JP2810182B2 - Structure of hybrid integrated circuit components - Google Patents

Description

The present invention relates to a single substrate made of a composite inductor formed by a laminated structure of a magnetic material and a conductor, or at least one of a composite inductor and a composite capacitor or a composite resistor. The present invention relates to a structure of a hybrid integrated circuit component provided with a composite substrate on which a heel is superimposed.

(Prior Art) FIG. 4 is a cross-sectional view showing a conventional hybrid integrated circuit component of this kind, and a composite inductor in which a plurality of inductors are formed by laminating a magnetic body 1 and a coil conductor 2 by a printing method or the like. 3 (a transformer may be formed in the composite inductor 1, but in this specification, the transformer is represented by an inductor, and the description of the transformer is omitted);
And a conductor 5 for electrodes are laminated by a printing method or the like, and a composite capacitor 6 constituting a plurality of capacitors is superimposed, and this superimposed body is used as an integrated substrate. One or more electronic components 7A,
It is equipped with 7B. Reference numeral 8 denotes a terminal electrode which is a conductor formed on the side surface of the laminate, and connects between built-in inductors, capacitors or electronic components 7A and 7B, and a predetermined terminal electrode 8 is provided on a mother board (not shown). Soldered. Reference numeral 9 denotes a conductor pattern for connecting the terminals 10 of the electronic components 7A and 7B to the terminal electrodes 8 and the like.

(Problems to be Solved by the Invention) In such a hybrid integrated circuit component, the electronic component 7A
Or, when 7B generates radiated noise such as a switching element, the radiated noise is transmitted to peripheral components, causing malfunction of peripheral circuits or disturbance of signals. In the case of electronic components that generate such radiation noise, measures such as covering the element and circuit causing the noise with a shield case or disposing them at a distance from peripheral circuits are taken. There is a problem that the size of the device is increased.

The present invention has been made in view of the above problems, and has as its object to provide a structure of a hybrid integrated circuit component in which the influence of radiation noise on peripheral circuits is minimized.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a single substrate composed of a composite inductor formed by a laminated structure of a magnetic material and a conductor, or a composite inductor and a composite capacitor or a composite. In a hybrid integrated circuit component comprising a composite substrate having at least one of resistors superimposed thereon, an opening penetrating the substrate in a thickness direction is provided, and an electronic component generating radiated noise is accommodated in the opening, and the opening is provided. A short ring for shielding radiation noise is provided along the inner diameter of the.

(Operation) Since the present invention has the above-described structure, radiation noise generated in the electronic component housed in the opening is converted into a current by the short ring and is consumed.

(Embodiment) FIG. 1 is a sectional view showing an embodiment of a structure of a hybrid integrated circuit component according to the present invention, and FIG. 2 is a plan view of the embodiment.
1 and 2, reference numeral 11 denotes a mother substrate,
An electronic component 7 such as a transistor that generates radiation noise is fixedly attached to the conductor pattern 12 formed on the mother board 11 on the mother board 11. The composite inductor 3 is provided with an opening 13 which penetrates in the thickness direction substantially at the center, accommodates the electronic component 7 in the opening 13, and forms a predetermined portion of the terminal electrode 8 on the side surface of the substrate made of the composite inductor 3. Is fixed to the conductor pattern 12 by soldering or the like. Further, a short ring 14 is formed on the inner diameter of the opening 13 by a method such as printing a conductor in a laminated structure or laminating a sheet-shaped conductor.

With such a structure, noise radiated from the electronic component 7 is converted into a current flowing back to the short ring 14 and is consumed.

Further, in the present invention, an electronic component that does not substantially generate radiation noise may be mounted on the substrate made of the composite inductor 3, but as in the present embodiment, the electronic component 7 is connected to the opening 13.
In a configuration in which only the components are housed inside, the thickness T of the entire component is only the thickness of the composite inductor 3, and a reduction in thickness is achieved.

FIG. 3 shows another embodiment of the present invention, in which an opening 13 is provided in a composite inductor 3 in which a composite capacitor 6 is integrally superimposed as in the previous embodiment, and radiation noise is generated in the opening 13. The electronic component 7 is accommodated. Also,
In the present embodiment, the terminals 10 of the electronic component 7 are soldered not to the conductor patterns 12 on the mother board 11, but to the conductor patterns 9 formed on a board made of a laminate.

The present invention can be applied not only to the above-described embodiment but also to a composite inductor 3 having a composite resistor superimposed thereon, or a laminate of FIG. 3 in which a composite resistor is further superimposed.

(Effects of the Invention) According to the present invention, an opening penetrating a substrate made of a laminate in the thickness direction is provided, an electronic component generating radiated noise is accommodated in the opening, and the opening is formed along the inner diameter of the opening. Since the short ring is provided to shield the radiated noise, transmission of the radiated noise to peripheral components is prevented, and malfunction of the circuit or disturbance of the signal is prevented. Also, according to the present invention, compared to the case where a shield case is covered as in the related art or a measure such as taking a distance from a peripheral circuit is taken,
Since the short ring can be provided integrally with the laminate, the size of the entire circuit can be reduced.

[Brief description of the drawings]

1 is a sectional view showing an embodiment of a hybrid integrated circuit component according to the present invention, FIG. 2 is a plan view of the embodiment, FIG. 3 is a sectional view showing another embodiment of the present invention, and FIG. FIG. 2 is a cross-sectional view showing the structure of a conventional hybrid integrated circuit component. 1: magnetic body, 2: conductor for coil, 3: composite inductor, 4: dielectric, 5: conductor for electrode, 6: composite capacitor, 7: electronic component, 8:
Terminal electrode, 9, 12: conductor pattern, 10: terminal, 11: mother board, 13: opening, 14: short ring

Claims (1)

(57) [Claims] 1. A hybrid integrated circuit component comprising a single substrate composed of a composite inductor formed by a laminated structure of a magnetic substance and a conductor, or a composite substrate in which a composite inductor and at least one of a composite capacitor and a composite resistor are superimposed. An opening that penetrates the substrate in the thickness direction, an electronic component that generates radiation noise is accommodated in the opening, and a short ring that shields the radiation noise along the inner diameter of the opening is provided. The structure of the hybrid integrated circuit component characterized by the above.