JP2911351B2 - Structure of semiconductor chip for driving in thermal print head - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip for driving a thermal print head which is used to selectively heat any of a plurality of heating dots in a heating resistor line. It is related to the structure of.

[0002]

2. Description of the Related Art Conventionally, thermal print heads are disclosed, for example, in Japanese Patent Application Laid-Open Nos.
4 and 5, a driving semiconductor chip 2 is mounted on the upper surface of the head substrate 1, and a heating resistor (not shown) is mounted on the upper surface of the head substrate 1. Each output terminal portion 4 at one end of each of the plurality of individual electrode patterns 3 to each heating dot in the body line
To one side surface 2 ′ of the driving semiconductor chip 2.
And input terminals 6 at one end of the power supply and various signal circuit patterns 5.
The drive semiconductor chips 2 are formed in a row along the other side surface 2 ″.

A narrow space is formed between each of the output terminal portions 4 and each of a plurality of output pad portions 2a formed in a row at a portion on one side surface 2 'of the upper surface of the semiconductor chip 2. While being electrically connected by wire bonding with a metal wire 7, each of the input terminal portions 6 and a plurality of each of the input terminal portions 6 formed in a row on the other side surface 2 ″ side of the upper surface of the semiconductor chip 2 are formed. The input pad 2b is electrically connected to the input pad 2b by wire bonding with a thin metal wire 8.

As shown in FIG. 6, a terminal portion B formed on an upper surface of a head substrate A and a pad portion D on an upper surface of a semiconductor chip C mounted on the upper surface of the head substrate A are provided.
When wire bonding is performed with the metal wire E, the metal wire A is inserted to prevent the middle of the metal wire E from approaching or coming into contact with the corner of the semiconductor chip C. When the metal wire A is joined to the pad portion D by lowering the capillary tool F toward the pad portion D on the upper surface of the semiconductor chip C, the capillary tool F is moved upward and the terminal portion B is moved as it is. While moving upward without moving in the direction of the terminal portion, once move an appropriate distance L in the direction opposite to the terminal portion B, and then move in the direction of the terminal portion B, and then connect the metal wire A to the terminal portion. A wire bonding method of bonding to B is adopted.

[0005]

However, in the semiconductor chip 2 of the conventional thermal print head, each output pad portion 2a on the upper surface of the semiconductor chip 2 and each input pad portion 2b in the input pad portion row are connected. In the case where the wire bonding method shown in FIG. 6 is applied to the wire bonding to the semiconductor chip 2, the output pad portions including the respective output pad portions 2 a are provided. When the capillary tool F is moved by an appropriate distance L in the opposite direction to the spacing dimension W1 'between the row and the input pad section row including the input pad sections 2b, the capillary tool F is already wire-bonded. Must be large so that it does not touch the metal wire that is
The width W 'of the semiconductor chip 2 must be increased. As a result, in manufacturing the semiconductor chip 2, the number of semiconductor chips that can be manufactured simultaneously from one semiconductor wafer is reduced by an increase in the width dimension W 'of the semiconductor chip 2, so that the number of semiconductor chips can be reduced. This increases the manufacturing cost and, consequently, the price of the thermal printhead using this semiconductor chip.In addition, the increase in the width of the semiconductor chip increases the weight and size of the thermal printhead. There was a problem of inviting.

An object of the present invention is to solve this problem.

[0007]

In order to achieve this technical object, the present invention provides a method of manufacturing a semiconductor device comprising the steps of: providing an upper surface of a head substrate with one side of a driving semiconductor chip mounted on the upper surface; Output terminals for individual electrode patterns from each heating dot in the heating resistor line on the upper surface are formed in a row along one side surface of the semiconductor chip, and power is supplied to a portion on the other side surface side of the semiconductor chip. An input terminal portion for a circuit pattern for various signals is formed in a row along the other side surface of the semiconductor chip, and further, each of the output terminal portions and one side surface side of the upper surface of the semiconductor chip. Between the plurality of output pad portions formed in a row at the site, and the input terminal portions, and the other one of the upper surfaces of the semiconductor chips. "The thermal print head in which a plurality of input pad portions formed in a row on the side surface side are connected by wire bonding with a metal wire." For the output pad row near this,
Each input pad section in the input pad section row is shifted so as to be located between each output pad section in the output pad section row. ".

[0008]

With this configuration, a line connecting the center of each input pad in the input pad row and the center of each output pad in the output pad row near the input pad row is formed by the input pad section. Since the row is inclined with respect to the row and the output pad section row, the distance between them is set such that each input pad section in the input pad section row is placed right next to each output pad in the output pad section row as in the conventional case. It can be made larger than in the case of being located at the site of the above.

As a result, when the wire bonding method as shown in FIG. 6 is applied to the wire bonding to each of the output pad portions and the input pad portions, the capillary tool is connected to each input pad in the input pad portion row. The distance between the unit and each output pad unit in the output pad unit row can be increased from the metal wire already wire-bonded, in other words, the metal wire that has already been wire-bonded to the capillary tool. Can be made larger so that the distance between the input pad section row and the output pad section row can be reduced by that much. The width dimension can be reduced as compared with the conventional case.

[0010]

As described above, according to the present invention, the width of the semiconductor chip for driving the thermal print head can be reduced, so that the number of semiconductor chips that can be manufactured simultaneously from one semiconductor wafer increases. The manufacturing cost can be reduced, and the price of the thermal print head can be reduced, and the size and weight of the thermal print head can be reduced.

[0011]

Embodiments of the present invention will be described below with reference to the drawings. 1 and 2 show a first embodiment. In this figure, reference numeral 11 denotes a head substrate.
A semiconductor chip 12 for driving is mounted on the upper surface of 1.

One end of each of a plurality of individual electrode patterns 13 for each heating dot in a heating resistor line (not shown) is provided in a region of the upper surface of the head substrate 11 on one side surface 12c of the semiconductor chip 12. Are formed so as to be arranged in a row along one side surface 12c of the semiconductor chip 12. Furthermore, the other side surface 12d of the semiconductor chip 12 in the upper surface of the head substrate 11
In the area on the side, each input terminal portion 16 at one end of power supply and various signal circuit patterns 15 is provided with the semiconductor chip 1
2 are formed so as to be arranged in a row along the other side surface 12d.

Each of the output terminals 14 and the semiconductor chip 1
A plurality of output pad portions 12a formed in a line on the one side surface 12c side of the upper surface of the two are electrically connected to each other by wire bonding with a thin metal wire 17. A plurality of input pad portions 1 formed in a row on each of the input terminal portions 16 and a portion of the upper surface of the semiconductor chip 12 on the other side surface 12d side.
2b is also electrically connected by wire bonding with a thin metal wire 18.

Each output terminal section 14 and each output pad section 1
The wire bonding method shown in FIG. 6 is employed for the wire bonding between the input terminals 2a and the input terminal portions 16 and the input pad portions 12b. Then, an input pad section row including each input pad section 12b on the upper surface of the semiconductor chip 12 is compared with an output pad section row including each output pad section 12a on the upper surface of the semiconductor chip 12 in the input pad section row. Each input pad section 12b
Are output pad sections 12a in the output pad section row.
It is configured to be displaced so as to be located between them.

With this configuration, a line 19 connecting the center of each input pad section 12b in the input pad row and the center of each output pad section 12a in the output pad row is
Since the input pad section row and the output pad section row are inclined with respect to each other, the distance W2 between the input pad section row and the input pad section row in the input pad section row, as in the conventional case, is set in the output pad section row. It can be made larger than when it is located just beside each output pad.

As a result, when the wire bonding method as shown in FIG. 6 is applied to the wire bonding to each of the output pad portions 12a and the input pad portions 12b, the capillary tool is connected to each of the input pad portion rows. As the distance W2 between the input pad section 12b and each output pad section 12a in the output pad section row increases, it can be separated from the metal wire that has already been wire-bonded. Since it is possible to increase the margin for preventing the metal wire from being in contact with the metal wire, the distance W1 between the input pad section row and the output pad section row can be reduced accordingly. Since the width W of the semiconductor chip 12 can be
The size can be reduced as compared with the conventional case.

FIG. 3 shows a second embodiment. In the second embodiment, a plurality of output pads 12a 'on the upper surface of a semiconductor chip 12' are arranged in a staggered manner along two rows. In this case, a plurality of input pads 12a 'are provided. The input pad section row including the pad section 12b 'is shifted from the output pad section row on the side closer to the input pad section row among the two output pad section rows, whereby Similarly, the width W of the semiconductor chip 12 'can be reduced.

[Brief description of the drawings]

FIG. 1 is a plan view showing a first embodiment of the present invention.

FIG. 2 is a sectional view taken along line II-II of FIG.

FIG. 3 is a plan view showing a second embodiment of the present invention.

FIG. 4 is a plan view showing a conventional example.

FIG. 5 is a sectional view taken along line VV of FIG. 4;

FIG. 6 is a diagram illustrating wire bonding using a metal wire.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Head board 12 Semiconductor chip 12a, 12a 'Output pad part 12b, 12b' Input pad part 13 Individual electrode pattern 14 Output terminal part 15 Power supply and various signal circuit patterns 16 Input terminal part 17, 18 Metal wire

Claims (1)

(57) [Claims] An output for each individual electrode pattern from each heating dot on a heating resistor line on an upper surface of a head substrate is provided on one side surface of a driving semiconductor chip mounted on the upper surface of the head substrate. The terminal portion is formed in a row along one side surface of the semiconductor chip, and an input terminal portion for a circuit pattern for power supply and various signals is provided at a portion on the other side surface of the semiconductor chip on the other side of the semiconductor chip. Are formed in a row along the side surface of the semiconductor chip, and further, each of the output terminal portions and a plurality of output pad portions formed in a row at a portion on one side surface of the upper surface of the semiconductor chip. while,
And connecting the input terminal portions with a plurality of input pad portions formed in a row on the other side surface portion of the upper surface of the semiconductor chip by wire bonding with a metal wire. In the thermal print head, the input pad section row on the upper surface of the semiconductor chip is connected to the output pad section row close thereto, and each input pad section in the input pad section row is connected to each output in the output pad section row. A structure of a driving semiconductor chip in a thermal print head, wherein the structure is shifted so as to be located between pad portions.