JP2972623B2 - Metal bond whetstone - Google Patents
Metal bond whetstoneInfo
- Publication number
- JP2972623B2 JP2972623B2 JP9032116A JP3211697A JP2972623B2 JP 2972623 B2 JP2972623 B2 JP 2972623B2 JP 9032116 A JP9032116 A JP 9032116A JP 3211697 A JP3211697 A JP 3211697A JP 2972623 B2 JP2972623 B2 JP 2972623B2
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- Prior art keywords
- metal bond
- weight
- metal
- bond
- total weight
- Prior art date
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Description
【０００１】[0001]
【発明の属する技術分野】本発明はボンド材として金属
粉を用いたメタルボンド砥石に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal bond whetstone using metal powder as a bonding material.
【０００２】[0002]
【従来の技術】ダイヤモンド砥粒やＣＢＮ砥粒などの超
砥粒を結合材によって固めたいわゆる超砥粒砥石とし
て、メタルボンド砥石、レジノイドボンド砥石、ビトリ
ファイドボンド砥石など知られており、その用途に応じ
て使い分けられている。2. Description of the Related Art Metal-bonded grinding wheels, resinoid-bonded grinding wheels, vitrified-bonded grinding wheels and the like are known as so-called super-abrasive grinding wheels in which superabrasive grains such as diamond abrasive grains and CBN abrasive grains are solidified by a binder. It is used properly according to.
【０００３】メタルボンドは金属を結合材として用いる
もので、粉末冶金法を応用したものと、電着と称する電
気メッキ法を応用したものとがある。メタルボンドの種
類は、主成分により区分され、Ｃｕ−Ｓｎ系ボンド、Ｆ
ｅ系ボンド、Ｃｏ系ボンド、Ｎｉ系ボンド、タングステ
ン系ボンドなど種々あり、このような砥石には、切れ味
は無論のこと、耐久性、加工時に発生する熱に対する耐
熱性などがその性能として要求される。A metal bond uses a metal as a binder, and there are a metal bond applied by a powder metallurgy method and a metal bond applied by an electroplating method called electrodeposition. The types of metal bonds are classified according to the main components, Cu-Sn based bonds, F
There are various types such as e-based bond, Co-based bond, Ni-based bond, tungsten-based bond, and such a grindstone is required to have not only sharpness but also durability, heat resistance against heat generated during processing, and the like. You.
【０００４】例えば、Ｃｕ−Ｓｎ系のボンドは焼結性が
良いという利点を有する。その反面、融点が７６０〜９
６０℃と低く耐熱性に劣るため、切断時に焼け、目潰れ
が発生して切れ味が持続しにくい。また、切断機械の高
馬力化が進み脱粒しやすいといった欠点を有する。[0004] For example, a Cu-Sn-based bond has an advantage of good sinterability. On the other hand, the melting point is 760-9
Since it is as low as 60 ° C. and inferior in heat resistance, burning and crushing occur at the time of cutting, and it is difficult to maintain sharpness. In addition, there is a disadvantage that the cutting machine has a high horsepower and is easy to shed.
【０００５】またＦｅ系ボンドやＣｏ系ボンドは、強度
が高いという利点を有するが、単体では延性が大きいた
め、切れ刃となる砥粒がボンド内に埋まり込み研削性能
に悪影響を与える。この対策として、ブロンズやＳｎな
どを添加することも一部試みられているが、Ｓｎなどの
添加によって融点が下がり、耐熱性や強度が低下するこ
ととなる。さらには、耐磨耗性を向上させるためにＷを
添加すると、ボンド材の硬度が高くなってボンド後退が
悪くなり、砥粒が自生しにくいといった問題が生じる。[0005] Further, Fe-based bonds and Co-based bonds have the advantage of high strength, but since they have high ductility by themselves, abrasive grains serving as cutting edges are buried in the bond and adversely affect grinding performance. As a countermeasure, the addition of bronze, Sn, or the like has been attempted in some cases, but the addition of Sn or the like lowers the melting point, thereby lowering heat resistance and strength. Furthermore, if W is added to improve abrasion resistance, the hardness of the bond material is increased, the bond retreat is deteriorated, and there is a problem that abrasive grains are unlikely to grow on their own.
【０００６】[0006]
【発明が解決しようとする課題】一方Ｎｉを含有するボ
ンドは、上記したボンドに比べて耐熱性が高いという優
れた特徴を有するが、少量のＮｉでは耐熱性が改善され
ない。耐熱性を改善するためには、ボンド全体重量の４
０％以上のＮｉを含有させることが必要であるが、Ｎｉ
成分が４０％を越えると強度や硬度が低下し、また延性
が高くなりすぎて上記したように砥粒の埋まり込みが発
生しやすい。On the other hand, a bond containing Ni has an excellent feature that the heat resistance is higher than the above-mentioned bond, but the heat resistance is not improved with a small amount of Ni. In order to improve heat resistance, 4
It is necessary to contain 0% or more of Ni.
If the content of the component exceeds 40%, the strength and hardness decrease, and the ductility becomes too high, so that embedding of the abrasive grains easily occurs as described above.
【０００７】本発明は特に耐熱性に優れた特徴を有する
Ｎｉ系ボンド材の特徴を活かし、さらにその性質改善を
図ることを目的とする。An object of the present invention is to make use of the characteristics of a Ni-based bonding material having particularly excellent heat resistance and to further improve the properties thereof.
【０００８】[0008]
【課題を解決するための手段】本発明者は上記目的を達
成するために、Ｎｉと合金化するのに適した種々の材料
について実験を行った結果、耐熱性に優れた性質を有す
るＮｉに、ＳｎとＣｕを特定量添加することにより、Ｎ
ｉのもつ特性を損なうことなく優れた効果を発揮できる
ことを知見し本発明を完成するに至ったものである。In order to achieve the above object, the present inventor conducted experiments on various materials suitable for alloying with Ni. , Sn and Cu by adding specific amounts,
The inventors have found that excellent effects can be exhibited without impairing the characteristics of i, and have completed the present invention.
【０００９】すなわち、本発明のメタルボンド砥石は、
メタルボンド組成としてＮｉを４０重量％以上、Ｓｎお
よびＣｕを合計で３０重量％以上含有し、残部がＳｎを
固溶しない成分とすることによって上記目的を達成した
ものである。That is, the metal bond whetstone of the present invention is:
The above object has been achieved by using a metal bond composition containing at least 40% by weight of Ni and at least 30% by weight of Sn and Cu in total, with the balance being a component that does not dissolve Sn.
【００１０】従来よりＳｎはメタルボンド組成分として
用いられているが、従来は主として焼結性を向上させる
ことを目的として用いられていたものであって、本発明
においては、Ｓｎを強度、硬度の向上、延性の抑制を目
的として用いる。添加されたＳｎはＮｉに固溶しやす
く、ＮｉへのＳｎの固溶により、Ｎｉ粉末とＳｎ粉末の
結合力が大きくなり、緻密度が高くなるため、強度、硬
度が向上し、延性が抑制される。これによって、Ｎｉ分
を増加させた場合の強度、硬度の低下や、延性が高くな
りすぎるという欠点が解消され、耐熱性、砥粒の埋まり
込みが改善され、切れ味性能、寿命性能に優れたメタル
ボンド砥石が得られる。Conventionally, Sn has been used as a metal bond component, but it has been used mainly for the purpose of improving sinterability, and in the present invention, Sn has strength and hardness. It is used for the purpose of improvement of ductility and suppression of ductility. The added Sn easily dissolves in Ni, and the solid solution of Sn in Ni increases the bonding force between the Ni powder and the Sn powder and increases the denseness, thereby improving strength and hardness and suppressing ductility. Is done. This eliminates the drawbacks of reduced strength and hardness and increased ductility when the Ni content is increased, improved heat resistance, improved embedding of abrasive grains, and excellent metal sharpness and life performance. A bonded whetstone is obtained.
【００１１】メタルボンド全体重量に対するＮｉ、Ｓｎ
およびＣｕの合計重量は７０重量％以上、残余成分が３
０重量％未満とするのが良い。Ｎｉ、ＳｎおよびＣｕの
合計が７０重量％未満であると、結合力に関与しないほ
かの成分（例えばＷ、Ｗ2 Ｃ、ＷＣなどの成分）が多く
なって砥材を保持できなくなり、研削性能に悪影響を及
ぼす。Ni, Sn based on the total weight of metal bond
And the total weight of Cu is 70% by weight or more, and
The content is preferably less than 0% by weight. If the total of Ni, Sn and Cu is less than 70% by weight, other components not involved in the bonding force (for example, components such as W, W 2 C, WC, etc.) increase, and the abrasive cannot be held, and the grinding performance is reduced. Adversely affect
【００１２】Ｎｉ、ＳｎおよびＣｕの合計重量における
ＮｉとＳｎの割合は、ＮｉとＳｎの重量比が１：０．２
〜１：０．３５、例えば合計重量に対してＮｉが６０重
量％のときＳｎを１２〜２１重量％、残部をＣｕとする
のが望ましい。ＮｉとＳｎの重量比がこの範囲である
と、焼結性（緻密度）、曲げ強度、硬度、延性の全ての
面において優れた性質改善が達成される。ＳｎがＮｉの
０．２倍よりも少ないと、ＮｉへのＳｎの固溶量が少な
いため、曲げ強度、硬度および延性の点での改善が充分
でなく、砥材の埋まり込みによる切れ味低下となり、逆
にＳｎがＮｉの０．３５倍を越えると、ＳｎがＮｉに固
溶しきれずに残るため、曲げ強度及び硬度が低下する。The proportion of Ni and Sn in the total weight of Ni, Sn and Cu is such that the weight ratio of Ni and Sn is 1: 0.2.
For example, when Ni is 60% by weight with respect to the total weight, Sn is preferably 12 to 21% by weight, and the balance is preferably Cu. When the weight ratio of Ni and Sn is in this range, excellent property improvement is achieved in all aspects of sinterability (density), bending strength, hardness, and ductility. If Sn is less than 0.2 times Ni, the amount of Sn dissolved in Ni is small, so that the bending strength, hardness and ductility are not sufficiently improved, and the sharpness is reduced due to embedding of the abrasive. Conversely, if Sn exceeds 0.35 times that of Ni, Sn is not completely dissolved in Ni and remains, so that the bending strength and the hardness are reduced.
【００１３】また、メタルボンド用のＮｉ金属粉、Ｓｎ
金属粉およびブロンズ金属粉の粒径は、２〜２５μｍの
範囲とするのが好ましい。これらの粒径が２μｍ未満で
あると、メタルボンド中の各粉末粒子の分散が不均一と
なり、メタルボンドの硬度、強度、延性にバラツキが生
じ、粒径が２５μｍを越えると、各粉末粒子間に隙間が
生じ、メタルボンドの緻密度が低下するので好ましくな
い。Further, Ni metal powder for metal bonding, Sn
The particle size of the metal powder and the bronze metal powder is preferably in the range of 2 to 25 μm. When the particle size is less than 2 μm, the dispersion of the powder particles in the metal bond becomes uneven, and the hardness, strength, and ductility of the metal bond vary. This is not preferable because a gap is formed in the metal bond and the compactness of the metal bond decreases.
【００１４】Ｎｉ、ＳｎおよびＣｕ以外のメタルボンド
組成分は、ＮｉへのＳｎの固溶量を一定にするために、
Ｓｎが固溶しない成分とする。Ｓｎが固溶しない成分と
しては、例えばＷ、Ｗ2 Ｃ、ＷＣを用いることができ
る。The metal bond components other than Ni, Sn and Cu are used in order to keep the solid solution amount of Sn in Ni constant.
A component in which Sn does not form a solid solution. As a component in which Sn does not form a solid solution, for example, W, W 2 C, and WC can be used.
【００１５】[0015]
【実施の形態】本発明のメタルボンド砥石は、メタルボ
ンドの組成が異なる点を除いて、従来のメタルボンド砥
石と同様な方法によって製造し、使用することができ
る。以下本発明におけるメタルボンドの組成について、
実験例に基づいて詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The metal bond grindstone of the present invention can be manufactured and used by the same method as a conventional metal bond grindstone except that the composition of the metal bond is different. Hereinafter, the composition of the metal bond in the present invention,
This will be described in detail based on an experimental example.
【００１６】（実験例１）Ｎｉ、Ｓｎ、Ｃｕの組成比の
検討 Ｎｉ、ＳｎおよびＣｕの合計重量に対するＮｉの割合を
６０重量％に固定し、Ｓｎの割合を０〜３０重量％の範
囲で変化させ、残部をＣｕとしたときのメタルボンドの
物性値を図１〜図３に示す。図１はメタルボンドの曲げ
強度とＮｉとＳｎの重量比の関係を示し、図２はメタル
ボンドの伸びとＮｉとＳｎの重量比の関係を示し、図３
はメタルボンドの硬度とＮｉとＳｎの重量比の関係を示
す。(Experimental Example 1) Examination of the composition ratio of Ni, Sn, and Cu The ratio of Ni to the total weight of Ni, Sn, and Cu was fixed at 60% by weight, and the ratio of Sn was in the range of 0 to 30% by weight. FIG. 1 to FIG. 3 show the physical property values of the metal bonds when the balance was changed and Cu was used as the balance. FIG. 1 shows the relationship between the bending strength of the metal bond and the weight ratio of Ni and Sn, FIG. 2 shows the relationship between the elongation of the metal bond and the weight ratio of Ni and Sn, and FIG.
Indicates the relationship between the hardness of the metal bond and the weight ratio of Ni and Sn.
【００１７】図１〜図３に示すように、Ｎｉ、Ｓｎおよ
びＣｕの合計重量に対してＮｉが６０重量％の場合、Ｓ
ｎが１２〜２１重量％のとき、すなわちＮｉとＳｎの重
量比ＷNi：ＷSnが１：０．２〜１：０．３５のときに、
曲げ強度と伸びと硬度がバランスした優れた物性値が得
られた。なお、図２における伸びは、スパン距離３０ｍ
ｍでの三点曲げにおける伸びを示す。As shown in FIGS. 1 to 3, when Ni is 60% by weight based on the total weight of Ni, Sn and Cu, S
When n is 12 to 21% by weight, that is, when the weight ratio of Ni to Sn W Ni : W Sn is 1: 0.2 to 1: 0.35,
Excellent physical properties with a balance of flexural strength, elongation and hardness were obtained. In addition, the elongation in FIG.
The elongation in three-point bending at m is shown.
【００１８】（実験例２）Ｎｉ、ＳｎおよびＣｕの合計
重量の検討 Ｎｉ、ＳｎおよびＣｕの合計重量に対するＮｉの割合を
６０重量％、Ｓｎの割合を１５重量％、Ｃｕの割合を２
５重量％に固定し、メタルボンド全体重量に対するＷの
添加割合を変化させたときのメタルボンドの物性値を図
４〜図６に示す。図４はメタルボンドの緻密度とＮｉ、
ＳｎおよびＣｕの合計重量の関係を示し、図５はメタル
ボンドの強度とＮｉ、ＳｎおよびＣｕの合計重量の関係
を示し、図６はメタルボンドの伸びとＮｉ、Ｓｎおよび
Ｃｕの合計重量の関係を示す。(Experimental Example 2) Examination of the total weight of Ni, Sn and Cu The ratio of Ni to the total weight of Ni, Sn and Cu was 60% by weight, the ratio of Sn was 15% by weight, and the ratio of Cu was 2%.
FIGS. 4 to 6 show the physical property values of the metal bond when it was fixed at 5% by weight and the addition ratio of W to the total weight of the metal bond was changed. Figure 4 shows the density of metal bond and Ni,
5 shows the relationship between the total weight of Sn and Cu, FIG. 5 shows the relationship between the strength of the metal bond and the total weight of Ni, Sn and Cu, and FIG. 6 shows the relationship between the elongation of the metal bond and the total weight of Ni, Sn and Cu. Is shown.
【００１９】図４〜図６に示すように、メタルボンド全
体重量に対するＷの添加割合が３０重量％未満のとき、
すなわちＮｉ、ＳｎおよびＣｕの合計重量がメタルボン
ド全体重量の７０重量％以上のときに、緻密度と強度と
伸びがバランスした優れた物性値が得られた。As shown in FIGS. 4 to 6, when the addition ratio of W to the total weight of the metal bond is less than 30% by weight,
That is, when the total weight of Ni, Sn, and Cu was 70% by weight or more of the total weight of the metal bond, excellent physical properties in which the compactness, strength, and elongation were balanced were obtained.
【００２０】（実験例３）耐熱性の調査 メタルボンドの耐熱性とメタルボンド全体重量に対する
Ｎｉの割合の関係を図７に示す。同図の縦軸は従来のＣ
ｕ−Ｓｎ系のメタルボンドの耐熱性を基準（１００）と
した指数を表す。(Experimental Example 3) Investigation of Heat Resistance FIG. 7 shows the relationship between the heat resistance of the metal bond and the ratio of Ni to the total weight of the metal bond. The vertical axis in FIG.
An index based on the heat resistance of a u-Sn-based metal bond as a reference (100).
【００２１】メタルボンド全体重量に対するＮｉの割合
を４０重量％以上とすると、メタルボンドの融点が１１
４０〜１４４０℃となり、図７に示すように、耐熱性は
従来のＣｕ−Ｓｎ系のメタルボンドの１．５倍以上とな
る。When the ratio of Ni to the total weight of the metal bond is 40% by weight or more, the melting point of the metal bond is 11%.
The temperature is 40 to 1440 ° C., and as shown in FIG. 7, the heat resistance is 1.5 times or more that of the conventional Cu—Sn based metal bond.
【００２２】（実験例４）切断性能の調査 実験例１のメタルボンドを用いた砥石における切れ味指
数、寿命指数とＮｉとＳｎの重量比の関係を図８に示
し、実験例２のメタルボンドを用いた砥石における切れ
味指数、寿命指数とＮｉ、ＳｎおよびＣｕの合計重量の
関係を図９に示す。同図の縦軸の切れ味指数および寿命
指数は従来のＣｕ−Ｓｎ系のメタルボンドを用いた砥石
を基準（１００）とした指数を表し、図中の太線は切れ
味指数を、細線は寿命指数を表す。(Experimental Example 4) Investigation of Cutting Performance The relationship between the sharpness index, life index and the weight ratio of Ni to Sn in the grindstone using the metal bond of Experimental Example 1 is shown in FIG. FIG. 9 shows the relationship between the sharpness index and life index of the used grindstone and the total weight of Ni, Sn and Cu. The sharpness index and the life index on the vertical axis in the figure represent indices based on a grindstone using a conventional Cu-Sn-based metal bond (100), the thick line in the figure indicates the sharpness index, and the thin line indicates the life index. Represent.
【００２３】図８に示すように、Ｎｉ、ＳｎおよびＣｕ
の合計重量に対してＮｉが６０重量％の場合、Ｓｎが１
２〜２１重量％のとき、すなわちＮｉとＳｎの重量比Ｗ
Ni：ＷSnが１：０．２〜１：０．３５のときに、切れ味
指数、寿命指数ともに良好な結果が得られた。また図９
に示すように、メタルボンド全体重量に対するＷの添加
割合が３０重量％未満のとき、すなわちＮｉ、Ｓｎおよ
びＣｕの合計重量がメタルボンド全体重量の７０重量％
以上のときに、切れ味指数、寿命指数ともに良好な結果
が得られた。As shown in FIG. 8, Ni, Sn and Cu
When Ni is 60% by weight based on the total weight of Sn, Sn is 1
2 to 21% by weight, that is, the weight ratio W of Ni and Sn
When Ni : W Sn was 1: 0.2 to 1: 0.35, good results were obtained for both the sharpness index and the life index. FIG.
As shown in the figure, when the addition ratio of W to the total weight of the metal bond is less than 30% by weight, that is, the total weight of Ni, Sn and Cu is 70% by weight of the total weight of the metal bond.
At the above time, good results were obtained for both the sharpness index and the life index.
【００２４】[0024]
【発明の効果】本発明によって以下の効果を奏すること
ができる。According to the present invention, the following effects can be obtained.
【００２５】（１）耐熱性に優れた性質を有するＮｉ
に、ＳｎとＣｕを特定量添加することにより、Ｎｉ含有
メタルボンドの耐熱性の良さを損なうことなく強度、硬
度、延性などの物性値を向上させることができる。(1) Ni having excellent heat resistance
By adding Sn and Cu in specific amounts, it is possible to improve physical properties such as strength, hardness and ductility without impairing the good heat resistance of the Ni-containing metal bond.
【００２６】（２）メタルボンド全体量に対してＮｉ、
ＳｎおよびＣｕの量を特定範囲に調整することにより、
メタルボンドの緻密度と強度と延性がバランスし、耐熱
性、砥粒の埋まり込みが改善され、切れ味性能、寿命性
能に優れたメタルボンド砥石が得られる。(2) Ni, Ni
By adjusting the amounts of Sn and Cu to a specific range,
The density, strength and ductility of the metal bond are balanced, heat resistance and embedding of abrasive grains are improved, and a metal bond whetstone excellent in sharpness performance and life performance can be obtained.
【００２７】（３）Ｎｉ金属粉、Ｓｎ金属粉およびブロ
ンズ金属粉の粒径を２〜２５μｍの範囲とすることによ
り、メタルボンド中の各粉末粒子が均一に分散し、切れ
味性能、寿命性能のバラツキのないメタルボンド砥石が
得られる。(3) By setting the particle size of the Ni metal powder, Sn metal powder and bronze metal powder in the range of 2 to 25 μm, each powder particle in the metal bond is uniformly dispersed, and the sharpness performance and the life performance are improved. A metal bond whetstone without variation can be obtained.
【図１】メタルボンドの曲げ強度とＮｉとＳｎの重量比
の関係を示す図である。FIG. 1 is a diagram showing the relationship between the bending strength of a metal bond and the weight ratio of Ni and Sn.
【図２】メタルボンドの伸びとＮｉとＳｎの重量比の関
係を示す図である。FIG. 2 is a diagram showing a relationship between elongation of a metal bond and a weight ratio of Ni and Sn.
【図３】メタルボンドの硬度とＮｉとＳｎの重量比の関
係を示す図である。FIG. 3 is a diagram showing the relationship between the hardness of a metal bond and the weight ratio of Ni and Sn.
【図４】メタルボンドの緻密度とＮｉ、ＳｎおよびＣｕ
の合計重量の関係を示す図である。FIG. 4 Compactness of metal bond and Ni, Sn and Cu
It is a figure which shows the relationship of total weight.
【図５】メタルボンドの強度とＮｉ、ＳｎおよびＣｕの
合計重量の関係を示す図である。FIG. 5 is a diagram showing the relationship between the strength of metal bonds and the total weight of Ni, Sn and Cu.
【図６】メタルボンドの伸びとＮｉ、ＳｎおよびＣｕの
合計重量の関係を示す図である。FIG. 6 is a diagram showing the relationship between the elongation of a metal bond and the total weight of Ni, Sn and Cu.
【図７】メタルボンドの耐熱性とメタルボンド全体重量
に対するＮｉの割合の関係を示す図である。FIG. 7 is a graph showing the relationship between the heat resistance of metal bonds and the ratio of Ni to the total weight of metal bonds.
【図８】砥石の切れ味指数、寿命指数とＮｉとＳｎの重
量比の関係を示す図である。FIG. 8 is a diagram showing a relationship between a sharpness index and a life index of a grindstone and a weight ratio of Ni and Sn.
【図９】砥石の切れ味指数、寿命指数とＮｉ、Ｓｎおよ
びＣｕの合計重量の関係を示す図である。FIG. 9 is a diagram showing the relationship between the sharpness index and life index of a grindstone and the total weight of Ni, Sn and Cu.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭58−217271（ＪＰ，Ａ) 特開 昭64−34674（ＪＰ，Ａ) 実開 昭62−39970（ＪＰ，Ｕ) 特公 昭51−752（ＪＰ，Ｂ１) (58)調査した分野(Int.Cl.6，ＤＢ名) B24D 3/06 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-58-217271 (JP, A) JP-A-64-34674 (JP, A) JP-A-62-39970 (JP, U) 752 (JP, B1) (58) Field surveyed (Int. Cl. 6 , DB name) B24D 3/06
Claims (3)
％以上、ＳｎおよびＣｕを合計で３０重量％以上含有
し、残部がＳｎを固溶しない成分であることを特徴とす
るメタルボンド砥石。1. A metal bond grindstone comprising 40% by weight or more of Ni as a metal bond composition, 30% by weight or more of Sn and Cu in total, and the balance being a component which does not dissolve Sn.
重量比を１：０．２〜１：０．３５とした請求項１記載
のメタルボンド砥石。2. The metal bond grinding wheel according to claim 1, wherein the weight ratio of Ni to Sn in the metal bond composition is 1: 0.2 to 1: 0.35.
金属粉およびブロンズ金属粉の粒径を２〜２５μｍの範
囲とした請求項１または２記載のメタルボンド砥石。3. The metal bond Ni metal powder, Sn
The metal bond grindstone according to claim 1 or 2, wherein the particle diameter of the metal powder and the bronze metal powder is in the range of 2 to 25 µm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9032116A JP2972623B2 (en) | 1997-02-17 | 1997-02-17 | Metal bond whetstone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9032116A JP2972623B2 (en) | 1997-02-17 | 1997-02-17 | Metal bond whetstone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10230464A JPH10230464A (en) | 1998-09-02 |
| JP2972623B2 true JP2972623B2 (en) | 1999-11-08 |
Family
ID=12349937
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9032116A Expired - Fee Related JP2972623B2 (en) | 1997-02-17 | 1997-02-17 | Metal bond whetstone |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2972623B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007055616A1 (en) | 2005-11-14 | 2007-05-18 | Evgeny Aleksandrovich Levashov | Binder for the fabrication of diamond tools |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8894731B2 (en) | 2007-10-01 | 2014-11-25 | Saint-Gobain Abrasives, Inc. | Abrasive processing of hard and /or brittle materials |
| US8882868B2 (en) | 2008-07-02 | 2014-11-11 | Saint-Gobain Abrasives, Inc. | Abrasive slicing tool for electronics industry |
-
1997
- 1997-02-17 JP JP9032116A patent/JP2972623B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007055616A1 (en) | 2005-11-14 | 2007-05-18 | Evgeny Aleksandrovich Levashov | Binder for the fabrication of diamond tools |
| US9764448B2 (en) | 2005-11-14 | 2017-09-19 | National University of Science and Technology “MISIS” | Binder for the fabrication of diamond tools |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH10230464A (en) | 1998-09-02 |
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