JP2941182B2 - Printed circuit board and its cutting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to formation of a guide for positioning a cutting blade for press-cutting for dividing a printed circuit board or removing a discarded board portion, a cutting method, and inspection of a cutting position.

[0002]

2. Description of the Related Art FIG.
FIG. 1 is an explanatory cross-sectional view showing a conventional printed circuit board cutting means disclosed in Japanese Unexamined Patent Application Publication No. H10-115,004. In the figure, 1 is a printed circuit board, 2
Is a V-cut groove formed in a line for cutting the printed circuit board 1, 3 is a fixed cutting blade of a pair of press-cutting cutting blades vertically opposed, and 4 is a movable cutting blade. .

Next, the operation will be described. After the components are mounted on the printed board 1, the printed board 1 is inserted between the fixed cutting blade 3 and the movable cutting blade 4 along the V-cut groove 2. The printed board 1 is cut by operating the movable cutting blade 4 with the V-cut groove 2 positioned on the fixed cutting blade 3 and the movable cutting blade 4. By this cutting, a predetermined printed circuit board is completed.

[0004]

As a conventional means for cutting the printed circuit board 1 as described above, it was necessary to previously form the V-cut groove 2 in the line where the printed circuit board 1 was cut. In this case, the formation of the V-cut groove 2 in the manufacture of the printed board 1 requires a processing step for that purpose, and there is a problem that the unit price of the printed board 1 becomes relatively high.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and a first object of the present invention is to position a press-cutting cutting blade for dividing a printed circuit board or removing a discarded board portion. An object of the present invention is to obtain a printed board that can be cut accurately without providing a V-cut groove as a guide. A second object is to provide a printed circuit board that can easily perform dimensional inspection of a cut and divided printed circuit board. Further, a third object is to obtain a working method capable of cutting and dividing easily and accurately.

[0006]

In a printed circuit board according to the present invention, as a positioning guide for a cutting blade for press cutting, a plurality of positions are provided along both sides of the line so as to sandwich a line to be cut on the printed circuit board at a predetermined interval. On which solder bumps are formed.

Further, as a positioning guide for a cutting blade for press cutting, solder bumps are formed at a plurality of positions along both sides of the line so as to sandwich the line to be cut on the printed board at a predetermined interval, and both sides of the line are cut. The solder bumps are arranged in a staggered positional relationship.

Further, as a positioning guide for the cutting blade for press cutting, solder bumps are formed at a plurality of locations along both sides of the line so as to sandwich the line to be cut on the printed board at a predetermined interval. And a space forming slit is provided between the solder bumps.

Still further, the solder bump is formed on the discarded substrate portion.

[0010] In addition, a tolerance mark indicating a tolerance of the positional deviation of the line to be cut is provided on the back surface of the solder bump forming surface.

Further, solder bumps are formed at a plurality of positions along both sides of the line so as to sandwich the line to be cut at a predetermined interval, and the solder bump is cut by applying a cutting blade for press cutting. is there.

[0012]

In the printed circuit board constructed as described above, solder bumps formed along both sides of the printed circuit board so as to sandwich the line to be cut at predetermined intervals serve as positioning guides for the cutting blade for press cutting. It works to cut at the exact position.

In addition, a dimensional inspection of the cut / divided printed circuit board is determined by a tolerance mark provided on the back surface of the solder bump forming surface and indicating a tolerance of a positional deviation of a line to be cut.

Furthermore, by applying a cutting blade for press cutting to the solder bumps formed along both sides of the line so as to sandwich the line to be cut at a predetermined interval, a simple and accurate cutting can be performed.

[0015]

【Example】

Embodiment 1 FIG. FIG. 1 is a sectional view showing a relationship between a printed board and a cutting blade for press cutting according to an embodiment of the present invention. In the figure, 1 is a printed circuit board, 3 is a fixed cutting blade of a pair of vertically cutting press cutting blades, and 4 is a movable cutting blade. Reference numeral 5 denotes a conductor pattern (land) formed at a plurality of locations along both sides of the line 1a so as to sandwich the line 1a (shown in FIG. 2) of the printed circuit board 1 at a predetermined interval. The conductor pattern 5 has, for example, a diameter of about 1 mm, and an interval (pitch dimension) between the lines 1a is set to about 2 mm. Reference numeral 6 denotes a solder bump formed on the conductor pattern 5. The solder bumps 6 are formed simultaneously with flow soldering for mounting various electronic components.

The cutting of the printed board 1 is performed by applying the valley portion of the solder bump 6 to the tip of the fixed cutting blade 3 to hold the printed board 1 and operating the movable cutting blade 4. At this time, the valleys of the solder bumps 6 have the same function as the V-cut groove 2 in the conventional example.

Embodiment 2 FIG. In order to improve the accuracy of the cutting position of the printed circuit board 1, the interval (pitch dimension) between the opposed solder bumps 6 is reduced in the configuration of the first embodiment. If the interval is reduced, the gap between the conductor patterns 5 is bridged during flow soldering, and a state in which a valley is not formed by the solder bump 6 occurs. In this regard, if the solder bumps 6 are formed as shown in FIG. That is, in FIG. 2, reference numeral 1 a denotes a cutting line of the printed circuit board 1, and a dashed line in the drawing is an imaginary line indicating the cutting line 1 a. The conductor patterns 5 are arranged along both sides of the line 1a so as to sandwich the line 1a at a predetermined interval, that is, at a predetermined pitch, and so that the positional relationship between the conductor patterns 5 on both sides is staggered. When the conductor patterns 5 on both sides of the line 1a are arranged in a staggered manner as described above, the intervals between the individual conductor patterns 5 are widened, so that the solder bumps 6 do not bridge. In addition, even if the positional relationship of the conductor patterns 5 is arranged in a staggered manner, when viewed from the cross-sectional side of the cutting blades 3 and 4, it becomes the same as FIG. Thus, the printed circuit board 1 can be held and cut.

Embodiment 3 FIG. As a means for preventing the solder bumps 6 from bridging, the configuration shown in FIGS. 3 and 4 is more reliable. That is, in FIG. 3 and FIG.
Reference numeral 8 denotes a space forming slit provided between the conductor patterns 5 on both sides. In this case, FIG. 3 shows the conductor patterns 5 facing each other across the line 1a, and FIG. 4 shows the conductor patterns 5 arranged in a staggered manner across the line 1a. By providing the space forming slits 8 as described above, a space is formed between the conductor patterns 5 and the occurrence of solder bridges is reliably prevented. In addition, this space forming slit 8 is
This also reduces the load on the cutting blades 3 and 4 during cutting.

Embodiment 4 FIG. FIG. 5 shows that the solder bumps 6 are formed on the substrate portion. That is, in the drawing, reference numeral 1 denotes a multi-panel printed circuit board, and three printed circuit boards can be obtained by cutting. Reference numeral 1b denotes a slit for division, and 1c (a portion where diagonal grid lines are inserted) denotes a discarded substrate portion. Reference numeral 5 denotes a conductor pattern formed along both sides of the cutting line 1a in the discard substrate portion 1c.
Is a solder bump. Thus, by providing the solder bumps 6 on the discarded board portion 1c and cutting the line 1a, three printed boards are obtained. With the printed circuit board 1 formed as described above, the solder bumps 6 do not remain on the final product.

Embodiment 5 FIG. Depending on the mounting of the printed circuit board 1 or the dimensions related to other components, etc.
In some cases, the external dimensions of the printed circuit board 1 after division become important. The embodiment of FIG. 6 can cope with such a case. That is, in FIG. 6, reference numerals 7a and 7b denote tolerance marks provided on the back side of the surface on which the conductor pattern 5 is formed, corresponding to the line 1a to be cut. This tolerance mark 7
Symbols “a” and “7b” are displayed by silk-screen printing, and indicate the tolerance of the positional deviation of the line 1a to be cut. The tolerance, that is, the dimension of the interval between the tolerance marks 7a and 7b may vary depending on the type of the printed circuit board 1, but is generally set to 1 mm to 2 mm. According to the printed board 1 configured as described above, after cutting, one of the tolerance marks 7a and 7b is provided on each of the divided boards.
If the book remains, it is a good product.
If all the books remain, or if none remain, it is determined to be defective. This identification can be easily determined visually.
Note that the tolerance marks 7a and 7b may not be thick lines as shown, but may be dotted lines or band-like marks.

Embodiment 6 FIG. FIG. 7 illustrates one method of cutting the printed circuit board 1 according to the present invention. In the figure, a conductor pattern 5 is formed as close as possible to a cutting line 1a (not shown). That is, the intervals between the conductor patterns 5 are formed narrow, and therefore, the solder bumps 6 are formed close to each other. When cutting, the fixed cutting blade 3 is applied to the valley of the solder bump 6 to fix the printed circuit board 1 as shown in the figure, and the movable cutting blade 4 is operated to cut. By forming the solder bumps 6 close to each other and applying the fixed cutting blade 3 to the solder bumps 6 as described above, the solder bumps 6 can be cut at an accurate position and can cope with the manufacture of the printed circuit board 1 whose external dimensions are important.

[0022]

Since the present invention is configured as described above, it has the following effects.

The solder bumps formed along both sides of the printed circuit board so as to sandwich the line to be cut at a predetermined interval serve as positioning guides for the cutting blade for press cutting, so that the cutting can be performed at an accurate position. Therefore, it is not necessary to provide a V-cut groove, and an inexpensive printed circuit board can be obtained.

In addition, the dimensional inspection of the cut and divided printed circuit board can be easily judged visually by using a tolerance mark which is provided on the back side surface of the solder bump forming surface and indicates a tolerance of a positional deviation of a line to be cut. A printed circuit board having accurate external dimensions can be provided as required.

Furthermore, by forming solder bumps along both sides of the line so as to sandwich the line to be cut at a predetermined close interval, and applying a cutting blade for press cutting to the solder bump, a cutting operation is performed. It is possible to obtain a cutting method capable of cutting at an appropriate position.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a relationship between a printed board of the present invention and a cutting blade for press cutting.

FIG. 2 is a plan view of a printed circuit board according to a second embodiment of the present invention.

FIG. 3 is a plan view of a printed circuit board according to a third embodiment of the present invention.

FIG. 4 is a plan view of a printed circuit board according to a third embodiment of the present invention.

FIG. 5 is a plan view of a printed circuit board according to a fourth embodiment of the present invention.

FIG. 6 is a plan view of a printed circuit board according to a fifth embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a relationship between a printed board and a cutting blade for press cutting according to a sixth embodiment of the present invention.

FIG. 8 is a cross-sectional view showing the relationship between a conventional printed board and a cutting blade for press cutting.

[Explanation of symbols]

1 printed circuit board, 1a cutting line, 3 fixed cutting blade, 4 moving cutting blade, 5 conductor pattern, 6 solder bump, 7 tolerance mark, 8 slit for forming space.

Claims (6)

(57) [Claims] 1. As a positioning guide for a press-cutting cutting blade for cutting a printed circuit board, solder bumps are formed at a plurality of locations along both sides of the printed circuit board so as to sandwich the line for cutting the printed circuit board at a predetermined interval. A printed circuit board. 2. As a positioning guide for a press-cutting cutting blade for cutting a printed circuit board, solder bumps are formed at a plurality of locations along both sides of the printed circuit board so as to sandwich the line for cutting the printed circuit board at a predetermined interval. A printed circuit board, wherein the solder bumps on both sides are arranged in a staggered positional relationship. 3. As a positioning guide for a press-cutting cutting blade for cutting a printed circuit board, solder bumps are formed at a plurality of locations along both sides of the printed circuit board so as to sandwich the line to be cut at a predetermined interval. 3. The printed circuit board according to claim 1, wherein a slit for forming a space is provided between the solder bumps on both sides. 4. The printed circuit board according to claim 1, wherein the solder bumps are formed on the substrate part. 5. The printed circuit board according to claim 1, wherein a tolerance mark indicating a tolerance of positional deviation of a line to be cut is provided on a back side surface of the solder bump forming surface. . 6. A method in which solder bumps are formed at a plurality of positions along both sides of the printed circuit board so as to sandwich the line to be cut at a predetermined interval, and the solder bump is cut by applying a cutting blade for press cutting to the solder bump. A method for cutting a printed circuit board, comprising: