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JP2899781B2 - Resonance tag - Google Patents

Resonance tag

Info

Publication number
JP2899781B2
JP2899781B2 JP5354105A JP35410593A JP2899781B2 JP 2899781 B2 JP2899781 B2 JP 2899781B2 JP 5354105 A JP5354105 A JP 5354105A JP 35410593 A JP35410593 A JP 35410593A JP 2899781 B2 JP2899781 B2 JP 2899781B2
Authority
JP
Japan
Prior art keywords
resin coating
circuit
resin
metal foil
resonance tag
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP5354105A
Other languages
Japanese (ja)
Other versions
JPH07200954A (en
Inventor
晋弥 内堀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MYAKE KK
Original Assignee
MYAKE KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP5354105A priority Critical patent/JP2899781B2/en
Application filed by MYAKE KK filed Critical MYAKE KK
Priority to AT94120960T priority patent/ATE440480T1/en
Priority to EP94120960A priority patent/EP0665705B1/en
Priority to DE69435230T priority patent/DE69435230D1/en
Priority to US08/366,548 priority patent/US5645932A/en
Publication of JPH07200954A publication Critical patent/JPH07200954A/en
Priority to US08/820,874 priority patent/US6383616B1/en
Priority to US08/898,077 priority patent/US6214444B1/en
Priority to JP32453798A priority patent/JP3455898B2/en
Application granted granted Critical
Publication of JP2899781B2 publication Critical patent/JP2899781B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V15/00Tags attached to, or associated with, an object, in order to enable detection of the object

Landscapes

  • Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Geophysics (AREA)
  • Burglar Alarm Systems (AREA)

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、検知装置から発信され
る特定の周波数の電波に共振する回路を備えた共振タグ
に関するものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resonance tag provided with a circuit that resonates with a radio wave of a specific frequency transmitted from a detection device.

【0002】[0002]

【従来の技術】既に知られているように、共振タグは特
定の周波数の電波に共振する回路を備えたタグで、この
共振タグを特定の周波数の電波が発せられている領域内
に存在させると共振によって検知装置のブザーや警告ラ
ンプを作動させることができる。そのため、百貨店、デ
ィスカウントストアー、ビデオレンタル店、CDショッ
プ等では、この共振タグを商品等に取り付け、万引き防
止等に利用している。この共振タグは、レジでの代金決
済の際に取り外されるか共振回路が破壊されるが、顧客
が代金を支払わず、この共振タグを商品に取りつけたま
ま特定の検知装置を装備したゲートを通過するとブザー
やランプ等により警告が発せられるようになっている。
2. Description of the Related Art As is already known, a resonance tag is a tag provided with a circuit that resonates with a radio wave of a specific frequency, and this resonance tag is present in an area where a radio wave of a specific frequency is emitted. Due to the resonance, the buzzer and the warning lamp of the detection device can be operated. Therefore, in a department store, a discount store, a video rental store, a CD shop, and the like, the resonance tag is attached to a product or the like and used to prevent shoplifting and the like. This resonance tag is removed or the resonance circuit is destroyed at the time of payment at the cash register, but the customer does not pay the price and passes through the gate equipped with the specific detection device with this resonance tag attached to the product Then, a warning is issued by a buzzer, a lamp, or the like.

【0003】共振タグは、基本的には、誘電体としての
プラスチックフィルムと、該フィルムの少なくとも一面
に形成された螺旋状(コイル状)回路と、他面に形成さ
れたコンデンサ電極板用回路またはコンデンサを兼ねた
螺旋状回路とからなっており、必要に応じて紙等の基材
シート上に積層されている。典型的な共振タグの一例を
図6示す。図中、22は誘電体としてのプラスチックフィ
ルム、23は金属箔より形成された螺旋状回路、24は金属
箔よりなるコンデンサ電極板用回路を示す。螺旋状回路
23は図に示すように、一端にコンデンサ電極板部23A、
他端に回路端子部23Bが形成されており、これに対応す
るようにコンデンサ電極板用回路24にもコンデンサ電極
板部24Aと回路端子部24Bが形成されており、プラスチ
ックフィルム22を挟んで形成されている回路端子部23B
と24Bは圧接等の物理的手段でプラスチックフィルム22
層を破壊して接続されて共振回路が構成され、共振タグ
21が作られる。図6の例のほかに、螺旋状回路の端部に
コンデンサ電極板部を形成せず、プラスチックフィルム
の両面に螺旋状回路を形成し、プラスチックフィルムを
挟んで回路が互いに対応するように形成することによっ
て回路自体にコンデンサ電極板の役割を持たせたものも
提案されている。
A resonance tag is basically composed of a plastic film as a dielectric, a spiral (coil-shaped) circuit formed on at least one surface of the film, and a circuit for a capacitor electrode plate formed on the other surface. It is a spiral circuit that also serves as a capacitor, and is laminated on a base sheet such as paper as necessary. FIG. 6 shows an example of a typical resonance tag. In the figure, 22 is a plastic film as a dielectric, 23 is a spiral circuit formed of metal foil, and 24 is a circuit for a capacitor electrode plate made of metal foil. Spiral circuit
23 is a capacitor electrode plate 23A at one end as shown in the figure,
A circuit terminal portion 23B is formed at the other end, and a capacitor electrode plate portion 24A and a circuit terminal portion 24B are also formed in the capacitor electrode plate circuit 24 to correspond to the circuit terminal portion 23B. Circuit terminal section 23B
And 24B are plastic films 22 by physical means such as pressure welding.
The layers are destroyed and connected to form a resonance circuit, and the resonance tag
21 is made. In addition to the example shown in FIG. 6, a spiral circuit is formed on both sides of a plastic film without forming a capacitor electrode plate at the end of the spiral circuit, and the circuits are formed so as to correspond to each other with the plastic film interposed therebetween. Accordingly, a circuit in which the circuit itself has a role of a capacitor electrode plate has been proposed.

【0004】共振回路は、抵抗R、インダクタンスLお
よび静電容量(コンデンサ容量)Cから構成され、コン
デンサ容量Cは誘電体であるプラスチック(樹脂)フイ
ルムとその両面に形成される螺旋状回路等の金属箔とで
形成され、抵抗Rは回路を形成する金属箔によって形成
される。これらのことから、共振タグに求められる所定
の共振周波数を得るためには非常に正確な寸法とその公
差を得ることが可能な素材構成でなければならない。
A resonance circuit is composed of a resistance R, an inductance L and an electrostatic capacitance (capacitor capacitance) C. The capacitor capacitance C is a plastic (resin) film as a dielectric and a spiral circuit formed on both surfaces thereof. The resistor R is formed by a metal foil forming a circuit. From these facts, in order to obtain a predetermined resonance frequency required for a resonance tag, a material configuration capable of obtaining extremely accurate dimensions and their tolerances is required.

【0005】[0005]

【発明が解決しようとする課題】上記の理由から、螺旋
状回路は、従来は通常誘電体としてのプラスチックフィ
ルムの片面または両面にアルミ箔等の金属箔を積層した
ものを素材とし、印刷配線板の製法と同様にして、プラ
スチックフィルム上の金属箔に耐エッチング性インクを
所定パターンに印刷して酸またはアルカリ等の薬液でエ
ッチングするか、またはフォトレジストエッチング法に
よって形成している。しかしながら、この薬液によるエ
ッチング法は金属箔が溶解するのに一定時間を必要とす
るほかエッチング液の廃棄処理などの問題を有してい
る。
For the above-mentioned reasons, a spiral circuit is conventionally made of a plastic film as a dielectric material, which is formed by laminating a metal foil such as an aluminum foil on one or both sides of a plastic film. In the same manner as in the above method, an etching resistant ink is printed on a metal foil on a plastic film in a predetermined pattern and etched with a chemical such as acid or alkali, or formed by a photoresist etching method. However, this etching method using a chemical solution requires a certain time for the metal foil to dissolve, and has problems such as disposal of the etching solution.

【0006】また、従来使用されている誘電体としての
プラスチックフィルムは、通常ポリエチレン等の押し出
し成形フィルムなどが使用されているが、成型ダイのス
リット幅や樹脂の押し出し圧など種々の調整条件を有す
ることから、成形上厚さの下限が限定されることと、厚
みの公差に限界があるという問題点を有している。これ
らのプラスチックフィルムと金属箔との積層は、押し出
し成形した半溶融状態の樹脂フィルムを金属箔に熱圧接
着する方法と成形されたフィルムを接着剤で金属箔に貼
り合わせる方法とがあるが、いづれも誘電体層にばらつ
きが生じ易い方法である。また、成形プラスチックフィ
ルムは被膜性が強いため、共振回路形成のためのプラス
チックフィルムの表面と裏面の回路を接続させるのが容
易でないとか、更に共振回路の破壊(共振特性の消去)
も容易でないという問題をも有する。
Conventionally, as a plastic film used as a dielectric, an extruded film of polyethylene or the like is usually used, but it has various adjustment conditions such as a slit width of a forming die and an extruding pressure of a resin. Therefore, there is a problem that the lower limit of the thickness in forming is limited, and there is a limit in tolerance of the thickness. Lamination of these plastic films and metal foil, there is a method of hot-pressing the extruded semi-molten resin film to the metal foil and a method of bonding the formed film to the metal foil with an adhesive, Any of these methods is likely to cause variations in the dielectric layer. Also, since the molded plastic film has a strong coating property, it is not easy to connect the circuits on the front and back surfaces of the plastic film for forming the resonance circuit, or furthermore, the resonance circuit is destroyed (erasing the resonance characteristics).
It is also not easy.

【0007】本発明は上記従来の問題点を解決するため
のもので、製造が容易でかつ共振特性の安定した共振タ
グを提供せんとするものである。
An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a resonance tag which is easy to manufacture and has stable resonance characteristics.

【0008】[0008]

【課題を解決するための手段】上記課題を解決するため
に、本発明者らは鋭意検討を重ねた結果、従来より使用
されている成形樹脂フィルムに代えて樹脂液の塗布方法
によって誘電体層を形成するとともに、該樹脂塗膜を接
着剤として使用して金属箔回路を貼り合わせることによ
って、所望の厚さの誘電体層を得ることができ、それに
よって共振周波数特性に優れた共振タグが得られること
を見出して本発明を完成した。
Means for Solving the Problems In order to solve the above-mentioned problems, the present inventors have conducted intensive studies and as a result, the dielectric layer has been formed by a method of applying a resin liquid instead of a conventionally used molded resin film. And by bonding the metal foil circuit using the resin coating film as an adhesive, a dielectric layer having a desired thickness can be obtained, whereby a resonance tag having excellent resonance frequency characteristics can be obtained. The inventors have found that the present invention can be obtained and completed the present invention.

【0009】したがって本発明の共振タグは、回路状
(コイル状)の金属箔を樹脂液の塗布によって形成され
た誘電体樹脂塗膜の両面または片面に貼り合わせたこと
を特徴とするものである。本発明において誘電体樹脂塗
膜は、コイル状金属箔と同じコイル形状であっても良
く、またコイル状金属箔の外周形状の大きさとほぼ同じ
大きさの面積形状を有する樹脂塗膜であっても良い。
Therefore, the resonance tag of the present invention is characterized in that a circuit-shaped (coil-shaped) metal foil is bonded to both sides or one side of a dielectric resin coating film formed by applying a resin liquid. . In the present invention, the dielectric resin coating may be the same coil shape as the coil-shaped metal foil, and is a resin coating having an area shape substantially equal to the size of the outer peripheral shape of the coil-shaped metal foil. Is also good.

【0010】具体的には、例えば、コイル状に抜く前の
金属箔の一面に樹脂塗膜を形成し、しかる後樹脂塗膜付
金属箔をコイル状に抜くことによってコイル状金属箔と
同じコイル形状の樹脂塗膜を形成してもよく、また離型
紙等の表面に樹脂液を塗布して樹脂塗膜を形成し、その
樹脂塗膜の表面にコイル状金属箔を貼り合わせ、離型紙
を剥離したのち離型紙側の樹脂塗膜面に裏面側のコイル
状金属箔を貼り合わせた構成としてもよい。このほか、
離型紙表面にコイル状金属箔を重ねその表面より液状樹
脂を塗布して樹脂塗膜を形成したのち、この樹脂塗膜上
にコイル状金属箔を貼り合わせても良い。
Specifically, for example, a resin coating film is formed on one surface of the metal foil before being drawn into a coil shape, and then the metal foil with the resin coating film is drawn into a coil shape. A resin film of a shape may be formed, or a resin liquid is applied to the surface of release paper to form a resin film, and a coil-shaped metal foil is attached to the surface of the resin film to form a release paper. After peeling, a coil-shaped metal foil on the back side may be bonded to the resin coating surface on the release paper side. other than this,
After a coil-shaped metal foil is laminated on the release paper surface and a liquid resin is applied from the surface to form a resin coating film, the coil-shaped metal foil may be bonded on the resin coating film.

【0011】本発明において使用される樹脂液として
は、それ自体液状、すなわちエポキシ樹脂などの無溶剤
型樹脂液でも良く、また溶剤によって溶解された溶液型
樹脂液でも良い。樹脂としては、塗布に適するもので優
れた誘電特性を有するものであれば使用でき、例えばポ
リオレフィンなどを挙げることができる。形成された樹
脂塗膜は、金属箔との貼り合わせの際に接着剤としての
役割を果たし得るものが好ましく、そのため熱接着性を
有するものがより好ましい。樹脂塗膜中には、必要に応
じ、塗膜の誘電特性を向上または改善させることができ
る充填剤等を含ませることができる。
The resin liquid used in the present invention may be a liquid itself, that is, a solventless resin liquid such as an epoxy resin, or a solution resin liquid dissolved by a solvent. As the resin, any resin suitable for application and having excellent dielectric properties can be used, and examples thereof include polyolefin. It is preferable that the formed resin coating film can function as an adhesive at the time of bonding with a metal foil, and therefore, a resin film having thermal adhesion is more preferable. In the resin coating film, if necessary, a filler or the like capable of improving or improving the dielectric properties of the coating film can be included.

【0012】樹脂塗膜はコイル状金属箔の片面である必
要はなく、両面に設けても良い。また、少なくとも一面
に樹脂塗膜を設けたコイル状金属箔を2枚以上重ねて貼
り合わせ、各層の金属箔を適当な手段で接続して、所望
の共振特性を得るようにしても良い。樹脂塗膜を形成す
るに当たり、樹脂液の塗布はロールコーティングによる
全面塗布でも良く、またグラビア印刷、シルクスクリー
ン印刷等により所定のパターンに塗布しても良い。また
更に、多色印刷方式により金属箔回路の一部に金属粉末
等の導電性充填剤を含む樹脂液を塗布し、この塗膜によ
って誘電体樹脂塗膜の表裏両面のコイル状金属箔を接続
して所望の共振回路を形成するようにしても良く、また
この導電性充填剤を含む樹脂塗膜を利用して共振回路の
破壊を容易にするようにしても良い。
The resin coating does not need to be on one side of the coiled metal foil, but may be provided on both sides. Alternatively, two or more coiled metal foils provided with a resin coating film on at least one surface may be laminated and bonded, and the metal foils of each layer may be connected by appropriate means to obtain desired resonance characteristics. In forming the resin coating film, the application of the resin liquid may be performed over the entire surface by roll coating, or may be performed in a predetermined pattern by gravure printing, silk screen printing, or the like. Furthermore, a resin solution containing a conductive filler such as metal powder is applied to a part of the metal foil circuit by a multicolor printing method, and this coating connects the coiled metal foils on both sides of the dielectric resin coating. Thus, a desired resonance circuit may be formed, or the resonance circuit may be easily broken using the resin coating film containing the conductive filler.

【0013】上記のようにして樹脂塗膜の両面に共振回
路としてのコイル状金属箔を貼り合わせた共振タグ基材
の少なくとも一面には、常法により紙、プラスチックフ
ィルムまたはシート等の支持体または装飾シートを貼り
合わせて目的とする共振タグを得ることができる。例え
ば、共振タグ基材の片面に接着剤で紙、プラスチックフ
ィルムを貼り合わせ、この基材の他面に粘着剤を塗布
し、その上面に離型紙を貼り合わせた構成とし、離型紙
を剥して直接商品に貼付できるようにした共振タグなど
とすることができる。従来誘電体としてポリエチレンフ
ィルムのような非接着性フィルムを使用していたため、
粘着剤によって支持体を貼り合わせる必要があったが、
本発明の場合には樹脂塗膜を使用するため、通常の接着
剤を使用することができる。
[0013] At least one surface of the resonance tag base material in which a coil-shaped metal foil as a resonance circuit is bonded to both surfaces of the resin coating film as described above, is provided with a support such as paper, plastic film or sheet by a conventional method. The desired resonance tag can be obtained by attaching the decorative sheet. For example, paper and a plastic film are adhered to one surface of the resonance tag base material with an adhesive, an adhesive is applied to the other surface of the base material, and a release paper is bonded to the upper surface, and the release paper is peeled off. It can be a resonance tag that can be directly attached to a product. Conventionally, since a non-adhesive film such as a polyethylene film was used as a dielectric,
Although it was necessary to attach the support with an adhesive,
In the case of the present invention, since a resin coating film is used, a normal adhesive can be used.

【0014】[0014]

【発明の効果】本発明は、誘電体層を樹脂液の塗布によ
って形成するため、従来の押し出し成形等によるプラス
チックフィルムに比べて厚み公差の点で格段に優れた誘
電体被膜を形成することができる。また、樹脂被膜を直
接接着剤として利用するため、従来プラスチックフィル
ムを接着剤を用いて貼り合わせていたのに対して、プラ
スチックフィルムと接着剤使用と起因する厚さのバラツ
キを避けることができる。さらに、樹脂を広い範囲で選
択でき、樹脂塗膜中に誘電特性を向上させることのでき
る充填剤等を任意の割合で配合することや2種以上の樹
脂を任意にブレンドすることができるため、共振周波数
特性の向上や、任意の柔軟性を有する共振タグを得るこ
とができる。このほか、本発明では金属箔の少なくとも
片面に樹脂塗膜を形成するため、金属箔をコイル状に抜
く等の作業が容易にできる。
According to the present invention, since the dielectric layer is formed by applying a resin liquid, it is possible to form a dielectric film which is far superior in thickness tolerance in comparison with a conventional plastic film formed by extrusion or the like. it can. Further, since the resin film is directly used as the adhesive, the thickness variation due to the use of the plastic film and the adhesive can be avoided as compared with the conventional case where the plastic film is bonded using the adhesive. Furthermore, since a resin can be selected in a wide range and a filler or the like capable of improving dielectric properties can be blended in an arbitrary ratio in a resin coating film or two or more resins can be arbitrarily blended, It is possible to improve the resonance frequency characteristics and obtain a resonance tag having any flexibility. In addition, in the present invention, since a resin coating film is formed on at least one surface of the metal foil, operations such as removing the metal foil in a coil shape can be easily performed.

【0015】[0015]

【実施例】以下、本発明の実施例を図面にしたがって説
明するが、本発明はこれらの例に限られるものではな
い。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments.

【0016】図1は、本発明の共振タグの一例を示す分
解斜視図で、誘電体層としての樹脂塗膜2がコイル状に
抜かれたアルミ箔3aと同じ形状で形成された例を示
す。図では、アルミ箔3aから離れた状態で樹脂塗膜2
が示されているが、アルミ箔に樹脂液が塗布され、アル
ミ箔3aと共にコイル状に打ち抜かれるためアルミ箔3
a面に樹脂塗膜2は一体的に形成されている。図中、3
bはコイル状のアルミ箔でアルミ箔3aとコイルの向き
が反対方向となるように重ねて樹脂塗膜2に貼り合わさ
れる。貼り合わせは、樹脂塗膜2が熱接着性樹脂である
場合には、アルミ箔3aと3bを重ね合わせた状態かま
たは更に支持体4を重ねて加熱圧着させる。本例の場
合、アルミ箔3bも同様に樹脂塗膜2が形成されてお
り、その下面に紙、プラスチックフィルム等の支持体4
を積層し、粘着剤5を塗布して離型紙6を貼る。他方、
アルミ箔3aの上面には粘着剤または接着剤7で紙8を
貼り合わせて、目的とする共振タグ1とする。紙8はそ
の下の共振回路の保護および回路を隠す目的で用いられ
ることから、商品や販売店の表示や宣伝文字等の印刷が
施される。
FIG. 1 is an exploded perspective view showing an example of the resonance tag of the present invention, and shows an example in which a resin coating film 2 as a dielectric layer is formed in the same shape as an aluminum foil 3a which is removed in a coil shape. In the figure, the resin coating 2 is separated from the aluminum foil 3a.
However, the resin solution is applied to the aluminum foil, and the aluminum foil 3a is punched in a coil shape together with the aluminum foil 3a.
The resin coating film 2 is integrally formed on the a surface. In the figure, 3
Reference numeral b denotes a coil-shaped aluminum foil, which is laminated on the resin coating 2 so as to overlap the aluminum foil 3a with the coil. When the resin coating film 2 is a heat-adhesive resin, the bonding is performed by heat-pressing the aluminum foils 3a and 3b in a state where they are overlapped or the support 4 is further stacked. In the case of this example, a resin coating film 2 is formed on the aluminum foil 3b in the same manner.
Are laminated, the adhesive 5 is applied, and the release paper 6 is attached. On the other hand,
A paper 8 is attached to the upper surface of the aluminum foil 3a with an adhesive or an adhesive 7 to obtain a target resonance tag 1. Since the paper 8 is used for the purpose of protecting the resonance circuit thereunder and concealing the circuit, the paper 8 is printed with a display of merchandise and a store, and advertising characters.

【0017】図2は本発明の他の実施例で、樹脂塗膜を
コイル状のアルミ箔3aの外周形状と同じ大きさの面積
の樹脂塗膜2aとした例である。その他の構成は図1と
同じであるので、同一符号を付して説明を省略する。本
例の場合、樹脂塗膜2aは平らなフィルム状に記載され
ているが、コイル状のアルミ箔面に樹脂液を全面塗布し
て塗膜を形成しても良いため、アルミ箔のコイルとコイ
ルの間に樹脂塗膜が存在する形状、すなわち平面上にコ
イル状の凸部を有する形とすることができる。このよう
にすることによって樹脂塗膜の表裏両面のアルミ箔の絶
縁性をより確実に確保することができる。
FIG. 2 shows another embodiment of the present invention, in which the resin coating is a resin coating 2a having the same size as the outer peripheral shape of the coiled aluminum foil 3a. Other configurations are the same as those in FIG. 1, and thus the same reference numerals are given and the description is omitted. In the case of this example, the resin coating film 2a is described as a flat film. However, since the coating film may be formed by applying a resin liquid on the entire surface of the coil-shaped aluminum foil, the coil may be formed of an aluminum foil coil. A shape in which a resin coating film exists between the coils, that is, a shape having a coil-shaped convex portion on a plane can be employed. By doing so, the insulation of the aluminum foil on both the front and back surfaces of the resin coating can be more reliably ensured.

【0018】図3は、コイル状の樹脂塗膜2と平面状の
樹脂塗膜2aを併用した例である。積層方法としては、
支持体4がプラスチックフィルムのような場合、片面に
コイル状樹脂塗膜2を設けたコイル状アルミ箔3bを該
樹脂塗膜2によって支持体4に貼り合わせ、次に樹脂塗
膜2の形成されてないアルミ箔3bの面側にコイルの間
に見える支持体4面をも含めて全面に樹脂液を塗布して
樹脂塗膜2aを形成しても良い。
FIG. 3 shows an example in which a coil-shaped resin coating 2 and a planar resin coating 2a are used in combination. As a lamination method,
When the support 4 is a plastic film, a coiled aluminum foil 3b provided with a coiled resin coating 2 on one side is bonded to the support 4 with the resin coating 2, and then the resin coating 2 is formed. A resin liquid may be applied to the entire surface of the aluminum foil 3b, including the surface of the support 4 visible between the coils, on the surface side of the uncoated aluminum foil 3b to form the resin coating film 2a.

【0019】図4は、多色印刷の手法を用いて樹脂塗膜
2の途中に、アルミ粉、銅粉等の導電性物質を混入した
導電性または半導電性樹脂塗膜2bを形成した例であ
る。本例ではアルミ箔回路の途中に設けているが、コイ
ルの最外部2cに導電性樹脂塗膜を線状に設けて樹脂塗
膜2の表裏面に積層した金属箔を導通させる接続点とし
ても良い。
FIG. 4 shows an example in which a conductive or semiconductive resin coating 2b mixed with a conductive substance such as aluminum powder and copper powder is formed in the middle of the resin coating 2 using a multicolor printing technique. It is. In this example, the conductive foil is provided in the middle of the aluminum foil circuit. However, a conductive resin coating may be linearly provided on the outermost surface 2c of the coil, and may be used as a connection point for conducting the metal foil laminated on the front and back surfaces of the resin coating 2. good.

【0020】図5は本発明の樹脂塗膜を設けたコイル状
アルミ箔を多数積層した場合の例で、本例の場合3枚の
アルミ箔3を積層している。なお、図中10は上下のア
ルミ箔を接合する位置を示す。このように多数接合する
ことによって、より小型で所定の共振特性を有する共振
タグを得ることができる。
FIG. 5 shows an example in which a large number of coiled aluminum foils provided with the resin coating of the present invention are laminated. In this example, three aluminum foils 3 are laminated. In the drawing, reference numeral 10 denotes a position where the upper and lower aluminum foils are joined. By joining a large number in this way, it is possible to obtain a smaller resonant tag having predetermined resonance characteristics.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の一例を示す分解斜視図である。FIG. 1 is an exploded perspective view showing an example of the present invention.

【図2】本発明の他の例を示す分解斜視図である。FIG. 2 is an exploded perspective view showing another example of the present invention.

【図3】本発明の別の例を示す分解斜視図である。FIG. 3 is an exploded perspective view showing another example of the present invention.

【図4】樹脂塗膜の一部に導電性樹脂塗膜を設けた例を
示す斜視図である。
FIG. 4 is a perspective view showing an example in which a conductive resin coating film is provided on a part of the resin coating film.

【図5】コイル状金属箔を多数積層した共振タグの例を
示す分解斜視図である。
FIG. 5 is an exploded perspective view showing an example of a resonance tag in which a number of coiled metal foils are stacked.

【図6】従来の共振タグの例を示す分解斜視図である。FIG. 6 is an exploded perspective view showing an example of a conventional resonance tag.

【符号の説明】[Explanation of symbols]

1 共振タグ 2 樹脂塗膜 3 アルミ箔 4 支持体 5 粘着剤 6 離型紙 7 接着剤 8 紙 DESCRIPTION OF SYMBOLS 1 Resonance tag 2 Resin coating film 3 Aluminum foil 4 Support body 5 Adhesive 6 Release paper 7 Adhesive 8 Paper

Claims (7)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】 少なくとも2枚の回路状の金属箔を合成
樹脂溶液の塗布によって形成された誘電体樹脂塗膜の両
面に金属箔面を互いに対向させて該樹脂塗膜によって貼
り合わせてなり、金属箔の間に形成される誘電体樹脂塗
膜の間に、導電性物質を混入した導電性塗膜を設けたこ
を特徴とする共振タグ。
At least two circuit-shaped metal foils are synthesized. A dielectric resin coating formed by applying a resin solution is bonded to both surfaces of the dielectric resin coating with the metal foils facing each other. The dielectric resin coating formed between the metal foils
A conductive coating with a conductive material mixed between the films
And a resonance tag.
【請求項2】 誘電体樹脂塗膜が回路状の金属箔の形状
と同じ形状で形成されていることを特徴とする請求項1
記載の共振タグ。
2. The circuit according to claim 1, wherein the dielectric resin coating film is formed in the same shape as the shape of the circuit-shaped metal foil.
The described resonance tag.
【請求項3】 誘電体樹脂塗膜が回路状の金属箔の外周
形状と同じ大きさの面積の形状で金属箔間に積層されて
いることを特徴とする請求項1記載の共振タグ。
3. The resonance tag according to claim 1, wherein the dielectric resin coating is laminated between the metal foils in a shape having the same area as the outer peripheral shape of the circuit-shaped metal foil.
【請求項4】 誘電体樹脂塗膜が熱接着性樹脂よりなる
ことを特徴とする請求項1ないし3のいずれか1項記載
の共振タグ。
4. The resonance tag according to claim 1, wherein the dielectric resin coating is made of a thermo-adhesive resin.
【請求項5】 樹脂塗膜を介して貼り合わされる回路
(コイル)状の金属箔の巻き方向が互いに異なる方向で
あることを特徴とする請求項1ないし3のいずれか1項
記載の共振タグ。
5. The resonance tag according to claim 1, wherein the winding directions of the circuit (coil) -shaped metal foils bonded via the resin coating film are different from each other. .
【請求項6】 金属箔の少なくとも一面に熱接着性誘電
体樹脂溶液を塗布して誘電体樹脂塗膜を形成し、該樹脂
塗膜付き金属箔を回路状に打ち抜き、該回路状の金属箔
と他の回路状金属箔とを重ね合わせて該樹脂塗膜によっ
て熱接着することを特徴とする共振タグの製造法。
6. A metal foil having a resin coating film is formed by applying a heat-adhesive dielectric resin solution to at least one surface of the metal foil, and the metal foil with the resin coating is punched into a circuit shape. A method for producing a resonance tag, comprising: laminating a resin foil with another circuit-shaped metal foil, and thermally bonding the resin foil with the resin foil.
【請求項7】 離型紙に回路状の金属箔の外周形状とほ
ぼ同じ大きさの合成樹脂塗膜を熱接着性誘電体樹脂溶液
を塗布して形成し、形成された該樹脂塗膜面に回路状の
金属箔を貼り合わせ、離型紙から該樹脂塗膜を剥離して
該樹脂塗膜の剥離した面に他の回路状金属箔を重ねて該
樹脂塗膜によって熱接着することを特徴とする共振タグ
の製造法。
7. A release paper is formed by applying a thermo-adhesive dielectric resin solution to a synthetic resin coating film having substantially the same size as the outer peripheral shape of the circuit-shaped metal foil. Laminating a circuit-shaped metal foil, peeling off the resin coating from the release paper, stacking another circuit-shaped metal foil on the peeled surface of the resin coating, and thermally bonding with the resin coating. Method of manufacturing resonant tags.
JP5354105A 1993-12-30 1993-12-30 Resonance tag Expired - Lifetime JP2899781B2 (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP5354105A JP2899781B2 (en) 1993-12-30 1993-12-30 Resonance tag
EP94120960A EP0665705B1 (en) 1993-12-30 1994-12-30 Circuit-like metallic foil sheet and the like and process for producing them
DE69435230T DE69435230D1 (en) 1993-12-30 1994-12-30 Composite foil with circuit-shaped metal foil or the like and method for the production
US08/366,548 US5645932A (en) 1993-12-30 1994-12-30 Circuit-like metallic foil sheet and the like and process for producing them
AT94120960T ATE440480T1 (en) 1993-12-30 1994-12-30 COMPOSITE FILM WITH CIRCUIT-SHAPED METAL FOIL OR THE LIKE AND METHOD FOR PRODUCING IT
US08/820,874 US6383616B1 (en) 1993-12-30 1997-03-20 Circuit-like metallic foil sheet and the like and process for producing them
US08/898,077 US6214444B1 (en) 1993-12-30 1997-07-22 Circuit-like metallic foil sheet and the like and processing for producing them
JP32453798A JP3455898B2 (en) 1993-12-30 1998-10-29 Resonance tag

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5354105A JP2899781B2 (en) 1993-12-30 1993-12-30 Resonance tag

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP32453798A Division JP3455898B2 (en) 1993-12-30 1998-10-29 Resonance tag

Publications (2)

Publication Number Publication Date
JPH07200954A JPH07200954A (en) 1995-08-04
JP2899781B2 true JP2899781B2 (en) 1999-06-02

Family

ID=18435330

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5354105A Expired - Lifetime JP2899781B2 (en) 1993-12-30 1993-12-30 Resonance tag

Country Status (1)

Country Link
JP (1) JP2899781B2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2739194B1 (en) * 1995-09-21 1997-10-31 Sermme Systemes Sarl METHOD AND DEVICE FOR PROTECTING ARTICLES AGAINST THEFT AND THEIR APPLICATIONS TO AUTOMATED BOOK LENDING

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CH677988A5 (en) * 1986-07-30 1991-07-15 Actron Entwicklungs Ag
JPH05326343A (en) * 1992-05-26 1993-12-10 Marcon Electron Co Ltd Monolithic solid electrolytic capacitor

Also Published As

Publication number Publication date
JPH07200954A (en) 1995-08-04

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