JP3082741B2 - Solder ball mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball mounting method for mounting a solder ball for forming a bump on a work such as a substrate.

[0002]

2. Description of the Related Art As means for forming bumps (protruding electrodes) on electrodes of a work such as a substrate and a chip, there is known a method of mounting a solder ball on a work and then heating and melting and solidifying the solder ball. Generally, many bumps are formed on a work, and thus a large number of solder balls are mounted on the work. As a method for mounting a large number of solder balls at the same time, a method using a solder ball mounting apparatus using vacuum suction is known. This solder ball mounting device vacuum-adsorbs the solder balls to the suction holes of the head by lowering and ascending a head having a large number of suction holes on the lower surface above a container in which a large number of solder balls are stored. To pick up.

[0003]

However, in the conventional solder ball mounting method, the head descends to a level at which the lower surface thereof is slightly over the upper surface of the solder ball 3, and the head is vacuum-sucked. However, there is a problem that it is difficult to surely suck the solder ball into the suction hole in vacuum, and a pickup error is likely to occur.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a solder ball mounting method capable of reliably sucking and picking up a solder ball of a supply portion in all suction holes on a lower surface of a head.

[0005]

For this purpose, a method of mounting a solder ball according to the present invention comprises lowering and raising a head with respect to a solder ball provided in a supply portion, thereby forming a suction ball formed on a lower surface of the head. A solder ball mounting method in which the solder ball is vacuum-adsorbed and picked up in the hole, and then the head is moved above the work, and then lowered and raised again, so that the picked-up solder ball is mounted on the work. Picking up the solder ball by lowering the head until the lower surface of the head sinks below the upper surface of the solder ball in the supply unit, vacuum-sucking the solder ball into the suction hole, and then raising the head. I did it.

According to the above construction, the head is lowered until the lower surface of the head sinks below the upper surface of the solder ball to vacuum-suction the solder ball into the suction hole, and then the head is raised to ensure that the solder ball is lifted. Can be picked up by vacuum suction.

[0007]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention, and FIG. 2 is a side view of a head and a container during pickup of the solder ball. Hereinafter, a solder ball mounting apparatus for mounting a large number of solder balls on a work at once will be described.

Reference numeral 1 denotes a solder ball supply unit, which is configured as follows. Reference numeral 2 denotes a container in which solder balls 3 are stored. 4 is a column of the container 2. Container 2
A vibrator 5 is mounted on the lower surface of the. When the vibrator 5 is driven, the container 2 vibrates, and the solder balls 3 inside are fluidized.

Reference numeral 6 denotes a movable table as a positioning portion for the substrate, which positions the substrate 7. The position of the substrate 7 is adjusted by driving the movable table 6 to move the substrate 7 in the horizontal direction. 11 is a head,
It is held at the lower part of the lifting plate 12. Reference numeral 13 denotes a block provided with a vertical ball screw 22 and a motor 23 for rotating the ball screw 22. A nut 24 is coupled to the lifting plate 12, and the ball screw 22 is screwed into the nut 24. Therefore, when the motor 23 is driven forward and reverse to rotate the ball screw 22 forward and backward, the elevating plate 12 moves up and down along the ball screw 22 and the head 11 integrated therewith also moves up and down.

Reference numeral 14 denotes a horizontally long movable table, which is installed between the supply section 1 and the movable table 6. The moving table 14 is provided with a horizontal feed screw 15. The nut 16 provided on the back of the block 13 is a feed screw 1
5 is screwed. Therefore, when the motor 17 is driven and the feed screw 15 is rotated, the block 13 and the head 11 move laterally along the moving table 14. Reference numeral 18 denotes a vacuum device, which is a head 1 via a tube 19.
1 connected. Although not shown, a suction hole for the solder ball 3 is formed on the lower surface of the head 11, and the vacuum ball 18 drives the vacuum device 18 to vacuum-suck the solder ball 3 into the suction hole. Reference numeral 25 denotes a replenishing portion for the solder balls 3, and replenishes the container 2 with the solder balls 3 when the amount of the solder balls 3 in the container 2 becomes small.

This solder ball mounting device is configured as described above, and the operation will be described next. The motor 11 is driven to move the head 11 above the container 2. Next, the motor 23 is driven to move the head 11 to a level lower than the level of the solder balls 3 supplied into the container 2 by the supply unit 25, that is, the level of the upper surface of the solder balls 3 shown in FIG. At this time, the solder ball 3 in the container 2 is caused to flow by driving the vibrator 5 to vibrate the container 2.

If the head 11 is sunk below the upper surface of the solder ball 3 as described above, the solder ball 3 can be more reliably vacuum-sucked into the suction hole 21. Next, motor 2
The solder ball 3 is picked up by driving the head 3 in reverse to raise the head 11. Next, the motor 17 is driven to move the head 11 above the substrate 10. Next, the head 11 is lowered, and the solder balls 3 on the lower surface thereof are
Then, the vacuum suction state of the solder ball 3 by the vacuum device 18 is released. Then head 1
When 1 is raised, the solder balls 3 fall from the suction holes and are mounted on the substrate 10. Next, the head 11 moves above the container 2, and the above-described operation is repeated.

[0013]

As described above, according to the present invention, by lowering the head until the lower surface of the head sinks below the upper surface of the solder ball, the solder ball can be reliably sucked by the suction hole of the head.

[Brief description of the drawings]

FIG. 1 is a side view of a solder ball mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of a head and a container during picking up a solder ball according to an embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Supply part of solder ball 3 Solder ball 6 Movable table 7 Substrate 11 Head 14 Moving table 21 Suction hole

Claims (1)

(57) [Claims] 1. A head is lowered and raised with respect to a solder ball provided in a supply unit, so that the solder ball is vacuum-sucked into a suction hole formed in a lower surface of the head and picked up. A method of mounting a solder ball, wherein the solder ball is moved to an upper part of the work and then lowered and raised again, so that the picked-up solder ball is mounted on the work. A method of mounting a solder ball, comprising: lowering a head until it sinks below a level, vacuum sucking a solder ball into the suction hole, and picking up the solder ball by raising the head.