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JP2910779B2 - Flexible printed circuit board - Google Patents

Flexible printed circuit board

Info

Publication number
JP2910779B2
JP2910779B2 JP2176897A JP17689790A JP2910779B2 JP 2910779 B2 JP2910779 B2 JP 2910779B2 JP 2176897 A JP2176897 A JP 2176897A JP 17689790 A JP17689790 A JP 17689790A JP 2910779 B2 JP2910779 B2 JP 2910779B2
Authority
JP
Japan
Prior art keywords
flexible printed
printed circuit
circuit board
insulating material
polyimide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2176897A
Other languages
Japanese (ja)
Other versions
JPH0463486A (en
Inventor
仁志 野尻
好史 岡田
広作 永野
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kanegafuchi Chemical Industry Co Ltd
Original Assignee
Kanegafuchi Chemical Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kanegafuchi Chemical Industry Co Ltd filed Critical Kanegafuchi Chemical Industry Co Ltd
Priority to JP2176897A priority Critical patent/JP2910779B2/en
Publication of JPH0463486A publication Critical patent/JPH0463486A/en
Application granted granted Critical
Publication of JP2910779B2 publication Critical patent/JP2910779B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
  • Paints Or Removers (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
  • Organic Insulating Materials (AREA)

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、優れた機械的物性と寸法安定性及び耐湿性
を有するフレキシブルプリント基板に関する。
Description: TECHNICAL FIELD The present invention relates to a flexible printed circuit board having excellent mechanical properties, dimensional stability and moisture resistance.

〔従来の技術〕[Conventional technology]

従来、フレキシブルプリント基板は、一般にパターニ
ング後、エッチング乾燥処理工程において寸法に変化を
生じるため、回路設計の際、以後の工程の寸法変化をあ
らかじめ考慮し設計する必要があった。この寸法の変化
量は、フレキシブルプリント基板のパターンの種類によ
って異なり、このためフレキシブルプリント基板の製造
工程は複雑化しており、更には製品の歩どまりを低下さ
せる大きな要因となっている。
Conventionally, a flexible printed circuit board generally undergoes a change in dimensions in an etching and drying process after patterning, and therefore it has been necessary to design a circuit in consideration of the dimensional change in subsequent steps in advance when designing a circuit. The amount of the change in dimension differs depending on the type of the pattern of the flexible printed circuit board, which complicates the manufacturing process of the flexible printed circuit board, and is a major factor in lowering the product yield.

この寸法変化を改良すべく、各種の試みが行われてい
る。例えば特開昭60−243120号公報に記載の方法では、
絶縁材の熱膨張係数を低下させることには成功している
ものの、同時に該絶縁材の可撓性が失われ、その結果、
該絶縁材は非常に脆弱となり、フレキシブルプリント基
板特有のフレキシビリティや耐折り曲げ強度が劣化する
ため、この種の改良は実用に供されるに至っていない。
Various attempts have been made to improve this dimensional change. For example, in the method described in JP-A-60-243120,
Although successfully reducing the coefficient of thermal expansion of the insulation, it also loses the flexibility of the insulation at the same time,
The insulating material becomes very brittle, and the flexibility and the bending resistance characteristic of the flexible printed circuit board deteriorate, so that this kind of improvement has not been put to practical use.

このような問題に応えるべく、特開昭64−19789号公
報には、フレキシビリティを損なうことなく寸法安定性
を改良したフレキシブルプリント基板が示されている。
しかし、この場合、絶縁材はピロメリット系のポリイミ
ドが用いられており、そのため、吸湿・吸水性の点で問
題があった。吸湿・吸水性が高いと、フレキシブルプリ
ント基板の製造工程において、吸湿・吸水による寸法変
化が大きい、吸水に伴いイオン性不純物をとりこむ可能
性がある、等の問題が生じる。
In order to respond to such a problem, Japanese Patent Application Laid-Open No. 19789/1979 discloses a flexible printed circuit board having improved dimensional stability without impairing flexibility.
However, in this case, as the insulating material, pyromellitic polyimide is used, and therefore, there is a problem in terms of moisture absorption and water absorption. If the moisture absorption / water absorption is high, problems such as a large dimensional change due to moisture absorption / water absorption and a possibility of taking in ionic impurities due to the water absorption occur in the manufacturing process of the flexible printed circuit board.

〔発明が解決しようとする問題点〕[Problems to be solved by the invention]

本発明は、前述のごとくパターニング後エッチング乾
燥に至る工程での寸法変化が大きく、また吸水に伴い電
気的信頼性に問題のあった従来のフレキシブルプリント
基板の欠点を、フレキシビリティを大きく損なうことな
く改良するものである。
The present invention, as described above, the dimensional change in the process leading to etching and drying after patterning is large, and the disadvantage of the conventional flexible printed circuit board that had a problem in electrical reliability due to water absorption, without significantly impairing flexibility It is an improvement.

〔問題点を解決するための手段〕[Means for solving the problem]

即ち、本発明は少なくとも導体と絶縁材とを包含する
フレキシブルプリント基板において、絶縁材が下記一般
(I) (式中、Rは4価の酸無水物残基、xは自然数を表
す。) で表わされる構造単位を有するポリイミドからなること
を特徴とするフレキシブルプリント基板を内容とする。
That is, the present invention relates to a flexible printed circuit board including at least a conductor and an insulating material, wherein the insulating material is the following general (I): (Wherein, R represents a tetravalent acid anhydride residue, and x represents a natural number.) A flexible printed circuit board comprising a polyimide having a structural unit represented by the following formula:

本発明によるフレキシブルプリント基板は、良好な寸
法安定性と、フレキシビリティ及び耐湿性を兼ね備えた
ものである。
The flexible printed board according to the present invention has both good dimensional stability, flexibility and moisture resistance.

上記のフレキシブルプリント基板は、絶縁層と導体と
の間に接着剤を介して貼り合わされたもの、あるいは、
絶縁層にスパッタや蒸着により導体層を形成させたも
の、及びこれらにパターニング、エッチング処理等を施
されたものをいい、該接着剤は通常のフレキシブルプリ
ント基板の製造に用いられる接着剤を用いることが可能
である。
The above-mentioned flexible printed circuit board is bonded with an adhesive between an insulating layer and a conductor, or
This refers to a conductor layer formed on the insulating layer by sputtering or vapor deposition, or a conductor layer that has been subjected to patterning, etching, or the like, and the adhesive used is an adhesive used in the manufacture of ordinary flexible printed circuit boards. Is possible.

本発明に用いられる導体とは、銅、鉄、アルミニウム
等の金属、あるいは金属箔に代表されるものであるが、
導電性と加工性のバランスから、銅を用いるのが好まし
い。
The conductor used in the present invention is copper, iron, a metal such as aluminum, or a metal foil,
It is preferable to use copper from the balance between conductivity and workability.

本発明に用いられる絶縁材は、下記一般式(I) (式中、Rは4価の酸無水物残基、xは自然数を表
す。) で表わされる構造単位を有するポリイミドからなり、x
は1〜10が好ましい。Xが10より大きいと第二酸無水物
の添加効果が充分発揮されない傾向がある。また、特に
Rが のものが低線膨張係数を実現するために好適である。上
記ポリイミドとその他の構造を有するポリイミドとの共
重合物あるいはブレンド物も使用可能である。また、こ
の絶縁材には、各種の有機の添加剤、無機のフィラー
類、あるいは各種の強化材を複合することも可能であ
る。
The insulating material used in the present invention has the following general formula (I) (In the formula, R is a tetravalent acid anhydride residue, and x represents a natural number.) A polyimide having a structural unit represented by the following formula:
Is preferably 1 to 10. When X is larger than 10, the effect of adding the second acid anhydride tends to be insufficient. In particular, R Are suitable for realizing a low coefficient of linear expansion. Copolymers or blends of the above polyimides and polyimides having other structures can also be used. In addition, various organic additives, inorganic fillers, or various reinforcing materials can be combined with the insulating material.

ポリイミド絶縁材は、その前駆体であるポリアミド酸
溶液より得られるが、本発明のポリアミド酸は以下に示
すような方法で合成することが出来る。即ち、例えばパ
ラフェニレンジアミンを有機極性溶媒中に溶解し、3,
3′,4,4′−ジフェニルスルフォンテトラカルボン酸二
無水物をパラフェニレンジアミンに対して過小モル量添
加し、充分反応させた後に続いて第二番目の酸無水物成
分を酸無水物の総モル量がパラフェニレンジアミンのモ
ル量とほぼ同量になるように添加し充分反応させて得ら
れる。
The polyimide insulating material is obtained from a polyamic acid solution which is a precursor thereof, and the polyamic acid of the present invention can be synthesized by the following method. That is, for example, dissolving paraphenylenediamine in an organic polar solvent,
Add 3 ', 4,4'-diphenylsulfonetetracarboxylic dianhydride to paraphenylenediamine in a small molar amount and allow it to react sufficiently, and then add the second acid anhydride component to the total amount of acid anhydride. It is obtained by adding and reacting sufficiently so that the molar amount becomes substantially the same as the molar amount of paraphenylenediamine.

該ポリアミド酸溶液の生成反応に使用される第二番目
の酸無水物成分は、3,3′,4,4′−ジフェニルスルフォ
ンテトラカルボン酸二無水物よりも反応性が高いものを
用いるのが好ましい。例えば3,3′,4,4′−ベンゾフェ
ノンテトラカルボン酸二無水物、3,3′,4,4′−ビフェ
ニルテトラカルボン酸二無水物、ピロメリット酸二無水
物、4,4′−オキシジフタル酸二無水物等を用いること
が出来るが、前記した如く、低線膨張係数を実現するた
めにはポリメリット酸二無水物を用いることが望まし
い。
As the second acid anhydride component used in the reaction for producing the polyamic acid solution, one having higher reactivity than 3,3 ', 4,4'-diphenylsulfonetetracarboxylic dianhydride is preferably used. preferable. For example, 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, 3,3', 4,4'-biphenyltetracarboxylic dianhydride, pyromellitic dianhydride, 4,4'-oxydiphthal An acid dianhydride or the like can be used, but as described above, it is desirable to use a polymellitic dianhydride to realize a low linear expansion coefficient.

上記のように、第二番目の酸無水物成分を用いること
によって、反応性の低い3,3′,4,4′−ジフェニルスル
フォンテトラカルボン酸二無水物の欠点を補い、より高
分子量のポリアミド酸を得ることができ、これをポリイ
ミドとした時に高い機械物性を実現することが出来る。
また上記に示した様に、二種の酸無水物を段階的に加え
ることによって、上記一般式(I)で示したような構造
の特殊なブロック共重合体が得られるが、このような構
造はランダム共重合体よりも高い機械物性を有する。
As described above, the use of the second acid anhydride component compensates for the disadvantage of the low-reactivity 3,3 ', 4,4'-diphenylsulfonetetracarboxylic dianhydride and increases the molecular weight of the polyamide. An acid can be obtained, and high mechanical properties can be realized when the acid is used as a polyimide.
As shown above, a special block copolymer having the structure represented by the general formula (I) can be obtained by adding two kinds of acid anhydrides in a stepwise manner. Has higher mechanical properties than the random copolymer.

二種の酸無水物の共重合比は、3,3′,4,4′−ベンゾ
フェノンテトラカルボン酸二無水物と第二番目の酸無水
物成分のモル比を1:1〜100:1、より好ましくは2:1〜10:
1の間で設定するのが望ましい。この範囲よりも3,3′4,
4′−ベンゾフェノンテトラカルボン酸二無水物の比率
が大きいと、高い高分子量を得るのが困難になり、ま
た、これより3,3′,4,4′−ベンゾフェノンテトラカル
ボン酸二無水物の比率が小さいと、耐湿性の改良効果が
充分ではなくなる。
The copolymerization ratio of the two acid anhydrides is 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride and the molar ratio of the second acid anhydride component is 1: 1 to 100: 1, More preferably 2: 1 to 10:
It is desirable to set between 1. 3,3′4,
If the ratio of 4'-benzophenonetetracarboxylic dianhydride is large, it becomes difficult to obtain a high molecular weight, and from this, the ratio of 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride Is small, the effect of improving the moisture resistance is not sufficient.

該ポリアミド酸溶液の生成反応に使用される有機極性
溶媒としては、例えばジメチルスルフォキシド、ジエチ
ルスルフォキシド等のスルフォキシド系溶媒、N,N−ジ
メチルホルムアミド、N,N−ジエチルホルムアミド等の
ホルムアミド系溶媒、N,N−ジメチルアセトアミド、N,N
−ジエチルアセトアミド等のアセトアミド系溶媒、N−
メチル−2−ピロリドン等のピロリドン系溶媒、フェノ
ール、o−、m−、又はp−クレゾール、キシレノー
ル、ハロゲン化フェノール、カテコール等のフェノール
系溶媒、あるいはヘキサメチレンフォスフォルアミド、
γ−ブチロラクトン、1,4−ジオキサン、テトラヒドロ
フラン等を挙げることができ、これらを単独又は混合物
として用いるのが望ましいが、更にはキシレン、トルエ
ンのような芳香族炭化水素の使用も可能である。
Examples of the organic polar solvent used in the reaction for producing the polyamic acid solution include sulphoxide solvents such as dimethylsulfoxide and diethylsulfoxide, and formamide solvents such as N, N-dimethylformamide and N, N-diethylformamide. Solvent, N, N-dimethylacetamide, N, N
-Acetamide solvents such as diethylacetamide, N-
A pyrrolidone-based solvent such as methyl-2-pyrrolidone, a phenol-based solvent such as phenol, o-, m-, or p-cresol, xylenol, a halogenated phenol, or catechol, or hexamethylenephosphoramide;
γ-butyrolactone, 1,4-dioxane, tetrahydrofuran and the like can be mentioned, and it is desirable to use these alone or as a mixture, but it is also possible to use aromatic hydrocarbons such as xylene and toluene.

また、このポリアミド酸溶液は各々前記の有機極性溶
媒中に5〜40重量%、好ましくは10〜30重量%溶解され
ているが、取扱いの面からも望ましい。
The polyamic acid solution is dissolved in the above-mentioned organic polar solvent in an amount of 5 to 40% by weight, preferably 10 to 30% by weight.

次いで、このポリアミド溶液からポリイミドからなる
有機絶縁膜を製造する方法については、従来公知の方法
を用いることができる。即ち、i)熱的にポリイミドに
転化する、ii)脱水剤及び触媒を用いて化学的にポリイ
ミドに転化する方法等が採用される。ここでいう脱水剤
としては、例えば無水酢酸等の脂肪族酸無水物、フタル
酸無水物等の芳香族酸無水物等が挙げられる。また触媒
としては、例えばトリエチルアミン等の脂肪族三級アミ
ン類、N,N−ジメチルアニリン等の芳香族第三級アミン
類、ピリジン、ピコリン、イソキノリン、キノリン等の
複素環式第三級アミン類等が挙げられる。
Next, as a method of manufacturing an organic insulating film made of polyimide from the polyamide solution, a conventionally known method can be used. That is, i) a method of thermally converting to polyimide, ii) a method of chemically converting to polyimide using a dehydrating agent and a catalyst, and the like are employed. Examples of the dehydrating agent used herein include aliphatic acid anhydrides such as acetic anhydride, and aromatic acid anhydrides such as phthalic anhydride. Examples of the catalyst include aliphatic tertiary amines such as triethylamine, aromatic tertiary amines such as N, N-dimethylaniline, and heterocyclic tertiary amines such as pyridine, picoline, isoquinoline, and quinoline. Is mentioned.

絶縁材の厚さは7〜125μmが好ましい。 The thickness of the insulating material is preferably 7 to 125 μm.

本発明のフレキシブルプリント基板は上記の絶縁材に
導体を積層することによって得られる。代表例を以下に
説明するが、この方法に限定されるものではないことは
勿論である。
The flexible printed circuit board of the present invention is obtained by laminating a conductor on the above-mentioned insulating material. Representative examples will be described below, but it is needless to say that the present invention is not limited to this method.

まず絶縁材に接着剤を塗布し、乾燥後約10〜70μmの
銅などの金属箔を加圧下で熱ラミネートし、所定のポス
トキュアを行ない、フレキシブル基板を得ることができ
る。更に金属箔に所望の回路をパターニングし、次にエ
ッチング、水洗乾燥工程を経た後、パターン化されたフ
レキシブル基板を得ることができる。接着剤としてはエ
ポキシ/ナイロン系接着剤など通常フレキシブル基板の
製造に用いられる接着剤を使用することができる。
First, an adhesive is applied to an insulating material, and after drying, a metal foil of about 10 to 70 μm, such as copper, is heat-laminated under pressure, and a predetermined post-curing is performed to obtain a flexible substrate. Further, after a desired circuit is patterned on the metal foil and then subjected to etching, washing and drying steps, a patterned flexible substrate can be obtained. As the adhesive, an adhesive usually used for manufacturing a flexible substrate, such as an epoxy / nylon adhesive, can be used.

尚、本発明で言うフレキシブルプリント基板の寸法変
化とは、上述のパターニング後からフレキシブルプリン
ト基板に至る過程での寸法変化を指すものである。
The dimensional change of the flexible printed board according to the present invention refers to a dimensional change in a process from the above-mentioned patterning to the flexible printed board.

〔実施例〕〔Example〕

以下、実施例及び比較例により本発明を更に具体的に
説明するが、本発明はこれらにより何ら制限を受けるも
のではない。
Hereinafter, the present invention will be described more specifically with reference to Examples and Comparative Examples, but the present invention is not limited thereto.

尚、以下の記載において、DSDAは3,3′,4,4′−ジフ
ェニルスルフォンテトラカルボン酸二無水物、を、p−
PDAはパラフェニレンジアミンを、PMDAはピロメリット
酸二無水物を、BTDAは3,3′,4,4′−ベンゾフェノンテ
トラカルボン酸二無水物を、ODAは4,4′−ジアミノジフ
ェニルエーテルを、DMAcはジメチルアセトアミドを表
す。
In the following description, DSDA refers to 3,3 ′, 4,4′-diphenylsulfonetetracarboxylic dianhydride as p-
PDA is paraphenylenediamine, PMDA is pyromellitic dianhydride, BTDA is 3,3 ', 4,4'-benzophenonetetracarboxylic dianhydride, ODA is 4,4'-diaminodiphenyl ether, DMAc Represents dimethylacetamide.

実施例1 DMAc中にp−PDAを溶解し、p−PDAに対して80モル%
のDSDAを添加し、約1時間撹拌した後、続いてp−PDA
に対して約20%のPMDAを添加し、更に30分撹拌して15重
量%のポリアミド酸溶液を得た。このポリアミド酸溶液
をガラス板上に流延塗布し、約100℃にて約60分間乾燥
した後、生成したポリアミド酸塗膜をガラス板より剥
し、これを支持枠に固定した。その後、約100℃で約30
分間、続いて約200℃で約60分間、続いて約300℃で約60
分間加熱し、脱水閉環、乾燥した後、上記支持枠より取
り外し、約20μmの厚みを有するポリイミド絶縁材を得
た。この絶縁材の線膨張係数は1.3×10-5/℃であった。
また、この絶縁材の吸水率は約0.3%であった。
Example 1 p-PDA was dissolved in DMAc and 80 mol% based on p-PDA
Was added and stirred for about 1 hour, followed by p-PDA
About 20% of PMDA was added thereto, and the mixture was further stirred for 30 minutes to obtain a 15% by weight polyamic acid solution. This polyamic acid solution was applied on a glass plate by casting and dried at about 100 ° C. for about 60 minutes, and then the resulting polyamic acid coating film was peeled off from the glass plate and fixed to a support frame. Then at about 100 ° C for about 30
For about 60 minutes at about 200 ° C, followed by about 60 minutes at about 300 ° C.
After heating for minutes, dehydration ring closure and drying, the substrate was removed from the support frame to obtain a polyimide insulating material having a thickness of about 20 μm. The linear expansion coefficient of this insulating material was 1.3 × 10 −5 / ° C.
The water absorption of this insulating material was about 0.3%.

次に、この絶縁材にナイロン・エポキシ系の接着剤を
塗布乾燥した後、銅箔を加圧熱ラミネートし、これにポ
ストキュアを施した後、フレキシブル銅張板を得た。
Next, after applying a nylon-epoxy adhesive to this insulating material and drying it, a copper foil was laminated under pressure and heat, and this was post-cured to obtain a flexible copper-clad board.

続いて、このフレキシブル銅張板の絶縁材上にA、B
の二点を刻印し、このAB間の長さを測定し、これをL0
した。
Then, A, B on the insulating material of this flexible copper clad board
Were marked, and the length between AB was measured, and this was defined as L0 .

更に、常法に従い、このフレキシブル銅張板にパター
ニングを行ない、続いてエッチング水洗乾燥処理を施
し、フレキシブルプリント基板を得た。
Further, this flexible copper-clad board was patterned according to a conventional method, and subsequently subjected to etching, washing, and drying processes to obtain a flexible printed circuit board.

このフレキシブルプリント基板において上記のAB間距
離を測定し、これをL1とした。
The distance between the above-mentioned AB were measured in the flexible printed circuit board, which was used as L 1.

以下の計算式を用い、寸法変化率を計算した。 The dimensional change rate was calculated using the following formula.

この結果、フレキシブルプリント基板の寸法変化率は
0.1%であった。また、得られたフレキシブルプリント
基板の耐折回数は1700回であった。
As a result, the dimensional change rate of the flexible printed circuit board is
0.1%. Further, the obtained flexible printed circuit board had a folding endurance of 1700 times.

比較例1 DMAc中でODAとPMDAを重合し、15重量%のポリアミド
酸溶液を得た。以下実施例1と同様の操作により、約20
μmの厚みを有するポリイミド絶縁材を得た。この絶縁
材の線膨張係数は2.5×10-5/℃であった。またこの絶縁
材の吸水率は2.0%であった。
Comparative Example 1 ODA and PMDA were polymerized in DMAc to obtain a 15% by weight polyamic acid solution. Thereafter, the same operation as in Example 1
A polyimide insulating material having a thickness of μm was obtained. The linear expansion coefficient of this insulating material was 2.5 × 10 −5 / ° C. The water absorption of this insulating material was 2.0%.

次に、この絶縁材に実施例1と同様の操作を施し、そ
の寸法変化率を求めた結果、0.4%であった。また得ら
れたフレキシブルプリント基板の耐折強度は約2500回で
あった。
Next, the same operation as in Example 1 was performed on this insulating material, and the dimensional change was found to be 0.4%. The bending strength of the obtained flexible printed circuit board was about 2500 times.

比較例2 DMAc中でBTDAとp−PDAを重合し、15重量%のポリア
ミド酸溶液を得た。以下実施例1と同様の操作により、
約20μmの厚みを有するポリイミド絶縁材を得た。この
絶縁材の線膨張係数は2.1×10-5/℃であった。また、こ
の絶縁材の吸水率は1.8%であった。
Comparative Example 2 BTDA and p-PDA were polymerized in DMAc to obtain a 15% by weight polyamic acid solution. Hereinafter, by the same operation as in Example 1,
A polyimide insulating material having a thickness of about 20 μm was obtained. The linear expansion coefficient of this insulating material was 2.1 × 10 −5 / ° C. The water absorption of the insulating material was 1.8%.

次に、この絶縁材に実施例1と同様の操作を施し、そ
の寸法変化を求めた結果0.3%であった。また得られた
フレキシブルプリント基板の耐折強度は約2000回であっ
た。
Next, the same operation as in Example 1 was performed on this insulating material, and the dimensional change was determined to be 0.3%. The bending resistance of the obtained flexible printed circuit board was about 2000 times.

〔作用・効果〕[Action / Effect]

本発明のフレキシブルプリント基板は、加熱や吸水に
よる寸法変化が小さく、しかも信頼性に優れ、従って、
より高密度な配線パターンを実現することが可能であ
る。
The flexible printed circuit board of the present invention has a small dimensional change due to heating or water absorption, and is excellent in reliability.
Higher density wiring patterns can be realized.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6,DB名) H05K 1/03 C08G 73/10 C08G 75/20 CA(STN) REGISTRY(STN)──────────────────────────────────────────────────の Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 1/03 C08G 73/10 C08G 75/20 CA (STN) REGISTRY (STN)

Claims (3)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】少なくとも導体と絶縁材とを包含するフレ
キシブルプリント基板において、絶縁材が下記一般
(I) (式中、Rは4価の酸無水物残基、xは自然数を表
す。) で表わされる構造単位を有するポリイミドからなること
を特徴とするフレキシブルプリント基板。
1. A flexible printed circuit board including at least a conductor and an insulating material, wherein the insulating material has the following general formula (I): (Wherein, R represents a tetravalent acid anhydride residue and x represents a natural number.) A flexible printed circuit board comprising a polyimide having a structural unit represented by the following formula:
【請求項2】Rが で表わされる請求項1記載のフレキシブルプリント基
板。
2. R is The flexible printed circuit board according to claim 1, wherein
【請求項3】導体が銅箔である請求項1又は2記載のフ
レキシブルプリント基板。
3. The flexible printed circuit board according to claim 1, wherein the conductor is a copper foil.
JP2176897A 1990-07-03 1990-07-03 Flexible printed circuit board Expired - Lifetime JP2910779B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2176897A JP2910779B2 (en) 1990-07-03 1990-07-03 Flexible printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2176897A JP2910779B2 (en) 1990-07-03 1990-07-03 Flexible printed circuit board

Publications (2)

Publication Number Publication Date
JPH0463486A JPH0463486A (en) 1992-02-28
JP2910779B2 true JP2910779B2 (en) 1999-06-23

Family

ID=16021665

Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
JP (1) JP2910779B2 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007334021A (en) * 2006-06-15 2007-12-27 Necディスプレイソリューションズ株式会社 Projector system and contrast improving method
US20220002489A1 (en) * 2018-11-19 2022-01-06 Pi Advanced Materials Co., Ltd. Polyamic acid composition for packaging electronic components, and method for packaging electronic components using same
KR101988809B1 (en) * 2018-11-19 2019-06-12 에스케이씨코오롱피아이 주식회사 Polyamic acid Composition for Packaging Electronic Component and Method for Packaging Electronic Component by Using the Same

Also Published As

Publication number Publication date
JPH0463486A (en) 1992-02-28

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