JP3028189B2 - Die bonding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding method for mounting an element or a semiconductor chip (hereinafter referred to as a die) from a wafer on a lead frame.

[0002]

2. Description of the Related Art A wafer composed of a set of semiconductor chips (hereinafter referred to as die) composed of elements or integrated circuits is
The product is inspected for pass / fail while being fixed to the carrier, and the mark described above is read to select only non-defective products and die-bonded to the lead frame.

In a die bonder, when bonding is performed using wafer mapping data, it is necessary to collate each wafer with the mapping data. Conventionally, a bar code label that matches the wafer ID number is attached to a wafer ring on which a wafer is placed for verification. For this purpose, a person checks the ID number of the wafer and prepares and applies a bar code label, or equips an automated wafer ID number recognition device and a bar code label attaching device. Barring on the wafer ring
The label is pasted. Further, the die bonder requires a bar code reader.

[0004]

As described above, in the conventional die bonding, a bar code label is prepared as a preparation and attached to a wafer ring, and a bar code label is read at the time of bonding. Therefore, the apparatus becomes large-scale, the equipment cost increases, and the workability is not good, and there is a problem in productivity.

According to the present invention, the cost of equipment can be reduced without the need for a bar code label sticking device or a reading device, and the die bonding that improves the workability by eliminating the need to create or stick a bar code label. Aim for the method.

[0006]

SUMMARY OF THE INVENTION The gist of the present invention is that
The control number indicated by c is picked up by a CCD camera, and an image pick-up signal from the camera is input to an image processing apparatus, and from among map data of individual wafers previously stored in the image processing apparatus. A search is made for map data that matches the input image signal, and the map data is transferred to a die bonder for die bonding.

[0007]

According to the present invention, the management number written on the wafer is bar-coded.
An image is directly picked up by a CCD camera without being directly attached to a code label, and the picked-up image signal is input to an image processing apparatus to match map data among map data of individual wafers stored in advance. Is searched, and the search map data is transferred to the die bonder for die bonding.
There is no need to create and attach a label and read a bar code label, thereby improving workability.

[0008]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described based on one embodiment with reference to the drawings. In the drawing, reference numeral 1 denotes a wafer, on which a management number, for example, an ID number (indicated by a triangle in FIG. 2) is written. The wafer 1 is attached to a wafer ring 2.

Reference numeral 3 denotes a wafer magazine.
A predetermined number of wafer carriers 4 each containing a wafer ring 2 with affixed thereon are stored and used for transport to a die bonder or the like.

Reference numeral 5 denotes a CCD camera for picking up an image of the control number written on the wafer 1.
The wafer magazine 3 is provided above the mounting device 6 of the wafer magazine 3 so as to capture an image from above the wafer 1 stored in the magazine. The placing device 6 described above is vertically movable.

An image signal from the CCD camera 5 is input to an image processing device 7. In the storage unit of the image processing device 7, map data of each wafer 1 is stored in advance.
The map data that matches the input image pickup signal is searched, and the map data is output to the die bonder controller 8 in this embodiment.

At the time of die bonding, the image of the carrier 4 of the wafer 1 is transferred by the pusher 9 to the transfer device 1.
0 on the XY table 1 via the transfer device 10.
Transferred to 1.

A predetermined die is taken out from the wafer carrier 4 mounted on the XY table 11 by a control signal from the die bonder control device 8 via a die pickup 12 and is transferred to a predetermined portion of a lead frame 13 which is sequentially conveyed. Mount and die bond. By repeating this, all the good dies in the wafer 1 are die-bonded to the lead frame 13.

In this embodiment, the image signal from the CCD camera 5 and the map data of the wafer 1 stored in the image processing device 7 which match each other are searched for, and the die bonder control device 8 The output is immediately performed and the die bonding is performed. However, the present invention is not limited to this. The search map data may be temporarily stored in a storage device and then transferred to a die bonder for die bonding.

[0015]

According to the present invention, as described above, the control number of the wafer is imaged as it is, and the map data corresponding to the image signal is obtained.
Since the data is retrieved from the map data of each wafer stored in advance and die-bonded, there is no need to create, attach, and read a conventional bar code label for wafer identification. Thus, there is an effect that the equipment can be omitted, the cost can be reduced, the productivity can be increased, and the work can be easily performed.

[Brief description of the drawings]

FIG. 1 is a diagram showing die bonding in one embodiment of the present invention.

FIG. 2 is a diagram showing a wafer according to one embodiment of the present invention.

FIG. 3 is a view showing a wafer ring with a wafer attached thereto in one embodiment of the present invention.

FIG. 4 is a diagram showing an image of a wafer captured by a CCD camera in one embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Wafer 2 Wafer ring 3 Wafer magazine 4 Wafer carrier 5 CCD camera 6 Magazine loading device 7 Image processing device 8 Die bonder control device 9 Pusher 10 Transport device 11 XY table 12 Die pickup device

Claims (1)

(57) [Claims] A control number given to a wafer is stored in a CCD.
An image is picked up by a camera, an image pickup signal from the camera is input to an image processing device, and the input image signal matches with the input image signal among map data of individual wafers previously stored in the image processing device. A die bonding method characterized by retrieving map data, transferring the map data to a die bonder, and performing die bonding.