JP3059461U - Ultra small molded coil - Google Patents
Ultra small molded coilInfo
- Publication number
- JP3059461U JP3059461U JP1998009449U JP944998U JP3059461U JP 3059461 U JP3059461 U JP 3059461U JP 1998009449 U JP1998009449 U JP 1998009449U JP 944998 U JP944998 U JP 944998U JP 3059461 U JP3059461 U JP 3059461U
- Authority
- JP
- Japan
- Prior art keywords
- coil
- short
- ultra
- solder
- cylindrical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
(57)【要約】
【課題】自動組込み装置の組込みアームへの吸着性及び
プリント配線基板への実装性をよくし、振動等で回転し
ないようにして、半田端子を接地面だけの極短い先端部
のみ極短半田端子2としても的確に半田付けできるよう
にするとともに、コンデンサ浮遊容量を低減し、Qを向
上させ、かつ、回転防止のための脚を無用にし、また、
スプリングバックによる形態の変形をなくして、高精度
にて容易に製作できるようにする。
【解決手段】絶縁被覆導電線材11を螺旋状に巻いた円筒
形のコイル1を、プレス成形により角筒形、扁平筒形又
はトンネル形に形成し、かつ、コイル端の接地面に相当
するだけの極短い先端部に、絶縁被覆を剥いで半田メッ
キ21を施した極短半田端子2を設けた。
(57) [Summary] [Problem] To improve the attraction to an assembling arm of an automatic assembling device and the mountability to a printed wiring board, to prevent rotation due to vibration, etc., and to make a solder terminal a very short tip of only a ground plane. Only the part can be accurately soldered as the ultra-short solder terminal 2, and the stray capacitance of the capacitor is reduced, Q is improved, and legs for preventing rotation are made unnecessary.
Eliminates deformation of the form due to springback, and enables easy production with high precision. A cylindrical coil (1) formed by spirally winding an insulated conductive wire (11) is formed into a rectangular tube, flat tube, or tunnel shape by press molding, and only corresponds to the ground plane at the coil end. The ultra-short solder terminal 2 provided with the insulating coating was peeled off and subjected to solder plating 21 at the very short end of the.
Description
【0001】[0001]
本考案は、筒状の超小型成形コイルに係るものである。 The present invention relates to a cylindrical microminiature formed coil.
【0002】[0002]
プリント配線基板への表面実装タイプの電子部品は、急速な勢いで小型化、超 小型化が進んでおり、コイルについても例外ではなく、最近の空芯コイルでは、 表面に絶縁皮膜を施した導電細線を螺旋状に巻いて外径約0.65mm、長さ約1.25mm 程度の円筒形に形成した超小型のものも出現している。この超小型コイルは、円 筒形であることから、コイルとしては方向性がなく、超小型ではあっても比較的 生産し易いものである。 この超小型コイルのプリント配線基板への実装に当たっては、他の各種電子部 品と同様、自動組込み装置にリールにて装着させるエンボステープの適宜収納部 に個別に収容して、該エンボステープの繰り出しと同期的に作動する同装置の組 込みアームにより、その先端に真空吸着させて取り出してはプリント配線基板へ と実装している。 The size and ultra-miniaturization of surface-mounted electronic components on printed wiring boards are rapidly progressing, and coils are no exception.Recently, air-core coils have conductive coating with an insulating coating on the surface. Ultra-small ones in which a thin wire is spirally wound into a cylindrical shape with an outer diameter of about 0.65 mm and a length of about 1.25 mm have also appeared. Since this microminiature coil has a cylindrical shape, it has no directionality as a coil and is relatively easy to produce even though it is microminiature. When mounting the microminiature coil on a printed wiring board, like other various electronic components, it is individually housed in an appropriate storage section of an embossed tape to be mounted on a reel in an automatic assembly device, and the embossed tape is fed out. With the built-in arm of the device, which operates synchronously with the device, it is vacuum-adsorbed to the tip of the device, taken out, and mounted on a printed circuit board.
【0003】[0003]
しかし、この円筒形の超小型コイルには、次のような問題点がある。 超小型でしかも円筒形のコイルでは上述の組込みアームへの吸着性が悪く、 実装性が悪い。 円筒形であることから、エンボステープの収納部内でも振動等により回転す るため、コイル端部の半田端子を接地面だけの極短い先端部のみとすることが できず、1回転を許容する1巻分を半田端子として確保なければならない。 このように半田端子が長くなると、コンデンサ浮遊容量が増大し、Qが悪く なる。 一方、エンボステープの収納部内で振動等により回転しないようにしようと すれば、脚を出す必要があり、その加工が困難で、コスト高となる。また、脚 を設けることで、上記収納部への収容も困難となる。 回転しないよう角筒形等にすることも考えられるが、空芯コイルにおいて、 角形等の芯材に線材を巻いた後、その芯材を引き抜いたのでは、スプリングバ ックでコイルがねじれてしまい、適正な角筒形等に形成することができず、生 産が困難である。 本考案は、これらの問題点を解決しようとするものである。 However, this cylindrical micro coil has the following problems. An ultra-small and cylindrical coil has poor adsorbability to the above-mentioned built-in arm and poor mountability. Since it is cylindrical, it rotates even in the embossed tape storage section due to vibrations, etc., so the solder terminal at the coil end cannot be made only a very short tip, which is only the ground plane. The winding must be secured as a solder terminal. As described above, when the solder terminal is long, the stray capacitance of the capacitor is increased, and the Q is deteriorated. On the other hand, if it is attempted to prevent the embossed tape from rotating due to vibrations or the like in the storage portion, it is necessary to extend the legs, which makes the processing difficult and increases the cost. In addition, the provision of the legs makes it difficult to store in the storage section. It is conceivable to use a square tube shape or the like to prevent rotation.However, in the case of an air-core coil, if the wire is wound around a square or other core material and then pulled out, the coil will be twisted by the spring back. As a result, it cannot be formed into an appropriate square tube or the like, which makes production difficult. The present invention seeks to solve these problems.
【0004】[0004]
上記目的達成のため、請求項1の角筒形の超小型成形コイルに係る考案は、絶 縁被覆導電細線11を螺旋状に巻いた円筒形のコイル1を、プレス成形により角筒 形に形成し、かつ、コイル端の接地面に相当するだけの極短い先端部に、絶縁被 覆を剥いで半田メッキ21を施した極短半田端子2を設けて成る。 In order to achieve the above-mentioned object, the invention of a square-shaped ultra-small shaped coil according to claim 1 is to form a cylindrical coil 1 in which an insulating coated conductive wire 11 is spirally wound into a square-tube shape by press forming. At the very short end corresponding to the ground plane at the coil end, an ultra-short solder terminal 2 having an insulating coating removed and plated with solder 21 is provided.
【0005】 請求項2の扁平筒形の超小型成形コイルに係る考案は、絶縁被覆導電細線11を 螺旋状に巻いた円筒形のコイル1を、プレス成形により扁平筒形に形成し、かつ 、コイル端の接地面に相当するだけの極短い先端部に、絶縁被覆を剥いで半田メ ッキ21を施した極短半田端子2を設けて成る。[0005] A flat cylindrical microminiature shaped coil according to a second aspect of the present invention is to form a cylindrical coil 1 in which an insulated conductive thin wire 11 is spirally wound into a flat cylindrical shape by press molding, and An extremely short solder terminal 2 provided with a solder jack 21 by stripping an insulating coating is provided at an extremely short tip portion corresponding to the ground plane of the coil end.
【0006】 また、請求項3のトンネル形の超小型成形コイルに係る考案は、絶縁被覆導電 細線11を螺旋状に巻いた円筒形のコイル1を、プレス成形によりトンネル形に形 成し、かつ、コイル端の接地面に相当するだけの極短い先端部に、絶縁被覆を剥 いで半田メッキ21を施した極短半田端子2を設けて成る。A third aspect of the present invention relates to a tunnel-shaped microminiature shaped coil, in which a cylindrical coil 1 in which an insulated conductive wire 11 is spirally wound is formed into a tunnel shape by press molding, and An ultra-short solder terminal 2 provided with a very short end corresponding to the ground plane at the coil end and having been subjected to solder plating 21 by stripping an insulating coating.
【0007】[0007]
その1. 図1、図2は、請求項1の考案についての角筒形にした空芯の超小型成形コイ ルに係る実施の形態を示している。 この超小型成形コイルは、表面に絶縁皮膜12を施した導電細線11である線径0. 11mm程度の絶縁被覆銅線(エナメル線:2種PEW等)を螺旋状に巻いて、外径 約0.65mm、長さ約1.25mm程度の円筒形の空芯の超小型コイル1を形成し、該円筒 形のコイルを更にプレス成形により幅約0.6mm 程度、長さ約1.25mm程度の角筒形 の超小型コイル1に形成し、また、該コイルの両端の接地面に相当するだけの極 短い先端部に、絶縁皮膜12を剥いで半田メッキ21を施した極短半田端子2を設け ている。 Part 1. FIG. 1 and FIG. 2 show an embodiment relating to a square cylindrical air core microminiature molding coil according to the invention of claim 1. This microminiature shaped coil is formed by spirally winding an insulated copper wire (enameled wire: 2 types of PEW, etc.) having a wire diameter of about 0.11 mm, which is a conductive fine wire 11 having an insulating film 12 on the surface, and having an outer diameter of about 0.11 mm. A cylindrical air core microminiature coil 1 of about 0.65 mm in length and about 1.25 mm in length is formed, and the cylindrical coil is further press-formed to form a square tube having a width of about 0.6 mm and a length of about 1.25 mm. And an ultra-short solder terminal 2 formed by peeling the insulating film 12 and applying a solder plating 21 to an extremely short tip portion corresponding to the ground plane at both ends of the coil. .
【0008】 この超小型成形コイルの製作は、まず、表面に絶縁皮膜12を施した所定長さの 導電細線11たる上記絶縁被覆銅線を、極短半田端子を設ける両端において、その 絶縁皮膜12を剥離させて半田メッキ21を施し、そして、図7(1) に示すように、 丸細棒の芯材Aに巻き付けて、外径約0.65mm程度の円筒形の空芯の超小型コイル 1を作製する。こうして成形した円筒形の空芯の超小型コイル1は、芯材Aを引 き抜いた時点で一定のスプリングバックを生じるが、円筒形は維持する。 次いで、図7(2) に示すように、その円筒形の空芯のコイル1内に角細棒の芯 材Bを挿入し、これの外側に、双方にV溝を形成した角筒用の一対のプレス型C ,Cを押し当てて、角筒形の空芯のコイル1にプレス成形する。このプレス成形 でもスプリングバックを生じるが、極僅かであり、また、ねじれるようなことは ないので、角筒形を維持する。このとき、当初に半田メッキ21を施した絶縁被覆 銅線の両端がコイル両端の極短半田端子2となる。In order to manufacture the micro compact coil, first, the above-mentioned insulated copper wire, which is a conductive wire 11 having a predetermined length with an insulative film 12 formed on the surface thereof, is placed on both ends where an extremely short solder terminal is provided. Is peeled off, solder plating 21 is applied, and as shown in FIG. 7 (1), it is wound around a core material A of a round and thin rod to form a cylindrical air-core microminiature coil having an outer diameter of about 0.65 mm. Is prepared. The cylindrical air core microminiature coil 1 formed in this way generates a certain springback when the core material A is pulled out, but maintains the cylindrical shape. Next, as shown in FIG. 7 (2), a core material B of a square rod is inserted into the cylindrical air-core coil 1 and a V-groove is formed on both sides of the core material B on the outside thereof. A pair of press dies C 1 and C 2 are pressed against each other to press-form the coil 1 having a rectangular cylindrical air core. This press forming also causes springback, but it is very slight and does not twist, so it maintains a square cylindrical shape. At this time, both ends of the insulated copper wire that has been initially plated with solder 21 become the extremely short solder terminals 2 at both ends of the coil.
【0009】 作製した角筒形の超小型成形コイルは、電子部品の一つとして、上述の自動組 込み装置において、リールにて装着させるエンボステープの適宜収納部に個別に かつ一定の方向及び姿勢にて収容して、該エンボステープの繰り出しと同期的に 作動する組込みアームにより、その先端に真空吸着させて取り出してはプリント 配線基板へと実装する。[0009] The manufactured rectangular cylindrical microminiature coil is used as one of the electronic components in the above-mentioned automatic assembling apparatus individually and in a predetermined direction and posture in an appropriate storage portion of an embossed tape to be mounted on a reel. Then, the embossed tape is vacuum-adsorbed to the tip of the embossed tape by a built-in arm that operates in synchronization with the feeding of the embossed tape, taken out, and mounted on a printed wiring board.
【0010】 その2. 図3、図4は、請求項2の考案についての扁平筒形にした空芯の超小型成形コ イルに係る実施の形態を示している。 この超小型コイル1は、図1、図2の超小型コイル1において、幅を0.6mm 以 上にして扁平筒形に形成している。他は、図1、図2の場合と同じである。[0010] 2. 3 and 4 show an embodiment relating to a flat cylindrical air core microminiature molding coil according to the invention of claim 2. FIG. This micro coil 1 is formed into a flat cylindrical shape with a width of 0.6 mm or more in the micro coil 1 of FIGS. Others are the same as those in FIGS. 1 and 2.
【0011】 この超小型コイル1の製作についても、扁平棒の芯材と扁平筒用のプレス型を 用いる点を除けば、図7の場合と同様であり、また、電子部品の一つとしてプリ ント配線基板の要所へ表面実装することも、図1、図2の場合と同様であるから 、説明を省略する。The manufacture of the micro coil 1 is the same as that of FIG. 7 except that a core material of a flat bar and a press die for a flat cylinder are used. 1 and FIG. 2 is also the same as that of FIG. 1 and FIG.
【0012】 その3. 図5、図6は、請求項3の考案についてのトンネル形にした空芯の超小型コイ ルに係る実施の形態を示している。 この超小型コイル1も、トンネル形にする点を除けば、図1、図2の超小型コ イル1と同じであり、その製作についても、トンネル形に対応した芯材とプレス 型を用いる点を除けば、図7の場合と同様である。また、電子部品の一つとして プリント配線基板の要所へ表面実装することも、図1、図2の場合と同様である から、ここでも説明を省略する。Part 3. 5 and 6 show an embodiment relating to a tunnel-shaped air core microminiature coil according to the invention of claim 3. This microminiature coil 1 is the same as the microminiature coil 1 shown in FIGS. 1 and 2 except that it is formed in a tunnel shape. Are the same as those in FIG. In addition, surface mounting of the electronic component on a principal part of the printed wiring board as one of the electronic components is the same as in the case of FIGS.
【0013】 なお、以上の実施の形態では、空芯の超小型コイル1を対象としたが、フェラ イトやセラミックなどを装入してもよい。In the above embodiment, the air-core microminiature coil 1 is used, but ferrite, ceramic, or the like may be inserted.
【0014】[0014]
本考案によれば、次の効果を奏する。 円筒形ではなく、角筒形、扁平筒形、トンネル形の超小型コイル1としたか ら、自動組込み装置の組込みアームへの吸着性がよく、プリント配線基板への 実装性がよい。 円筒形ではなく、角筒形、扁平筒形又はトンネル形の超小型コイル1とした から、自動組込み装置に用いるエンボステープの収納部に収容しても該収納部 内で振動等により回転するようなことはなく、したがって、その収納部内では 実装のための一定の方向及び姿勢を維持確保できるので、コイル端の半田端子 を接地面だけの極短い先端部のみの極短半田端子2としても的確に半田付けで きる。 そのようにして半田端子を接地面だけの極短い先端部のみ極短半田端子2と することができて、1巻きの長さにまで長くする必要がないから、コンデンサ 浮遊容量を低減でき、Qを向上させることができる。 エンボステープの収納部内での回転を防止するために脚を出す必要がなく、 したがって、加工が困難になることもコスト高になることもなく、収納部への 収容が困難になることもない。 円筒形のコイルをプレス成形にて角筒形、扁平筒形又はトンネル形に形成す るので、スプリングバックにより形態が変形することなく、高精度にて容易に 製作できる。 According to the present invention, the following effects can be obtained. Since the coil 1 is not a cylinder but a rectangular cylinder, a flat cylinder, or a tunnel, it has good adsorbability to the built-in arm of the automatic mounting device and good mountability to the printed wiring board. Since the coil is not a cylinder but a rectangular cylinder, flat cylinder or tunnel-shaped microminiature coil 1, even if it is stored in the storage section of the embossed tape used in the automatic assembling device, it will rotate in the storage section due to vibration or the like. Therefore, a fixed direction and orientation for mounting can be maintained and secured in the housing. Therefore, the solder terminal at the coil end can be used as an ultra-short solder terminal 2 having only a very short tip only of the ground plane. It can be soldered to. In this way, the solder terminal can be used as the ultra-short solder terminal 2 only at the very short tip of the ground plane only, and it is not necessary to extend the length to one turn. Can be improved. There is no need to extend the legs in order to prevent the embossed tape from rotating in the storage section. Therefore, there is no difficulty in processing, increase in cost, and storage in the storage section. Since the cylindrical coil is formed into a rectangular tube, a flat tube, or a tunnel by press molding, it can be easily manufactured with high accuracy without deformation due to springback.
【図1】 請求項1の考案についての実施の形態その
1.を示す正面図である。FIG. 1 is a diagram showing an embodiment of the invention of claim 1; FIG.
【図2】 同側面図である。FIG. 2 is a side view of the same.
【図3】 請求項2の考案についての実施の形態その
2.を示す正面図である。FIG. 3 is an embodiment of the invention of claim 2; FIG.
【図4】 同側面図である。FIG. 4 is a side view of the same.
【図5】 請求項3の考案についての実施の形態その
3.を示す正面図である。FIG. 5 is a diagram showing a third embodiment of the present invention; FIG.
【図6】 同側面図である。FIG. 6 is a side view of the same.
【図7】 請求項1の考案についての実施の形態その
1.に係る作製要領を示す説明図である。FIG. 7 is an embodiment of the invention of claim 1; FIG. 4 is an explanatory view showing a manufacturing procedure according to the first embodiment.
1…コイル 2…極短半田端子 11…導電細線 12…絶縁皮膜 21…半田メッキ A…丸細棒の芯材 B…角細棒の芯材 C…プレス型 DESCRIPTION OF SYMBOLS 1 ... Coil 2 ... Very short solder terminal 11 ... Conductive thin wire 12 ... Insulating film 21 ... Solder plating A ... Core material of round thin rod B ... Core material of square thin rod C ... Press type
Claims (3)
筒形の超小型コイル1を、プレス成形により角筒形に形
成し、かつ、コイル端の接地面に相当するだけの極短い
先端部に、絶縁被覆を剥いで半田メッキ21を施した極短
半田端子2を設けて成る角筒形の超小型成形コイル。1. A cylindrical microminiature coil 1 formed by spirally winding an insulated conductive thin wire 11 is formed into a rectangular cylindrical shape by press molding, and has a very short end corresponding to a ground surface at the coil end. An ultra-small rectangular tube-shaped coil formed by providing an ultra-short solder terminal 2 in which the insulating coating is stripped and solder plated 21 is provided.
筒形の超小型コイル1を、プレス成形により扁平筒形に
形成し、かつ、コイル端の接地面に相当するだけの極短
い先端部に、絶縁被覆を剥いで半田メッキ21を施した極
短半田端子2を設けて成る扁平筒形の超小型成形コイ
ル。2. A cylindrical microminiature coil 1 in which an insulated conductive thin wire 11 is spirally wound, is formed into a flat cylindrical shape by press molding, and has a very short tip corresponding to a ground surface at the coil end. A flat cylindrical microminiature formed coil having an extremely short solder terminal 2 provided with a solder plating 21 by stripping an insulating coating on a portion thereof.
筒形の超小型コイル1を、プレス成形によりトンネル形
に形成し、かつ、コイル端の接地面に相当するだけの極
短い先端部に、絶縁被覆を剥いで半田メッキ21を施した
極短半田端子2を設けて成るトンネル形の超小型成形コ
イル。3. A cylindrical microminiature coil 1 in which an insulated conductive wire 11 is spirally wound, is formed into a tunnel shape by press molding, and has a very short end portion corresponding to a ground surface at the coil end. And a tunnel-shaped ultra-small molded coil comprising an ultra-short solder terminal 2 having an insulating coating removed and plated with solder 21.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP1998009449U JP3059461U (en) | 1998-11-30 | 1998-11-30 | Ultra small molded coil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1998009449U JP3059461U (en) | 1998-11-30 | 1998-11-30 | Ultra small molded coil |
Publications (1)
Publication Number | Publication Date |
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JP3059461U true JP3059461U (en) | 1999-07-09 |
Family
ID=43193318
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JP1998009449U Expired - Fee Related JP3059461U (en) | 1998-11-30 | 1998-11-30 | Ultra small molded coil |
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JP (1) | JP3059461U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002052589A1 (en) * | 2000-12-25 | 2002-07-04 | Hitachi, Ltd | Semiconductor device, and method and apparatus for manufacturing semiconductor device |
WO2005024946A1 (en) * | 2003-09-04 | 2005-03-17 | Renesas Technology Corp. | Semiconductor device and method for manufacturing same |
-
1998
- 1998-11-30 JP JP1998009449U patent/JP3059461U/en not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002052589A1 (en) * | 2000-12-25 | 2002-07-04 | Hitachi, Ltd | Semiconductor device, and method and apparatus for manufacturing semiconductor device |
WO2002052588A1 (en) * | 2000-12-25 | 2002-07-04 | Hitachi, Ltd. | Semiconductor device, and method and apparatus for manufacturing semiconductor device |
JPWO2002052589A1 (en) * | 2000-12-25 | 2004-04-30 | 株式会社日立製作所 | Semiconductor device, method of manufacturing the same, and semiconductor manufacturing apparatus |
WO2005024946A1 (en) * | 2003-09-04 | 2005-03-17 | Renesas Technology Corp. | Semiconductor device and method for manufacturing same |
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