JP2893151B2 - Processing apparatus and cleaning method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for applying a processing liquid such as a resist liquid to a surface of a processing target such as a semiconductor wafer, and a cleaning method thereof .

[0002]

2. Description of the Related Art Conventionally, as a processing apparatus of this type, an object to be processed such as a semiconductor wafer is held on a spin chuck, a processing liquid is dropped on a central portion of the object to be processed, and then the spin chuck is rotated at a high speed. 2. Description of the Related Art There is known an apparatus for uniformly applying a processing liquid to a peripheral portion of an object to be processed by centrifugal force.

[0003] In this type of apparatus, the periphery of the spin chuck is surrounded by a cup (a container having an open top), and the processing liquid shaken off from the peripheral portion of the object rotating at high speed scatters to the outside. I was trying not to.

[0004] However, if the processing liquid is prevented from scattering to the outside by the cup, the inner surface of the cup is contaminated by the adhesion of the processing liquid. If this is left as it is, solutes that have been deposited from the processing solution will accumulate on the inner surface of the cup,
The processing liquid rebounds on the rough inner surface of the cup and re-adheres to the surface of the object to be processed, or solute fragments fly up due to convection in the device and adhere to the coating film, resulting in lower product yield. .

Therefore, in recent years, a processing apparatus provided with a means for cleaning the inside of the cup has been proposed. For example, a cleaning liquid is caused to flow down along the inner surface of the side wall of the cup surrounding the periphery of the spin chuck, and the bottom is formed in a conical shape. The cleaning liquid is caused to flow down along the slope from the center side of the raised portion (see Japanese Patent Application Laid-Open No. 57-45273), and the resist solution is discharged from a large number of holes provided at the top of the cup. And a drip along the inner peripheral surface of the cup (see JP-A-59-212226). Further, a corrugated wall surrounding the periphery of the spin chuck is provided in the cup, and the wall surface of the wall is provided. Through which the solvent of the treatment liquid is dropped (see Japanese Utility Model Publication No. 1-26655).
Etc. are known.

[0006]

By the way, recently,
As a cup structure of the processing apparatus, a cylindrical cup with a bottom (hereinafter referred to as an outer cup) for preventing the processing liquid from scattering as described above, and a workpiece holding portion of a spin chuck in the outer cup. 2. Description of the Related Art A double cup structure including an annular cup (hereinafter, referred to as an inner cup) provided so as to surround the periphery has been widely used. In such a cup having a double structure, it is necessary to wash not only the inner surface of the outer cup but also the outer surface of the inner cup.

[0007] However, the cleaning means provided in the above-mentioned conventional processing apparatus is for cleaning the inner peripheral surface or the bottom surface of the outer cup, and cannot be applied to the cleaning of the inner cup as it is. Therefore, there has been proposed a cleaning method in which a hole or a slit for discharging the cleaning liquid is provided in the inner cup and the cleaning liquid is supplied to the outer surface of the inner cup. However, when the cleaning liquid discharge holes and the like are provided in each of the outer cup and the inner cup, there is a problem that the cup structure becomes complicated.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and provides a processing apparatus provided with cleaning means capable of satisfactorily cleaning the inner surface of the outer cup and the outer surface of the inner cup with a simple structure, and a method of cleaning the same. It is intended for.

[0009]

In order to achieve the above object, the invention according to claim 1 comprises an inner cup and an outer cup.
Spin-coating the treatment liquid on the surface of the object to be treated in the cup
In the processing apparatus, the inner cup and the outer cup of the above cups
Cleaning liquid discharge section for discharging the cleaning liquid toward
A cleaning liquid supply source for supplying the cleaning liquid to the liquid discharge section, and the external
Control to allow the washing liquid to flow down to the inner surface of the
Control of spraying the cleaning liquid on the side of the tip
And a flow control means.

In the processing apparatus according to the first aspect ,
The cleaning liquid discharge part has an opening edge near the upper opening of the outer cup.
Formed with a large number of cleaning liquid discharge holes provided along
(Claim 2) or near the upper opening of the outer cup
Numerous cleaning liquid discharge holes provided alongside the opening edge
And a cleaning liquid discharge provided around these cleaning liquid discharge holes.
It is formed by a slit (claim 3). In this case, the cleaning liquid discharge slit may be located above or below the cleaning liquid discharge hole as long as it is provided in the vicinity of the cleaning liquid discharge hole, but is preferably provided below the cleaning liquid discharge hole. It is better to do.

The invention according to claim 4 is characterized in that the inner cup and
Treatment liquid is applied to the surface of the object to be treated in the cup consisting of the outer cup
In the cleaning method of the processing apparatus for spin-coating
A step of washing by flowing a washing solution down on the inner surface of the
Spraying a cleaning liquid onto the side surface of the inner cup for cleaning.
It is characterized by having.

The invention according to claim 5 is the same as the invention according to claim 4.
In the cleaning method of the processing apparatus described above, the inner surface of the outer cup
Washing the washing solution by flowing down the washing solution to the inner cup;
Cleaning process by spraying a cleaning solution on the side
It is characterized by the following.

[0013]

According to the first , second and fourth aspects of the present invention, the discharge speed of the cleaning liquid from the cleaning liquid discharge section can be freely switched between high speed and low speed by appropriately adjusting the flow rate of the processing liquid by the flow rate control means. be able to. Therefore, when the processing apparatus is configured to have the outer cup and the inner cup, when discharging the cleaning liquid from the cleaning liquid discharge unit ,
By setting the discharge speed to a low speed, the cleaning liquid can flow down the inner surface of the outer cup to wash the inner surface of the outer cup, and by setting the discharge speed to a high speed, the cleaning liquid can be directed toward the outer surface of the inner cup. Spray the cleaning liquid vigorously
Since the cleaning liquid can be sprayed on the outer surface of the inner cup, the outer surface of the inner cup can be cleaned well.

As described above, by switching the cleaning liquid discharge speed so that the cleaning liquid discharge holes formed in the outer cup are used for cleaning the outer cup and the inner cup, the cleaning liquid discharge holes and the cleaning liquid supply source are provided on the inner cup side. Since there is no need to provide the cleaning liquid supply source and only one cleaning liquid supply source is required, a processing apparatus having cleaning means can be realized with a simple structure.

According to the third and fifth aspects of the present invention ,
A number of cleaning liquid discharge holes are formed in the vicinity of the opening at the top of the outer cup, and a cleaning liquid discharge slit is provided in the vicinity thereof,
The cleaning liquid is spouted vigorously toward the outer surface of the inner cup from the cleaning liquid discharge hole, and the cleaning liquid is discharged at a low speed from the cleaning liquid discharge slit and flows down along the inner surface of the outer cup, whereby the inner surface of the outer cup and the outer surface of the inner cup are separated. Can be washed at the same time. Since the cleaning liquid discharged from the cleaning liquid discharge slit spreads uniformly and flows down to the inner surface of the outer cup, the entire inner surface of the outer cup is uniformly cleaned. In this case, by forming the cleaning liquid discharge hole above the cleaning liquid discharge slit, there is no inconvenience that the power of the discharge liquid from the cleaning liquid discharge hole is prevented by the cleaning liquid discharged from the cleaning liquid discharge slit and flowing down. It is always well cleaned by a well supplied cleaning liquid.

[0016]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below in detail with reference to the drawings. This embodiment is applied to a resist coating and developing apparatus.

As shown in FIG. 1, the resist coating and developing apparatus includes a processing mechanism unit 10 in which processing mechanisms for performing various processes on a processing target, for example, a semiconductor wafer (hereinafter, simply referred to as a wafer) W, are provided. The loading / unloading mechanism 1 for automatically loading / unloading the wafer W into / from the mechanism unit 10 constitutes a main part.

The loading / unloading mechanism 1 includes a wafer carrier 2 for storing the unprocessed wafer W, a wafer carrier 3 for storing the processed wafer W, and an arm for holding the wafer W by suction.
A moving mechanism 5 for moving the arm 4 in X, Y (horizontal), Z (vertical) and θ (rotation) directions;
Stage 6 on which wafers are aligned and wafers W are transferred to and from processing mechanism unit 10
And

The processing mechanism unit 10 is provided with a transport mechanism 12 movably along a transport path 11 formed in the X direction from the alignment stage 6. Transport mechanism 1
2 has a main arm 13 movably in the Y, Z and θ directions.
Is provided. On one side of the transfer path 11, an adhesion processing mechanism 14 for performing an adhesion process for improving the adhesion between the wafer W and the resist liquid film, and a solvent remaining in the resist applied to the wafer W are heated and evaporated. A pre-bake mechanism 15 for cooling the wafer W and a cooling mechanism 16 for cooling the overheated wafer W are arranged.
On the other side of the transfer path 11, a processing liquid application mechanism 17 for applying a resist on the surface of the wafer W (processing apparatus of the present invention)
In order to prevent diffused light reflection during the exposure process,
And a surface coating layer coating mechanism 18 for coating and forming a CEL film or the like on the resist.

In the resist coating and developing apparatus configured as described above, first, the unprocessed wafer W is unloaded from the wafer carrier 2 by the arm 4 of the loading / unloading mechanism 1 and placed on the alignment stage 6. Is done. Then
The wafer W on the alignment stage 6 is transferred to the transfer mechanism 12
Of each of the processing mechanisms 14 to 1
8. Then, the processed wafer W is returned to the alignment stage 6 by the main arm 13, and
Further, the wafer is transported by the arm 4 and stored in the wafer carrier 3.

Next, regarding the processing device 17 of the present invention,
This will be described with reference to FIGS.

FIG. 2 is a cross-sectional perspective view of a processing apparatus according to a first embodiment of the present invention.
FIG. 3 is a cross-sectional view of the main part.

As shown in FIG. 2, the processing apparatus 1 of the present invention
Reference numeral 7 denotes a spin chuck 19 for holding the wafer W by suction and horizontally rotating the wafer W; an annular inner cup 20 concentrically arranged so as to surround the periphery of a wafer holding portion 19a of the spin chuck 19; Outer cup 21 for accommodating the inner space 19 and the inner cup 20 to form a processing space
And a processing liquid supply nozzle 22 that is moved onto the spin chuck 19 and supplies a resist liquid, which is a processing liquid, to the surface of the wafer W.

The lower end of the spin chuck 19 is fixed to a rotating shaft of a motor (not shown) for rotating the spin chuck 19 and the wafer W at a predetermined speed at a high speed.

The processing liquid supply nozzle 22 is connected to a resist liquid supply source (not shown) via a pipe 22a. The pipe 22a includes a mechanism for circulating constant-temperature water, and is provided with a resist temperature control device (not shown) that controls the temperature of the resist solution via the pipe wall.

The upper surface 20a of the inner cup 20 is formed horizontally at a position slightly lower than the upper surface of the wafer holding portion 19, and the side surface 20b extends outwardly below the periphery of the upper surface 20a to form a cone. Is formed. The upper surface 2 of the inner cup 20
The outer diameter of 0a is set substantially equal to the outer diameter of the wafer W, and the inclination angle of the side surface 20b is set to about 15 ° to 30 °.

The outer cup 21 is composed of an upper cup 23 and a lower cup 24. The upper cup 23 has an opening 25 slightly larger in diameter than the wafer W at the center, and the inner surface 23a is closer to the inner surface 24a of the lower cup 24 than the lower opening edge of the opening 25.
And is formed in a conical shape substantially parallel to the side surface 20b of the inner cup 20. The inside of the lower cup 24 is partitioned inside and outside by an annular wall 36, and an exhaust port 37 is provided at the inside bottom.
However, a drain port 38 is provided at the outer bottom. A vacuum device (not shown) is connected to the exhaust port 37, and the resist solution and particles scattered when performing the spin coating process on the wafer W are discharged from the exhaust port 37 together with the atmosphere in the processing apparatus 17. You can do it. Further, a drainage storage tank (not shown) is connected to the drainage port 38, and descends along the outer cup inner surfaces 23 a and 24 a and the inner cup outer surface 20 b to discharge the resist liquid accumulated on the bottom of the lower cup 24. The liquid can be discharged and stored from the liquid port 38.

The upper cup 23 constituting the outer cup 21
On the upper surface of the inner surface 23a, a cleaning liquid spout for supplying the cleaning liquid to the inner surface 23a of the upper cup 23 and the side surface of the inner cup 20 is provided.
A large number of cleaning liquid discharge holes 26 as outlets are formed at equal intervals along the opening edge of the opening 25. These many cleaning liquid discharge holes 26 communicate with an annular liquid reservoir 27 formed inside the upper cup 23. Further, the discharge port of each cleaning liquid discharge hole 26 is opened toward the vicinity of the upper edge of the inclined side surface 20b of the inner cup 20, and the cleaning liquid discharge angle is set to be inclined by 15 ° to 30 ° with respect to the vertical axis. ing. A cleaning liquid supply port 28 is opened at the side of the upper cup 23 so as to communicate with the liquid reservoir 27. The cleaning liquid supply port 28 is provided with a cleaning liquid supply source 29 through a flow rate adjusting means 39 as shown in FIG. Is connected.

The flow rate adjusting means 39 includes an opening / closing valve 31 and a throttle valve 32 provided in the middle of a pipe 30 connecting the cleaning liquid supply port 28 and the cleaning liquid supply source 29, and an upstream side of the throttle valve 32 of the pipe 30. It comprises an on-off valve 34 and a throttle valve 35 provided in the middle of a bypass pipe 33 connecting the downstream side of the on-off valve 31. The on-off valves 31 and 32 are provided with a valve driving device (not shown).
The two on-off valves 31, 32 can be individually opened and closed. The valve opening (throttle) of the throttle valves 32 and 35 is determined by the piping 3
The flow rate of the throttle valve 32 provided at 0 is large (for example, 1.0
１．５1.5 liters / minute) and the flow rate of the throttle valve 35 is set to a small value (for example, 0.3 to 0.5 liters / minute).

In the processing apparatus 17 of the present invention configured as described above, while the spin coating process is performed on the surface of the wafer W, both of the on-off valves 31 and 32 of the flow rate adjusting means 39 are closed. When the coating process is performed on a predetermined number of wafers W and cleaning of the inside of the apparatus is required, the mounting of the next wafer W on the spin chuck 19 is interrupted, and the flow rate adjusting means 39 is operated. Performs internal cleaning.

At the time of cleaning, first, the on-off valve 31 on the pipe 30 side
While the valve is closed, the on-off valve 3 on the bypass pipe 33 side
Open only 4. Thereby, the cleaning liquid in the cleaning liquid supply source 29 is introduced into the liquid reservoir 27 of the upper cup 23 via the throttle valve 35 and the on-off valve 34 on the bypass pipe 33 side. Then, when the inside of the liquid reservoir 27 becomes full, the cleaning liquid starts to be discharged from the cleaning liquid discharge hole 26. Since the flow rate of the throttle valve 35 on the bypass pipe 33 side is set to be small, the internal pressure of the liquid reservoir 27 is low, and the cleaning liquid is discharged from the cleaning liquid discharge hole 26 gradually. Therefore, as shown by the arrow A, the cleaning liquid gradually flows down the inclined upper cup inner surface 23a and further flows down the lower cup inner surface 24a without falling onto the inner cup 20. Since a large number of cleaning liquid discharge holes 26 are provided at equal intervals along the opening edge of the opening 25 of the upper cup 23, the cleaning liquid discharged from the large number of cleaning liquid discharge holes 26 flows into the upper cup inner surface 23 a and the lower cup inner surface 24 a. Therefore, the inner surface of the outer cup 21 is evenly washed.

After washing the outer cup 21, the on-off valve 34 on the bypass pipe 33 side is closed and the on-off valve 31 on the pipe 30 side is opened.
Thereby, the cleaning liquid in the cleaning liquid supply source 29 is introduced into the liquid reservoir 27 of the upper cup 23 via the throttle valve 32 and the on-off valve 31 on the pipe 30 side. At this time, since the inside of the liquid reservoir 27 is already full, the cleaning liquid starts to be discharged simultaneously from all the cleaning liquid discharge holes 26 as soon as the on-off valve 31 is opened. Since the flow rate of the throttle valve 32 on the side of the pipe 30 is set to be large, the internal pressure in the liquid reservoir 27 is high, and the cleaning liquid is ejected at a high speed from the cleaning liquid discharge hole 26, and as shown by the arrow B, the inner cup 20 Is sprayed vigorously near the upper edge of the inclined side surface 20b. The cleaning liquid sprayed on the side surface 20b of the inner cup 20 spreads uniformly in the circumferential direction by the action of the high fluid pressure, and flows down along the side surface 20b. Further, since the cleaning liquid spreads slightly upward from the sprayed position, the side surface 20b of the inner cup 20 is uniformly cleaned over the entire surface. As described above, by discharging the cleaning liquid from the upper side to the lower side, the cleaning effect due to physical impact can be significantly improved.

The cleaning liquid used for cleaning the inner surface of the outer cup and the outer surface of the inner cup is collected at the bottom of the lower cup 24 and discharged from the drain port 38.

Second Embodiment FIG. 4 is a longitudinal sectional view of a second embodiment of the processing apparatus of the present invention, and FIG. 5 is a sectional view of a main part thereof. In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

As shown in FIG. 4, on the upper surface 23a of the upper cup 23 constituting the outer cup 21, a number of cleaning liquid discharge holes 40 for supplying the cleaning liquid to the side surface 20b of the inner cup 20 are formed. along the opening edge is formed into equal intervals, below and in the vicinity of a number of these cleaning liquid discharge holes 40, the cleaning liquid ejecting slit 41 for supplying a cleaning liquid to the inner surface 23a of the upper cup 23 is circumferentially provided, these Washing
The cleaning liquid discharge unit includes the cleaning liquid discharge hole 40 and the cleaning liquid discharge slit.
Is configured . Inside the upper cup 23, two annular liquid reservoirs 42 and 43 are formed up and down, the large number of cleaning liquid discharge holes 40 are formed in the upper liquid reservoir 42, and the cleaning liquid discharge slit 41 is formed in the lower liquid reservoir. Each of the sections 43 communicates with each other.
The discharge port of each cleaning liquid discharge hole 40 is
Opening toward the vicinity of the upper edge of the inclined side surface 20b,
The cleaning liquid discharge angle is set at an angle of 15 ° to 30 ° with respect to the vertical axis. A first cleaning liquid supply port 44 communicating with the upper liquid reservoir 42 and a second cleaning liquid supply port 45 communicating with the lower liquid reservoir 43 are opened on the side of the upper cup 23. . The first and second cleaning liquid supply ports 44 and 45 are connected to the first and second flow rate adjusting means 4 respectively.
6 and 47 are connected to separate cleaning liquid supply sources 48 and 49.

The first flow rate adjusting means 46 comprises an on-off valve 51 and a throttle valve 52 provided in the middle of a pipe 50 connecting the first cleaning liquid supply port 44 and the cleaning liquid supply source 48. The second flow rate adjusting means 47 includes an on-off valve 54 and a throttle valve 55 provided in the middle of a pipe 53 connecting the second cleaning liquid supply port 45 and the cleaning liquid supply source 49. Each of the on-off valves 51 and 54 is provided with a valve driving device (not shown).
1, 54 can be individually opened and closed. Regarding the valve opening degree (throttle) of the throttle valves 52 and 55, the flow rate of the throttle valve 52 of the first flow rate adjusting means 46 is large (for example, 1.0 to 1..
5 liter / min), the throttle valve 5 of the second flow control means 47
5 is small (for example, 0.3 to 0.5 liter / min)
Is set to

In the processing apparatus of the second embodiment configured as described above, while the spin coating process is performed on the surface of the wafer W, the open / close valves 51 of the first and second flow rate adjusting means 46 and 47 are used. 54 are all closed. When cleaning the inside of the apparatus, the on-off valves 51 and 54 of the first and second flow rate adjusting means 46 and 47 are simultaneously opened to clean the inside of the apparatus.

That is, in the first flow rate adjusting means 46, when the on-off valve 51 is opened, the cleaning liquid in the cleaning liquid supply source 48 flows into the upper liquid reservoir 42 via the throttle valve 52 and the on-off valve 51. be introduced. When the inside of the upper liquid reservoir 42 becomes full, the cleaning liquid starts to be discharged simultaneously from all the cleaning liquid discharge holes 40. Since the flow rate of the throttle valve 52 of the first flow rate adjusting means 46 is set to be large, the internal pressure in the upper liquid reservoir 42 is high, and the cleaning liquid is supplied to the cleaning liquid discharge port 40.
At high speed, as shown by the arrow A in FIG. 5, and is vigorously sprayed near the upper edge of the inclined side surface 20b of the inner cup 20. The cleaning liquid sprayed on the side surface 20b of the inner cup 20 spreads uniformly in the circumferential direction by the action of the high fluid pressure, and flows down along the side surface 20b. Also, since the cleaning liquid will spread slightly above the sprayed position,
The side surface 20b of the inner cup 20 is uniformly washed over the entire surface.

On the other hand, in the second flow rate adjusting means 47, when the on-off valve 54 is opened, the cleaning liquid in the cleaning liquid supply source 49 passes through the throttle valve 55 and the on-off valve 54 to the inside of the lower liquid reservoir 43. Is introduced to Then, the lower liquid reservoir 4
When the inside of 3 becomes full, the cleaning liquid starts to be discharged from the cleaning liquid discharge slit 41. Throttle valve 5 of second flow rate adjusting means 47
5 is set to a small flow rate, so that the lower liquid reservoir 4
3, the cleaning liquid is gradually discharged from the cleaning liquid discharge slit 41, and flows down along the inner surface 23a of the upper cup as shown by an arrow B in FIG. The cleaning liquid discharged from the cleaning liquid discharge slit 41 forms a continuous flow in the circumferential direction and spreads uniformly on the inner surface of the outer cup, so that the entire inner surface of the outer cup is uniformly and uniformly cleaned. Further, since the large number of cleaning liquid discharge holes 40 are formed above the cleaning liquid discharge slits 41, the cleaning liquid discharged from the cleaning liquid discharge slits 41 and flowing down is supplied to the cleaning liquid discharge holes 4.
It does not hinder the momentum of the ejection of the liquid from zero.

As described above, according to the processing apparatus of the second embodiment, the inner surfaces 23a and 24a of the outer cup 20 and the inner cup 2
0 side surface 20b can be cleaned at the same time.

In the above embodiment, the case where the processing apparatus is applied to a resist coating and developing apparatus has been described. In addition to this, for example, an etching liquid coating processing, an insulating protective film coating processing (PIQ coating), a phosphorus glass film coating processing, or the like. Processing (SOG
It is needless to say that the present invention can also be applied to an apparatus that performs a coating process and a magnetic liquid coating process.

[0042]

As described above, the processing of the present invention
According to the apparatus and its cleaning method , the following effects can be obtained.

1) According to the first, second, and fourth aspects of the present invention.
For example, when the cleaning liquid is discharged from the cleaning liquid discharge section , the discharge speed is set to a low speed, so that the cleaning liquid can flow down the inner surface of the outer cup to clean the inner surface of the outer cup, and the discharge speed can be increased. By setting, the cleaning liquid can be vigorously jetted toward the outer surface of the inner cup to clean the outer surface of the inner cup satisfactorily.

2) According to the third and fifth aspects of the present invention, a large number of cleaning liquid discharge holes are formed near the opening on the upper portion of the outer cup, and a cleaning liquid discharge slit is provided in the vicinity of the plurality of cleaning liquid discharge slits. The cleaning liquid is jetted vigorously toward the outer surface of the inner cup, and the cleaning liquid is discharged at a low speed from the cleaning liquid discharge slit to flow down the inner surface of the outer cup .
As a result , the inner surface of the outer cup and the outer surface of the inner cup can be washed at the same time. Also, it is discharged from the cleaning liquid discharge slit
Since the cleaning liquid spreads uniformly down the inner surface of the outer cup,
The entire inner surface of the outer cup can be washed evenly and evenly
(Claim 3).

3) According to the first to third aspects of the present invention.
For example, even when the processing device is configured to have the outer cup and the inner cup, it is not necessary to provide any cleaning means in the inner cup, so that the device structure can be simplified.

[Brief description of the drawings]

FIG. 1 is a schematic plan view showing an embodiment in which a processing apparatus of the present invention is applied to a resist liquid coating and developing apparatus.

FIG. 2 is a sectional perspective view showing a first embodiment of the processing apparatus of the present invention.

FIG. 3 is a sectional view of a main part of the processing apparatus shown in FIG. 2;

FIG. 4 is a longitudinal sectional view showing a second embodiment of the processing apparatus of the present invention.

FIG. 5 is a sectional view of a main part of the processing apparatus shown in FIG. 4;

[Explanation of symbols]

 Reference Signs List 20 inner cup 21 outer cup (cup) 25 opening 26 cleaning liquid discharge hole 29 cleaning liquid supply source 39 flow rate control means 40 cleaning liquid discharge hole 41 cleaning liquid discharge slit 48 cleaning liquid supply source 49 cleaning liquid supply source W semiconductor wafer (workpiece)

Claims (5)

(57) [Claims] In the processing apparatus for spin coating a processing solution to the surface of the object at 1. A cup and the outer cup and consisting of a cup, a cleaning liquid toward the inner cup and outer cup of the cup
A cleaning liquid discharging unit to be discharged, a cleaning liquid supply source for supplying a cleaning liquid to the cleaning liquid discharging unit, and control for causing the cleaning liquid to flow down to the inner surface of the outer cup;
Controls the spraying of the cleaning liquid on the side of the inner cup.
A controllable flow rate control means . 2. The processing apparatus according to claim 1, wherein the cleaning liquid discharge section is opened near an upper opening of the outer cup.
It is formed by a large number of cleaning liquid discharge holes provided along the edge.
A processing device characterized by being processed. 3. The processing apparatus according to claim 1, wherein the cleaning liquid discharge section is opened near an upper opening of the outer cup.
A large number of cleaning liquid discharge holes provided along the edge and these
The cleaning liquid discharge slit provided around the cleaning liquid discharge hole
A processing device characterized by being formed by: 4. A cup comprising an inner cup and an outer cup.
Cleaning of the processing equipment that spin-coats the processing liquid on the surface of the workpiece
In the cleaning method, a step of cleaning by flowing a cleaning liquid down on the inner surface of the outer cup
And a step of cleaning by blowing the cleaning liquid to the side surface of the inner cup
And a method for cleaning a processing apparatus. 5. The method for cleaning a processing apparatus according to claim 4, wherein
There are, washing by flowing down the cleaning liquid on the inner surface of the outer cup
Cleaning process by spraying a cleaning solution on the side of the inner cup
And cleaning method of the processing apparatus, characterized in that
Law.