JP2917629B2 - Bypass circuit - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bypass circuit, and more particularly to a bypass circuit for a high frequency signal when a hybrid integrated circuit is mounted at high density.

[0002]

2. Description of the Related Art Conventionally, as a bypass circuit used for a power supply system terminal of a hybrid integrated circuit, a metal case 1 shown in FIG.
There is a case where a bypass chip capacitor 14 is provided in 1 and a case where a bypass capacitor 15 is provided outside the metal case shown in FIG. 4 and 5, 1
1 is a metal case, 12 is an input / output terminal, 13 is a power supply terminal, 14 is an internal bypass chip capacitor, 15
Is a bypass capacitor.

[0003]

In the above-described conventional bypass circuit of a hybrid integrated circuit, when a bypass chip capacitor is mounted inside a metal case, the main circuit of the hybrid integrated circuit is usually a large part of the metal case 11. Therefore, a large-capacity chip capacitor cannot be used, and the bypass effect in a low frequency region is significantly reduced. In addition, when the size of the main circuit is large, a chip capacitor cannot be mounted in the metal case 11 in some cases. On the other hand, when a bypass capacitor is mounted outside the metal case 11, one lead wire of the individual capacitor is attached to a terminal portion of the metal case, and the other is attached to a ground lug or the like. With such a structure, the lead wire of the capacitor becomes long, and the bypass has a large external shape due to the lead inductance and occupies a space for mounting. Therefore, there is a disadvantage that the hybrid integrated circuit cannot be mounted at a high density.

[0004]

SUMMARY OF THE INVENTION A bypass circuit according to the present invention comprises a hybrid integrated circuit body in which a monolithic circuit or a chip-shaped individual semiconductor and an internal bypass circuit portion are mounted in a metal case, and the hybrid circuit is provided at one end of a laminated circuit board. A mounting hole corresponding to the terminal arrangement of the integrated circuit body and a power supply terminal are provided, a grounding conductor is provided at the other end, and a multilayer chip capacitor is mounted between the power supply terminal and the grounding conductor. The power supply system terminal and the terminal of the hybrid integrated circuit are connected through a contact between the grounding conductor of the multilayer circuit board and the metal case for mounting the hybrid integrated circuit body on the bottom surface of the hybrid integrated circuit body. One or both ends of a resilient metal piece inserted for extension are extended and grounded by solder or the like.

[0005]

Next, the present invention will be described with reference to the drawings. FIG. 1 is a circuit diagram of a hybrid integrated circuit and a bypass circuit according to an embodiment of the present invention. 2A and 2B are structural views of the present embodiment. FIG. 2A is a plan view, and FIG. 2B is a side view.
1 and 2, 1 is a metal case, 1A is a hybrid integrated circuit main body, 2 is an internal bypass circuit portion mounted in the hybrid integrated circuit, and 3 is provided on both ends of a power supply system terminal of the hybrid integrated circuit main body. The laminated circuit board, 4 is a laminated chip capacitor mounted on the laminated circuit board, 5 is a resilient metal piece, 6 is an input / output terminal, 7 is a power supply terminal, 8 is a fixing screw, and 9 is provided on the laminated circuit board. Mounting hole. FIG. 2 (a), (b)
As can be seen from the figure, a mounting hole 9 corresponding to the arrangement of the power supply terminals 7 of the hybrid integrated circuit main body 1A and a conductor including the mounting hole 9 are provided at one end of the laminated circuit board 3, and the other end for grounding is provided. The conductors 5A are provided, and the multilayer chip capacitor 4 is mounted between the conductors. At this time, the grounding conductor 5A may be expanded to the back side of the laminated circuit board by a conduction hole or a side contact. The power supply system terminal 7 of the hybrid integrated circuit body 1A is fixed to the mounting hole 9 of the laminated circuit board by soldering or the like. on the other hand,
When the hybrid integrated circuit body 1A is attached to the metal case 1 with the fixing screw 8, the bottom of the hybrid integrated circuit is
The spring metal 5 is inserted so as to make good contact. At this time, one or both of the spring metal pieces 5 are extended in the direction of the input / output terminal 6 of the hybrid integrated circuit, and the tip is fixed to the grounding conductor 5A of the laminated circuit board 3 by soldering or the like and grounded. . With such a structure, unnecessary wave components appearing at the power supply system terminal 7 are grounded via the multilayer chip capacitor 4 at the shortest. Since the distance from the power supply system terminal 7 to the grounding location is short, it is possible to prevent a reduction in the bypass effect due to the lead inductance. By determining the optimum capacitance of the multilayer chip capacitor by the frequency component to be bypassed, a good bypass effect can be obtained according to the level of the frequency. Further, in this bypass circuit, a chip capacitor can be attached to the power supply system terminal 7 of the hybrid integrated circuit body 1A, so that the hybrid integrated circuit can be mounted at a high density.

[0006]

As described above, the present invention provides a laminated circuit board and a laminated chip having a mounting hole and a conductor corresponding to the terminal arrangement of a hybrid integrated circuit at one end and a grounding conductor at the other end. By attaching a capacitor and extending one or both ends of the springy metal piece and connecting it to the grounding conductor of the laminated circuit board, a bypass circuit with low lead inductance is possible even at high frequencies and high-density mounting There is also an effect that can be.

[Brief description of the drawings]

FIG. 1 is a circuit diagram showing one embodiment of the present invention.

FIGS. 2A and 2B are a plan view and a side view, respectively, showing the structure of this embodiment.

FIG. 3 is a conventional bypass circuit.

FIG. 4 is another type of conventional bypass circuit.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 11 Metal case 1A Hybrid integrated circuit main body 2 Internal bypass circuit part 3 Multilayer circuit board 4 Multilayer chip capacitor 5 Spring metal piece 5A Grounding conductor 6, 12 Input / output terminal 7, 13 Power supply terminal 8 Fixing screw 9 Mounting Hole 11 Metal case 11A Hybrid integrated circuit 14 Chip capacitor 15 Capacitor

Claims (2)

(57) [Claims] 1. A hybrid integrated circuit body in which a monolithic circuit or a chip-shaped individual semiconductor and an internal bypass circuit section are mounted in a metal case, and mounting corresponding to a terminal arrangement of the hybrid integrated circuit body on one end of a laminated circuit board. A hole and a power supply terminal are provided, a grounding conductor is provided at the other end, a multilayer chip capacitor is mounted between the power supply terminal and the grounding conductor, and the power supply terminal is mixed with the power supply terminal through a mounting hole of the multilayer circuit board. A resilient metal which is connected to a terminal of an integrated circuit and which is inserted to improve the contact between a grounding conductor of the laminated circuit board and a metal case for mounting the hybrid integrated circuit body on the bottom surface of the hybrid integrated circuit body. A bypass circuit characterized in that one end or both ends of a piece are extended and grounded by solder or the like. 2. The multi-layer circuit board according to claim 1, wherein a grounding conductor provided on the chip capacitor mounting surface of the multi-layer circuit board is also enlarged on the back surface of the multi-layer circuit board by a conduction hole or a side contact. Bypass circuit.