JP2830212B2 - Hybrid integrated circuit - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid integrated circuit, and more particularly to a high-power hybrid integrated circuit in which heat generation of heat-generating components is improved.

2. Description of the Related Art Conventionally, a hybrid integrated circuit in this field generally has a configuration as shown in a perspective view of FIG. 9 and a cross-sectional view of FIG. In FIG. 9, reference numeral 1 denotes a wiring board made of a metal substrate such as aluminum or copper, and reference numerals 2 to 5 denote heat-generating components having large self-heating, such as a power semiconductor 2, such as a power MOS FET, a thyristor 3, a chip capacitor 4, and the like. Chip resistor 5
And so on. Reference numeral 6 'denotes a resin case, and 7' denotes a through hole for attachment to an external radiator. Hereinafter, this conventional example will be described. A power semiconductor 2, a thyristor 3, a chip capacitor 4, and a chip resistor 5, which are heat-generating components, are mounted on the wiring board 1, and the periphery of the wiring board 1 is bonded and fixed to a resin case 6 'with an adhesive. The heat generated was dissipated through the wiring board 1 by an external radiator (not shown).

Problems to be Solved by the Invention In the above-mentioned conventional hybrid integrated circuit, when heat generated by heat-generating components is large, a large external radiator must be used, which is expensive, and the inside of the case is hollow. Therefore, there were drawbacks such as insufficient airtightness.

The present invention solves such a problem and efficiently dissipates heat from a heat-generating component to the outside, and can reduce or eliminate the need for an external radiator by reducing thermal resistance. To provide a hybrid integrated circuit that significantly improves the performance of the hybrid integrated circuit.

Means for Solving the Problems In order to solve the above problems, the present invention provides an aluminum plate having a U-shaped cross section, a wiring board having good thermal conductivity provided on a bottom surface inside the aluminum plate, A heat-generating component provided on the substrate and an aluminum plate having a U-shaped cross section disposed in contact with the back surface of the wiring board, and having an end portion and a back surface of the wiring substrate having heat conductivity. The adhesive is fixed on the inner bottom surface of the aluminum plate with a good adhesive, and the gap between the upper surface of the wiring board and the inner top surface of the aluminum plate is filled with resin.

According to the configuration of the present invention, the heat generated from the heat-generating component is transmitted to the aluminum plate via the wiring board and the adhesive, and is radiated from the aluminum plate to the outside. Therefore, an external heat sink is not required. Furthermore, since the gap between the wiring board and the aluminum plate as in the conventional example is filled with the resin, sufficient airtightness can be obtained.

Embodiment Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

(Embodiment 1) FIG. 1 is a partially cutaway perspective view of a hybrid integrated circuit according to an embodiment, FIG. 2 is a cross-sectional view of the hybrid integrated circuit, and FIG. 3 is an enlarged cross-sectional view of a portion A in FIG. It is. In the figure, reference numeral 1 denotes a wiring board, which is formed by forming a thin insulating layer on a metal substrate having excellent heat conductivity such as aluminum and copper, and further forming an electric wiring pattern. Reference numeral 2 denotes a power semiconductor, such as a power MOS FET, which generates a large amount of heat, and is mounted on a thick copper plate. Thyristor 3, chip capacitor 4, chip resistor 5
Electronic components such as the electronic component are mounted on the wiring board 1. 6 is an aluminum plate having a U-shaped cross section and a concave portion on its inner bottom surface.
6b is provided. The concave portion 6b is adhered to a contact portion between the end surface 7 of the wiring board 1 and the back surface 8 of the wiring board 1 via an adhesive 9 having good thermal conductivity, and furthermore, the upper surface of the wiring board 1 and the inner top surface of the aluminum plate. A resin 10 such as epoxy having a good thermal conductivity is filled between them.

Heat generated from the power semiconductor 2, the thyristor 3, the chip capacitor 4, and the chip resistor 5 is radiated outside through the wiring board 1 and the aluminum plate 6. This situation will be described with reference to the transient thermal resistance curve of FIG. This characteristic diagram is a measurement of the temperature rise that occurs in the wiring board 1 when a constant power is applied. In the conventional example, the thermal resistance is 10.0 ° C./W one minute after the start of the load, and 25 ° C. in the steady state. ° C / W, whereas in the embodiment according to the present invention the aluminum plate 6
The heat is released to the outside and the temperature rise is suppressed by the heat conduction by the filled resin 10. Therefore, the temperature is 3 ° C / W in 1 minute after the load starts, and 11.2 ° C / W in the steady state, which is 1/2 of the conventional example.
It is improved below.

As described above, the transient thermal resistance and the steady thermal resistance can be reduced, and an external radiator can be eliminated or reduced in size.

Further, by filling the resin 10, the airtightness can be greatly improved, and the length of the wiring board 1 and the length of the aluminum plate 6 are made the same to constitute a small hybrid integrated circuit as a whole. .

(Embodiment 2) Next, a second embodiment will be described with reference to FIGS. 5, 6, and 7. FIG. In this embodiment, the aluminum plate 6
The length of the aluminum plate 6 is made longer than that of the wiring board 1.
An external heat radiator 13 is provided on at least one of the outer surfaces of the device via an electric insulating sheet 12 having good thermal conductivity. Resin 10,
The electric insulating sheet 12 and the external radiator 13 also have through holes at positions corresponding to the through holes 11 of the aluminum plate 6, respectively.
13 is fixed using screws 14 '.

In this embodiment, the heat generated from the wiring board 1 can be dissipated through the external radiator 13 and the heat radiation efficiency is improved. The size of the external radiator 13 can be changed for the wiring board 1 that generates a large amount of heat.

As shown in FIG. 7, an electrically insulating bushing 14 made of resin may be fitted into the through-hole 11 to provide electrical insulation between the aluminum plate 6 and the external radiator 13.

Third Embodiment A third embodiment will be described with reference to FIG. In this embodiment, the radiation fins are provided outside the aluminum plate 6.
By providing 15, the surface area of the aluminum plate 6 can be increased and the heat radiation efficiency can be improved.

As described above, according to the present invention, a part of the end face and the back face of the wiring board constituting the hybrid integrated circuit are bonded on the inner bottom face of the U-shaped aluminum plate with the adhesive having good thermal conductivity. And
Furthermore, by filling a resin with good thermal conductivity between the upper surface of the wiring board and the inner top surface of the aluminum plate, the heat generated from the heat-generating components is dissipated from above and below the U-shaped aluminum plate to the outside. You can do it. For this reason,
Transient thermal resistance, steady thermal resistance can be greatly reduced,
In addition, the temperature rise of the heat-generating components can be further suppressed, and the wiring board and the aluminum plate can be integrated, so that it is possible to provide a small-sized, large-power hybrid integrated circuit that generates a large amount of heat. Becomes

[Brief description of the drawings]

1 is a partially cutaway perspective view of a hybrid integrated circuit according to a first embodiment of the present invention, FIG. 2 is a sectional view of the same, FIG. 3 is an enlarged sectional view of a main part of FIG. 2, and FIG. FIG. 5 is a transient thermal resistance characteristic diagram, FIG. 5 is a perspective view of the hybrid integrated circuit of the second embodiment, FIG. 6 is a sectional view of the hybrid integrated circuit, and FIG. FIG. 8 is a perspective view of a hybrid integrated circuit of the third embodiment, FIG. 9 is a partially cutaway perspective view of a conventional hybrid integrated circuit, and FIG. FIG. 1 ... wiring board, 2-5 ... heat-generating components (power MOS FE
T and other power semiconductors, thyristors, chip capacitors,
Chip resistance), 6 ... U-shaped aluminum plate, 6b ...
Recessed part, 7 ... end face, 8 ... back face, 9 ... adhesive, 10 ...
Resin, 11: Through-hole, 12: Electrical insulation sheet, 13: External radiator, 14: Bushing, 14 ': Screw, 15: Heat radiation fin.

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-48-79976 (JP, A) JP-A-61-156754 (JP, A) JP-A-59-18495 (JP, U) JP-A-46 30728 (JP, Y1) (58) Fields investigated (Int. Cl. ⁶ , DB name) H05K 1/02 H05K 7/20

Claims (5)

(57) [Claims] An aluminum plate having a U-shaped cross section, a wiring board having good thermal conductivity provided on a bottom surface of the aluminum plate, a heat-generating component provided on the wiring board,
The cross section disposed in contact with the back surface of the wiring board is formed of a U-shaped aluminum plate, and the end and the back surface of the wiring board are bonded on the inner bottom surface of the aluminum plate with an adhesive having good thermal conductivity. And a gap between the upper surface of the wiring board and the inner top surface of the aluminum plate is filled with a resin. 2. The hybrid integrated circuit according to claim 1, wherein the length of the wiring board is equal to the length of the aluminum plate. 3. The aluminum plate is made longer than the wiring substrate by providing a through hole in the aluminum plate and the resin, and an external radiator is screwed on the back surface of the wiring substrate via the aluminum plate. 2. The hybrid integrated circuit according to claim 1, wherein said hybrid integrated circuit can be fixed by a fixed member. 4. A through hole is provided in an aluminum plate and a resin.
2. The hybrid integrated circuit according to claim 1, wherein an electrically insulating bushing is fitted into said through hole, and said aluminum plate and said external radiator can be electrically insulated and fixed by screws through said bushing. 5. The hybrid integrated circuit according to claim 1, wherein projecting radiating fins are provided on a part of the outside of the aluminum plate.