JP3175059B2 - Peripheral exposure apparatus and method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an exposure apparatus for a rectangular large substrate, that is, a so-called square substrate for manufacturing a liquid crystal display panel or the like. BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a peripheral exposure apparatus having a function of irradiating a specific area irrelevant to the area with exposure illumination light to previously expose a photosensitive layer in that area.

[0002]

2. Description of the Related Art In recent years, liquid crystal display panels have been frequently used as display elements for calculators, word processors, personal computers, portable televisions and the like. A liquid crystal display panel is made by patterning a transparent thin-film electrode into a desired shape on a glass substrate as a rectangular substrate by a photolithography technique. As an apparatus for this, a mirror projection type aligner or a step-and-repeat type stepper that exposes an original pattern formed on a mask to a photoresist layer on a glass substrate via a projection optical system is used. Glass substrates as a means to be exposed are becoming larger year by year,
Recently, a size of about 500 × 500 mm has been used.

An aligner or a stepper as described above, which projects and exposes an original image pattern on a glass substrate, exposes a plurality of identical mask patterns to almost the entire surface of the glass substrate. Usually, the exposure regions of each mask pattern are arranged so as to form a large margin of about several tens of mm around the glass substrate. For this reason, when the lithography process is performed using a positive resist, the peripheral portion (margin portion) of the glass substrate is not exposed, so that the resist remains after the development processing. This residual resist may adhere not only to the upper surface of the glass substrate but also to the end surface of the glass substrate. Therefore, after the above-described process, when the end face of the glass substrate is locked by some stopper, there is a problem that the remaining resist on the end face is peeled off and becomes dust.

Further, there is a demand for removing the resist remaining on the peripheral portion of the resist-coated surface other than the glass substrate due to the process. This problem has been attracting attention in the lithography process for semiconductor wafers, and it has been attempted to solve the problem by exposing only the peripheral portion of the wafer to a certain width for resist removal before development processing. Many attempts have been made to do so.

For example, in the device disclosed in Japanese Patent Application Laid-Open No. 3-242922, as shown in FIG. 7, light from a light source lamp 105 such as an ultra-high pressure mercury lamp
06, through the plane reflecting mirror 107 to the incident end 109a of the optical fiber 109. The light beam emitted from the emission end 109 b of the optical fiber 109 is irradiated onto the wafer 101 mounted on the rotary stage 102, and the arm 1 supporting the emission end of the optical fiber 109.
The edge exposure is performed by moving the emission end 109b in the X and Y directions by the movement mechanism 110 that drives the arm 111 and the arm 111.

[0006]

However, the width of the peripheral portion of the rectangular substrate on which peripheral exposure must be performed sometimes reaches several tens of mm. Here, if the optical fibers are bundled as described above and peripheral exposure is performed on a rectangular substrate, the optical fibers must be bundled to a thickness of several tens of mm. You have to take it big. For this reason, Japanese Patent Application Laid-Open No.
Japanese Patent Application Laid-Open No. 242922 has a problem that a range in which peripheral exposure can be performed on a rectangular substrate as a surface to be exposed is reduced. In addition, the optical fiber is repeatedly bent every time the peripheral exposure is performed. Therefore, if the optical fiber is used in a forcibly bent state, the optical fiber may be damaged due to fatigue.

Further, in the above-mentioned Japanese Patent Application Laid-Open No. 3-242922, when peripheral exposure is performed on the peripheral portion of the rectangular substrate, the exit end of the optical fiber needs to repeat the movement along the peripheral portion of the rectangular substrate four times. Therefore, there is a problem that the throughput is reduced. Therefore, the present invention provides a peripheral exposure apparatus capable of peripherally exposing not only the peripheral portion on a glass substrate but also an arbitrary region other than the original mask pattern exposure region without lowering the throughput. The purpose is to:

[0008]

The peripheral exposure apparatus according to the present invention has the following configuration in order to achieve the above-mentioned object. For example, as shown in FIGS. The peripheral exposure apparatus of the present invention, which exposes the outside of an exposure area of a predetermined mask pattern to be formed, includes a substrate storage unit (PC).
1, PC2), a one-dimensional transport mechanism (10, 12, 16, 18) for one-dimensionally transporting a rectangular substrate (PG) toward an exposure stage (ST) of an exposure apparatus; Transport means (10, 12, 14, 16, 18) including a rotating mechanism (14) for rotating the paper;
0,12,14,16,18) square substrate (PG)
Peripheral exposure optical system (44A, 44B, 30, 32A, 32B) for locally exposing the outside of the exposure area of a predetermined mask pattern on a rectangular substrate in a transport path on which a one-dimensional transport is performed
The peripheral exposure optical system includes a light source for supplying exposure light, light guide means (32A, 32B) for guiding light from the light source to the rectangular substrate (PG), and light guide means (32A, 32B). ), A variable-magnification projection optical system (24A, 24B) for projecting the exit end face onto a rectangular substrate, a projection optical system (44A, 44B), and light guide means (32A, 3B).
Exposure position changing means (3) for integrally moving the exit end face of 2B) in the direction orthogonal to the direction of conveyance by the one-dimensional conveyance mechanism.
0).

[0009]

The peripheral exposure by the peripheral exposure apparatus of the present invention is carried out by a combination of one-dimensional transport of the rectangular substrate by the transport means and local exposure on the rectangular substrate by the peripheral exposure optical system. Specifically, one-dimensional transfer mechanism 1
When local exposure is performed by the peripheral exposure optical system together with the dimensional conveyance, a first belt-shaped peripheral exposure region extending in one direction is formed on the rectangular substrate. Then, after the rectangular substrate is rotated by 90 ° by the rotation mechanism, when the rectangular substrate is one-dimensionally transported and the local exposure is performed by the peripheral exposure optical system, the direction orthogonal to the first band-shaped peripheral exposure region is obtained. A second peripheral exposure region extending to the edge is formed.

In addition, the one-dimensional transfer of the square substrate by the one-dimensional transfer mechanism as described above is also used for the transfer operation of the square substrate from the substrate storage section of the exposure apparatus for exposing the original mask pattern to the substrate stage. Can be done. Further, it is also possible to form the first peripheral exposure region when performing the loading operation of the rectangular substrate, and to form the second peripheral exposure region when performing the unloading operation of the rectangular substrate. That is, the time required for the peripheral exposure is only the time required for the loading operation and the unloading operation inherent to the exposure apparatus, so that the throughput can be improved.

Further, since the magnification of the projection optical system is variable, the exit end of the light guide means can be projected onto the rectangular substrate at a desired magnification. Therefore, the size of the image at the exit end of the light guide means, that is, the size of the local exposure area can be made variable.

[0012]

An embodiment of the present invention will be described below with reference to FIG. FIG. 1 schematically shows an edge exposure apparatus according to an embodiment of the present invention. In FIG. 1, the transport direction of the plate PG, which is a rectangular substrate, is the Y-axis,
Is a coordinate system in which the normal direction of the surface to be exposed is the Z axis, and the direction orthogonal to the Y axis and the Z axis is the X axis.

In FIG. 1, an exposure apparatus body for exposing a mask pattern on a plate PG displays only an optical axis Ax of a projection optical system (not shown) and a plate stage ST as a stepper. The projection exposure by the stepper is of a step-and-repeat type, and the plate stage ST on which the plate PG is placed at the time of exposure moves two-dimensionally in the XY coordinate system. A plurality of square glass plates PG having a surface coated with a resist layer are provided with a plate carrier PC.
1 and PC2 in the Z direction. The plate transport mechanism that transports the plate PG from the plate carriers PC1 and PC2 toward the plate stage ST of the stepper includes a fork-shaped arm 10 that holds the back surface of the plate PG, and a mechanism for sliding the arm 10 in one dimension. An arm guide 12, a turntable 14 for rotating the arm guide 12 in the direction of arrow K5, and a base moving unit 16 for mounting the turntable 14 and moving it one-dimensionally in the Y direction indicated by arrow K1 in FIG. When,
The base moving unit 16 includes a guide section 18 for guiding one-dimensional movement.

The position where the plate PG is held on the arm 10 as shown in FIG. When the arm 10 is extended from this position in the Y direction as indicated by the arrow K2, the arm 10 passes below the spot irradiation units 24A and 24B, which are projection optical systems of the peripheral exposure optical system that exposes the area outside the mask pattern by the stepper. , Plate PG is located immediately above center-up 20. The center up 20 performs an operation of receiving the plate PG from the arm 10 by moving up and down in the Z direction as indicated by an arrow K3. Also, since the center-up 20 has a rotating mechanism, the plate PG placed on the stage ST
Direction can be changed. Slider arm 22
A and 22B move one-dimensionally in the Y direction as indicated by arrow K4.
The plate PG on the center up 20 is received. Further, since the slider arms 22A and 22B can move in the Z direction, the plate PG can be placed on the stage ST.

The plate PG mounted on the stage ST, which can be moved two-dimensionally with respect to the optical axis Ax of the projection optical system (not shown), is exposed to a mask pattern by a step-and-repeat method. The plate PG on which the exposure of the mask pattern is completed is placed on the slider arm 22A, 2A.
2B, the center-up 20, the arm 10, and the peripheral exposure optical systems 24A and 24B), and then returned to the drawing position shown in FIG. When the plate PG comes to the drawn-out position, the rotation center of the turntable 14 is located substantially at the center of the plate PG. Then turntable 1
4 rotates 90 °, the arm 10
It is possible to feed out in the X direction toward C1 or PC2.
Then, the plate PG is stored in the original slot in the carrier PC1 or PC2.

In this embodiment, as shown in FIG. 1, spot irradiation units 24A and 24B are provided as a projection optical system of a peripheral exposure optical system in a transport path between the draw-out position and the center-up 20. Have been. As shown in the schematic diagram of the peripheral exposure optical system in FIG. 2, the peripheral exposure optical system includes a light source unit (not shown), shutters 34A and 34B for blocking light beams from the light source unit, and a light beam from the light source unit. Fibers 32A and 32B for transmitting light, and a spot irradiation unit 24 movably provided in the X direction.
A and 24B, and a column 30 for changing the position of the spot irradiation units 24A and 24B by an internal motor or the like.

These irradiation units 24A and 24B are
Along the guide rail in the column 30 extending in the X direction,
They move in the X direction independently of each other. Then, exposure light from a light source such as a mercury lamp is guided to the irradiation unit 24A via the optical fiber 32A and the shutter 34A.
Similarly, for the irradiation unit 24B, the optical fiber 3
Exposure light is guided through 2B. And the plate P
When each of the two sides extending in the Y direction of G is exposed with a constant width, each irradiation area SP of the irradiation units 24A and 24B is located on the areas L1 and L2 to be exposed on the plate PG indicated by the broken lines. As described above, each irradiation unit 24A, 24
Position B. The center line CL in FIG.
The center of rotation of the turntable 14 and the center of the center-up 20 shown in FIG.

The irradiation units 24A and 24B will be described with reference to a schematic diagram of the irradiation unit shown in FIG. Since the irradiation units 24A and 24B have the same functions, only the irradiation unit 24A will be described for the sake of simplicity. In FIG. 3, a fiber frame 40 supporting the end face of the optical fiber 32A (32B) and defining the shape of the exit end thereof in a slit shape.
A mirror 43 that bends the traveling direction of the light beam emitted from the optical fiber 32A (32B) downward by 90 °; a projection objective lens 44A (44B) that enlarges and projects the exit end face of the optical fiber 32A (32B) onto a rectangular substrate; Projection system 46A (46) as an oblique incidence focus sensor
B) and a light receiving system 47A (47B).

The exposure light from a light source (not shown) that has passed through the optical fiber 32A (32B) is bent at a right angle by a mirror 43, and is projected to a projection objective lens 44A (44B).
Is focused by the optical fiber 32 within a predetermined image plane.
The exit end face of A (32B) is projected as the irradiation area SP. The light projecting system 46A (46B) as an optical oblique incidence focus sensor for measuring the distance between the projection objective lens 44A (44B) and the plate PG includes a projection objective lens 44A.
A light beam BM for forming a slit (pinhole) image with light having low sensitivity to the resist is obliquely applied to the plate PG into the slit-shaped (or pinhole-shaped) irradiation area SP projected by (44B). Irradiate. The light receiving system 47A (47B) receives the reflected light beam BR of the light beam BM from the plate PG, and detects a change in the light receiving position with a position sensor or the like using a semiconductor element, thereby displacing the plate PG in the Z direction (defocusing). Amount) can be detected.

Here, the surface of the plate PG is the best image forming plane (optical fiber 32) of the projection objective lens 44A (44B).
A, the plane conjugate with the exit end of 32B)
On the surface of the plate PG, a slit (or pinhole) image projected from the light projecting system 46A (46B) forms the best focus at the position of the best image plane of the projection objective lens 44A (44B). Light receiving system 4 receiving reflected light beam BR
7A (47B) forms a reproduced image of the slit (or pinhole) image on the plate PG on the light receiving surface of the position sensor.

The irradiation units 24A and 24B have the above-mentioned light projecting system 46A (46B) and light receiving system 47A (4
7B), the distance in the Z direction from the tip of the projection objective lens 44A (44B) to the plate PG is always kept constant based on the displacement of the plate PG detected in the Z direction.
An auto focus mechanism for moving the projection objective lens 44A (44B) in the Z direction is provided.

The projection objective lens 44A (44B)
Is an optical system of a zoom system,
The projection magnification of the exit end of A (32B) can be set arbitrarily.
That is, the size of the irradiation area SP can be arbitrarily enlarged or reduced. The size of the irradiation area SP is set by controlling the magnification of the projection objective lens 44A (44B) so as to have a predetermined size based on the setting of the width of the exposure band to be exposed peripherally. Specifically, first, although not shown, information such as the width of an exposure band to be subjected to peripheral exposure is input to the control unit via input means such as a keyboard. And this control unit, based on the width of the input exposure band,
The size of the irradiation area SP irradiated on the plate PG is calculated, and the projection objective lens 44A (44B) is set so that the size of the emission end of the optical fiber 32A (32B) becomes the calculated size of the irradiation area SP. ) Set the magnification.

Here, the projection objective lens 44A (44B)
The numerical aperture on the entrance side changes with the magnification. Therefore, in order for the light beam from the optical fiber 32A (32B) to be incident on the projection objective lens 44A (44B) without loss of light amount regardless of the change in the numerical aperture of the projection objective lens 44A (44B),

[0024]

It is desirable that sin α ≦ sin θ _W be satisfied. Where sin α is the numerical aperture at the exit end of the optical fiber 32A (32B), and sin θ _{W is} the maximum numerical aperture on the incident side of the projection objective lens 44A (44B).

At this time, the optical fiber 32A (32B)
When the numerical aperture at the exit end of the optical fiber and the maximum numerical aperture on the incident side of the projection objective lens 44A (44B) deviate from the above-mentioned conditional expression, the light beam from the optical fiber 32A (32B) becomes an effective diameter of the projection objective lens 44A (44B). Since the incident light spreads as described above, a light amount loss is caused, which is not preferable. The exposure amount of the resist on the plate PG is a product of the illuminance of light irradiated on the plate PG and the irradiation time. Therefore, an illuminance monitor is provided on the lower surface of the plate PG or on the back surface of the mirror 43, and based on the illuminance of light emitted on the plate PG measured by the illuminance monitor or the illuminance of light emitted from the optical fiber 32A (32B). A control unit for controlling the transfer speed of the base moving unit 16 for setting the irradiation time may be provided to set the transfer speed of the plate PG. Here, the projection objective lens 44A
When the magnification of (44B) changes, the numerical aperture of the projection objective lens 44A (44B) changes accordingly. Therefore, when an illuminance monitor is provided on the back of the mirror 43, the measured illuminance and the current projection objective lens 44A (4
It is desirable to set the transport speed of the plate PG based on the numerical aperture value of 4B).

Next, an example of a typical peripheral exposure operation according to the present embodiment will be described with reference to FIG. In FIG. 4, the plate PG has a rectangular shape, and its long side is exposed first. First, X of the exposure zones EX ₁ and EX ₂
The spot irradiation unit 24
The spot irradiation units 24A and 24B are moved by the column 30 so that the irradiation areas SPa and SPb of A and 24B are at predetermined positions. Then, the exposure zones EX ₁ and EX ₂
Corresponding to the width in the X direction of each of the irradiation areas SPa and SPb.
So that the projection objective lens 44A
The magnification of (44B) is set.

Thereafter, using the light projecting system 46A (46B) and the light receiving system 47A (47B), the shutter 34 is automatically focused at the end in the Y direction of the plate PG.
A (34B) is opened, the base moving unit 16 is moved at a predetermined speed in the Y direction, and exposure of the exposure bands EX ₁ and EX ₂ is performed. And this autofocus is performed by the plate P
Since the flatness of G may be poor, it is desirable to always perform this during peripheral exposure.

Next, after the plate PG is rotated by 90 ° by the turntable 14, the exposure zones EX ₃ and EX ₄ on the short side of the plate PG are exposed in the same sequence. Here, for example, during loading for transporting the plate PG from the carrier 1 to the plate stage ST, exposure is performed on the exposure bands EX ₁ and EX ₂ on the long side of the plate PG. Then, a predetermined mask pattern is exposed by a stepper on the plate stage ST, and the turntable 14 is rotated by 90 ° during unloading to transfer the carrier from the plate stage ST to the carrier 1 to expose the short side of the plate PG. Exposure of the bands EX ₃ and EX ₄ further improves the throughput.

As is clear from the above sequence,
The position, width and direction of the exposure band formed on the plate PG are set in the X direction of the irradiation units 24A and 24B, the magnification of the projection objective lens 44A (44B) is set, and the turntable 14 is rotated by 90 °. Can be made as intended by each combination of Also, a combined operation of scanning the plate PG in the Y direction and rotating by 90 °, or
The operation of scanning only in the Y direction can be repeated in principle any number of times.

The peripheral exposure of the plate PG using the irradiation units 24A and 24B is basically performed by one-dimensional (Y-direction) movement of the base moving unit 16. Of course, in a state where the arm 10 moves in the Y direction as shown in FIG. 1, peripheral exposure can be performed by moving the arm 10 in the Y direction. However, in a state where the turntable 14 is rotated by 90 ° from the position shown in FIG. 1, the plate PG cannot be moved in the Y direction by the movement of the arm 10 alone. Performs peripheral exposure. And
The moving stroke of the base moving unit 16 is set to be equal to or longer than the length of the largest side of the plate PG in consideration of the case where the entire length of one side of the plate PG is exposed.

As is apparent from the configuration shown in FIG. 1, the turntable 14 is rotated from the state shown in FIG.
When the peripheral exposure is performed while the plate PG is being transported by 6, the exposure band on the plate PG can be formed obliquely. Further, when at least one of the irradiation units 24A and 24B is moved in the X direction at the same time as the transfer of the plate PG by the base moving unit 16, an oblique exposure band can be formed on the plate PG.

Further, the exposure band formed by the peripheral exposure may be shorter than the length of each side of the plate PG. In this case, it is necessary to accurately manage the length of the exposure band and the arrangement of the exposure band on the plate PG. Therefore, the base moving unit 16 includes a length measuring device such as an encoder for measuring the transport distance of the plate PG. It is desirable to provide. Here, when the transport distance of the plate PG is measured and the size of the irradiation area on the plate PG is changed, for example, as shown by hatching in FIG. Can be formed.

Further, the output end of the optical fiber 32A (32B) is rotated or the optical fiber 32A (3B
By providing an image rotator between 2B) and the projection objective lens 44A (44B) and rotating the irradiation area on the plate PG, the width of the exposure band can be changed.
In this case, as shown in FIG. 6, the local width of the X direction of the exposure area SP ₁ before rotation indicated by the dashed line d, the width in the Y direction when is h, only the rotation angle ω shown by a solid line The width D in the X direction of the local exposure area SP ₂ after rotation is

[0034]

## EQU2 ## D = d.cos.omega. + H.sin.omega. Therefore, since the width of the strip-shaped exposure region formed on the plate PG is the local width D of the exposure region in the X direction, even when the optical fiber exit end is rotated and projected,
The width of the belt-shaped exposure region can be made variable. In this case, the width of the exposure band on the plate PG can be changed without changing the magnification of the projection objective 44A (44B). Without increasing the zoom ratio of the lens,
The range of adjustment of the width of the exposure zone can be widened.

[0035]

As described above, according to the present invention, since the transfer of the rectangular substrate and the peripheral exposure are performed at the same time, the peripheral exposure can be realized without lowering the throughput.
Further, since a plurality of exposure bands extending in directions orthogonal to each other can be formed at an arbitrary position and an arbitrary width on the rectangular substrate, the exposure region of the original mask pattern formed on the rectangular substrate can be formed. Irrespective of the outer shape and the arrangement, it is possible to surely expose the mask pattern outside the exposure area.

[Brief description of the drawings]

FIG. 1 is a schematic view of an embodiment according to the present invention.

FIG. 2 is a schematic view of a peripheral exposure optical system according to an embodiment of the present invention.

FIG. 3 is a schematic diagram showing a configuration of an irradiation unit according to an embodiment of the present invention.

FIG. 4 is a view showing a typical operation of plate peripheral exposure according to an embodiment of the present invention.

FIG. 5 is a diagram showing an example in which a plurality of exposure zones are formed on a plate in different directions and different widths.

FIG. 6 is a plan view showing the principle of changing the width of an exposure band by rotating an irradiation area.

FIG. 7 is a plan view showing a conventional example.

[Explanation of main symbols]

 10 Arm 14 Turntable 16 Base moving unit 24A Spot irradiation unit 24B Spot irradiation unit 30 Column 32A Optical fiber 32B Optical fiber 40 Fiber frame 44A Spot irradiation Projection objective lens 44B 投影 Projection objective lens for spot irradiation SP ‥‥ Spot irradiation area PG ‥‥ Plate ST ‥‥ Stage PC1 ‥‥ Substrate storage unit PC2 ‥‥ Substrate storage unit

Claims (5)

(57) [Claims] 1. A peripheral exposure apparatus for exposing an outside of an exposure area of a predetermined mask pattern formed on a rectangular substrate by an exposure apparatus, wherein the peripheral exposure apparatus directs from a substrate storage section to an exposure stage of the exposure apparatus. Transport means including a one-dimensional transport mechanism for transporting the rectangular substrate one-dimensionally and a rotating mechanism for rotating the rectangular substrate approximately 90 °; transport wherein the rectangular substrate is transported one-dimensionally by the transport means A peripheral exposure optical system for locally exposing an outside of an exposure area of the predetermined mask pattern on the square substrate in a path;
Having a light source for supplying exposure light, light guide means for guiding light from the light source to the rectangular substrate, and an emission end face of the light guide means on the rectangular substrate. A projection optical system having a variable magnification for projection; and an exposure position changing means for integrally moving the projection optical system and the exit end face in a direction orthogonal to a transport direction by the one-dimensional transport mechanism.
And, exposure by the peripheral exposure optical system is the one of the rectangular substrate
A peripheral exposure apparatus, which is performed during dimensional conveyance . (2) Formed on a square substrate by the exposure equipment
Peripheral exposure that exposes outside the exposure area of the specified mask pattern
In the device, The peripheral exposure apparatus moves the rectangular substrate one-dimensionally.
One-dimensional moving means; Rotating means for rotating the rectangular substrate by approximately 90 °; In the movement locus of the rectangular substrate by the one-dimensional moving means,
The irradiation area of the illumination light for exposure is arranged, on the square substrate
Locally exposing an area outside the exposure area of the mask pattern
Peripheral exposure means; The local irradiation area by the peripheral exposure means is
Exposure position change that changes in the direction orthogonal to the direction of movement
And further means; While moving the rectangular substrate by the one-dimensional moving means
By performing local exposure by the peripheral exposure means,
A first strip exposure area extending in one direction on the square substrate
And rotating the square substrate by the rotating means.
And then move the rectangular substrate by the one-dimensional moving means
By letting it go on the square substrate Almost one direction
Forming a second strip-shaped exposure area extending in a direction orthogonal to
And an exposure apparatus for a rectangular substrate. (3) The peripheral exposure unit supplies exposure light
A light source; and a laser for guiding light from the light source to the rectangular substrate.
Light guide means and the exit end face of the light guide means.
It has a variable magnification projection optical system that projects onto a square substrate.
And The exposure position changing unit includes: the projection optical system;
The surface and the direction perpendicular to the transport direction by the one-dimensional transport mechanism
3. The moving device according to claim 2, wherein
Exposure equipment for square substrates. (4) Formed on a square substrate by the exposure device
Peripheral exposure that exposes outside the exposure area of the specified mask pattern
In the method, While moving the rectangular substrate one-dimensionally, the rectangular substrate
Locally exposing an area different from the above exposure area.
A first band extending in one direction on the rectangular substrate
Forming a linear exposure area; Rotating the rectangular substrate; After rotating the square substrate, the square substrate is
While moving the exposure area, the exposure area on the square substrate is
By locally exposing different areas,
A second strip-shaped exposure area extending in a direction substantially orthogonal to the
Exposing the rectangular substrate.
Light method. (5) Forming the first band-shaped exposure region
Now, a plurality of strip-shaped exposure regions extending in one direction are formed.
And In the step of forming the second band-shaped exposure area,
A plurality of strip-shaped exposure areas extending in a direction
The exposure of the rectangular substrate according to claim 4, wherein
Light method.