JP3141634B2 - Semiconductor device manufacturing method and resin sealing mold - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a storage container for a semiconductor device, and more particularly, to a semiconductor device sealing structure of a TAB type.

[0002]

2. Description of the Related Art Conventional TAB system mounting forms (hereinafter, referred to as TAB mounting forms)
Called "TCP". FIG. 3 is a cross-sectional view of the semiconductor device sealing structure (hereinafter, referred to as “package”).

In FIG. 3, a circuit pattern is formed on a surface of a carrier tape 5 made of polyimide or the like by using a conductive material such as copper to form a circuit board called a “TAB tape”. The portion 6 connecting the circuit pattern of the TAB tape and the external circuit is called an outer lead,
The portion 4 connecting the circuit pattern of the TAB tape and the semiconductor element is called an inner lead. The semiconductor element 1 is
The bumps 3 made of gold or the like for improving the electrical and mechanical bonding with the external circuit are electrically connected to the inner leads 4 of the TAB tape together with other inner leads by thermocompression bonding called gang bonding. And by mechanically joining, it becomes TCP. Thereafter, in order to protect the connection portion and the semiconductor element, the package is formed by transfer molding with a mold sealing material 2 made of resin or the like while leaving the outer leads. in this case,
The circuit configuration of the semiconductor device that needs to be protected
Called "active surface". ) And other portions of the TAB tape other than the electrical joints with the inner leads have more sealing resin than necessary.

[0004]

However, due to the demand for lighter, thinner and smaller devices to be used, the integration of semiconductor elements has advanced and the outer shape of the semiconductor elements has become larger, and the outer shape of the package has become larger than before. Therefore, when a semiconductor element having a large outer shape is packaged as in the conventional case, only the thickness of the semiconductor element is the same as in the conventional case, and the amount of molding resin used for sealing increases. Has a problem that the weight increases in proportion to the size of the semiconductor element. In addition, an ultraviolet erasable rewritable read-only memory (hereinafter referred to as “U
VEPROM ") or a charge-coupled device (hereinafter referred to as" CC
D ". ), Etc., there is also a problem that it is difficult to form a package by transfer molding when a TCP is used for a semiconductor element in which a circuit configuration surface of a semiconductor element or an optical junction of an optical semiconductor element cannot be molded and sealed. It became a thing.

SUMMARY OF THE INVENTION It is an object of the present invention to reduce the weight of a package when TCP is sealed with a transfer mold using a mold sealing material made of a resin as compared with the conventional one, and to provide a semiconductor device such as a UVEPROM or a CCD. In the case where a semiconductor element whose active surface cannot be molded and sealed is made of TCP, the semiconductor element can be packaged by transfer molding.

[0006]

The present invention employs the following means to achieve the above object.

[0007]

Another method of manufacturing a semiconductor device according to the present invention includes a step of connecting an electrode of a semiconductor element and an inner lead via a bump on the electrode, and a step of connecting the inner lead to a surface of the semiconductor element on which the electrode is formed. Disposing a removable member after resin sealing at a position to be a non-resin forming region; and resin-sealing only the active surface of the semiconductor element by transfer molding in a state where the removable member is disposed. And a step of removing the removable member after the resin sealing step. In addition to the above method, in the step of disposing the removable member using a light transmitting resin for the removable member, the light transmitting resin is bonded to the non-resin forming region with an ultraviolet-curable adhesive member. In the step of sticking to a place to be removed and removing, the adhesive member is irradiated with ultraviolet rays, and then the light transmitting resin is removed. Further, a heat-resistant resin is used for the removable member. Still further, a silicone resin is used for the removable member. Further, the resin-sealing mold of the present invention is a resin-sealing mold for sealing a semiconductor element, and the cavity of the mold has a gap of 10 μm or less from a side surface of the semiconductor element to be sealed. The cavity side surface is formed as described above.

[0009]

FIG. 1, FIG. 2, FIG.
This will be described with reference to FIGS. TC based on (means 1)
FIG. 1 shows a cross-sectional view of an example in which the present invention is implemented at P. As shown in FIG. 1, the inner lead 4 of the TAB tape and the semiconductor element 2 are joined via the bumps 3 by, for example, gang bonding to form TCP. Next, the semiconductor element and TA
Only the joint of the inner lead B and the active surface of the semiconductor element are resin-sealed by transfer molding.
In the transfer mold, as shown in FIG. 6, a cavity called a cavity 10 formed by injecting a resin is provided on a division surface of a mold die 9 which can be divided vertically or horizontally. The semiconductor element 2 connected to the TAB to be sealed is sandwiched, the mold is closed, a resin is injected into the cavity, and the resin is cured to form a package. According to the present invention, in order to prevent the portion of the semiconductor element to be sealed with the resin from protruding outside the outer peripheral portion when the circuit configuration surface of the semiconductor element is flat as shown in FIG. In the structure of the cavity 10 on the mold 9, the side surface of the cavity is manufactured so that the boundary between the side surfaces of both the cavity 10 and the semiconductor element 2 has an interval of about 10 μm or less where the sealing resin does not enter. By fitting the semiconductor element into the cavity and performing resin molding, only the connection between the TAB tape and the semiconductor element and the active surface of the semiconductor element can be resin-sealed as shown in FIG.

An embodiment of the present invention using (means 2) will be described with reference to FIGS. 2, 4 and 5. FIG. FIG. 2 is a sectional view of an embodiment of the present invention, and FIGS. 4 and 5 are views showing an example of a manufacturing method of the embodiment of the present invention shown in FIG.

[0011] As shown in FIG.
After bonding to the inner leads 4 of the tape via the bumps 3 to form a TCP, a portion such as a heat-resistant resin such as a transparent silicone resin is formed on a portion of the circuit structure of the semiconductor element which is to be opened for exposure or the like. 7 is formed into a plate shape so as to have a thickness equal to a thickness of a section to be sealed with a resin when a circuit configuration surface of the semiconductor element is a flat surface, and is adhered by, for example, an ultraviolet curing adhesive 8. Thereafter, resin sealing is performed by transfer molding in the same manner as in the first means. FIG.
By irradiating the adhesive 8 of the package after molding with ultraviolet rays as shown in FIG.
Peels off. With the above method, a package as shown in FIG. 2 is completed.

[0012]

According to the present invention, the volume occupied by the sealing resin 2 is smaller than that of the conventional TCP.
The volume of the sealing resin 2 can be suppressed to about 20%, and the weight and size of the TCP can be reduced. In addition, it is possible to make the elements having the function of receiving and emitting light, such as UVEPROM, CCD, optical semiconductor element, etc., which were difficult to transfer mold TCP in the past, into TCP. There is an effect that the package does not warp due to the difference. Also, as compared with the conventional manufacturing process, only the shape of the mold used in the transfer molding process is different, and there is an effect that the influence on the production process in implementing the present invention is very small. .

[Brief description of the drawings]

FIG. 1 is a sectional view of one embodiment based on the means 1 of the present invention.

FIG. 2 is a sectional view of an embodiment based on the means 2 of the present invention.

FIG. 3 is a cross-sectional view of a conventional TCP.

FIG. 4 is a sectional view showing a forming process of an embodiment based on the means 2 of the present invention.

FIG. 5 is a sectional view showing a forming process of an embodiment based on the means 2 of the present invention.

FIG. 6 is a sectional view showing a forming process of an embodiment based on the means 1 of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor element 2 Encapsulation resin 3 Bump 4 Inner lead 5 Carrier tape 6 Outer lead 7 Heat resistant resin 8 Ultraviolet curing type adhesive 9 Mold 10 Cavity

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Claims (5)

(57) [Claims] A step of connecting an electrode of a semiconductor element and an inner lead via a bump on the electrode; and a step of forming a non-resin forming area on a surface of the semiconductor element on which the electrode is formed. After the step of disposing a removable member after sealing; the step of resin-sealing only the active surface of the semiconductor element by transfer molding in a state where the removable member is disposed; and Removing the removable member. A method for manufacturing a semiconductor device, comprising: 2. The step of arranging the removable member using a light-transmitting resin as the removable member, wherein the light-transmitting resin is to be the non-resin forming region with an ultraviolet-curable adhesive member. 2. The method of manufacturing a semiconductor device according to claim 1, wherein in the removing step, the adhesive member is irradiated with ultraviolet light, and then the light transmitting resin is removed. 3. The method according to claim 2, wherein a heat-resistant resin is used for the removable member. 4. The method according to claim 3, wherein a silicon resin is used for the removable member. 5. A resin-sealing mold for sealing a semiconductor element, wherein a side surface of the cavity is formed such that a cavity of the mold has a gap of 10 μm or less from a side surface of the semiconductor element for sealing. A mold for resin encapsulation, comprising: