JP3167981U - Structure of flat plate heat pipe - Google Patents

Abstract

The present invention provides a flat plate heat pipe structure that is thin and has improved working fluid circulation efficiency. A first plate body 21 and a second plate body 22 are provided. The first plate 21 has a condensing part 213 composed of a plurality of convex bodies 214. The second plate 22 has a plurality of current collecting portions 2211 and an evaporation portion 2212. The condensing unit 213 corresponds to the current collecting unit 2211 and the evaporation unit 2212, and the first plate 21 and the second plate 22 are connected to face each other. Due to the action of the plurality of convex bodies 214, the working fluid that has been cooled and phase-changed into a liquid state is quickly concentrated and returned to the evaporation unit 2212, so that the circulation efficiency of the working fluid can be increased. [Selection] Figure 1

Description

The present invention relates to a structure of a flat plate heat pipe, and in particular, provided with a convex body capable of quickly concentrating and dropping a working fluid that has been cooled and phase-changed into a liquid state in a condensing part. It is related with the structure of the flat plate type heat pipe which can make it recirculate | reflux to an evaporation part rapidly, and can improve the circulation efficiency of the working fluid of a flat plate type heat pipe by this.

Electronic devices are required to be further thinned. Therefore, each member used in the electronic device is also required to be reduced in size. However, as the dimensions of the electronic device are reduced, the heat generated from the electronic device has become an obstacle to improving the performance of the electronic device and system. In addition, although semiconductors constituting electronic elements continue to be reduced in size, higher performance is required.

Semiconductors increase in heat flux as their dimensions are reduced. Thereby, there exists a possibility that a semiconductor will be in an overheated state and an electronic product may fail or be damaged. Therefore, it is not sufficient to dissipate heat with respect to the total heat quantity of the electronic product.

In order to solve the problem that the heat radiation space is narrow, a technique has been devised in which a heat sink including a VC (Vapor chamber) is disposed above the chip and used as a heat radiator. In this prior art, in order to increase the capillary phenomenon, struts having a wick structure such as a sintered coated copper pillar, a pillar-shaped sintered body, and a pillar-shaped foam are disposed, and these pillars serve as a reflux path. However, since the upper and lower wall thickness of the conventional flat plate heat pipe is thin (1.5 mm or less), when the conventional technique using the above-mentioned support having the wick structure is applied to the flat plate heat pipe, the sintered coated copper column In addition, only the portion where the columnar sintered body, the columnar foam and the like are arranged is supported, and the other portion is depressed. As a result, the flatness and strength of the structure of the flat plate heat pipe cannot be maintained, and the thickness reduction cannot be realized.

The working fluid in the flat plate-type heat pipe according to the above-described prior art absorbs heat in the evaporation section, and changes in phase from a liquid state to a gas state. When the working fluid in the gaseous state reaches the condensing part of the flat plate heat pipe, the phase changes from the gaseous state to the liquid state, and then circulates back to the evaporation part. Usually, the condensing part of a flat plate type heat pipe has a glossy surface or a wick structure by sintering. As a result, the working fluid in a gaseous state is cooled in the condensing unit and changed into a liquid water droplet, and then returned to the evaporating unit by the capillary action of gravity or wick structure. However, since the structure of the condensing unit according to the above-described prior art is a glossy surface, the water droplets of the cooled working fluid in the liquid state do not drop by gravity unless a predetermined volume is reached. Therefore, the circulation efficiency is very low. Furthermore, since the recirculation speed of the working fluid in the liquid state is extremely slow, there is no working fluid in the evaporation section, and the heat conduction efficiency is greatly reduced. Further, if a wick structure (sintered body or net-like body) is added to increase the circulation efficiency of the working fluid, the flat plate heat pipe cannot be thinned.

That is, the conventional flat plate type heat pipe has the following defects (1) to (3).
(1)
The return speed of the working fluid is extremely slow.
(2) The heat conduction efficiency is low.
(3) Thinning cannot be realized.

Japanese Patent Laid-Open No. 07-332883

The main object of the present invention is to provide a structure of a flat plate heat pipe that can be made thin.
The next object of this invention is to provide the structure of the flat plate type heat pipe which can raise the circulation efficiency of a working fluid significantly.

In order to solve the above-mentioned problem, the structure of the flat plate type heat pipe of the present invention is attached to at least one heat source. The structure of the flat plate heat pipe has a first plate and a second plate. The first plate has a first plane and a second plane. The first plane has at least one condensing part. The condensing part has a plurality of convex bodies. The second plate has a third plane and a fourth plane. The third plane is oppositely connected to the first plane. The third plane has a plurality of current collecting portions and at least one evaporation portion. The fourth plane is attached to the heat source.

The structure of the flat plate heat pipe according to the present invention is that a plurality of convex bodies provided in the condensing unit quickly concentrate the working fluid that has changed phase from a gas state to a liquid state in the condensing unit, and a plurality of collecting units and an evaporation unit Can be quickly refluxed. Thereby, the circulating efficiency of the working fluid inside the flat plate type heat pipe can be enhanced. That is, the structure of the flat plate heat pipe of the present invention has the following advantages (1) to (3).
(1) The structure is simple.
(2) Thinning can be realized.
(3) High heat conduction efficiency.

1 is an exploded perspective view showing a structure of a flat plate heat pipe according to a first embodiment of the present invention. 1 is a perspective view illustrating a structure of a flat plate heat pipe according to a first embodiment of the present invention. It is sectional drawing which shows the structure of the flat plate type heat pipe by 1st Embodiment of this invention. It is sectional drawing which shows the 1st board body of the structure of the flat plate type heat pipe by 2nd Embodiment of this invention. It is sectional drawing which shows the 1st board body of the structure of the flat plate type heat pipe by 3rd Embodiment of this invention. It is sectional drawing which shows the 1st board body of the structure of the flat plate type heat pipe by 4th Embodiment of this invention. It is sectional drawing which shows the 1st board body of the structure of the flat plate type heat pipe by 5th Embodiment of this invention. It is sectional drawing which shows the 1st board body of the structure of the flat plate type heat pipe by 6th Embodiment of this invention. It is sectional drawing which shows the 1st board body of the structure of the flat plate type heat pipe by 7th Embodiment of this invention. It is sectional drawing which shows the use condition of the flat plate type heat pipe of this invention.

DESCRIPTION OF EMBODIMENTS Embodiments showing the objects, features, and effects of the present invention will be described in detail with reference to the drawings.

(First embodiment)
Please refer to FIG. FIG. 1 is an exploded perspective view illustrating a structure of a flat plate heat pipe according to a first embodiment of the present invention. FIG. 2 is a perspective view showing a structure of a flat plate heat pipe according to the first embodiment of the present invention. FIG. 3 is a cross-sectional view showing the structure of a flat plate heat pipe according to the first embodiment of the present invention. As shown in FIGS. 1 to 3, the structure of the flat plate heat pipe according to the first embodiment of the present invention is attached to at least one heat source 1. The structure of the flat plate heat pipe 2 includes a first plate body 21 and a second plate body 22.

  The first plate body 21 has a first plane 211 and a second plane 212. The first plane 211 has at least one condensing part 213. The condensing unit 213 has a plurality of convex bodies 214. The convex body 214 may be provided with an unequal diameter. In addition, a sharp end may be formed at the end of the convex body 214 so that the working fluid can be conveniently dropped. The convex body 214 is a copper pillar.

  The condensing unit 213 includes at least one first condensing unit 2131 and at least one second condensing unit 2132. The first condensing unit 2131 and the second condensing unit 2132 are composed of a plurality of convex bodies 214. The second condensing unit 2132 is provided on both sides of the first condensing unit 2131. Further, the height of the convex body 214 of the second condensing unit 2132 gradually increases in the direction of the first condensing unit 2131. That is, the height of the convex body 214 of the first condensing unit 2131 is higher than the height of the convex body 214 of the second condensing unit 2132.

  The second plate body 22 has a third plane 221 and a fourth plane 222. The third plane 221 is connected to face the first plane 211. The third plane 221 has a plurality of current collecting portions 2211 and at least one evaporation portion 2212. The fourth plane 222 is attached to the heat source 1. The current collecting part 2211 and the evaporation part 2212 have a plurality of flow paths 2211a and 2212a. The current collecting part 2211 is located outside the evaporation part 2212.

(Second Embodiment)
Please refer to FIG. FIG. 4 is a cross-sectional view showing a first plate body of a flat plate heat pipe structure according to a second embodiment of the present invention. As shown in FIG. 4, the structure of the flat plate heat pipe according to the present embodiment is the same as that of the first embodiment, and therefore the same portions will not be described in detail here. In the structure of the flat plate type heat pipe according to the second embodiment, the condensing unit 213 includes a first condensing unit 2131, a second condensing unit 2132, and a third condensing unit 2133. The second condensing unit 2132 and the third condensing unit 2133 are provided on both sides of the first condensing unit 2131, respectively. In addition, the first condensing unit 2131, the second condensing unit 2132, and the third condensing unit 2133 are each defined by a plurality of convex bodies 214. Further, the gap 2131a between the convex bodies 214 in the first condensing part 2131 is narrower than the gaps 2132a and 2133a between the convex bodies 214 of the second condensing part 2132 and the third condensing part 2133.

(Third embodiment)
Please refer to FIG. FIG. 5 is a cross-sectional view showing a first plate body of a flat plate heat pipe structure according to a third embodiment of the present invention. As shown in FIG. 5, the structure of the flat plate heat pipe according to the present embodiment is the same as that of the first embodiment, and therefore the same portions will not be described in detail here. In the structure of the flat plate heat pipe according to the third embodiment, the condensing unit 213 includes at least one first condensing unit 2131 and at least one second condensing unit 2132. The first condensing unit 2131 and the second condensing unit 2132 are composed of a plurality of convex bodies 214. The second condensing unit 2132 is provided on both sides of the first condensing unit 2131. The height of the convex body 214 of the second condensing unit 2132 gradually decreases in the direction of the first condensing unit 2131. That is, the height of the convex body 214 of the first condensing unit 2131 is lower than the height of the convex body 214 of the second condensing unit 2132. The convex body 214 is a powder sintered body.

(Fourth embodiment)
Please refer to FIG. FIG. 6 is a cross-sectional view showing a first plate body of a flat plate heat pipe structure according to a fourth embodiment of the present invention. As shown in FIG. 6, the structure of the flat plate heat pipe according to the present embodiment is the same as that of the first embodiment, and therefore the same parts will not be described in detail here. In the structure of the flat plate heat pipe according to the fourth embodiment, the convex body 214 is a copper pillar. Further, the outside of the copper pillar has at least one groove 2141.

(Fifth embodiment)
Please refer to FIG. FIG. 7 is a cross-sectional view showing a first plate body of a flat plate heat pipe structure according to a fifth embodiment of the present invention. As shown in FIG. 7, the structure of the flat plate heat pipe according to the present embodiment is the same as that of the first embodiment, and therefore the same portions will not be described in detail here. In the structure of the flat plate heat pipe according to the fifth embodiment, the convex body 214 is a copper pillar. Further, the outside of the copper pillar has a powder sintered ring 215.

(Sixth embodiment)
Please refer to FIG. FIG. 8 is a cross-sectional view illustrating a first plate body of a flat plate heat pipe structure according to a sixth embodiment of the present invention. As shown in FIG. 8, the structure of the flat plate-type heat pipe according to the present embodiment is the same as that of the first embodiment, and therefore the same portions will not be described in detail here. In the structure of the flat plate heat pipe according to the sixth embodiment, the convex body 214 is a copper pillar. Further, the outside of the copper pillar has a powder sintered ring 215. The powder sintered ring 215 has at least one groove 2151.

(Seventh embodiment)
Please refer to FIG. FIG. 9 is a cross-sectional view showing a first plate body of a flat plate heat pipe structure according to a seventh embodiment of the present invention. As shown in FIG. 9, the structure of the flat plate heat pipe according to the present embodiment is the same as that of the third embodiment, and therefore, the same portions will not be described in detail here. In the structure of the flat plate heat pipe according to the seventh embodiment, the convex body 214 is a powder sintered body. In addition, the outside of the powder sintered body has at least one groove 2142.

  Please refer to FIG. FIG. 10 is a cross-sectional view showing a usage state of the flat plate type heat pipe of the present invention. As shown in FIG. 10, the fourth plane 222 of the second plate 22 is in contact with at least one heat source 1 and absorbs heat generated from the heat source 1. The working fluid 3 is vaporized in the evaporation unit 2212 after absorbing heat. The working fluid 32 in the gaseous state moves to the first plate 21 and is cooled in the condensing part 213 of the first plate 21, and then changes into a liquid state. In addition, due to the action of the convex body 214 of the aggregation unit 213, the working fluid 31 in a liquid state is quickly concentrated on the convex body 214 portion and refluxed to the evaporation unit 2212. Thereby, the circulation efficiency of the working fluid 3 in the flat plate-type heat pipe 2 can be significantly increased, and the heat conduction effect can be greatly increased.

DESCRIPTION OF SYMBOLS 1 Heat source 2 Flat plate heat pipe 21 1st plate body 211 1st plane 212 2nd plane 213 Condensing part 2131 1st condensing part 2131a clearance 2132 2nd condensing part 2132a clearance 2133 3rd condensing part 2133a clearance 214 Convex body 2141 Groove portion 2142 Groove portion 215 Powder sintered ring 2151 Groove portion 22 Second plate body 221 Third plane 2211 Current collecting portion 2211a Flow path 2212 Evaporating section 2212a Flow path 222 Fourth plane 3 Working fluid 31 Liquid state Working fluid 32 Working fluid in gaseous state

Claims (11)

Consists of a first plate and a second plate that are coupled to each other,
The first plate has a first plane and a second plane, the first plane has at least one condensing part, and the condensing part comprises a plurality of convex bodies,
The second plate has a third plane and a fourth plane, and the third plane is coupled and connected to face the first plane, and the third plane has a plurality of planes. A structure of a flat plate type heat pipe having a current collecting portion and at least one evaporation portion, wherein the fourth plane is attached to the heat source.   The condensing unit includes a first condensing unit, a second condensing unit, and a third condensing unit, and the second condensing unit and the third condensing unit are both sides of the first condensing unit, respectively. Each of the first condensing part, the second condensing part, and the third condensing part is defined by a plurality of convex bodies, and a gap between the convex bodies of the first condensing part is The structure of the flat plate type heat pipe according to claim 1, wherein the structure is narrower than a gap between the convex bodies of the second condensing part and the third condensing part.   The flat heat pipe structure according to claim 1, wherein the convex body is a copper pillar.   The structure of the flat plate type heat pipe according to claim 1, wherein the convex body is a copper pillar, and the outside of the copper pillar has at least one groove.   The structure of the flat plate type heat pipe according to claim 1, wherein the convex body is a copper pillar, and the outside of the copper pillar has a powder sintered ring.   2. The flat plate type according to claim 1, wherein the convex body is a copper pillar, and the outside of the copper pillar has a powder sintered ring, and the powder sintered ring has at least one groove portion. Heat pipe structure.   The flat heat pipe structure according to claim 1, wherein the convex body is a powder sintered body.   The structure of the flat plate type heat pipe according to claim 1, wherein the convex body is a powder sintered body, and the outside of the powder sintered body has at least one groove portion.   The structure of the flat plate type heat pipe according to claim 1, wherein the current collecting part and the evaporation part have a plurality of flow paths, and the current collecting part is located outside the evaporation part.   The condensing part has at least one first condensing part and at least one second condensing part, and the first condensing part and the second condensing part are composed of a plurality of convex bodies, The second condensing unit is provided on both sides of the first condensing unit, and the height of the plurality of convex bodies of the second condensing unit is gradually lowered in the direction of the first condensing unit. The structure of the flat plate type heat pipe according to claim 1, wherein The condensing part has at least one first condensing part and at least one second condensing part, and the first condensing part and the second condensing part are composed of a plurality of convex bodies, The second condensing unit is provided on both sides of the first condensing unit, and the height of the plurality of convex bodies of the second condensing unit is gradually increased in the direction of the first condensing unit. The structure of the flat plate type heat pipe according to claim 1, wherein

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