductor device 40 that has fallen into the return path 56 returns, the semiconductor device 40 can be returned to an appropriate direction by utilizing a difference in taper angle, a difference in vertical and horizontal dimensions, the presence or absence of a terminal, and the like. It is good also as a structure provided with the correction mechanism which performs the correction | amendment process of direction. On the other hand, the semiconductor device 40
A direction changing unit 55 that performs a direction changing process so that the metal film of the semiconductor device 40 faces outward with respect to the flow direction of the transport of the semiconductor device 40 is provided downstream of the position where the direction determining unit 54 is provided.

As described with reference to FIG. 10, the direction judging section 54 assumes that the state in which the bump 44 slides on the inclined surface 90 is the proper direction. However, if this state is maintained after the judgment processing, The sliding contact between the bump 44 and the inclined surface 90 may cause damage or peeling of the metal film forming the bump 44. Therefore, by providing a direction conversion unit 55 that performs a direction conversion process of the semiconductor device 40 so that the metal film faces outward after the determination process of the direction determination unit 54,
It is possible to prevent the metal film from slidingly contacting the wall of the inclined surface 90 of the transport passage 88, thereby preventing the metal film from peeling and being damaged.

The semiconductor devices 40 aligned in an appropriate direction by the above-described series of processes are supplied to the visual inspection unit 20 through the linear feeder 58. The appearance inspection unit 20 is generally composed of a separation unit 60, transfer robots 62 and 70, an appearance inspection device 66, a direction correction unit 68, and the like. As described above, the semiconductor device 4 in which the front, back, vertical and horizontal directions are aligned
When 0 is conveyed to the final end of the linear feeder 58,
The semiconductor devices 40 continuously transported in the linear feeder 58 are separated and positioned one by one by a separation unit 60, and are placed on a rotary table 64 by a transfer robot 62. The rotary table 64 is provided with a vacuum suction mechanism, and the semiconductor device 40 mounted on the rotary table 64 is fixed to the rotary table 64 by the vacuum suction mechanism.

Subsequently, the turntable 64 is connected to the semiconductor device 4.
The semiconductor device 40 is rotated by 90 ° with 0 fixed, whereby the semiconductor device 40 faces the visual inspection device 66. The appearance inspection device 66 is provided with an imaging camera (not shown), and various inspections (external dimensions, missing mounting terminals, pinholes on the back surface) are performed on the semiconductor device 40 by the imaging camera.

At this time, the semiconductor device 4 should be turned upside down.
The appearance inspection device 66 is provided with a reversing mechanism for reversing the semiconductor device 40 so that the semiconductor device 40 can be reversed on the spot when 0 is transported. At the same time as the above-described various inspections, the direction of the first bump 44A is determined using the difference in the shape of the first bump 44A (see FIG. 5C).

In the appearance inspection device 66, when the above-described inspections and the direction determination processing of the first bumps 44A are completed,
The turntable 64 is rotated again by 90 °. As a result, the semiconductor device 40 faces the direction correcting unit 68, and when the direction of the first bump 44A is opposite in the direction correcting unit 68, the semiconductor device 40 is inverted by 180 ° to change the direction. Alignment processing is performed.

Then, the rotary table 64 is further moved to 9
The semiconductor device 40 is rotated by 0 °, and if the semiconductor device 40 is good, the vacuum suction is stopped, and the semiconductor device 40 is moved to the positioning unit 72 by the transfer robot 70. When the positioning operation is performed by the positioning section 72, the semiconductor device 40 is subsequently moved to the storage section 24.
And stored in a jig (not shown). When the storage of a certain number of semiconductor devices 40 is completed, the jig is stocked and the next jig is set automatically.

On the other hand, when the semiconductor device 40 is conveyed to the vicinity of the defective product discharge box 22, air is blown from a nozzle (not shown) when the semiconductor device 40 is conveyed to the vicinity of the defective product discharge box 22. As a result, the defective semiconductor device is discharged into the defective product discharge box. The storage unit 24 has a unit type so that it can be applied to any type of container / tray / taping / other as a storage jig used in the storage unit 24.
Further, the storage section 24 is configured so that when the type of the jig changes, the storage section 24 can be replaced with a dedicated unit and used.

In the separating section 60 and the positioning section 72, the semiconductor device 40 is lightly clamped with claws in order to position the semiconductor device 40.
0 may be damaged. Therefore, a configuration may be adopted in which a spring is provided in the clamp mechanism to prevent overload. Alternatively, a pressure sensor may be provided to stop the clamping operation when a pressure equal to or more than a certain value is applied.

Further, in the above-described embodiment, the vertical and horizontal directions and the front and back directions of the semiconductor device 40 are arranged in the bowl feeder 36. However, the direction is not distinguished by the bowl feeder 36 and the linear feeder 58.
Alternatively, the direction correcting unit 68 may be configured to align all directions. When a series of processes by the manufacturing apparatus 10A described above is completed, the semiconductor device 40 is supplied to the manufacturing apparatus 10B shown in FIG. 2, and the processing described below is performed.

The semiconductor device 40 stored in the jig in the storage section 24 is conveyed to the manufacturing apparatus 10B while being stored in the jig. And this manufacturing apparatus 10B
In the above, the semiconductor devices 40 are taken out one by one from the jig by a loader (not shown) and sent to the manufacturing apparatus 10B. In the manufacturing apparatus 10B, the semiconductor device 40 is applied with its own weight, which is transferred by its own weight. As described above, in the manufacturing apparatus 10B, the self-weight transfer is used because the gate unit 52 in the semiconductor device 10A is used.
In order to transport the resin package 42 having the shape, the horizontal transport with suction or chuck could be used.
This is because horizontal transfer using suction and chuck is not desirable because 0 is handled.

As described above, the manufacturing apparatus 10B includes the direction alignment unit 26, the separation unit 28, the measurement unit 30, and the appearance inspection unit 3.
The semiconductor device 40 is subjected to an operation inspection and an appearance inspection in the process of passing through each of the components. The semiconductor device 40 sent to the manufacturing apparatus 10B
First, it is conveyed to the direction alignment unit 26 by its own weight. FIG.
2 shows a detailed configuration of the direction alignment unit 26. The direction alignment unit 26 aligns the semiconductor device 40 in the vertical and horizontal directions.

That is, the semiconductor device 4 taken out of the jig
0 indicates that the sheet is fed in the direction in which the second side 48 is located on the right side as shown by the arrow D in the figure, and that the second side 48 is located on the left side as shown by the arrow E in the figure. May be sent in the orientation. If there is a difference in the orientation of the semiconductor device 40 in the state of being sent in this way, the measurement unit 30 and the appearance inspection unit 32 described below cannot perform appropriate measurement and inspection.

For this purpose, the direction aligning section 26 is provided, and the semiconductor device 40 to be fed is moved to the measuring section 30 and the visual inspection section 32.
Before the process, the sorting process is performed. The semiconductor device 40
Of the semiconductor device 40 from the jig
When the loader is taken out, the loader is configured to correctly feed in the front and back directions, so that the direction alignment unit 26 is configured to perform only the vertical and horizontal alignment processing. In the present embodiment, the direction in which the second side 48 shown by the arrow D in the figure is located on the right side is assumed to be an appropriate direction.

As shown in FIG. 12, the direction aligning section 26 is generally composed of a rail 96 before inversion, a rail 98, a stopper pin 100, a rail 102 after inversion, and the like. The pre-reversing rail 96 has a non-tapered passage 96a for transporting the semiconductor device 40 therein. The semiconductor device 40 is transported from the loader to the pre-reversal rail 96. The non-tapered passage 96 a formed in the pre-reversal rail 96 is configured to allow the semiconductor device 40 to pass through regardless of the direction of the semiconductor device 40.

The reversing rail 98 has a circular shape when viewed from the front, and a tapered passage 98a extending in the radial direction is formed at the center thereof. The tapered portion 98b formed in the tapered passage 98a is
It is configured to correspond to the second side 48 formed at 0. Therefore, when the semiconductor 40 enters the reversing rail 98 in a direction in which the second side 48 and the tapered portion 98b coincide with each other (that is, the direction indicated by the arrow D in the drawing), the semiconductor 40 is allowed to pass through. If the side 48 and the tapered portion 98b enter in a direction in which they do not coincide with each other (that is, the direction indicated by the arrow E in the drawing), the passage is prevented. Further, the reversing rail 98 configured as described above is configured to be rotatable by a driving device (not shown).

The stopper pin 100 is
At the center of rotation and within the tapered passage 98a. This stopper pin 100
Is configured to be vertically displaceable with respect to the drawing by a driving device (not shown). Therefore, the stopper pin 1
00 is displaced vertically downward with respect to the drawing,
The stopper pin 100 is located inside the tapered passage 98a, and thus prevents the semiconductor device 40 from advancing through the tapered passage 98a. Conversely, when the stopper pin 100 is displaced vertically upward with respect to the drawing, the stopper pin 100 is separated from the tapered passage 98, and thus allows passage of the semiconductor device 40 through the tapered passage 98a.

The post-reversing rail 102 has a tapered passage 102a for transporting the semiconductor device 40 therein. The semiconductor device 40 that has passed through the reversing rail 98 is conveyed to the rail 102 after the reversing, and the semiconductor device 40
Is transported toward the separation unit 28. In addition, after this reversing rail 1
The taper-free passage 102a formed at 02 is configured to be able to pass through the semiconductor device 40 regardless of the direction of the semiconductor device 40.

Subsequently, the direction aligning unit 26 having the above-described structure is used.
The operation will be described with reference to FIGS.
When the direction alignment unit 26 is in the state shown in FIG. 12, the direction alignment unit 26 is in the initial state. On the basis of this initial state, the direction alignment unit 26 performs a direction alignment operation.

First, a case where the semiconductor device 40 is transported in a proper direction (the direction shown by the arrow D) with respect to the direction alignment unit 26 will be described. In this case, since the second side edge 48 and the tapered portion 98b coincide with each other as described above, the semiconductor device 40 that has passed the pre-inversion rail 96 subsequently proceeds to the inversion rail 98. In this state, the stopper pin 1
00 is displaced to a position separated from the tapered passage 98. Therefore, the semiconductor device 40 passes through the tapered passage 98 and proceeds on the rail 102 after the inversion.

Next, a case where the semiconductor device 40 is transported in an inappropriate direction (the direction shown by the arrow E) with respect to the direction alignment section 26 will be described. In this case, since the second side 48 does not coincide with the tapered portion 98b, the semiconductor device 40 that has passed the pre-reversal rail 96 comes into contact with the reversal rail 98 as shown in FIG. This prevents the tapered passage 98a from advancing.

Note that the semiconductor device 4 is mounted on the rail 96 before inversion.
A detection sensor (not shown) for detecting 0 is provided, and is configured to be able to detect when the progress of the tapered passage 98a is blocked by the semiconductor device 40. This detection sensor is connected to the tapered passage 98 a of the semiconductor device 40.
When it is detected that the forward movement is stopped, the driving device is activated to rotate the reversing rail 98 clockwise by 180 °, and the stopper pin 100 is displaced in the downward direction perpendicular to the drawing, and the state shown in FIG. The state shown in FIG.

As described above, when the reversing rail 98 is rotated by 180 °, the second side 48 and the tapered passage 9 are rotated.
The semiconductor device 40 advances into the tapered passage 98a. However, since the stopper pin 100 is located in the tapered passage 98a, as shown in FIG. 14C, the semiconductor device 40 comes into contact with the stopper pin 100 and the progress thereof is regulated.

In this state, the driving device is started again, and
As shown in FIG. 14D, the reversing rail 98 is rotated counterclockwise by 180 ° while maintaining the state where the semiconductor device 40 exists in the tapered passage 98a. In addition, the stopper pin 100 is displaced vertically upward with respect to the drawing and separates from the inside of the tapered passage 98a. FIG. 15E shows a state where the reversing rail 98 has been rotated 180 ° counterclockwise. This state is the same as the initial state. In this state, the vertical and horizontal directions of the semiconductor device 40 are reversed, so that the direction is changed to a state where the second side 48 is located on the right side in the drawing. That is, the semiconductor device 40
Is changed in an appropriate direction by the rotation of the reversing rail 98.

Then, the semiconductor device 40 whose direction has been changed to the appropriate direction is conveyed to the separating section 28 after passing over the rail 102 as shown in FIG. Therefore, by providing the direction alignment section 26 having the above-described configuration, the semiconductor device 40 can always keep the separation section 2 in an appropriate direction.
8 is conveyed. Next, a first embodiment of the separation unit 28 will be described with reference to FIGS.

The separation unit 28 performs a process of sending the semiconductor device 40 conveyed from the direction alignment unit 26 to the measurement unit 30 at a constant timing. Since the reason for providing the separation unit 28 has been described above, the description thereof is omitted here. FIG. 16 is a diagram illustrating a detailed configuration of the separation unit 28. As shown in the figure, the separation unit 28 is roughly composed of a transport rail 104, a first upper holding 106A,
The lower presser 106B, the second upper presser 108A, the second lower presser 108B, the separation rail 110, the stopper 112, and the like.

The transport rail 104 is connected to the rail 102 after the direction alignment section 26 has been turned over. The transport path 104a formed inside the transport rail 104 has the direction alignment section 2 formed therein.
6, the aligned semiconductor devices 40 are sent. As is apparent from the above description, the timing at which the semiconductor device 40 is transported to the separation unit 28 in the direction alignment unit 26 differs depending on whether the semiconductor device 40 is transported in an appropriate direction or not. . Therefore, in order to eliminate this timing difference, the semiconductor device 40 sent from the direction alignment unit 26 and the semiconductor device 40 are temporarily stored on the transport rail 104.

The first upper retainer 106A and the first lower retainer 106B are disposed so as to face each other. Similarly, the second upper retainer 108A and the second lower retainer 108B
Are arranged to face each other. Further, the first upper holding member 106 </ b> A with respect to the traveling direction of the semiconductor device 40.
And the first lower retainer 106B is the second upper retainer 1B.
08A and the second lower retainer 108B.

The path between the first upper retainer 106A and the first lower retainer 106B (hereinafter, referred to as a first locking position) is a passage for the semiconductor device 40. In addition, the first upper holder 106A and the first lower holder 106B
Is configured to be movable in a direction perpendicular to the transport direction of the semiconductor device 40 (directions of arrows Y1 and Y2 in the figure). Therefore, when the semiconductor device 40 has reached the first locking position, the first upper retainer 106A and the first lower retainer 10A
6B moves in a direction in which the semiconductor device 40 approaches the first upper retainer 106A and the first lower retainer 106B.
The movement of 0 is regulated.

Similarly, the second upper retainer 108A and the second upper
A portion between the lower holding portion 108B (hereinafter, referred to as a second locking position) is also a passage of the semiconductor device 40. Also,
Second upper retainer 108A and second lower retainer 108
B is also configured to be movable in a direction perpendicular to the transport direction of the semiconductor device 40 (arrows Y1 and Y2 directions in the figure).

Therefore, in a state where the semiconductor device 40 has reached the second locking position, the second upper retainer 108A and the second lower retainer 108B move in the approaching direction, and the semiconductor device 40 becomes The second upper retainer 108A and the second
Is held between the lower presser 108B and
The movement of the semiconductor device 40 is regulated. Further, the first upper retainer 106A and the first lower retainer 106B are
The arrow X1. In the figure corresponds to the upper holding member 108A and the second lower holding member 108B. It is configured to be movable in the X2 direction.

The separation rail 110 is disposed further downstream than the positions of the first upper retainer 106A and the first lower retainer 106B in the transport direction of the semiconductor device 40. The inside of the separation rail 110 is the semiconductor device 40.
The stopper 112 is configured to extend into this passage. This stopper 11
Reference numeral 2 denotes a configuration that can be moved by a driving device (not shown) in a direction perpendicular to the transport direction of the semiconductor device 40 (directions of arrows Y1 and Y2 in the figure). Therefore, the stopper 11
2 moves in the direction of the arrow Y2, whereby the separation rail 1 is moved.
The passage in 10 is closed to prevent the semiconductor device 40 from advancing. Conversely, when the stopper 112 moves in the direction of the arrow Y1, the passage in the separation rail 110 is opened, and the semiconductor device 40 is allowed to advance.

Next, the operation of the separating unit 28 having the above configuration will be described. In the initial state, the separation unit 28 separates the first upper retainer 106A and the first lower retainer 106B, and separates the second upper retainer 108A from the second upper retainer 108A.
The lower holding member 108B is separated from the lower holding member 108B.
2 moves in the Y2 direction and is in a state where the passage of the semiconductor device 40 is closed. Therefore, the movement of the semiconductor device 40 conveyed through the first and second locking positions is restricted by contacting the stopper 112 in the separation rail 110.

In this state, the first upper holding member 10
6A and the first lower retainer 106B move closer to each other, and the second upper retainer 108A and the second lower retainer 108B move closer to each other. Thereby, the semiconductor device 40 at the head in the traveling direction is the first semiconductor device.
Is locked by being sandwiched between the first upper retainer 106A and the first lower retainer 106B at the lock position of. The second semiconductor device 40 in the traveling direction is locked by being sandwiched between the second upper holding member 108A and the second lower holding member 108B at the second locking position.
FIG. 16 shows this state.

Subsequently, the first upper retainer 10A is moved relative to the second upper retainer 108A and the second lower retainer 108B.
6A and the first lower retainer 106B
It moves in the direction of arrow X1 together with 0. As a result, the semiconductor device 40 located at the top is separated from the second semiconductor device 40. However, since the second semiconductor device 40 is locked between the second upper retainer 108A and the second lower retainer 108B as described above, the second semiconductor device 40 does not separate from the separating portion 28.

When the semiconductor device 40 located at the head is separated from the second semiconductor device 40 as described above, subsequently, the first upper holder 106A and the first lower holder 106B
Move away from each other, and the stopper 112 moves in the arrow Y1 direction in the figure. Thereby, as shown in FIG. 17, the semiconductor device 40 is in a movable state, and is conveyed from the separation rail 110 to the measuring unit 30.

The separation unit 28 is configured to execute the above-described series of processing at a predetermined timing. Therefore, it is possible to transport the semiconductor devices 40 from the separation unit 28 to the measurement unit 30 one by one at a constant timing. it can. This allows
The semiconductor device 40 can be prevented from being erroneously mounted on the measuring unit 30, and the measuring process performed by the measuring unit 30 can be reliably performed.

Next, a second embodiment of the separating section 28 will be described with reference to FIGS. 18 and 19, the same components as those shown in FIGS. 16 and 17 are denoted by the same reference numerals, and description thereof will be omitted. In the separation device 28 according to the first embodiment described above, the first upper retainer 106A, the first lower retainer 106B, the second upper retainer 108A, and the second upper retainer 106A restrict the movement of the semiconductor device 40. The lower holding member 108B is used. On the other hand, the separation unit 28A according to the present embodiment is characterized in that the transfer rail 114 with an electromagnet is used.

The transfer rail 114 with electromagnet has a transfer passage 114a through which the semiconductor device 40 is transferred at the center thereof, and an electromagnet is disposed at the outer periphery thereof. The semiconductor devices 40 aligned in the direction from the direction alignment unit 26 are transferred to the transfer passage 114a. Also,
A separation rail 116 with an electromagnet is disposed downstream of the conveyance rail 114 with an electromagnet in the direction of conveyance of the semiconductor device 40. A transport path for transporting the semiconductor device 40 is also formed at the center of the separation rail with electromagnet 116, and a stopper 112 for opening and closing the transport path is provided.

The separation rail with electromagnet 116 is configured to be movable in the direction of arrow X1 in FIG. In addition, the transfer rail 11 with electromagnet
4 and the electromagnets arranged on the separation rails 116 with electromagnets are configured to be able to be turned on and off. Accordingly, as described above, the bumps 44 provided on the semiconductor device 40 are provided.
Since the semiconductor device 40 has a magnetic metal, when the electromagnet is turned on, the semiconductor device 40 causes the transfer rail 114 with electromagnet to be turned on.
The semiconductor device 40 is allowed to be conveyed by the magnetic rail, which is locked to the separation rail 116 with an electromagnet and the electromagnet is turned off.

Next, the operation of the separating unit 28A having the above configuration will be described. In the separation section 28A, in the initial state, the transport rail with electromagnet 114 and the separation rail with electromagnet 116 are in contact with each other, and the electromagnets provided on the rails 114 and 116 are both off. Further, the stopper 112 moves in the Y2 direction and is in a state where the passage of the semiconductor device 40 is closed.
Therefore, the semiconductor device transported from the direction alignment unit 26 is
Transfer rail 114 with electromagnet and separation rail 11 with electromagnet
6, the movement thereof is restricted by contacting the stopper 112 in the separation rail with electromagnet 116.

In this state, the transport rail with electromagnet 1
The electromagnets 14 and the electromagnets arranged on the separation rails 116 with electromagnets are both turned on. As a result, the semiconductor device 40 at the head in the traveling direction is locked to the separation rail with electromagnet 116 by the magnetic force of the electromagnet provided on the separation rail with electromagnet 116. In addition, the semiconductor device 40 located at the second or subsequent position with respect to the traveling direction is
Due to the magnetic force of the electromagnet provided on the carrier 14, it is locked in the transport rail 114 with electromagnet. FIG. 18 shows this state.

Subsequently, the separation rail with electromagnet 116 moves in the direction of arrow X1 with respect to the transport rail with electromagnet 114. As a result, the semiconductor device 4 located at the top
0 is a state separated from the second semiconductor device 40. However, since the second semiconductor device 40 is locked by the magnetic force of the electromagnet provided on the separation rail with electromagnet 116 as described above, the second semiconductor device 40 does not separate from the separation portion 28A.

When the semiconductor device 40 located at the head is separated from the second semiconductor device 40 as described above, the electromagnet of the electromagnet separation rail 116 is subsequently turned off, and the stopper 112 is moved to the arrow Y1 in the figure. Move in the direction. As a result, as shown in FIG. 19, the semiconductor device 40 is in a movable state, and
6 to the measuring unit 30.

The separation unit 28A is configured to execute the above-described series of processing at a predetermined timing. Therefore, it is possible to transport the semiconductor devices 40 from the separation unit 28A to the measurement unit 30 one by one at a constant timing. it can. Thus, it is possible to prevent the semiconductor device 40 from being erroneously mounted on the measuring unit 30, and it is possible to reliably perform the measuring process performed by the measuring unit 30. Further, the configuration of the separation unit 28A according to the configuration of the present embodiment can be simplified as compared with the separation device 28 described with reference to FIGS.

Next, the measurement unit 30 and the appearance inspection unit 32 will be described. FIG. 20 shows the measurement unit 30 and the appearance inspection unit 32. The measurement unit 30 mounts the semiconductor device 40 on the measurement printed board 122, and performs a test to determine whether or not the semiconductor element provided inside operates properly and whether or not the semiconductor element and the bump 44 are properly connected. It is what you do. Further, the appearance inspection unit 32 uses the imaging camera 138 to inspect whether the bumps 44 are damaged or peeled off. First, a first embodiment of the measuring unit 30 will be described with reference to FIGS.

The measuring section 30 is roughly composed of a first moving device 120 and a measurement printed board 122. The first moving device 120 is roughly composed of a standby rail 124, a stopper 126, a rail cover 128A,
128B, moving rail 130, and positioning block 1
32 and the like. Standby rail 124 and stopper 126 (cooperate to form a positioning mechanism)
Has a function of temporarily positioning the semiconductor device 40 falling under its own weight at a predetermined standby position before the measurement position. The standby rail 124 is connected to the above-described separation unit 28, and the semiconductor device 40 is supplied from the separation unit 28 at regular intervals.

The standby rail 134 is formed with a groove-shaped transfer passage 124a, and the semiconductor device 40 supplied from the separation unit 28 is transferred into the transfer passage 124a. The stopper 126 is configured to be able to enter and exit the transfer passage 124a. When the stopper 126 is inserted into the transfer passage 124a, the semiconductor device 40 is engaged with the stopper 126, and its movement is restricted. Is done.

Although the transport passage 124a formed in the standby rail 124 is formed in a groove shape as described above, the rail covers 128A and 128B are not shown except for the measurement processing described later, as shown in FIG. It is closed to prevent the semiconductor device 40 from falling off the standby rail 124. Incidentally, even when the rail covers 128A and 128B are closed, the stopper 126 is kept in the conveying path 124a.
It is configured to be able to enter and exit from. The rail covers 128A and 128B are driven by a driving device (not shown).
It is configured to open and close at a predetermined timing.

The moving rail 130 and the positioning block 132 are provided below the standby rail 134 having the above-described structure. The moving rail 130 is a standby rail 134
Is formed, and the semiconductor device 40 is mounted in the positioning passage 130a.
It is configured to be movable in directions indicated by 1, X2.

Here, the moving rail 130 is indicated by an arrow X in the figure.
A moving mechanism for moving in the directions indicated by 1, X2 will be described with reference to FIG. The moving rail 130 is fixed to the carriage 144. Also, the carriage 144
The first base member 146 and the second base member 148
The guide shaft 150 and the screw shaft 152 are disposed between the guide shaft 150 and the screw shaft 152. These base members 146, 148 are fixed to the chassis of the manufacturing apparatus 10B.

The guide shaft 150 is a carriage 144
The screw shaft 152 is adapted to be movably supported, and the screw shaft 152 is screwed to a female screw portion formed on the carriage 144. The screw shaft 152 is connected to the first base member 14 via a belt 154.
6 is connected to the rotation shaft of a motor 142 fixed to the motor 6. Therefore, when the motor 142 rotates, the rotation is transmitted to the screw shaft 152 via the belt 154, and the screw shaft 152 also rotates.

Also, as described above, the screw shaft 1
Since the carriage 144 is screwed into the 52, the carriage 144 moves in the directions of the arrows X1 and X2 in the figure by the rotation (rotation direction) of the screw shaft 152. Therefore, by appropriately controlling the amount and direction of rotation of the motor 142, the moving rail 130 fixed to the carriage 144 moves in the directions indicated by arrows X1 and X2 with respect to the standby rail 124.

The moving rail 130 is provided with a vacuum suction mechanism (not shown). The vacuum suction mechanism includes a positioning passage 130 provided on the moving rail 130.
a when the semiconductor device 40 is mounted on the semiconductor device 4.
It has a function of fixing to the moving rail 130 by absorbing 0. Therefore, even if the moving rail 130 moves at the time of measurement, the mounted semiconductor device 40 is
Never fall off. In addition, the positioning block 132 moves the arrow X1, X
It is configured to be movable in two directions.

On the other hand, the measurement printed board 122 is provided with a contact 134 at a position facing the moving rail 130. The contact 134 is connected to a test device that performs a predetermined operation test on the semiconductor device 40 (not shown). Therefore, when the semiconductor device 40 moves in the direction of the arrow X <b> 1 in the drawing with the movement of the moving rail 130, the semiconductor device 40 is mounted on the contact 134 provided on the measurement printed board 122. And in this mounted state,
The test apparatus described above is configured to perform a predetermined operation test on the semiconductor device 40.

Next, the operation of the measuring section 30 having the above configuration will be described. FIG. 21 shows an initial state before the semiconductor device 40 is supplied from the separation unit 28. In this initial state, the stopper 126 has entered the transport path 124a of the standby rail 124, and the rail covers 128A, 128B have the transport path 124a.
Is closed. Further, the moving rail 130 and the positioning block 132 are in a state of being retracted in the arrow X2 direction in the figure. When the moving rail 130 is at the retracted position, the transport path 124a and the positioning path 13
0a is in a communication state.

In the above initial state, the separation unit 2
8, when the semiconductor device 40 is supplied by its own weight,
The semiconductor device 40 is once positioned at a predetermined standby position in the transport path 124a by engaging with the stopper 126. Then, after confirming that the moving rail 130 has reliably returned to the initial state, the stopper 1
26 retreats from within the transport path 124a.

Thus, the semiconductor device 4 at the standby position
0 is dropped again by its own weight and is mounted on the positioning passage 130a of the moving rail 130. At this time, a positioning block 132 extends below the positioning path 130a, and by contacting the positioning block 132, the semiconductor device 40 is positioned at a predetermined mounting position in the positioning path 130a. During the above series of processes, the rail covers 128A and 128B
a and the positioning passage 130a are closed, so that the semiconductor device 40 does not fall off.

As described above, the semiconductor device 40 that has fallen under its own weight is once positioned at a predetermined standby position in the standby rail 124, and then the positioning passage 13 of the movable rail 130 is placed thereon.
0a, the semiconductor device 40
Can be mounted in the positioning passage 130a with high positional accuracy. Therefore, in the subsequent process of mounting the semiconductor device 40 on the contact 134 of the measurement printed board 122, the semiconductor device 40 can be mounted with high accuracy, and the reliability of the test can be improved.

When the semiconductor device 40 is mounted on the moving rail 130 as described above, the above-described vacuum suction mechanism is activated, and the semiconductor device 40 is sucked by the moving rail 130.
Thus, the semiconductor device 40 is fixed to the moving rail 130. Then, rail cover 128A, 1
The cover 28B is opened to a position where it does not hinder the movement of the moving rail 130, and the motor 142 shown in FIG. 22 is started. As a result, the moving rail 130 moves in the direction indicated by the arrow X in the figure.
The movement in one direction is started, whereby the semiconductor device 40 starts moving toward the contact 134 provided on the measurement printed board 122.

Then, the moving rail 130 is indicated by an arrow X1 in the figure.
In a state where the semiconductor device 40 has moved to the direction limit, the semiconductor device 40 is mounted on the contact 134. During this movement, the semiconductor device 40 moves while being fixed to the moving rail 130 by the vacuum suction mechanism, so that the semiconductor device 40 can be prevented from being displaced (displaced) on the moving rail 130, and therefore, the semiconductor device can be accurately moved. 40 can be attached to contacts 134.

When the semiconductor device 40 is mounted on the contact 134, the test device sets the contact 134 and the bump 44
The semiconductor device 40 is electrically connected to the semiconductor device provided in the semiconductor device 40 via the semiconductor device 40, and the test device performs a predetermined operation test on the semiconductor device. At this time, as described above, in the present embodiment, the first moving device 120 is provided, and the semiconductor device 40 is moved and connected to the measurement printed circuit board 122 to perform a test. Therefore, even if the semiconductor device 40 uses the bumps 44 as the external connection terminals, that is, the semiconductor device 40 has no lead extending to the side of the resin package 42, the semiconductor device 40 can be reliably measured on the printed circuit board. 122, so that a highly accurate operation test can be performed. According to the configuration of the present embodiment, the semiconductor device 40 is connected to the measurement printed circuit board 12.
2 can be automatically mounted, and the measurement efficiency can be improved.

Next, a measuring section 30A according to a second embodiment will be described with reference to FIG. In FIG. 23,
The same components as those of the measuring unit 30 according to the first embodiment described with reference to FIGS. 20 to 22 are denoted by the same reference numerals, and description thereof will be omitted. The measuring unit 30 according to the first embodiment has a configuration in which a vacuum suction mechanism is used as a means for fixing the semiconductor device 40 to the moving rail 130. On the other hand, the first unit provided in the measurement unit 30A according to the present embodiment
The moving device 120A is characterized in that an electromagnet is used as means for fixing the semiconductor device 40 to the moving rail 130.

That is, in the present embodiment, it is noted that the bumps 44 of the semiconductor device 40 are formed of magnetic metal, and the electromagnet portion 158 (magnetic attraction mechanism) is provided on the moving rail 130. It is. The electromagnet section 158 is configured to be capable of being turned on and off, and is provided on a moving rail 130A on which the semiconductor device 40 is mounted.

When the semiconductor device is moved toward the measurement printed circuit board 122 to perform an operation test on the semiconductor device 40, the electromagnet section 158 is turned on.
Accordingly, the semiconductor device 40 is fixed to the moving rail 130 by the magnetic force generated by the electromagnet portion 158, so that the semiconductor device 40 can be prevented from being displaced when the moving rail 130 moves. Therefore, even in the configuration of the present embodiment, the semiconductor device 40 can be reliably connected to the measurement printed circuit board 122.
Can be accurately attached to the contact 134, and a highly reliable test can be performed.

By the way, in order to mount the semiconductor device 40 on the contact 134 of the measurement printed circuit board 122 with high accuracy, the first moving device 120 (120A) and the measurement printed circuit board 122 need to be accurately positioned.
FIGS. 24 and 25 show the first moving device 120 (120
3A shows an example of a method of positioning the measurement printed circuit board 122.

First, the first moving device 12 will be described with reference to FIG.
0 (120A) and the first positioning method for positioning the measurement printed circuit board 122 will be described. In the first positioning method, a positioning boat 160 is used instead of the measurement printed circuit board 122. As shown in the figure, a positioning hole 162 is formed at a predetermined position of the positioning boat 160, and the positioning hole 162 is used for positioning a positioning portion. In the figure, reference numeral 164 denotes a positioning pin which positions the positioning boat 160 at a predetermined position with respect to a chassis (apparatus main body) of the manufacturing apparatus 10B.

To perform the positioning process, the moving rail 1
30 is extended toward the positioning board 160, and the moving rail 130 is moved to the positioning block 132 while maintaining this state.
At the same time, it is brought close to the positioning board 160. Then, the first moving device 120 is moved and adjusted so that the positioning block 132 fits into the positioning hole 162.

When positioning is performed so that positioning block 132 is fitted into positioning hole 162,
The first moving device 120 is fixed and positioned in this state. Positioning hole 1 formed in positioning board 160
Reference numeral 62 corresponds to the position where the contact 134 is formed on the measurement printed board 122. Therefore, the positioning block 13
2 is positioned so as to fit into the positioning hole 162, so that the positioning passage 130a of the moving rail 130 is formed.
(That is, the mounting position of the semiconductor device 40) is positioned at the contact 134 of the measurement printed circuit board 122.

Therefore, when the positioning board 160 is replaced with the measurement printed circuit board 122 at the time when the above processing is completed, the moving rail 130 is positioned with respect to the contacts 134 of the measurement printed circuit board 122. Next, a second positioning method will be described with reference to FIG. In FIG. 25, the same components as those shown in FIG. 24 are denoted by the same reference numerals, and description thereof will be omitted.

In the example shown in FIG.
A feature is that a transparent substrate (for example, a glass plate) is used as 0A. By using a transparent substrate as the positioning board 160A, the positioning board 160A
Device 40 mounted on moving rail 130 through
Will be visible. A bump 44 provided on the semiconductor device 40 is provided at a predetermined position of the positioning board 160A.
A positioning mark 166 having the same size and shape as that of FIG. The position of the positioning mark 166 is determined by the position of the contact 13 on the measurement printed circuit board 122.
4 are formed.

To perform the positioning process, the moving rail 1
The semiconductor device 40 is mounted on 30 and the moving rail 130 is brought close to the positioning board 160A while maintaining this state. Then, the bumps 4 provided on the semiconductor device 40 are provided.
The first moving device 120 is moved and adjusted so that the position No. 4 coincides with the positioning mark 166 formed on the positioning board 160A.

Then, the positioning mark 166 and the bump 4
4 and the first moving device 120
Is fixed and positioned in this state. The positioning plate 166 formed on the positioning board 160A corresponds to the position where the contact 134 of the measurement printed board 122 is formed. Therefore, the positioning mark 166 and the bump 44 are positioned, so that the positioning path 130a of the moving rail 130 (that is, the mounting position of the semiconductor device 40).
Are positioned on the contacts 134 of the measurement printed circuit board 122.

Therefore, also in this embodiment, if the positioning board 160 is replaced with the measurement printed circuit board 122 at the time when the above processing is completed, the moving rail 130 is in a state of being positioned with respect to the contact 134 of the measurement printed circuit board 122. Become. According to the positioning method shown in FIGS. 24 and 25, since the positioning processing of the first moving device 120 is performed using the positioning boards 160 and 166, the positioning processing can be performed easily and accurately.

Returning to FIG. 20, the appearance inspection unit 3 will be described. The appearance inspection unit 32 is generally composed of a second moving device 136 and an imaging camera 138.
The second moving device 136 is a device that has completed a predetermined operation test in the measuring unit 30 described above.
And is conveyed by its own weight.

The second moving device 136 has the same configuration as the first moving device 120 provided in the measuring section 30, and has the same operation and function. Therefore, description of the second moving device 136 is omitted here. The imaging camera 138 is mounted on the moving rail 13.
An image of the surface of the semiconductor device 40 on which the bumps 44 are formed closer to 0 is imaged, and an image processing device (not shown) inspects whether or not the bump formation surface is chipped and the terminal peels off. After the above processing is completed, the semiconductor device 40 determined to be appropriate is packed and shipped. The semiconductor device 40 determined to be abnormal by the measurement unit 30 or the appearance inspection unit 32 is removed from the packing line and subjected to a maintenance process or a disposal process.

[0152]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, a semiconductor device conveyed in an improper direction through the conveyance path can be accurately removed with a simple configuration. Further, according to the second aspect of the present invention, the metal film can be prevented from slidingly contacting the wall of the transport passage, so that peeling and damage of the metal film can be prevented.

Further, according to the third aspect of the present invention, magnetic metal chips can be easily and reliably removed, thereby preventing the semiconductor device conveyed due to the magnetic metal chips from being clogged. Can be prevented. Further, according to the fourth aspect of the present invention, it is possible to improve the manufacturing efficiency as compared with the conventional configuration in which the gate break is manually performed. In addition, it is possible to perform the gate break process under optimized and uniform conditions, thereby suppressing the generation of resin dust and facilitating the removal process, thereby also improving the manufacturing efficiency of the semiconductor device. it can.

According to the fifth aspect of the present invention, the gate portion and the semiconductor device are sorted by adsorbing the magnetic metal film on the magnet, so that the gate portion and the semiconductor device can be automatically sorted. It is also possible to prevent erroneous recognition between the gate portion and the semiconductor device. According to the sixth aspect of the present invention, even in a state where the remaining amount of the semiconductor device in the ball feeder is small and it takes a long time for the semiconductor device to reach the entrance of the transfer passage, the semiconductor device is set in the transfer passage. Since it can be returned immediately, the work efficiency can be improved.

According to the seventh aspect of the present invention, a semiconductor having an external connection terminal having a configuration in which a magnetic metal film is provided on a resin protrusion (ie, a configuration having no lead extending to the side of the package). Even in the case of an apparatus, an operation test can be performed while being securely mounted on a measurement substrate, and an automatic mounting can be performed on the measurement substrate, so that measurement efficiency can be improved.

According to the eighth aspect of the present invention, since the semiconductor device falling by its own weight is once positioned at the standby position and then mounted on the mounting portion, the semiconductor device can be accurately positioned on the mounting portion. Can be installed. According to the ninth and tenth aspects of the present invention, it is possible to prevent the semiconductor device from being displaced when the mounting portion moves,
Therefore, the semiconductor device can be accurately mounted on the measurement substrate.

According to the eleventh aspect of the present invention, before the mounting portion is moved, the semiconductor device is detached from the mounting portion by covering the mounting portion of the mounting portion of the semiconductor device with the cover member. Can be prevented. Further, since the cover member is opened when the mounting portion moves and the mounting portion is allowed to move, the cover member does not interfere with the mounting of the semiconductor device on the measurement substrate.

Further, according to the twelfth aspect of the present invention, semiconductor devices can be supplied to the measuring section one by one at a predetermined timing, thereby preventing erroneous mounting of the semiconductor device on the measuring section. be able to.

[Brief description of the drawings]

FIG. 1 is a block diagram (part 1) of a manufacturing apparatus according to an embodiment of the present invention.

FIG. 2 is a block diagram (part 2) of a manufacturing apparatus according to an embodiment of the present invention.

FIG. 3 is a configuration diagram of the manufacturing apparatus shown in FIG.

FIG. 4 is a diagram showing a resin package in a state where gate portions are integrally connected.

FIG. 5 is a diagram showing a manufactured semiconductor device.

FIG. 6 is a view showing a first embodiment of a gate breaker provided in the manufacturing apparatus shown in FIG. 3;

FIG. 7 is a diagram showing a second embodiment of the gate breaking device provided in the manufacturing apparatus shown in FIG.

FIG. 8 is a diagram showing a third embodiment of the gate breaking device provided in the manufacturing apparatus shown in FIG.

FIG. 9 is a view showing a fourth embodiment of the gate breaking device provided in the manufacturing apparatus shown in FIG. 3;

FIG. 10 is a diagram (part 1) illustrating a specific configuration of a direction determining unit provided in the manufacturing apparatus illustrated in FIG. 3;

FIG. 11 is a diagram (part 2) illustrating a specific configuration of a direction determining unit provided in the manufacturing apparatus illustrated in FIG. 3;

12 is a diagram showing a specific configuration of a direction alignment unit provided in the manufacturing apparatus shown in FIG.

FIG. 13 is a diagram (part 1) for explaining the operation of the direction alignment unit shown in FIG. 12;

14 is a view (No. 2) for explaining the operation of the direction alignment unit shown in FIG.

15 is a view (No. 3) for explaining the operation of the direction alignment unit shown in FIG.

FIG. 16 is a diagram (part 1) illustrating a specific configuration and operation of the first embodiment of the separating unit provided in the manufacturing apparatus illustrated in FIG. 2;

17 is a diagram (part 2) illustrating a specific configuration and operation of the first embodiment of the separation unit provided in the manufacturing apparatus illustrated in FIG. 2;

FIG. 18 is a diagram (part 1) illustrating a specific configuration and operation of a second embodiment of the separation unit provided in the manufacturing apparatus illustrated in FIG. 2;

FIG. 19 is a diagram (part 2) illustrating a specific configuration and operation of a second embodiment of the separation unit provided in the manufacturing apparatus illustrated in FIG. 2;

20 is a diagram showing a specific configuration of a measuring unit and a visual inspection unit provided in the manufacturing apparatus shown in FIG.

21 is an enlarged view (part 1) of a specific configuration of a first embodiment of a measuring unit provided in the manufacturing apparatus shown in FIG. 2;

FIG. 22 is an enlarged view (part 2) of a specific configuration of the first embodiment of the measuring unit provided in the manufacturing apparatus shown in FIG. 2;

FIG. 23 is an enlarged view showing a specific configuration of a second embodiment of the measuring unit provided in the manufacturing apparatus shown in FIG. 2;

FIG. 24 is a diagram (part 1) for describing a positioning method of the moving device;

FIG. 25 is a diagram (part 2) for explaining the positioning method of the moving device;

FIG. 26 is a view illustrating an example of a conventional semiconductor device and a method of manufacturing the same.

FIG. 27 is a diagram illustrating an example of a miniaturized semiconductor device.

[Explanation of symbols]

 10A, 10B Manufacturing apparatus 12 Supply unit 14 Gate break 16 Gate discharge box 18 Alignment unit 20, 32 Appearance inspection unit 22 Defective product discharge box 24 Storage unit 26 Direction alignment unit 28, 28A, 60 Separation unit 30 Measurement unit 36 Ball feeder 38 Plating debris removal section 40 Semiconductor device 42 Resin package 44 Bump 44A First bump 46 First side 48 Second side 52 Gate section 54 Direction determination section 55 Orientation conversion section 56 Return path 64 Rotary table 66 Visual inspection device 68 Direction correcting part 72 Positioning part 74A-74C Rubber roller 78A, 78B Comb-shaped protrusion 80A-80C Gate break device 84 Laser generator 86 Cutter 33 Transport path 90 Inclined surface 92 Flange part 94, 112, 126 Stopper 96 Rail before inversion 98 Inversion Leh REFERENCE SIGNS LIST 100 Stopper pin 102 Rail after reversing 104 Transport rail 106A First upper retainer 106B First lower retainer 108A Second upper retainer 108B Second lower retainer 110 Separation rail 114 Transport rail with electromagnet 116 Separation rail with electromagnet 120 , 120A First moving device 122 Measurement printed board 124, 124A Standby rail 128A, 128B Rail cover 130, 130A Moving rail 132 Positioning block 134 Contact 136 Second moving device 138 Imaging camera 142 Motor 144 Carriage 150 Guide shaft 152 Screw shaft 156,158 Electromagnet part 160,160A Positioning board 162 Positioning hole 164 Positioning pin 166 Positioning mark

Continued on the front page (72) Inventor Masao Fukunaga 5950 Soeda, Iriki-cho, Satsuma-gun, Kagoshima Inside Kyushu Fujitsu Electronics Limited (72) Inventor Kazuto Tsuji 4-1-1 Kamikodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Yoshiyuki Yoneda 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki-shi, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Teruki Kamifukumoto 5950 Soeda, Iriki-cho, Satsuma-gun, Kagoshima Inside Kyushu Fujitsu Electronics (72) Inventor Kenji Itasaka 5950 Soeda, Iriki-cho, Satsuma-gun, Kagoshima Prefecture Inside Kyushu Fujitsu Electronics Co., Ltd. (58) Field surveyed (Int. Cl. ⁷ , DB name) G01B 21/00-21 / 32 B07C 5/00

Claims (12)

(57) [Claims] 1. A semiconductor device having an asymmetrical resin package and having an external connection terminal having a configuration in which a magnetic metal film is disposed on a resin protrusion formed on the resin package is used. A gate break unit configured to supply the resin package integrated with a gate unit from a supply unit, to separate the gate unit from the resin package and to remove the gate unit, and to fix the semiconductor device supplied from the gate break unit A first alignment unit for aligning the semiconductor device in a direction; and a visual inspection unit for supplying the semiconductor device in an aligned state from the first alignment unit and performing a visual inspection on the semiconductor device. In the manufacturing apparatus, the first alignment unit includes a transport path having an inclined surface, and a stopper provided in the middle of the transport path. The surface is set to an inclination angle at which the conductor device is dropped from the transport passage when the semiconductor device in which the resin package is formed into an asymmetric shape is transported in an inappropriate direction with respect to the front and back directions, and the stopper is set. The semiconductor device in which the resin package has an asymmetric shape is configured to come into contact with the semiconductor device when the semiconductor device is transported in an improper direction in the vertical and horizontal directions, and to be dropped from the transport path. Semiconductor device manufacturing equipment. 2. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the inclined surface and the stopper of the transport passage provided in the first alignment unit are arranged in a flow direction of the transport of the semiconductor device. An apparatus for manufacturing a semiconductor device, further comprising a direction conversion unit that performs a direction conversion process on a downstream side of a position so that the metal film of the semiconductor device faces outward. 3. The apparatus for manufacturing a semiconductor device according to claim 1, wherein magnetic metal debris generated in the gate break portion is blown downstream from the gate break portion with respect to a flow direction of the semiconductor device. An apparatus for manufacturing a semiconductor device, comprising: a dust removing unit including a blow device and a magnet that attracts the magnetic metal dust blown up by a magnetic force. 4. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the gate break portion includes one of a bending jig, a punching jig, and a cutting jig. And
An apparatus for manufacturing a semiconductor device, wherein the gate portion and the resin package integrated by using the one jig are automatically separated from each other. 5. The semiconductor device manufacturing apparatus according to claim 1, wherein a magnet that attracts the magnetic metal film disposed on the semiconductor device by a magnetic force is provided in the gate break portion, An apparatus for manufacturing a semiconductor device, wherein the gate portion and the semiconductor device are separated by adsorbing the magnetic metal film on the magnet. 6. The semiconductor device manufacturing apparatus according to claim 1, wherein a ball feeder is used as the first alignment unit, and the ball is dropped from the transport path by the inclined surface and the stopper. An apparatus for manufacturing a semiconductor device, comprising a return passage for returning the semiconductor device to a position halfway in the transport passage. 7. A semiconductor device having an asymmetric resin package and having an external connection terminal having a configuration in which a magnetic metal film is disposed on a resin protrusion formed on the resin package is used for manufacturing a semiconductor device. A transport path that transports the semiconductor device by its own weight, a second alignment unit that aligns the semiconductor device that is supplied through the transport path in a certain direction, and a second alignment unit that is supplied from the second alignment unit. A semiconductor device manufacturing apparatus comprising: a measuring unit for mounting a semiconductor device on a measurement substrate and performing an operation test; and mounting the semiconductor device on the measurement unit and moving the semiconductor device toward the measurement substrate. An apparatus for manufacturing a semiconductor device, comprising: an apparatus. 8. The semiconductor device manufacturing apparatus according to claim 7, wherein the moving device is configured to position the semiconductor device falling under its own weight at a standby position, and that the semiconductor device at the standby position is under its own weight. A manufacturing method of a semiconductor device, comprising: a mounting portion to be mounted by dropping; and a moving mechanism for mounting the semiconductor device on the measurement substrate by moving the mounting portion toward the measurement substrate. apparatus. 9. The apparatus for manufacturing a semiconductor device according to claim 7, wherein a vacuum suction mechanism is provided in said mounting portion to fix said semiconductor device to said mounting portion by performing vacuum suction. Equipment for manufacturing semiconductor devices. 10. The apparatus for manufacturing a semiconductor device according to claim 7, wherein a magnetic force attracting mechanism for fixing the semiconductor device to the mounting portion by magnetically attracting the magnetic metal film is provided in the mounting portion. An apparatus for manufacturing a semiconductor device. 11. The apparatus for manufacturing a semiconductor device according to claim 7, further comprising, before the mounting portion is moved, covering a mounting portion of the mounting portion of the semiconductor device. An apparatus for manufacturing a semiconductor device, comprising: a cover member that is opened when the mounting unit moves to allow the mounting unit to move. 12. The semiconductor device manufacturing apparatus according to claim 7, wherein the second alignment is provided at an intermediate position of the transport path from the second alignment section to the measurement section. A separating unit for separating the semiconductor device continuously supplied from the unit and sending the separated semiconductor device to the measuring unit at a fixed timing.