JP3068734B2 - Electronic components - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component having a built-in electronic component element having an end electrode, such as a chip coil element.

[0002]

2. Description of the Related Art A conventional example of this kind of electronic component will be described with reference to FIGS.

An electronic component lead frame 60 shown in FIGS. 15 and 16 has a pair of external connections for connecting a later-described drum-shaped electronic component element 51 having an end electrode such as a chip-shaped coil element to a printed board or the like. Terminals 52a and 52b are provided.

The external connection terminals 52a and 52b are connected to a bottom plate portion 57 which forms connection surfaces 53a and 53b with a printed circuit board or the like.
a, 57b, electrode receiving pieces 58a, 58b protruding from inner ends of the bottom plate portions 57a, 57b, and the bottom plate portion 5
7a and 57b are provided with four positioning pieces 59a and 59b projecting from both sides of each.

[0005] As shown in FIGS. 15 and 16, the positions of the bottom plates 57 a and 57 b indicated by dotted lines are bent,
Each of the electrode receiving pieces 58a and 58b is projected obliquely upward from the vertical direction, and each of the positioning pieces 59a and 59b is bent horizontally at a predetermined height, and in this state, as shown in FIG. The element 51 is supported.

The electronic component 50 shown in FIGS.
Each of the positioning pieces 59a, 5 is attached to both sides of a drum-shaped electronic component element 51 having an end electrode such as a chip-shaped coil element.
9b, each electrode receiving piece 58a, 58b is brought into contact with each end electrode of the electronic component element 51 and soldered. Further, the electronic component element 51 and a pair of external connection terminals 52a, 52b are provided. Connection surface (lower surface) 5
The region excluding 3a and 53b is covered with an insulating sheath 54 made of insulating synthetic resin, and the projecting ends of the bottom plates 57a and 57b from the insulating sheath 54 are bent vertically upward.

[0007]

However, in the case of the electronic component 50 constructed using the above-described lead frame 60 for an electronic component, the positioning piece protruded upward from the bottom plate portions 57a and 57b and bent horizontally. 59a, 5
9b, the core 55 is positioned, and the lowermost portion of the outer periphery of the core 55 is located considerably above the bottom plate portions 57a, 57b. As a result, it is difficult to reduce the height of the electronic component 50. There's a problem.

The electrode receiving pieces 58a and 58b are projected upward from the opposite ends of the bottom plate portions 57a and 57b, and the positioning pieces 59a and 59b are connected to the bottom plate portion 57a.
The core 55 of the electronic component 50 is dimensioned in the length direction because the core 55 of the electronic component 50 is projected upward from the opposite ends of the a and 57b and the positioning pieces 59a and 59b and the electrode receiving pieces 58a and 58b. And it is difficult to reduce the size of the entire electronic component 50.

Further, electrode receiving pieces 58a, 58b and positioning pieces 59a, 59b are provided inside the bottom plate portions 57a, 57b.
In the case where the size of the insulating outer body 54 is reduced, the area of the connection surfaces 53a and 53b is necessarily reduced to a small area as shown in FIG. 19, and as a result, soldering to a printed board or the like is required. Connection becomes difficult.

Accordingly, the present invention provides an electronic device which can improve the structure, reduce the overall size such as a reduction in height and the size in the length direction, and does not hinder connection to a printed circuit board or the like. The purpose is to provide parts.

[0011]

According to the present invention, there is provided an electronic component comprising a drum-shaped electronic component element having a pair of end electrodes, and a lead frame having an external connection terminal. A pair of external connection terminals on which the electronic component elements are mounted are formed at intervals, and a plurality of side positioning pieces for positioning the side portions of the electronic component elements stand on both sides of the pair of external connection terminals. And
Of the plurality of side positioning pieces, the front ends of the opposing positioning pieces on one side are each bent in the horizontal direction and protruded, and an electrode receiving piece provided with spring properties is integrally provided. The side of the electronic component element is positioned between the side positioning pieces, and both ends of the electronic component element are sandwiched between the pair of electrode receiving pieces provided with the spring property. It becomes.

[0012]

According to the electronic component having the above-described structure, since the outer peripheral surface of the electronic component element is disposed in direct contact with the inner surface of the external connection terminal, the height of the electronic component can be reduced.

[0013] In addition, a pair of positioning pieces provided on both sides of the external connection terminal are used to position both sides of the drum-like electronic component element, and one of the positioning pieces is provided with an elasticity to protrude the electrode receiving piece. Is connected to the end electrode of the electronic component element, so that the electronic component element can be reliably supported on the external connection terminal, and furthermore, the electronic component element is arranged so as to overlap the external connection terminal. It is possible to cope with a reduction in the size in the direction, and it is possible to sufficiently secure the exposed area of the external connection terminal even when the size of the insulating sheath is reduced.

[0014]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail.

The electronic component 1 shown in FIGS. 1 to 4 is disposed so as to face a drum-shaped electronic component element 2 having an end electrode such as a chip-shaped coil element so as to be in contact with a lower portion of the electronic component element 2. While supporting the electronic component element 2,
A pair of external connection terminals 3, 3 having connection surfaces 3a, 3a for connection to a printed circuit board or the like;
3. A total of four positioning pieces 4a, 4b are provided for positioning both sides of the electronic component element 2 provided on both sides of the electronic component element 2.
And one of the positioning pieces 4a, 4a of the external connection terminals 3, 3.
And a pair of electrode receiving pieces 5a, 5a,
5a, and an insulating sheath 6 made of an insulating synthetic resin that covers a region of the electronic component element 2 and the pair of external connection terminals 3, 3 excluding the connection surfaces 3a, 3a.

The electronic component element 2 includes a drum-shaped core 7.
And a coil 8 wound around the core 7.
1, 2 and 4, reference numeral 3b denotes a projecting bent piece of the external connection terminal 3, 3.

Next, a method of manufacturing the electronic component 1 will be described with reference to FIGS.

First, as shown in FIGS. 5, 6, and 7, a pair of external connection terminals 3, 3 and a pair of positioning pieces 4a, 4
b, a lead frame 10 is prepared in which a plurality of electrode receiving pieces 5a, 5a are opposed to each other and a plurality of electrode receiving pieces 5a are formed.

Next, as shown in FIGS. 8 and 9, the pair of electrode receiving pieces 5a, 5a are formed by forming to occupy positions above the positioning pieces 4a, 4a.
As shown in FIG. 10, each of the positioning pieces 4a and 4b is bent at a right angle along the electronic component element 2.

Further, as shown in FIG. 11, each of the positioning pieces 4a and 4b is bent, and each of the positioning pieces 4b and 4b is bent at a right angle along the electronic component element 2, thereby forming a pair of electrode receiving members. The pieces 5a, 5a are arranged above the external connection terminals 3, 3 in a parallel arrangement orthogonal to the respective positioning pieces 4a, 4b.

In this state, as shown in FIGS. 12 to 14, the electronic component element 2 is placed on the pair of external connection terminals 3 and 3.
At this time, the pair of electrode receiving pieces 5a and 5
a is pushed outward by utilizing its elasticity (springiness), and the inner surfaces of the pair of electrode receiving pieces 5a, 5a are brought into contact with the end electrodes of the electronic component element 2, and the soldering process is performed in this state. And connected to the end electrodes.

A region excluding the connection surfaces 3a, 3a of the electronic component element 2 and the pair of external connection terminals 3, 3 is covered in a rectangular parallelepiped shape by an insulating sheath 6 made of insulating synthetic resin. By cutting the portions protruding from the insulating casings 3 and 3 to form the protruding bent pieces 3b,
The electronic component 1 shown in FIGS. 1 to 4 can be obtained.

According to the electronic component 1 having the above-described configuration, the outer peripheral surface of the electronic component element 2 is disposed in direct contact with the external connection terminals 3 and 3 exposed on the end surface of the insulating sheath 6, so that the electronic component 1 can be provided as compared with the conventional example. The height can be reduced, and the height of the electronic component 1 can be reduced.

The positioning of both sides of the electronic component element 2 is performed by positioning pieces 4a and 4b provided on both sides of the external connection terminals 3 and 3, respectively, and one of the positioning pieces 4a and 4a is positioned.
Are connected to each end electrode of the electronic component element 2 by using the elasticity (springiness) of the opposing electrode receiving pieces 5a, 5a projecting from each other, so that the drum-shaped electronic component element 2 can be positioned. In addition, the electronic component element 2 can be reliably supported on the inner surfaces of the external connection terminals 3 and 3 exposed on the end surface of the insulating exterior body 6, thereby reducing the size of the electronic component 1 in the length direction. In addition to the above, the exposed area of the external connection terminals 3 and 3 can be sufficiently ensured even when the insulating sheath 6 is downsized, and a good connection state with a printed circuit board or the like can be obtained.

The present invention is not limited to the embodiment described above, and various modifications are possible within the scope of the invention.

[0026]

According to the present invention described in detail above, since the above-described structure is employed, the positioning can be reliably performed, and the overall size can be reduced, such as a reduction in height and a reduction in length. In addition, it is possible to provide an electronic component that does not hinder connection to a printed circuit board or the like.

[Brief description of the drawings]

FIG. 1 is a plan view showing an electronic component according to an embodiment in a partially transparent state.

FIG. 2 is a front view showing the electronic component of the embodiment in a partially transparent state;

FIG. 3 is a side view showing the electronic component of the embodiment in a partially transparent state;

FIG. 4 is a bottom view showing the electronic component of the embodiment in a partially transparent state;

FIG. 5 is a plan view of a lead frame used for the electronic component of the embodiment.

FIG. 6 is a partially enlarged view of a lead frame used for the electronic component of the present embodiment.

FIG. 7 is a view showing a forming process of a lead frame of an electronic component according to the present embodiment.

FIG. 8 is a view showing a forming process of a lead frame of an electronic component according to the present embodiment.

FIG. 9 is a view showing a forming process of a lead frame of an electronic component according to the present embodiment.

FIG. 10 is a view showing a forming process of a lead frame of an electronic component according to the present embodiment.

FIG. 11 is a view showing a forming process of a lead frame of an electronic component according to the present embodiment.

FIG. 12 is a plan view showing a manufacturing process of the electronic component according to the embodiment.

FIG. 13 is a front view showing a manufacturing process of the electronic component of the embodiment.

FIG. 14 is a partially cutaway side view showing a manufacturing process of the electronic component of the present embodiment.

FIG. 15 is a plan view showing a conventional lead frame for electronic components.

FIG. 16 is a side view showing a conventional lead frame for electronic components.

FIG. 17 is a front view showing a conventional electronic component in a partially transparent state;

FIG. 18 is a side view showing a conventional electronic component in a partially transparent state.

FIG. 19 is a bottom view of a conventional electronic component.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Electronic component 2 Electronic component element 3, 3 External connection terminal 4a, 4b Positioning piece 5a, 5a Electrode receiving piece 6 Insulation armor

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Claims (1)

(57) [Claims] 1. An electronic component comprising a drum-shaped electronic component element having a pair of end electrodes and a lead frame having an external connection terminal, wherein the lead frame has a pair of electronic component elements mounted thereon. Are formed at intervals, and a plurality of side positioning pieces for positioning the side of the electronic component element are respectively erected on both sides of the pair of external connection terminals. Of the pieces, the tips of the opposing positioning pieces on one side are each bent in the horizontal direction and protruded, and an electrode receiving piece provided with a spring property is integrally provided, A side portion of the electronic component element is positioned between the positioning parts, and both end portions of the electronic component element are sandwiched between the pair of electrode receiving pieces provided with the spring property. Electronics .