JP2839221B2 - Substrate transfer device and substrate transfer path adjusting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus for transferring a flat substrate and a method for adjusting a substrate transfer path in the apparatus.

[0002]

2. Description of the Related Art Conventionally, as this type of substrate transfer apparatus, there is one provided in, for example, a wire bonding apparatus, and one example thereof is shown in FIGS. Since the apparatus is disclosed in Japanese Utility Model Laid-Open No. 3-48225 and the like, only the main part will be described.

In the wire bonding apparatus,
A plurality of lead frames L each serving as a substrate on which a plurality of IC chips (semiconductors) 201 are mounted side by side in the longitudinal direction.
The #F is arranged and accommodated in a magazine M as a substrate accommodating means, and the magazine M is loaded on the loader 202. Along with the operation of the loader 202, these lead frames L＼F are sequentially taken out of the magazine M by a frame transfer means (not shown), intermittently fed by the arrangement pitch of the IC chips 201, and
(See FIG. 22) Heater plate 20 heated by
5 is transported. Then, the heater plate 205
Above, each of the IC chips 201 mounted on the lead frame L # F and the leads 208 formed on the lead frame (FIG.
1) are sequentially connected by bonding using a conductive wire.

[0004] The lead frame L # F to which bonding has been performed as described above is further fed back by the frame transfer means, and is accommodated in an empty magazine M loaded on the unloader 209.

[0005] A transport path is provided for preventing the meandering of the lead frame L＼F transported by the frame transport means and performing highly accurate transport. The transport path is provided on both sides of the lead frame L＼F. Are defined by a pair of guide rails 211 and 212 serving as guide members arranged corresponding to.

After the bonding by wire is completed, a concave portion is formed in the lead frame L＼F as shown in FIG. 22 for the purpose of thinning a semiconductor component as a product obtained by performing resin molding or the like. Then, the IC chip 201 is mounted as an island 213, and the island 213 is positioned with respect to a concave portion 205a provided on the heater plate 205 so that the island 213 is fitted during a bonding operation. In order to achieve this, the above-mentioned transport path is particularly important.

The lead frame L # F has various widths depending on the type of the IC chip 201 to be mounted thereon.
Numeral 12 allows the rail intervals to be adjusted so as to guide these various lead frames. For more information,
As shown in FIG. 21, a pair of frame bases 215 are fixed on a frame (not shown) of the wire bonding apparatus, and are slidable along rails provided on each frame base 215. Guide rails 211 and 212 are attached to the slider 216.

The two guide rails 211 and 21
The guide member driving means 217 is provided for moving each of the guide rails 211 and 212 by the operation of the guide member driving means 217.
F is moved close to and away from F. The guide member driving means 217 is fixed to the pulse motors 218a and 218b attached to the frame base 215, the male screw 219 connected to the output shaft of the pulse motor, and the two guide rails 211 and 212. And a nut 220 screwed onto the male screw 219.

Next, the guide rails 211 and 2
The loader 202 and the unloader 209 arranged so as to sandwich the block 12 will be described. Since the loader 202 and the unloader 209 have the same configuration, the loader 20
2 will be described in detail, and the description of the unloader 209 will be omitted.

As shown in FIG. 20, a loader 202 includes a plurality of lead frames L # arranged and accommodated in a magazine M.
F by the above-described frame transfer means (not shown) to 1
An elevating mechanism 222 for lowering or elevating the magazine M by the arrangement pitch of the lead frames L # F for taking out the sheets one by one, and an elevating mechanism base 223 on which the elevating mechanism 222 is mounted. The lifting mechanism base 223 is movable in a direction indicated by an arrow S, that is, in a direction parallel to the movable direction T of the guide rails 211 and 212 described above. Is made.

A pair of stocker guides 227 each having an L-shaped cross section are provided on the elevating mechanism base 223.
a and 227b are provided. One stocker guide 227a is fixed to the lifting mechanism base 223, and the other stocker guide 227b is position-adjustable in the direction indicated by the arrow U, that is, in the length direction of the magazine M.

The two stocker guides 227a, 227
A total of four regulating members 2 are provided on the inner surface of 27b.
28a to 228d are attached. These restricting members 228a to 228d are for engaging and restricting the magazine M, and the two restricting members 228a and 228b are respectively provided for the stocker guides 227a and 227b.
And the other two regulating members 228c and 228d
Can be adjusted in the direction indicated by the arrow V, that is, in the width direction of the magazine M.

Next, a description will be given of the operation of the apparatus having the above-described configuration when the transport path is adjusted so as to match the width of the lead frame L # F to be handled.

First, the pulse motors 218a and 218b (see FIG. 21) are driven to rotate based on a command signal issued from a control unit (not shown) including a microcomputer or the like. Is converted into the amount of advance and retreat, and both guide rails 211 and 212 are
It is moved to the movement limit position in the direction away from each other.

Next, one lead frame L # F for transport path adjustment is handled by an operator, and a reference hole (not shown) formed in the lead frame L # F projects onto the heater plate 205. The projection (not shown) serving as a reference is provided. Thereby, the lead frame L
The island 213 formed on the F and on which the IC chip 201 is mounted is formed in the recess 205 a of the heater plate 205.
(See FIG. 22).

Here, as shown in FIG. 21, the lead frame L＼F is pressed and fixed from above by the lead frame presser 229, and the bonding means 207 (FIG. 2).
0) to operate the lead frame presser 229.
The bonding origin 230 is set at the center position of the IC chip 201 and the island 213 through the opening 229a.

Thereafter, the pulse motors 218a, 218b
Is rotated in the reverse direction, the two guide rails 211 and 212 approach the lead frame L # F, and the gap between the both guide rails and the side end of the lead frame L # F is set to an optimum value.

Next, a magazine M accommodating a large number of the lead frames L リ ー ド F is loaded on the loader 202, and the stocker guide 227b and the regulating members 228c and 228c are loaded.
The position adjustment of 28d is performed by a manual operation of an operator, and the magazine M is regulated. At this time, the position of the regulated magazine M is adjusted in the width direction so that the lead frame L # F protruding from the magazine M smoothly enters between the guide rails 211 and 212. This position adjustment is performed by the operator appropriately turning the knob 225 (see FIG. 20) to adjust the position of the elevating mechanism base 223 on which each of the restricting members is mounted. In addition, adjustment is performed so as to provide a gap between each of the regulating members 228a to 228d and the magazine M, so that the lifting / lowering operation of the magazine M by the lifting / lowering mechanism 222 is performed smoothly.

On the other hand, the same adjustment as for the loader 202 is performed.
This is also performed for the unloader 209.

Thus, the adjustment of the transport path is completed.

The above-described adjustment of the transport path is performed by changing the type of the lead frame L # F (magazine M) to be transported, by changing the guide rails 211 and 212 and the regulating members 228a to 228a to 212c.
This is performed to adjust the interval of 228d. In addition, when the heater plate 205 is replaced, a relative displacement between the island fitting concave portion 205a provided on the heater plate 205 and the island 213 occurs. Also, the conveyance path is adjusted in the same procedure as described above. However, in this case, it is not the distance between the guide rails and between the regulating members that is adjusted, but
a, the guide rails 211 and 212 and the regulating members 228a to 228a
28d are all shifted in the same direction by the relative position shift. In addition, each regulation member 228a-228d
In order to shift them in the same direction, an operator turns the above-mentioned knob 225 (see FIG. 20) appropriately to adjust the position of the lifting mechanism base 223 on which the respective regulating members are mounted.

[0022]

As described above, in the conventional substrate transport apparatus and substrate transport path adjusting method, the type of the lead frame L＼F to be transported is changed or the heater plate 205 is replaced. In order to make the concave portion 205a of the heater plate 205 and the island 213 of the lead frame coincide with each other, adjustment work by a manual operation of an operator must be performed, which gives the operator an annoying feeling and requires much time. There is a disadvantage of spending. Therefore, the present invention has been made in view of the above-described drawbacks of the related art, and has as its object to provide a substrate transfer apparatus and a substrate transfer path adjustment method that can complete adjustment of a transfer path quickly and easily. I have.

[0023]

SUMMARY OF THE INVENTION A substrate transport apparatus according to the present invention is arranged so as to be able to freely contact with and separate from each other to move a substrate along a predetermined path.
A guide member for guiding, and driving each of the guide members
A guide member driving means for moving the guide member,
That the board can be guided by engaging with the board.
First detecting means for detecting, and the base of each of the guide members.
Arranged in the guide direction of the board to accommodate multiple substrates
Substrate storage means, and the substrate of each of the guide members
The substrate accommodating means is arranged side by side in the width direction.
Regulation parts that can be regulated at the same time
Material and a regulating member for driving and moving each of the regulating members
The driving amount of the driving unit and the regulating member driving unit is set to a desired value.
When the control member detects that the substrate has been
Second detecting means for detecting that the vehicle has reached a position where it can be regulated
A substrate transfer device comprising: a step;
The means may include at least one of the guide members.
The first detection means is driven from a set reference position.
Turn to the other guide member until the step detects the substrate
After the first detecting means detects the substrate,
Synchronize the guide members and move them in the same direction to
Positioning the substrate in the width direction of the predetermined path,
The restricting member driving unit is configured to control the reference position of the guide member.
The restricting members based on the amount of movement from
Move in the direction close to each other until the detection means detects
Position of the substrate storage means with respect to the width direction of the predetermined path.
It is to make a decision . In addition, the substrate transport path adjusting method according to the present invention includes a guide member that is disposed so as to be able to freely contact and separate from each other.
Guide the substrate along a predetermined path, and each of the guide members
Is moved by driving the guide member driving means,
A member is engaged with the substrate and can guide the substrate.
The first detecting means detects that the vehicle has reached the
Substrate storage means disposed in the direction of guiding the substrate of each material
A plurality of the substrates are arranged and accommodated by the guide members.
The substrate is arranged in the guide direction of the substrate and accommodated in the substrate.
Means can be regulated in the width direction, and can be freely moved toward and away from each other
Each of the plurality of regulating members is driven by the regulating member driving means.
To move the regulating member drive means to a desired value.
The control unit detects that the control unit has reached the position by the second detection unit.
That the material has reached a position where the substrate storage means can be regulated.
A method for adjusting a substrate transfer path, comprising detecting the guide member drive.
The moving means reserves at least one of the guide members.
The first detection is performed by driving from the set reference position.
Until the means detects the substrate, it is turned to the other guide member.
And the first detecting means detects the substrate.
Later, the guide members are synchronized and moved in the same direction.
Position the substrate in the width direction of the predetermined path.
The regulating member driving means is configured to control the reference
The regulating members are connected to each other based on the amount of movement from the position.
Move in the direction approaching each other until the detection means of 2
Then, the substrate accommodating unit moves in the width direction of the predetermined path.
This is to perform positioning . Also, the width of the predetermined path
The substrate positioned with respect to the direction between the regulating members.
And the regulating member is positioned such that the regulating surface of the regulating member is forward.
At a position separated by a preset value from the side edge of the substrate
It is for positioning.

[0024]

Next, a description will be given of a wire bonding apparatus provided with a substrate transfer apparatus according to the present invention.

As shown in FIG. 1, in the wire bonding apparatus, a loader 2 and an unloader 3 on which a magazine M is loaded are provided on a gantry 1 thereof. Each magazine M functions as a substrate storage unit that arranges and stores a plurality of lead frames L # F as substrates, and is detachable from the loader 2 and the unloader 3. The lead frame before bonding is stored in the magazine M loaded on the loader 2, and the bonded lead frame is stored in the magazine M on the unloader 3.

A heater plate 5 is provided at a position between the loader 2 and the unloader 3. As shown in FIG. 2, the heater plate 5 is overheated by the heater block 6 and carries a lead frame L＼F supplied from a magazine M on the loader 2. As shown in FIG. 2, an IC chip (semiconductor) 8 is mounted on the lead frame L @ F, and more specifically, in the longitudinal direction of the lead frame L @ F (the direction perpendicular to the paper). They are mounted side by side at multiple pitches.

As shown in FIG. 2, a recess is formed in the lead frame L # F, and the IC chip 8 is mounted on the recess as an island 9. The configuration of the concave island 9 is employed for the purpose of thinning a semiconductor component as a product obtained by performing resin molding or the like after bonding is completed. Therefore, as shown in the figure, the heater plate 5 is provided with the recess 5 so that the island 9 fits during the bonding operation.
a (also shown in FIG. 1).

As shown in FIGS. 1 and 2, above the heater plate 5, a bonding means 11 is provided. The bonding means 11 connects the lead 10 (see FIG. 11) formed on the lead frame L # F positioned on the heater plate 5 and the IC chip 8 mounted on the lead frame L # F. Bonding connection is performed using a conductive wire.

As shown in FIG. 1, in front of the loader 2,
A push mechanism 13 for projecting the lead frames L フ レ ー ム F in the magazine M loaded on the loader 2 one by one in accordance with the operation of the loader 2 is provided. The push mechanism 13 includes a motor 13a, a male screw 13b rotationally driven by the motor 13a, and a nut (not shown) screwed to the male screw, and reciprocates in the direction of arrow A by rotation of the male screw 13b. And a pusher 13c which engages with the rear end of the lead frame L # F during the forward movement and pushes it out of the magazine M.

Further, a lead frame L＼F protruded from the magazine M on the loader 2 by the push mechanism 13 to the side of the heater plate 5 is brought up to the heater plate 5. A feed mechanism 14 for feeding the magazine 3 to the vicinity of the magazine M is provided.

Further, behind the heater plate 5, the lead frame L # F sent to the vicinity of the magazine M on the unloader 3 by the feed mechanism 14 is supplied to the magazine M.
There is provided a push mechanism 15 to be housed inside. The push mechanism 15 includes a pusher 15a that engages with the rear end of the lead frame L # F and pushes the pusher 15a.
a reciprocating cylinder 15b as shown by arrow B
Consisting of

The above-described push mechanisms 13 and 15 and the feed mechanism 14 are collectively referred to as frame transfer means.

The loader 2 is moved by the frame transfer means described above.
A transport path for preventing the meandering of the lead frame L＼F transported from the upper magazine M to the magazine M on the unloader 3 and performing highly accurate transport is set, and the transport path is It is defined by a pair of guide rails 17 and 18 as guide members arranged corresponding to both sides of the lead frame L # F.

The two guide rails 17 and 18 are relatively close to and separated from each other as shown by arrows C and D so that they can correspond to various lead frames having different widths. It is adjustable. Guide member driving means 21 and 22 for moving the guide rails 17 and 18 respectively are provided, and both guide rails 17 and 18 are moved by the operation of the guide member driving means 21 and 22. Close to and away from ＼F. These guide member driving means 2
Reference numerals 1 and 22 denote pulse motors 21a and 22a fixed on the gantry 1 of the apparatus, male screws 21b and 22b connected to the output shafts of the respective pulse motors and rotated, and fixed to both guide rails 17 and 18. The external threads 21b, 22b
And nuts (not shown) screwed into the respective members.

Various sensors 25 to 29 are provided on the guide rails 17 and 18 described above. These sensors are composed of, for example, reflection type optical sensors.

The sensor 25 provided near the front end of the guide rail 17 determines whether the lead frame L # F to be subjected to bonding has been projected from the magazine M on the loader 2 by the operation of the push mechanism 13, that is,
This is for detecting the presence or absence of the lead frame L # F. The sensor 26 disposed near the rear end of the guide rail 17 determines whether or not the lead frame L # F that has completed bonding has been carried out of the heater plate 5 by the push mechanism 15, that is, in the magazine M on the unloader 3. It is provided to confirm that it has been stored in. A sensor 27 provided on the guide rail 17 so as to be located on the side of the heater plate 5
Is the lead frame L on the heater plate 5.
This is for confirming the position of ＼F.

The remaining two sensors 28 and 29 are used to detect that the two guide rails 17 and 18 are engaged with the lead frame L # F and can reach the lead frame L # F. These are collectively referred to as first detecting means. More specifically, as shown in FIG. 2, the guide rails 17 and 18 are provided at right angles to each other and have two receiving surfaces 17a, 17b and 18a to be brought into contact with the lower surface and the side end of the lead frame L フ レ ー ム F, respectively. , And 18b, so that the emitted light and the reflected light from the lead frame L # F are located in a plane including the vertical receiving surfaces 17b and 18b among these receiving surfaces. Are located. Therefore, the guide rails 17 and 18 are formed with holes 17c and 18c which open at the intersections of the receiving surfaces 17a and 17b and 18a and 18b.
And 29 are inserted through the holes 17c and 18c.

The pulse motors 21a and 22 are driving force generating means of the guide member driving means 21 and 22 for moving the guide rails 17 and 18, respectively.
If a is provided with an encoder as a signal generating means for generating a pulse signal corresponding to each operation amount, that is, a rotation angle, the sensors 28 and 29 described above can be dispensed with.

That is, if the two guide rails 17 and 18 are engaged with the lead frame L # F to sandwich the lead frames L # F, no further movement is possible, so that a pulse signal from the encoder cannot be obtained. . In this state, the pulse motor is stopped as detection. At this time, it is preferable that the pulse motor is reversely rotated by the number of pulses after the pulse motor is stopped, in consideration of the fact that each pulse motor rotates several pulses extra due to its inertia.

Next, the loader 2 and the unloader 3 arranged so as to sandwich the above-mentioned guide rails 17 and 18 will be described. However, since the loader 2 and the unloader 3 have a completely symmetrical configuration, only one of the loaders 2 will be described in detail to avoid complication of the drawings.

As shown in FIG. 1, the loader 2 has a lifting mechanism base 31 on which the lifting mechanism base 31 is mounted.
An elevating mechanism (not shown) is provided. The lifting mechanism is
The magazine M is lowered or raised by the arrangement pitch of the lead frames L # F in order to protrude the lead frames L # F arranged and accommodated in the magazine M one by one by the operation of the push mechanism 13. is there.

A pair of linear regulating members 33 and 34 are provided on the elevating mechanism base 31 so as to be substantially aligned in series with the guide rails 17 and 18 in the lead frame guiding direction. These two regulating members 33, 34
Are used to engage with the left and right sides of the magazine M to regulate the width in the width direction. As shown by arrows F and G, the magazine M is relatively close to and separated from each other, and the interval between the two is adjustable. It has become. Further, regulating member driving means 35 and 36 for moving the regulating members 33 and 34, respectively, are provided, and the regulating members 33 and 34 are moved toward and away from each other by the operation of the regulating member driving means 35 and 36. . These restricting member driving means 35 and 36 include pulse motors 35a and 36a fixed on the elevating mechanism base 31, and male screws 35b and 36b which are connected to the output shafts of the respective pulse motors and driven to rotate. Nuts (not shown) fixed to the regulating members 33 and 34 and screwed to the male screws 35b and 36b, respectively.

Before and after the restricting member 33, another two
Two regulating members 38 and 39 are provided. These restricting members 38 and 39 are for engaging the front and rear ends of the magazine M and restricting them in the longitudinal direction. One restricting member 38 is fixed to the rear end of the restricting member 33. The other regulating member 39 is attached to the front end of the regulating member 33 so as to be able to approach and separate from the regulating member 38 as shown by an arrow H. And, this regulating member 39
Is provided on the regulating member 33. The regulating member driving means 41 includes a pulse motor 41a fixed to the regulating member 33, and a male screw 4 connected to the output shaft of the pulse motor 41a and rotationally driven.
1b and a nut (not shown) fixed to the regulating member 39 and screwed to the male screw 41b. Each of the pulse motors 35a, 36a, and 41a includes an encoder (not shown) that emits a pulse signal according to the rotation angle of each. These encoders are provided with the respective regulating members 3
3, 34 and 39 function as second detecting means for detecting that the magazine M has reached a position where the magazine M can be regulated.

As shown in FIG. 3, each of the aforementioned sensors 25
2 to 29 are sent to a control unit (hereinafter referred to as a CPU) 47 which controls the operation of the wire bonding apparatus, and the CPU 47 sends these signals, a keyboard 48 and an image pickup device 49 (also shown in FIG. 2). Shown)
In response to the transmitted signal, each pulse motor 21a,
The motors 22a, 35a, 36a, 41a, the motor 13a, the cylinder 15b, the feed mechanism 14, and the bonding means 11 are operated at a timing described later.

Next, the operation when the type of the lead frame L # F to be handled in the wire bonding apparatus having the above configuration is changed will be described with reference to FIGS. In this case, the CPU 47 (see FIG. 3) is a ROM (Read Only Memory) 5
The work procedure information input in advance to 0 is read out, and based on this, the operation control is performed according to the flowcharts shown in FIGS. Also, as described later, the RAM (Rand)
om Access Memory) 51, and stores the information. 4 and 5 show a series of flowcharts divided into two. Further, as described above, the loader 2 and the unloader 3 have the same configuration and operate in the same manner. Therefore, only the operation of one loader 2 will be described.

First, when a command signal is issued by operating the keyboard 48 (see FIG. 3) or the like, the CP
U47, as shown in FIG.
2a, 35a, 36a and 41a are respectively rotated in the reverse direction to move the respective regulating members 33, 34 and 39 and the two guide rails 17 and 18 in the direction away from each other, to the movement limit positions set as the respective reference positions. Positioning is performed (shown as step S1 in FIG. 4).

In this state, as shown in FIG. 1, the lead frame L # F to be newly handled is
It is placed by the operator between the positions 7 and 18, that is, on the heater plate 5.

Subsequently, the pulse motor 22a for driving one guide rail 18 is rotated forward, and this guide rail 18 moves toward the other guide rail 17, as indicated by the arrow in FIG. When the lead frame L # F pushed to the guide rail 17 side by the guide rail 18 is detected by the sensors 28 and 29, it is stopped based on the detection signals issued from the sensors (steps S2 to S4). ). As a result, the lead frame L # F is sandwiched between the guide rails 17 and 18 from the side.

Thereafter, one pulse motor 21a is rotated forward and the other pulse motor 22a is rotated reversely (step S5), and as shown by arrows in FIG. 7, both guide rails 17 and 18 are moved in the same direction. The lead frame L # F is moved synchronously at the same resolution and the same speed, and is stopped when the center in the width direction of the lead frame L # F coincides with the center 53 of the predetermined path to guide the lead frame L # F. (Steps S6 and S7). In this case, the center 53 of the predetermined path refers to the center of the concave portion 5a formed in the heater plate 5.

Note that, as described above, the lead frame L＼F
When the two guide rails 17 and 18 are moved in the same direction so that the center in the width direction of the guide rails coincides with the center 53 of the predetermined path, the amount of movement of the two guide rails 17 and 18 is determined by one of the guides performed as a pre-process. If the movement amount of the rail 18 only from the reference position to the stop position is W (see FIG. 6), it is set to W / 2 (see FIG. 7).

When the positioning of the lead frame L # F is completed as described above, the pulse motors 21a and 22
are slightly rotated in reverse (Step S8). Thereby, as shown in FIG.
An optimum gap δ is provided between the vertical receiving surfaces 17b, 18b provided on the base 18 and both ends of the lead frame L # F, and the lead frame L # F can be transported. In addition,
As shown in FIG. 10, for example, the sensor 28 is installed such that the optical axis 28 a of the irradiation light is at the position of δ from the receiving surface 17 b of the guide rail 17. Is detected, the operation of returning the guide rail to provide the gap δ is unnecessary. The same applies to the sensor 29 provided on the other guide rail 18.

When the positioning of the lead frame L # F is completed as described above, the respective regulating members 33, 34, and 39 for regulating the magazine M are operated as described below to perform the positioning. Lead frame L＼
It is positioned at a position corresponding to F, that is, a position where the magazine M can be regulated.

First, the pulse motors 35a and 36a are respectively rotated forward (step S9), and a pair of regulating members for regulating the magazine M so as to sandwich it from the side as shown by arrows in FIGS. 33 and 34 are moved closer to each other by the same distance I (shown in FIG. 9) than the reference position shown by the solid line, and reach the regulation position shown by the two-dot chain line, that is, the position where the magazine M can be regulated. . However, at this point, the magazine M may not be loaded yet, or may be loaded. The fact that both regulating members 33 and 34 have reached this regulating position, that is, have moved the above-described distance I, means that each pulse motor 35
a, a pulse signal generated in accordance with the rotation angle of each pulse motor from an encoder (not shown) serving as a second detection means provided in the CPU 47 (see FIG. 3). ) Is confirmed by counting (step S10). When this confirmation is made, both pulse motors 35a and 36a are stopped (step S11).

Here, a method of obtaining the distance I will be described.

In FIG. 9, the distance J between both regulating members 33 and 34 is known since the regulating members 33 and 34 are at the preset reference positions before the mutual approach operation is performed. Therefore, the distance I is obtained by subtracting the width dimension K of the magazine M to be regulated from this J and dividing the remainder by two.

For the magazine M to be regulated,
Since the one that can accommodate the positioning lead frame L # F already mounted on the heater plate 5 is selected, knowing the width N of the lead frame L # F allows the width K to be determined. Can be requested. That is, in FIG. 9, the symbol Q indicates the thickness of the side wall of the magazine M (also shown in FIG. 12), and the thickness Q is variously aligned in correspondence with various lead frames. The dimensions are substantially the same for each magazine. Therefore, the width K is a value obtained by adding twice the thickness Q to the width N of the lead frame L＼F.

The width dimension N of the lead frame L # F can be obtained from the result of the operation amount of the two guide rails 17 and 18 performed in the previous step.

That is, in FIG. 2, since the guide rails 17 and 18 are located at a preset reference position before the proximity operation is performed, the distance between them, in this case, the distance T between the respective receiving surfaces 17b and 18b is Is known. As shown in FIG. 6, when one guide rail 18 moves W toward the other guide rail 17 from the stationary state, the two guide rails sandwich the lead frame L す る F. The width N of the lead frame L＼F can be obtained as a value obtained by subtracting W from the distance T. The pulse motor 22a for operating the guide rail 18 includes an encoder that generates a pulse signal according to the rotation angle, and the above-described moving distance W
Is obtained by the CPU 47 (see FIG. 3) counting this pulse signal using a counter provided therein.

Summarizing the description so far, it is understood that the above-mentioned distance I is obtained as I = (J−T + W−2Q) / 2.

As shown in FIG. 3, the CPU 47 has an arithmetic circuit 47a for performing an operation based on this equation. The CPU 47 calculates W from the rotation angle of the pulse motor 22a and substitutes it into the equation. Pulse motor 35 based on
a, 36a to rotate both regulating members 33, 34 to the distance I.
Only to reach the regulation position.

When the positioning of both regulating members 33 and 34 is completed as described above, each of the pulse motors 35a and 36
a are both slightly rotated backward (step S12). Thereby, the magazine M to be regulated and both regulating members 3
A suitable gap (not shown) is provided between the first and second nipples 3 and 34.

Subsequent to or in parallel with the above-described positioning operation of the regulating members 33 and 34, the regulating member 39 for regulating the magazine M in the longitudinal direction is positioned. As described above, the regulating member 39 and the regulating member driving means 41 for driving the regulating member 39 are connected to the regulating member 33.
Attached to. In such a configuration, first, the pulse motor 41a is rotated forward (step S13),
As shown by the arrows in FIGS. 8 and 9, the regulating member 39 moves toward the regulating member 38 (also attached to the regulating member 33) as the other fixed side, and as shown in FIG. The magazine M reaches a regulation position where the magazine M can be regulated.

The fact that the regulating member 39 has reached the regulating position indicates that a pulse signal generated by an encoder (not shown) as second detecting means provided in the pulse motor 41a in accordance with the rotation angle of the pulse motor 41a. (Shown in FIG. 3) is counted by a counter (not shown) provided therein (step S14). Then, when this is confirmed, the pulse motor 41a is stopped (step S15).

The movement distance until the above-mentioned regulating member 39 reaches the regulating position for regulating the magazine M is obtained as follows.

That is, as shown in FIG. 9, if the distance between the respective regulating surfaces of the regulating members 38 and 39 before movement is U and the length of the magazine M is V, the movement distance is expressed by UV. can get. Before the movement, the regulating member 39 is at a preset reference position, so the distance U is known. And
Since the length V of the selected magazine M is also known, U-
V is determined.

The CPU 47 calculates the value of this UV,
The pulse motor 41a is rotated based on the calculation result, and the regulating member 39 is brought to the regulating position.

When the regulating member 39 is positioned as described above, the pulse motor 41a is slightly rotated reversely (step S16). Thereby, an appropriate gap (not shown) is provided between the magazine M to be regulated and the regulating members 38 and 39. Thus, Magazine M
Is vertically movable (movable in a direction perpendicular to the paper surface) in a state surrounded by a gap by each of the regulating members 33, 34, 38, and 39, and the lifting / lowering operation of the magazine M by a lifting mechanism (not shown) is performed. It becomes possible.

By the above series of operations, the center in the width direction of the lead frame L # F to be newly handled and the magazine M accommodating the lead frame L # F is the center 53 of the predetermined path for guiding the lead frame L # F, that is, the heater. The plate 5 is aligned with the center of the concave portion 5a. As shown in FIG. 2, when the center of the island 9 of the lead frame L # F coincides with the center of the lead frame L # F in the width direction, the center of the island 9 is located at the center of the predetermined path. Matches 53.

By the way, as shown in FIGS. 11 and 12, the side end of the lead frame L $ F and the inner wall surface of the magazine M are connected so that the lead frame L # F can be smoothly projected and stored in the magazine M. Between them, a gap having a maximum of e ₁ is generated. Therefore, as shown in the figure, when the lead frame L # F is housed in one side in the magazine M, even if the center of the magazine M in the width direction coincides with the center 53 of the predetermined path as described above, The center 54 (shown in FIG. 11) of the island 9 provided on the lead frame L # F in the magazine M is shifted from the center 53 of the predetermined path by e _{1/2 and} does not coincide. In this case, the following operation is performed following the above operation to correct the deviation.

The above description is based on the premise that each lead frame L # F does not have the above-described displacement in the magazine M. As described above, when each lead frame L フ レ ー ム F is shifted to one side in the magazine M, the lead frame L＼F is placed on the inner wall surface of the magazine M.
Since the side ends of the lead frame L are in contact with each other, there is a concern that the projecting and storing operation of the lead frame L @ F may not be smooth. Will be Although this correction operation is not shown in the flowcharts of FIGS. 4 and 5, specifically, the pulse motors 35a and 36a are slightly rotated in synchronization with each other, and the two regulating members 33 and 34 are moved in the same direction. Then, the magazine M is moved in the direction in which the deviation is corrected.

Note that, as shown in FIG.
Center 54 may lead frame L\F formed offset by e ₂ with respect to the width direction center 55 of the lead frame, performs the correction operation as shown below in this case, the island 9 of Center 54 is the center 53 of the predetermined route
Do to match.

[0072] That is, this case becomes the offset by e _2/2 from the center 53 of the center 54 and predetermined path of the island 9, to correct the shift amount, the pulse motor 21
a and 35a are rotated forward while the other pulse motor 2
2a and 36a are rotated in reverse, so that each of the regulating members 33 and 34 and both guide rails 17, 1
8 are synchronously moved at the same resolution and at the same speed in the same direction as shown in FIG.
When the center in the width direction of F and the magazine M is shifted from the center 53 of the predetermined path by e _1/2 , that is, when the center 54 of the island 9 coincides with the center 53 of the predetermined path (Steps S17 to S17). S19).

It should be noted that the center 53 of the island 9 coincides with the center 53 of the predetermined path, that is, the center of the concave portion 5 a of the heater plate 5.
(See FIGS. 2 and 3).
47 (shown in FIG. 3),
This is performed by the operator himself watching a microscope (not shown) arranged above the heater plate 5 and a monitor television (not shown) connected to the imaging device 49.

Thus, the lead frame L to be handled
Adjustment of the transport path according to ＼F is completed.

When the positions of the magazine M and the lead frame L # F are set as described above, the CPU 47 (see FIG. 3) sets the positions, specifically, the restriction members 33, 3
4 and 39 and the set positions of the guide rails 17 and 18 are input to the RAM 51 and stored. Then, when the same type of lead frame L # F is handled again, the stored information is taken out and the position is set immediately.

When the adjustment in the frame width direction is completed as described above, the setting of the feed of the lead frame L # F in the direction along the predetermined path is performed according to the following procedure.

First, the feed mechanism 14 (see FIG. 1) is operated, and the lead frame L # F is fed by a minute distance.
In this state, the CPU 47 or the operator himself confirms the image obtained by the imaging device 49 in the same manner as in the above-described adjustment in the frame width direction, and the obtained image includes a crosshair ( Cross line) is projected at the same time.

First, the sent lead frame L #
It is confirmed that the tip of F has reached the intersection of the crosshairs, and this coordinate position is stored in the RAM 51 as a first reference.

Next, one end from the leading end of the lead frame L # F.
It is confirmed that the center of the island 9 has reached the intersection of the crosshairs, and this coordinate position is used as a second reference in the RAM 51.
To memorize.

Then, it is confirmed that the center of the second island 9 from the tip has reached the intersection of the crosshairs, and the lead frame L＼F feed amount from the second reference to this point is calculated and obtained. To be stored in the RAM 51. The calculated feed amount corresponds to the pitch between adjacent islands 9. The feed amount is obtained by monitoring the operation amount of the feed mechanism 14 using an encoder (not shown) or the like. In addition to the above, the feed amount from the first island 9 to the second island 9 is calculated and immediately obtained as a pitch. The average pitch may be obtained by dividing the feed amount from the first island to the Nth island, that is, the value obtained by dividing the center-to-center distance between the two islands by N-1.

After the above, the lead frame L # F is fed until the rear end reaches the intersection of the crosshairs, and the total feed amount from the first reference to this point is stored in the RAM 51. This total feed amount is the total length of the lead frame L＼F.

The set values stored in the RAM 51 as described above are read out from the stored information and reproduced as needed.

In this embodiment, each regulating member 3
The reference positions at the time of operation of the guide rails 3, 34 and 39 and the guide rails 17 and 18 are set at or near the movement limit positions in the direction in which the regulating members 33 and 34 and the guide rails 17 and 18 are separated from each other. However, in addition to this, if there is a lead frame that has been transported before an arbitrary position, for example, a lead frame to be newly handled, a position matching the previous lead frame and the magazine containing the lead frame is set as a new reference position. It is also possible to obtain a position that matches the appropriate lead frame and magazine by arithmetic processing based on this original reference position.

Further, without setting the reference position as described above, it is also possible to adjust the transport path while tracking the position of the guide rail or the like based on the image or the like obtained by the image pickup device 49.

In this embodiment, one of the guide rails 17 and 18 is moved in the same direction so that the center in the width direction of the lead frame L # F coincides with the center 53 of the predetermined path. While the guide rail 17 is fixed and only the other guide rail 18 is moved, the guide rail 17 may be fixed and the guide rail 17 may be moved, or both guide rails 17 and 18 may be moved. May be operated together.

Further, in this embodiment, a sensor as a first detecting means for detecting that the guide rails 17 and 18 are engaged with the lead frame L # F and can be guided therefrom. 28, 29, each regulating member 33,
An encoder (not shown: provided with each of the pulse motors 35a, 36a, 41a) for detecting that the 34, 38, 39 has reached a position where the magazine M can be regulated is provided. Is performed using the imaging device 49 or the like, the sensors and encoders are unnecessary.

In the present embodiment, when a certain kind of lead frame is handled, the heater plate 5 needs to be replaced, and the replacement causes the recess 5a of the heater plate to become the lead frame L フ レ ー ム F. In the case where a deviation has occurred from the island 9, it is only necessary to move the regulating members 33, 34 and the guide rails 17, 18 in the same direction to perform the operation of matching the island 9 with the concave portion 5 a, The adjustment is very quick and easy.

In this embodiment, the adjustment of the transport path of the lead frame in the wire bonding apparatus is described. However, it is noted that the present invention is applicable to other apparatuses, substrates, and substrate storage means. Nor.

Next, a wire bonding apparatus provided with a substrate transfer device according to a second embodiment of the present invention will be described with reference to FIGS. 1 to 1 except for the parts described below.
Since the configuration is the same as that of the wire bonding apparatus shown in FIG. 4, the description of the entire apparatus will be omitted and only the main part will be described. 1 to 1 in the following description.
The same reference numerals are used for the same components as those of the wire bonding apparatus shown in FIG.

As shown in FIG. 15, in the wire bonding apparatus, sensors 43, 44, and 45 are respectively provided on regulating members 33, 34, and 39 for regulating a magazine M serving as a substrate housing means. I have. These sensors serve as second detecting means for detecting that each of the regulating members 33, 34 and 39 has reached a position where the magazine M can be regulated. Therefore, each of the pulse motors 35a, 36a, and 41a for operating each of the regulating members 33, 34, and 39 may not include an encoder. These sensors 43 to 45 are composed of, for example, reflection type optical sensors. As shown in FIG. 16, detection signals emitted from the respective sensors are sent to the CPU 47.

The sensors 43 to 45 described above are attached to the regulating members 33, 34 and 39 as follows. Since the configuration of mounting these three sensors is the same, only the mounting state of the sensor 43 will be described as a representative.

As shown in FIG. 17, the sensor 43 is fixed to the distal end of a rod 62a of an air cylinder 62 mounted on the outer surface of the regulating member 33 via a bracket 61. An opening 33a is formed in the regulating member 33, and the rod 62a is inserted through the opening. Therefore, the sensor 43 detects the regulating surface 33b of the regulating member 33 by performing the rod 62a. Position (shown by a solid line) and an opening 33 separated by a predetermined distance from
a between a storage position (indicated by a two-dot chain line) which is immersed in a.

As shown in the drawing, when the sensor 43 is at the above-mentioned protruding position, the optical axis 43a of the irradiation light emitted from the sensor 43 is provided at a position apart from the regulating surface 33b of the regulating member 33 by a distance α. Have been. This distance α is
The thickness is set to be equal to or slightly larger than the thickness Q of the side wall of the magazine M. However, this slightly is a gap e ₃ which may arise between the side edges of the lead frame L\F accommodated to the inner surface of the side wall of the magazine M.

In the above configuration, the sensor 43 detects the side edge of the lead frame L # F and issues a detection signal. As shown by the arrow in FIG. 17, the magazine M performs an elevating operation. During this elevating operation, the rod 62a of the air cylinder 62 is retracted, and the sensor 43 is accommodated in the opening 33a, and the magazine M which elevates and descends. Do not interfere with each other.

Each of the pulse motors 3 serving as driving force generating means included in the regulating member driving means 35, 36 and 41 for moving the regulating members 33, 34 and 39, respectively.
If each of the sensors 5a, 36a and 41a is provided with an encoder as a signal generating means for generating a pulse signal corresponding to the operation amount, that is, the rotation angle, the above sensors 43, 44 and 45 are not required. Can be done.

That is, each of the regulating members 33, 34 and 39
If they are engaged with the lead frames L フ レ ー ム F, respectively, and cannot be moved further, the pulse signals from the encoder cannot be obtained. In this state, the pulse motor is stopped as detection. At this time, it is preferable that the pulse motor is reversely rotated by the number of pulses after the pulse motor is stopped, in consideration of the fact that each pulse motor rotates several pulses extra due to its inertia. Thereafter, each of the regulating members 33, 34 and 39
The pulse motors 35a, 36a, and 41a are rotated in reverse so that is returned to the regulation position for regulating the magazine M.

Next, the operation when the type of the lead frame to be handled in the wire bonding apparatus having the above configuration is changed will be described with reference to FIGS. In addition, the lead frame L # F for positioning is placed on the heater plate 5 by the operator, and the lead frame L # F is
The operation up to positioning with respect to the center 53 of the predetermined path by the operation of FIG. 8 is the same as that of the wire bonding apparatus according to the first embodiment shown in FIGS. Only the following will be described. Therefore, the flow chart shown in FIG. 18 to represent the operation of the second embodiment follows the step S8 in the flow chart of the apparatus of the first embodiment shown in FIGS.

When the lead frame L # F is positioned with respect to the center 53 of the predetermined path, first, the air cylinder 62 shown in FIG. 17 performs the projecting operation, and the sensor 43 is moved to the projecting position. Further, the other two sensors 44 and 45 are similarly moved to the protruding positions. Then, the feed mechanism 14 (see FIG. 15) is operated (step S9 ′), and the lead frame L＼F placed between the guide rails 17 and 18 is moved, and as shown in FIG. It reaches a position surrounded by members 33, 34, 38 and 39. Thereafter, the pulse motors 35a and 36
a and 41a are respectively rotated forward (step 10).
′), The two regulating members 33 and 34 for regulating the magazine M from the side and the regulating member 39 for regulating in the longitudinal direction are moved in directions approaching each other as shown by arrows in FIG. Reach controllable position. However, each of the sensors 43 to 45 is connected to each of the regulating members 33 and 34.
At this time, the magazine M is not loaded, and the control members 33, 3
It is loaded after the positioning of 4, 39 is completed.

The fact that each of the regulating members 33, 34, 38 and 39 has reached the regulating position is confirmed by the detection signals being sent from the sensors 43 to 45 (step S11).
´). When this confirmation is made, each pulse motor 3
5a, 36a, and 41a are stopped (step S12).
´).

When the positioning of each of the regulating members 33, 34 and 39 is completed as described above, each pulse motor 35
a, 36a and 41a are slightly rotated in reverse (Step S13 '). Thereby, an appropriate gap is provided between the magazine M to be regulated and each regulating member 33, 34, 38, 39. In this manner, the magazine M is surrounded by the regulating members 33, 34, and 39 with a gap therebetween, so that the magazine M can be raised and lowered by a lifting mechanism (not shown).

By the above-described series of operations, the center of the lead frame L # F to be newly handled and the center of the magazine M accommodating the lead frame L # F are aligned with the center 53 of the predetermined path for guiding the lead frame L # F, ie, the heater. Plate 5
Are aligned with the center of the concave portion 5a. In this state,
The magazine M is loaded in the space defined by the above-mentioned respective regulating members 33, 34, 38 and 39.

Thereafter, if necessary, correction of misalignment, setting of feed, and the like are performed in the same manner as in the wire bonding apparatus of the first embodiment described above.

[0103]

As described above, according to the present invention,
Adjustment of the transport path can be performed automatically, quickly, and easily, which has the effect of reducing the burden on the operator.

[Brief description of the drawings]

FIG. 1 is a plan view of a main part of a wire bonding apparatus including a substrate transfer device according to a first embodiment of the present invention.

FIG. 2 is a view on arrow PP of FIG. 1;

FIG. 3 is a block diagram showing an operation control system of the device shown in FIG. 1;

FIG. 4 is a flowchart showing the operation of the apparatus shown in FIG.

FIG. 5 is a flowchart showing the operation of the apparatus shown in FIG.

FIG. 6 is an operation explanatory diagram of the apparatus shown in FIGS. 1 and 2;

FIG. 7 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 8 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 9 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 10 is a longitudinal sectional view showing a modified example of a part of the device shown in FIGS. 1 and 2;

FIG. 11 is an explanatory diagram of the operation of the apparatus shown in FIGS. 1 and 2;

FIG. 12 is an operation explanatory diagram of the device shown in FIGS. 1 and 2;

FIG. 13 is a plan view of another example of a lead frame to be handled in the device shown in FIGS. 1 and 2;

FIG. 14 is a diagram illustrating the operation of the device shown in FIGS. 1 and 2;

FIG. 15 is a plan view of a main part of a wire bonding apparatus including a substrate transfer device according to a second embodiment of the present invention.

FIG. 16 is a block diagram showing an operation control system of the device shown in FIG.

FIG. 17 is a longitudinal sectional view of a part of the device shown in FIG. 15;

FIG. 18 is a flowchart showing the operation of the device shown in FIG.

FIG. 19 is an explanatory diagram of the operation of the device shown in FIG. 15;

FIG. 20 is a plan view of a main part of a wire bonding apparatus including a conventional substrate transfer apparatus.

FIG. 21 is a plan view of a portion of the apparatus shown in FIG.

FIG. 22 is a view taken in the direction of arrows LL in FIG. 21;

[Description of sign]

DESCRIPTION OF SYMBOLS 1 Stand 2 Loader 3 Unloader 5 Heater plate 5a Depression 8 IC chip 9 Island 11 Bonding means 13,15 Push mechanism 14 Feed mechanism 17,18 Guide rail (guide member) 21,22 Guide member drive means 25,26,27,28 , 29, 43, 44, 45 Sensors 33, 34, 38, 39 Restriction members 35, 36, 41 Restriction member driving means 47 CPU 49 Imaging device

Claims (3)

(57) [Claims] 1. A substrate which is arranged so as to be able to freely contact with and separate from each other, and
A guide member for guiding along a route, and a guide member driver for driving and moving each of the guide members
A step and the guide member may engage the substrate to guide the substrate.
A first detecting means for detecting that led to that state, before being arranged in the guiding direction of the substrate of the guide member each
A substrate accommodating means capable of arranging and accommodating a plurality of the substrates; and
The substrate storage means can be regulated in the width direction.
A plurality of regulating members that can be freely moved toward and away from each other, and a regulating member driving hand that drives and moves each of the regulating members.
Step and that the operation amount of the regulating member driving means has reached a desired value.
Upon detection, the regulating member can regulate the substrate storage means.
Second detecting means for detecting that the position has been reached.
In the substrate transfer device, the guide member driving unit includes at least one of the guide members.
Drive either one of them from a preset reference position.
Until the first detecting means detects the substrate,
The first detecting means is moved toward the
After detecting the board, the guide members are synchronized to the same direction
To the width direction of the predetermined path of the substrate.
Positioning is performed, and the regulating member driving unit is configured to control the reference position of the guide member.
The restricting members based on the amount of movement from
Move in the direction close to each other until the detection means detects
Position of the substrate storage means with respect to the width direction of the predetermined path.
A substrate transfer device for performing placement . 2. A guide member disposed so as to be able to contact and separate from each other.
Guide the substrate along a predetermined path, and each of the guide members
Is moved by driving the guide member driving means,
A member is engaged with the substrate and can guide the substrate.
The first detecting means detects that the vehicle has reached the
Substrate storage means disposed in the direction of guiding the substrate of each material
A plurality of the substrates are arranged and accommodated by the guide members.
The substrate is arranged in the guide direction of the substrate and accommodated in the substrate.
Means can be regulated in the width direction, and can be freely moved away from each other
Each of the plurality of regulating members is driven by the regulating member driving means.
To move the regulating member drive means to a desired value.
The control unit detects that the control unit has reached the position by the second detection unit.
That the material has reached a position where the substrate storage means can be regulated.
A substrate transport path adjusting method for detecting, wherein the guide member driving unit includes at least one of the guide members.
Drive either one of them from a preset reference position.
Until the first detecting means detects the substrate,
The first detecting means is moved toward the
After detecting the board, the guide members are synchronized to the same direction
To the width direction of the predetermined path of the substrate.
The positioning member driving means performs the positioning,
The regulating member based on the amount of movement of the material from the reference position
Close to each other until the second detection means detects them.
In the direction of the predetermined path of the substrate storage means.
Substrate transport characterized by positioning in the width direction
Route adjustment method. 3. The positioning in the width direction of the predetermined path.
Protruding between the regulating members, and
The member is set in such a manner that the regulating surface of the regulating member is
Positioning at a position separated by the set value.
3. The method for adjusting a substrate transfer path according to claim 2, wherein: