JP3192142U - Passive element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a passive element which is convenient to stand up, can be quickly assembled to a PCB substrate, reduces the total volume, increases the contact area with an electrode end, and increases the conductive effect. SOLUTION: A passive element main body 30 including a first electrode end 31 located on the first side and a second electrode end 32 facing the first electrode end 31 and located on the second side is first connected. A step 11, a bending step 12, and a first flat step 14 are provided in order, the first flat step 14 has a first plane 15, and the first connecting step 11 has a first electrode end 31. The first conductive wire 10, the second connecting stage 21, and the second flat stage 24, which are electrically connected and extend along the peripheral surface of the passive element main body 30, are provided in order in the refracting stage 12. The second flat step 21 and the second flat step 24 extend substantially linearly, the second flat step 24 has a second plane 25, and the second connecting step 21 is electrically connected to the second electrode end 32. Includes a second conductive wire 20 that connects to. [Selection diagram] Fig. 5

Description

  The present invention relates to a passive element, and more particularly, to a passive element having a flat conductive pin.

  Commonly used passive elements include, for example, capacitors, resistors and inductors, and are used in products driven by power. An electronic circuit for control is configured by combining various types of passive elements. The range of application of passive elements is very important because it is applied to the electronics industry and other industrial fields.

  A conventional passive element has two pins extending vertically from its bottom surface. The two pins are inserted into through holes provided in the PCB substrate, and the passive elements are electrically connected to the electronic circuit of the PCB substrate by soldering. For example, Taiwan invention I434306 in Patent Document 1, Taiwan utility model M472299 in Patent Document 2, Taiwan invention I425540 in Patent Document 3, and the like have been proposed.

However, the circuit of a general PCB substrate is extremely complicated, and it is necessary to provide a large number of passive elements. Therefore, it is necessary to open a large number of through holes, which requires a considerable number of man-hours. And during the soldering process, the two pins cannot support the passive element stably, and need to be supported by another one.
Since the two pins are shielded by the passive element, they cannot be observed directly and cannot be quickly inserted into the through holes provided in the PCB substrate.

  Because electronic products tend to be downsized, passive elements are also downsized. However, according to the above configuration and electrical connection method, the overall height is increased and the overall volume is also increased.

Taiwan Invention No. I434306 Taiwan Utility Model M472299 Publication Taiwan Invention No. I425540

  The main purpose of the present invention is to make it easy to stand up with two conductive pins with flat steps, quick assembly to the PCB substrate, reduce the overall volume, and increase the contact area with the electrode end Another object of the present invention is to provide a passive element that increases the conductive effect (decreases electrical resistance), has a simple structure, is low in production cost, and can be mass-produced.

  A passive element of the present invention includes a passive element body including a first electrode end positioned on a first side, a second electrode end facing the first electrode end and positioned on a second side, and a first connecting stage. And a refraction stage and a first flat stage are provided in order, the first flat stage faces the electronic circuit structure and has a first plane for attaching to the electronic circuit structure, The one connection step is electrically connected to the first electrode end, the refraction step extends along the peripheral surface of the passive element body, the first flat step is located on the same side as the second side, and the second side The first conductive wire, the second connecting step, and the second flat step are the same as the direction of the second side. The second connecting step and the second flat step extend almost linearly, and the second flat step faces the electronic circuit structure and is attached to the electronic circuit structure. The second connecting step is electrically connected to the second electrode end, and the second flat step is located on the same side as the second side and extends substantially parallel to the second side. The direction in which the second plane faces includes a second conductive wire that is the same as the direction in which the second side faces.

  The passive element of the present invention further includes an insulating material, the insulating material covers the passive element main body, and at least a part of the first flat step and the second flat step protrudes from the insulating material and is exposed. .

  In the passive element of the present invention, the first connecting step has a flat shape and is attached to the first electrode end, and the second connecting step has a flat shape and is attached to the second electrode end. It is characterized by that.

The passive element of the present invention has the following effects.
(1) Each of the two conductive pins has a flat step, and the two flat steps have a plane facing in the same direction, which makes it convenient for standing up a passive element and does not need to be supported by another device. The two conductive pins can be directly adhered to each other, and can be directly observed and aligned by the two flat steps extending outward, and are not shielded by the passive elements. As described above, the assembly of the passive element of the present invention to the PCB substrate is quick and convenient.

(2) The two flat stages of the passive element of the present invention extend substantially parallel to the lower surface of the passive element and do not extend perpendicular to the lower surface of the passive element as in the prior art. It is possible to decrease.

(3) The two flat stages of the passive element of the present invention increase the contact area with the electrode end, so that soldering can be performed quickly with good quality, the conductive effect increases, and the electrical resistance decreases. To do.

(4) The configuration is simple, the production cost is low, and mass production is possible.

It is a figure which shows the preparation methods of Example 1 of this invention. It is a figure which shows the preparation methods of Example 1 of this invention. It is a figure which shows the preparation methods of Example 1 of this invention. It is a figure which shows the preparation methods of Example 1 of this invention. It is a figure which shows the preparation methods of Example 1 of this invention. It is a figure which shows the preparation methods of Example 1 of this invention. It is a figure which shows the preparation methods of Example 1 of this invention. It is a perspective view which shows Example 1 of this invention. It is a perspective view which shows Example 2 of this invention. It is a perspective view which shows Example 3 of this invention.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
Please refer to FIG. 1 to FIG. 1 to 7 are views showing a manufacturing method of Embodiment 1 of the present invention. The method for producing a passive element of the present invention can be applied to production of passive elements such as capacitors, resistors, inductors, and surge absorbers. Hereinafter, a method for manufacturing the passive element of the present invention will be described.

Please refer to FIG. The passive element of the present invention has at least one first conductive wire 10. Each first conductive wire 10 includes a first connecting step 11, a refraction step 12, and a first flat step 13 which are provided in order.
Specifically, a large number of first conductive wires 10 are simultaneously fixed to a platform of the manufacturing machine (for example, a method such as adhesion or presser is adopted). Each first conductive wire 10 has a U-shape, and the lengths of the two legs are different from each other, so that fixing is convenient. A longer connecting portion of each first conductive wire 10 is provided with a first connecting step 11, a refraction step 12, and a first pin step 13.

The passive element of the present invention has at least one second conductive wire 20. Each second conductive wire 20 has a second connecting step 21 and a second pin step 22 which are provided in order.
Specifically, a large number of second conductive wires 20 are simultaneously fixed to the platform of the manufacturing machine. Each second conductive wire 20 has a U-shape, and the lengths of the two leg portions thereof are different from each other, so that fixing is convenient. A second connecting step 21 and a second pin step 22 are provided on the longer leg of each second conductive wire 20.

Please refer to FIG. 2 to FIG. As shown in FIG. 2, after the ends of the first connecting step 11 and the second connecting step 21 are refracted, solder paste is applied to the ends of the first connecting step 11 and the second connecting step 21 as shown in FIG. 23 (for example, a tin paste) is attached to make the ends of the first connecting step 11 and the second connecting step 21 flat as shown in FIG.
By refracting the ends of the first connecting step 11 and the second connecting step 21, it becomes easy to attach the solder paste 23, and by making the ends of the first connecting step 11 and the second connecting step 21 flat. As a result, the bonding area is increased and soldering is further facilitated. Of course, this invention is not limited to these, You may abbreviate | omit above-mentioned refraction and flat shape.

Please refer to FIG. 4 and FIG. Each first conductive wire 10 is refracted to make each first conductive wire 10 and each second conductive wire 20 flat. The first pin step 13 and the second pin step 22 are each processed into a flat shape to become a first flat step 14 and a second flat step 24. The first flat stage 14 faces the electronic circuit structure (not shown) and has a first flat surface 15 for being attached to the electronic circuit structure. The second flat step 24 faces the electronic circuit structure (not shown) and has a second flat surface 25 for being attached to the electronic circuit structure.
The refracted stage 12 of each refracted first conductive wire 10 is perpendicular to the first connecting stage 11. The first flat step 14 of each refracted first conductive wire 10 is perpendicular to the refraction step 12. The second connecting step 21 and the second flat step 24 of each second conductive wire 20 extend substantially linearly. Specifically, the first flat step 14 and the second flat step 24 are substantially parallel to the ends of the first connecting step 11 and the second connecting step 21, respectively.
Next, a process of making each first conductive wire 10 and each second conductive wire 20 flat by refracting each first conductive wire 10 will be described. First, each first conductive wire 10 is refracted so that the bending step 12 of the first conductive wire 10 is perpendicular to the first connecting step 11 and the first pin step 13 of the first conductive wire 10 is perpendicular to the bending step 12. Then, the first pin step 13 and the second pin step 22 are each processed into a flat shape, and the first flat step 14 and the second flat step 24 are formed.

  Each first connecting step 11 and each second connecting step 21 are provided with a space therebetween. It is preferable that the end of each first connecting step 11 to be flattened is parallel to the end of each second connecting step 21 to be flattened. Next, flux is attached to the ends of each first connecting stage 11 and each second connecting stage 21. Of course, it may be omitted to attach the flux to the ends of each first connecting stage 11 and each second connecting stage 21.

  Please refer to FIG. The passive element of the present invention has a passive element body 30. The passive element body 30 includes a first electrode end 31 located on the first side, and a second electrode end 32 facing the first electrode end 31 and located on the second side. Specifically, a large number of passive element bodies 30 are respectively provided between the first connection stages 11 and the second connection stages 21, and each first connection stage 11 corresponds to the first electrode end 31. Each second connecting stage 21 corresponds to the second electrode end 32.

Each first connecting step 11 is electrically connected to the first electrode end 31, and each second connecting step 21 is electrically connected to the second electrode end 32. It is preferable that each first connecting step 11 has a flat shape and is attached to the first electrode end 31, and each second connecting step 21 has a flat shape and is attached to the second electrode end 32. .
For example, by melting a solder paste, each first connection step 11 is electrically connected to the first electrode end 31, and each second connection step 21 is electrically connected to the second electrode end 32.
The refraction stage 12 extends along the peripheral surface of the passive element body 30. The first flat stage 14 is located on the same side as the second side, extends substantially parallel to the second side, and the direction in which the first plane 15 faces is the same as the direction in which the second side faces. It is. The second flat step 24 is located on the same side as the second side, extends substantially parallel to the second side, and the direction in which the second plane 25 faces is the same as the direction in which the second side faces. It is. The first flat step 14 and the second flat step 24 are preferably located on the same plane as the second side, but may have a slight difference in height.

Please refer to FIG. 5 and FIG. After each first connection step 11 is electrically connected to the first electrode end 31 and each second connection step 21 is electrically connected to the second electrode end 32, each first flat step 14 and each second step It is preferable to cover each passive element body 30 with the insulating material 40 so that at least a part of the flat step 24 protrudes from the insulating material 40 and is exposed.
The process of covering the passive element body 30 may employ a process such as vibration or rotation by placing the passive element body 30 in a mold and injecting the insulating material 40, but the present invention is not limited to these. .

  Please refer to FIG. If each 1st flat step 14 and each 2nd flat step 24 are cut | disconnected so that it may have suitable length, preparation of the passive element of this invention is completed. At this time, these passive elements are packaged or other processes are performed.

In the above description, the manufacturing method in which each first conductive wire 10 is refracted and each first conductive wire 10 and each second conductive wire 20 is flattened has been described. By forming each second pin step 22 in a flat shape, the first flat step 14 and the second flat step 24 may be formed to refract each first conductive wire 10.
As described above, the refracting stage 12 of each first conductive wire 10 is perpendicular to the first connecting stage 11, and the first flat stage 14 of each first conductive wire 10 is perpendicular to the refracting stage 12. Of course, the above processing may be performed after the passive element of the present invention is covered with the insulating material 40.

Please refer to FIG. 1 to FIG. The manufacturing method of the conductive pin of the passive element of the present invention may be performed as follows. That is, the passive element of the present invention has at least one first conductive wire 10. Each first conductive wire 10 is provided with a first connecting step 11, a refraction step 12, and a first pin step 13 in order.
The first flat step 14 is formed by making the first pin step 13 flat. The first flat step 14 faces the electronic circuit structure and has a first flat surface 15 for being attached to the electronic circuit structure. The refracted stage 12 of each refracted first conductive wire 10 is perpendicular to the first connecting stage 11. The first flat step 14 of each refracted first conductive wire 10 is perpendicular to the refraction step 12. When the first connecting step 11 is electrically connected to the first electrode end 31, the refraction step 12 extends along the peripheral surface of the passive element body 30. The first flat step 14 is located on the same side as the second side and extends substantially parallel to the second side. The direction in which the first plane 15 faces is the same as the direction in which the second side faces.
In the method of manufacturing the conductive pin of the passive element of the present invention, it has been described that each first conductive wire 10 is refracted and flattened, but of course, the first pin step 13 is flattened and each first conductive wire 10 is formed. The wire 10 may be refracted. Components and steps in the passive element manufacturing method of the present invention will not be described with respect to the same components and steps as in the above embodiment.

Please refer to FIG. 5, FIG. 7 and FIG. This is another embodiment of the passive element of the present invention. The passive element includes a passive element body 30, a first conductive wire 10, and a second conductive wire 20. The passive element body 30 includes a first electrode end 31 located on the first side, and a second electrode end 32 facing the first electrode end 31 and located on the second side.
The first conductive wire 10 is provided with a first connecting step 11, a refraction step 12, and a first flat step 14 in order. The first flat step 14 faces the electronic circuit structure and has a first flat surface 15 for being attached to the electronic circuit structure. The first connecting stage 11 is electrically connected to the first electrode end 31. The refraction stage 12 extends along the peripheral surface of the passive element body 30. The first flat step 14 is located on the same side as the second side and extends substantially parallel to the second side. The direction in which the first plane 15 faces is the same as the direction in which the second side faces. The second conductive wire 20 is provided with a second connecting step 21 and a second flat step 24 in order. The second connecting step 21 and the second flat step 24 extend substantially linearly.
The second flat step 24 faces the electronic circuit structure and has a second flat surface 25 for being attached to the electronic circuit structure. The second connecting stage 21 is electrically connected to the second electrode end 32. The second flat step 24 is located on the same side as the second side and extends substantially parallel to the second side. The direction in which the second plane 25 faces is the same as the direction in which the second side faces. It is preferable that the insulating material 40 covers the passive element main body 30 and at least a part of the first flat step 14 and the second flat step 24 protrudes from the insulating material 40 and is exposed.

  Components and steps in the manufacturing method of the passive element and the manufacturing method of the conductive pin of the passive element of the present embodiment will be omitted from the description of the same components and steps as in the above-described example.

  Please refer to FIG. 9 and FIG. If necessary, the passive element of the present invention may be designed as a passive element 60 having a cylindrical shape (for example, an electrolytic capacitor) or a passive element 70 having a bean shape (for example, a multilayer capacitor). The first flat step 14 and the second flat step 24 may have an opening angle of 90 degrees as shown in FIG. 9, and may be parallel to each other as shown in FIG. You may have the opening angle of the angle.

  In addition, this invention is not limited to the said embodiment, It can change variously based on the meaning of this invention, and they are not excluded from the range of this invention.

  The present invention can be applied to passive elements.

DESCRIPTION OF SYMBOLS 10 1st conductive wire 11 1st connection step 12 Refraction step 13 1st pin step 14 1st flat step 15 1st plane 20 2nd conductive wire 21 2nd connection step 22 2nd pin step 23 Solder paste 24 2nd flat step 25 Second plane 30 Passive element body 31 First electrode end 32 Second electrode end 40 Insulating material 60 Passive element 70 Passive element

Claims (3)

A passive element body comprising: a first electrode end positioned on the first side; and a second electrode end facing the first electrode end and positioned on the second side;
A first connecting step, a refraction step, and a first flat step are provided in order, and the first flat step faces the electronic circuit structure and is attached to the electronic circuit structure. The first connection step is electrically connected to the first electrode end, the refraction step extends along a peripheral surface of the passive element body, and the first flat step is the first flat step. A first conductive wire which is located on the same side as the second side and extends substantially parallel to the second side, and the direction in which the first plane faces is the same as the direction in which the second side faces When,
A second connecting step and a second flat step are provided in order, and the second connecting step and the second flat step extend substantially linearly, and the second flat step has an electronic circuit structure. And has a second plane for adhering to the electronic circuit structure, the second connecting step is electrically connected to the second electrode end, and the second flat step is connected to the second side. A second conductive wire that is located on the same side and extends substantially parallel to the second side, and the direction in which the second plane faces is the same as the direction in which the second side faces; Including,
Passive element.   The insulating material further includes an insulating material, and the insulating material covers the passive element main body, and at least a part of the first flat step and the second flat step protrude from the insulating material and are exposed. Item 2. The passive element according to Item 1.   The first connecting step has a flat shape and is attached to the end of the first electrode, and the second connecting step has a flat shape and is attached to the end of the second electrode. The passive element according to claim 1.

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