JP2889124B2 - Polishing surface plate of lapping polishing device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing platen used in a lapping polishing apparatus.

[0002]

2. Description of the Related Art In recent years, members to be polished such as ceramics, glass, and quartz used for electronic parts and optical parts are required to have not only a surface smoothness and a reduction in a work-affected layer, but also
High surface accuracy is also desired. Using a well-known soft and resilient polishing tool such as suede, pad, felt, etc., provides sufficient surface smoothness and reduces the work-affected layer. And the phenomenon that the thickness of the peripheral portion, which is referred to as edge droop, becomes small occurs, and there is a disadvantage that sufficient surface accuracy cannot be obtained. In addition, if a well-known rigid metal polishing plate such as cast iron or copper is used, the surface of the member to be polished is polished with high surface accuracy, but the surface smoothness is not sufficiently obtained, and There was a drawback that a layer was formed.

On the other hand, there has been proposed a technique in which a polishing platen is constituted by a porous body of thermosetting resin having continuous pores in which fine powder of copper or tin is dispersed. For example, a polishing platen described in Japanese Patent Application Laid-Open No. H3-60970 is one example. According to this, the abrasive grains are fixed in a form half-buried in the copper or tin powder, so that the abrasive can be efficiently polished, while the heat accompanying the polishing is effectively dissipated due to the porous body. At the same time, polishing dust is trapped in the pores to prevent clogging.

[0004]

With a polishing platen of the type described above, the surface smoothness of the member to be polished can be obtained and the deteriorated layer is reduced. Since the resin is a porous body having continuous pores, even if it is fixed to a highly rigid backup material, the thermosetting resin itself is significantly deformed, so that high surface accuracy cannot be obtained. there were.

The present invention has been made in view of the above circumstances, and an object of the present invention is to obtain a surface smoothness of a member to be polished and a reduction in a deteriorated layer at the same time as obtaining a high surface accuracy. To provide a polishing platen for a lapping polishing apparatus.

[0006]

SUMMARY OF THE INVENTION In order to achieve the above object, the gist of the present invention is to provide a polishing method for a lapping polishing apparatus for lapping a surface of a member to be polished using a polishing liquid containing free abrasive grains. A board, comprising: (a) a synthetic resin base material fixed to a rigid backup member; and (b)
Dispersed in the base material, soft metal particles that are plastically deformed by pressing the free abrasive grains on the polishing plane and bury the free abrasive grains, and (c) dispersed in a solid state in the base material, And a pore-forming agent that is formed into a large number of independent pores that are opened to the polishing plane by being discharged into the polishing liquid at the polishing plane.

[0007]

In this way, the free abrasive grains are plastically deformed in the polishing plane by the pressure of the free abrasive grains in the base material made of synthetic resin fixed to the backup member having high rigidity, thereby burying the free abrasive grains. Since the soft metal particles and the pore-forming agent that forms a large number of independent pores that are opened to the polishing plane by being discharged into the polishing liquid in the polishing plane are dispersed, in the polishing plane, A large number of soft metal particles are exposed, and a large number of independent pores are opened.

[0008]

Therefore, since relatively large abrasive grains exposed on the polishing plane are buried in the soft metal particles,
Since the cutting edge heights are easy to be uniform, high surface smoothness can be obtained and the processing-damaged layer is reduced. Further, since polishing dust is trapped in the pores to prevent clogging, high polishing efficiency can be obtained. In addition, since the pore-forming agent is dispersed in a solid state in the base material, the compression deformation of the synthetic resin base material is extremely small, and the rigidity is enhanced. High surface accuracy can be obtained.

Preferably, the base material is a thermosetting resin selected from an epoxy resin, a phenol resin, a polyurethane resin, a polyester resin, a phthalic acid resin, and a melamine resin. It is contained at a ratio of 20 to 50% by volume. By doing so, an elastic holding effect on the soft metal particles can be suitably obtained.

Preferably, the soft metal particles are plain or mixed powders selected from copper powder, tin powder, and lead powder, and have a particle size of 50 μm or less. is there. This has the advantage that the abrasive grains can be easily buried in the soft metal and the abrasive grains buried in the soft metal can be evenly distributed.

Preferably, the soft metal particles are 2
It is contained at a ratio of 0 to 50% by volume. By doing so, the holding area of the abrasive grains can be obtained while suppressing the soft metal particles from falling off, so that the polishing efficiency can be obtained.

[0012] Preferably, the pore-forming agent is a water-soluble organic compound softer than the free abrasive grains. In this way, there is an advantage that a large number of independent pores are formed in the polishing plane without roughening the polishing plane.

Preferably, the pore-forming agent comprises 50
It has a particle size of about 500 μm. In this way, without causing chipping near large pores,
There is an advantage that clogging is prevented.

Preferably, the pore-forming agent is contained at a ratio of 5 to 40% by volume. In this case, there is an advantage that clogging is prevented without reducing the strength of the surface plate itself and causing uneven wear.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below in detail with reference to the drawings.

FIGS. 1 and 2 show a plan view and a cross section, respectively, of a polishing table 10 used in the lapping polishing apparatus according to one embodiment of the present invention, in which a part of the polishing table 10 is cut away. In the figure, a polishing platen 10 is formed to have a high rigidity by being formed to a predetermined thickness from, for example, stainless steel or the like, and has a disk-shaped backup member 14 having a screw hole 12 for mounting at a central portion thereof, and an annular And a ring-shaped resin polishing layer 18 fixed at a predetermined thickness on the outer peripheral portion of one surface of the backup member 14. In addition, 1
9 is a through hole for injecting a polishing liquid when used as an upper surface plate for double-side polishing.

As shown in detail in FIG.
0 resin polishing layer 18 is made of a base material 20 made of a thermosetting resin,
A soft metal particle 22 that is dispersed in the base material 20 and is plastically deformed by the pressing of free abrasive grains contained in the polishing liquid on the polishing plane 16 so that the free abrasive grains are partially buried and held therein; A pore forming agent 26 which is dispersed in a solid state in the material 20 and flows out to the polishing liquid at the polishing plane 16 to form a large number of independent pores 24 opened in the polishing plane 16. FIG. 3 is a diagram for facilitating understanding, and the soft metal particles 2
The shape, size, and number of 2 and the pore-forming agent 26 are different from actual ones. A groove 28 having a U-shaped cross section is formed in the polishing plane 16 so that a polishing liquid containing free abrasive grains easily enters between the processing surface of the member to be polished and the polishing plane 16. It is formed along a circular arc.

The thermosetting resin constituting the base material 20 is as follows:
It is constituted by its precursor being cured by heat or a reaction catalyst, and is not only excellent in heat resistance but also hardly dissolved or swelled in water or an organic solvent used as a polishing liquid. The thermosetting resin used for the base material 20 is, for example, a single resin or a mixed resin selected from an epoxy resin, a phenol resin, a polyurethane resin, a polyester resin, a phthalic resin, and a melamine resin. However, an epoxy resin or a mixed resin using the epoxy resin as a main agent is the best in terms of durability and processing dimensional accuracy.

In the resin polishing layer 18, the base material 2
0 is contained in the resin polishing layer 18 in the range of 20 to 50% by volume, preferably 30 to 40% by volume. If the content of the base material 20 falls below the lower limit, the soft metal particles 2
In addition, the local elastic holding effect is reduced, and the smoothness is reduced. In addition, the soft metal particles 22 are not sufficiently held, and the soft metal particles 22 are detached, which further affects the polishing. . If the upper limit of the content of the base material 20 is exceeded, the content of the soft metal particles 22 is reduced, so that the polishing efficiency is reduced.

The soft metal particles 22 are composed of a single metal or a mixed metal selected from copper, tin, lead and the like, and are easily plastically deformed by pressing free abrasive grains such as alumina, silicon carbide, silicon nitride and diamond. Then, the loose abrasive grains are held in a partially buried state. The soft metal particles 22 have a thickness of 50 μm or less, preferably 10 to 40 μm.
Those having a particle size in the range of m are used. When the diameter of the soft metal particles 22 exceeds the range of the particle size, the distribution of fine abrasive grains held by the soft metal particles 22 on the polishing plane 16 becomes non-uniform, so that the distribution is suppressed to a relatively narrow range. It is.

In the resin polishing layer 18, the soft metal particles 22 are contained in the resin polishing layer 18 within a range of 20 to 50% by volume, preferably 30 to 40% by volume. When the content of the soft metal particles 22 falls below the lower limit, the area of the free abrasive grains held by the soft metal particles 22 decreases, and the polishing efficiency decreases. Conversely, if the upper limit of the content of the soft metal particles 22 is exceeded, the content of the base material 20, that is, the thermosetting resin is reduced, and the soft metal particles 22 are reduced.
Since the holding force of the metal is reduced to cause separation, the polishing is adversely affected.

When mixed with a precursor of a thermosetting resin in the preparation of the polishing platen 10 or when the pore forming agent 26 is present in the thermosetting resin after being hardened, the pore forming agent 26 is formed into a granular form by dissolution or the like. Although the mechanical shape is not impaired, when exposed to the polishing surface 16 and comes into contact with the polishing liquid, it has the property of dissolving in the polishing liquid or flowing out by the polishing liquid to form pores 24 in the polishing surface 16, and Organic compounds having a lower hardness than free abrasive grains, for example, biochemicals such as sugars and amino acids, inorganic salts such as salt and sodium bicarbonate, among others, sucrose, lactose (lactose), maltose (maltose), Na
Cl and Na ₂ CO ₃ are preferably employed.

The pore forming agent 26 retains its rigidity without forming pores in the base material 20 before being exposed to the polishing plane 16, but when exposed to the polishing plane 16, the swarf or the coagulated abrasive It is intended to form independent pores 24 for receiving the grains and providing a reservoir for them to prevent clogging, and is several tens of times or more the diameter of the free abrasive grains used, preferably in the range of 50 to 500 μm. Those having a particle size within are used. If the particle size of the pore-forming agent 26 falls below the lower limit value, the above-mentioned clogging prevention effect cannot be sufficiently obtained. If the particle size exceeds the upper limit value, chipping from the large-diameter pores 24 easily occurs, and abnormalities occur. Durability cannot be obtained due to wear.

Further, the pore-forming agent 26 is 5 to 40.
It is contained in the resin polishing layer 18 by volume%, preferably in the range of 10 to 30 volume%. If the content of the pore-forming agent 26 falls below the lower limit, the effect of preventing clogging cannot be sufficiently obtained. If the content exceeds the upper limit, the strength of the resin polishing layer 18 itself decreases and wear increases, resulting in high wear. Surface accuracy cannot be obtained. In addition, the rigidity of the resin polishing layer 18 itself is reduced, thereby causing edge dripping and undulation.

The polishing platen 10 is manufactured, for example, as follows. That is, a stock solution or powder of the thermosetting resin for forming the base material 20, the soft metal granules 22, and the pore-forming agent 26 are mixed at a ratio within the above range, and then kneaded, and the mixture is hot-pressed. The resin polishing layer 18 obtained in this manner is cured by being pressed in a heated state in a mold while being pressed, and is then bonded to the backup member 14 for finishing. Since the kneading and molding are performed in a dry manner in this manner, even the soft metal particles 22 having a high specific gravity are uniformly dispersed.

The polishing platen 10 configured as described above is
It is used for so-called single-side polishing or double-side polishing in a well-known lapping polishing apparatus. In the single-side polishing, a member to be polished held on a support (not shown) is pressed against a polishing plane 16 of a polishing platen 10 rotated around an axis in the presence of an aqueous polishing liquid containing free abrasive grains. Thereby, one surface of the member to be polished is polished. In the double-side polishing, in the presence of an aqueous polishing liquid containing free abrasive grains between a pair of opposing polishing plates 10 that are driven to rotate around an axis, in a hole of a holder that is thinner than a gap between the polishing planes 16. By interposing the member to be polished fitted on the both sides, both surfaces of the member to be polished are polished.

According to the polishing platen 10, since the soft metal particles 22 are dispersed in the base material 20, the soft metal particles 22 exposed on the polishing surface 16 are moderately elastic by the base material 20. The loose abrasive grains are held in a state of being partially buried by the soft metal particles 22 exposed on the polishing plane 16. For this reason, while the free abrasive grains are appropriately fixed and polished efficiently, the cutting edges of the free abrasive grains are easily aligned, so that sufficient surface smoothness is obtained and the formation of a damaged layer is reduced. You.

According to the polishing platen 10, since the pore forming agent 26 exposed on the polishing surface 16 is dissolved or discharged into the polishing liquid, independent pores 24 are formed. Polishing debris and agglomerated abrasive grains are trapped in the pores 24 to prevent clogging, so that high polishing efficiency can be obtained. In addition, the pore forming agent 26
Is dispersed in a solid state in the base material 20, the compressive deformation of the synthetic resin base material 20 is extremely small, and the rigidity is enhanced. Therefore, the resin polishing layer 18 is fixed to the backup member 14 having extremely high rigidity. By doing so, the edge of the member to be polished is eliminated in combination with the fact that it is backed up, and high surface accuracy can be obtained.

The following are examples of polishing tests performed to show the effects of the present embodiment, namely, an example of polishing a crystal piece used for a crystal oscillator (Experimental example 1) and an example of polishing a glass disk used for a magneto-optical disk. (Experimental example 2) and an example of polishing a silicon nitride ceramic plate (Experimental example 3) will be described.

(Experimental example 1) Polishing platen Mixing ratio of raw material Powdered metallic tin (75.5 wt%) Powdered metal resin (13.0 wt%) sieved to 20 μm or less from the atomized method Epoxy resin with epoxy equivalent of 220 lactose monohydrate (11.5 wt%) A small amount of water was added to the reagent, and the mixture was kneaded and granulated to give a particle size of 0.1.
The powdered material (kneaded clay) mixed in the above mixing ratio is filled in a mold of a predetermined size, and after molding, it becomes 3.35 g / cm ^3. The pressing conditions are set as described above, and a pressure of 100 kg / cm ² is applied between a pair of hot plates set at 180 ° C. for 15 minutes, and the cured molded product is aged in a 170 ° C. oven for 3 hours. Preparation of Surface Plate The molded product (outer diameter 285 mmφ × inner diameter 110 mmφ) obtained by the above-mentioned molding method is adhered to a stainless steel backup member, and finishing is performed. A through hole for injecting a polishing liquid (slurry) is formed in the upper platen, and a right-hand spiral 1.5 mm pitch groove is formed in the polishing plane. A 2.0 mm pitch groove having a right-handed spiral shape is formed on the polishing surface of the lower platen.・ Characteristics of polishing platen Composition Metal content 34.7 wol% Resin content 35.1 wol% Pore forming agent content 24.9 wol% Here, pores of 5.3 vol% are generated, which are very fine. The pores are not continuous pores and are independent pores uniformly dispersed throughout. Properties micro Vickers hardness (300 g load) Hv = 19.0kg / mm ² · polishing method polisher 4way type of double-side polishing machine upper platen rotational speed 5R.Pm, lower platen rotational speed 15r.p.
m Workpiece 8 mm x 0.060 mm ^t disk-shaped crystal piece, lap-polished with alumina abrasive # 2000 as pre-processing. The attachment to the polishing machine was performed using five dedicated carriers in which 20 workpieces were inserted into pockets. Processing pressure 100 g / cm ² Processing time 20 minutes Polishing liquid Cerium oxide (Ce) having an average particle size of 1.0 μm
O ₂ ) The abrasive grains are dispersed in water so as to have a concentration of 6% by weight, and are adjusted. During polishing, the abrasive grains are injected from the upper surface plate at 10 cc / min.・ Polishing test results

[0031]

[Table 1]

In Experimental Example 1, as shown in Table 1 above, the maximum roughness indicating the smoothness of the polished surface was determined by using a cerium pad and the surface plate of the present experimental example as compared with those using a casting surface plate. In comparison with the results that the cerium pad was larger in the edge runout, that is, the roll-off δ, the one using the casting platen and the platen of this experimental example Showed an extremely small value. In addition, the polishing rates were approximately the same when using a casting platen, when using a cerium pad, and when using the platen of this experimental example. The cerium pad has the same diameter as the surface plate of this experimental example, but is provided with a grating groove of 0.6 mm ^t , hardness (Shore C) of 80 degrees, and a pitch of 10 mm on the polished surface. The plate had the same diameter as the surface plate of the present experimental example, but was provided with a material FC20 and a 15 mm pitch lattice groove on the polished plane. Note that the roll-off δ indicates an edge dripping dimension and is defined as shown in FIG.

(Experimental example 2)-Polishing platen Mixing ratio of raw materials Powdered metallic tin (78.0 wt%) Atomized process sieved to 30 µm or less Liquid epoxy resin (13.0 wt%) Glycidyl type Epoxy resin (base resin) of 190 parts by weight Epoxy equivalent: 190 parts Modified polyamine type curing agent: amine equivalent of 330 50 parts Maltose monohydrate (9.0 wt%) A small amount of water was added to the reagent, and the mixture was kneaded and granulated. Particle size 0.1
What is sieved to be 0.4 mmφ Molding method Predetermined amount of epoxy resin base material and powdered tin are weighed, put into a vacuum defoaming mixer and mixed for 10 minutes, and then a predetermined amount of epoxy curing agent And further mixed, then maltose 1
Add the hydrate and mix for 5 minutes. The mixed fluid thus obtained is poured into a predetermined mold, allowed to stand, and cured. Then, after-curing is performed in an oven at 60 ° C. for 24 hours. The density of the molded product thus obtained was 3.50 g / cm ³ . Production of Surface Plate The molded product (outside diameter: 386 mmφ × inside diameter: 155 mmφ) obtained by the above molding method is adhered to a stainless steel backup member, and finishing is performed. A through-hole for injecting a polishing liquid (slurry) is formed in the upper platen, and concentric grooves are formed in the polishing plane. The groove pitch is made shorter toward the outer periphery so that the area separated by the groove is made equal, and the supply amount of the slurry is made uniform at the inner and outer periphery. A similar groove is also formed on the lower platen, but the groove pitch is twice as large as that of the upper platen to balance the amount of vertical polishing.・ Characteristics of polishing platen Composition Metal content 34.7 wol% Resin content 39.6 wol% Pore forming agent content 21.7 wol% Here, 4.0 wol% pores are generated, but they are very fine. , Are not continuous pores, but are uniformly dispersed independent pores. Physical properties Micro Vickers hardness (300 g load) Hv = 15.2 kg / mm ² · Polishing method Polishing machine 6B type 4-way double-side polishing machine Upper surface plate rotation speed 25/3 rpm, lower surface plate rotation speed 2
5r.pm a low alkali glass disc workpiece 50φ × 0.8mm ^t, before processing those lapped by alumina abrasive grains # 1200 as. The mounting to the polishing machine was performed using five glass epoxy carriers holding three low alkali glass disks. Processing pressure 150 g / cm ² Processing time 20 minutes Polishing liquid Cerium oxide (Ce) having an average particle size of 0.5 μm
O ₂ ) The abrasive grains are dispersed in water so as to have a concentration of 5 wt%, and are adjusted. During polishing, the abrasive grains are injected from the upper surface plate at 30 cc / min.・ Polishing test results

[0034]

[Table 2]

In Experimental Example 2, as shown in Table 2 above, the maximum roughness indicating the smoothness of the surface to be polished was lower than that obtained when a non-porous polishing plate was used (R _max = 0.02). In the case of using the cerium pad and the surface plate of this experimental example, the result was about 1/2, and the edge runout, that is, the roll-off δ, was larger in the case of using the cerium pad. The one using the platen of this example showed extremely small values. The polishing speed of the cerium pad and the surface plate of the present experimental example was twice as high as that of the non-porous surface plate (0.2 μm / min). When using a surface plate,
There was a feature that flaws and clogging occurred. The cerium pad has the same diameter as the surface plate of this experimental example, but has a diameter of 0.6 mm ^t , a hardness (Shore C) of 65 degrees, and a length of 20 m.
The polishing plate has m-pitch lattice grooves on the polishing surface, and the non-porous polishing surface plate is the same as the surface plate of this experimental example except that no pore forming agent is contained.

(Experimental example 3) Polishing platen Mixing ratio of raw material Powdered metallic copper (76.0 wt%) Powdered metal modified by atomization method and sieved to 40 μm or less Powdered epoxy-modified phenolic resin (10.8 wt%) Crosslinking agent: Hexamethylenetetramine, addition amount is 7 wt% lactose monohydrate (13.2 wt%) A small amount of water is added to the reagent product, and the mixture is kneaded and granulated to have a particle size of 0.5.
mm or less The molding method is the same as in Experimental Example 1, and is 3.55 g / cm ³ after molding.
The density is set to be Production of Surface Plate The molded product (outer diameter 300 mmφ × inner diameter 100 mmφ) obtained by the above-mentioned molding method is bonded to an aluminum backup member, and finishing is performed. On the polishing surface of the surface plate, a right-hand spiral groove having a peak width of 3 mm, a groove width of 2 mm, and a groove depth of 2 mm is formed.・ Characteristics of polishing platen Composition Metal content 30.1 wol% Resin content 30.4 wol% Pore forming agent content 29.8 wol% Here, 9.7 wol% voids are generated, but these are very fine Therefore, as in Example 1, continuous pores are not formed, and polishing is not affected. Atmospheric physical micro Vickers hardness (300 g load) Hv = 19.0kg / mm single-sided lapping polishing machine lower platen rotational speed 60r.pm workpiece ² and polishing method polisher modified ring method 38 Mm × 4.0 mm ^t Disc-shaped silicon nitride obtained by a sintering method, which has been lapped and polished with 5 to 8 μmφ single crystal diamond abrasive grains as a pre-process. For mounting on the grinder, three dedicated carriers holding three workpieces are required.
The test was carried out using two pieces. Processing pressure 250 g / cm ² Processing time 25 minutes Polishing liquid Polycrystalline diamond abrasive having a particle size of 0 to 2 μm is adjusted by dispersing it in water so that the concentration becomes 20 carat / l. It was supplied to the polishing portion at 0.5 cc / min using a pump.・ Polishing test results

[0037]

[Table 3]

In Experimental Example 3, as shown in Table 3 above, the average roughness indicating the smoothness of the polished surface was obtained using a metal copper platen and a non-porous platen (Ra = 9 nm and Ra = 9 nm).
7 nm) was best when the surface plate of the present experimental example was used (Ra = 5 nm), and flaws occurred when the metal copper surface plate and the non-porous polished surface plate were used. There is no case where the surface plate of the example is used. Also, in clogging,
This occurred when the metal copper platen and the non-porous polishing platen were used, but not at all when the platen of this experimental example was used, and the polishing rate was that when the metal copper platen was used (0.04 μm). In comparison with the case of using the polishing plate having no pores (0.02 μm), the case of using the surface plate of the present experimental example is the fastest (0.05%).
μm). The metal copper platen has the same diameter as the platen of the present experimental example, but is composed of only metal copper, and the non-porous polishing platen does not include a pore forming agent. It is the same as the surface plate of this experimental example.

Although the embodiment of the present invention has been described with reference to the drawings, the present invention can be applied to other embodiments.

For example, in the polishing platen 10 of the above-described embodiment, the groove 28 formed in the polishing plane 16 has a U-shaped cross section, but may have a V-shaped cross section. The direction of the groove 28 may be formed in a cross hatch shape in which straight lines intersect, in addition to the concentric or spiral arc direction.

In the polishing platen 10 of the above-described embodiment,
The grooves 28 are formed in the polishing plane 16. However, when the shape of the member to be polished is small or when the surface to be polished of the member to be polished is divided into small areas, the grooves 28 are not necessarily formed. May not be formed.

Although the polishing liquid of the above-mentioned embodiment has been described as being aqueous, it may be oily. In this case, as the pore forming agent 26, a substance that is dissolved or discharged in an oil-based polishing liquid is used.

The above is merely an embodiment of the present invention, and the present invention can be variously modified without departing from the gist thereof.

[Brief description of the drawings]

FIG. 1 is a partially cutaway front view showing a polishing platen according to an embodiment of the present invention.

FIG. 2 is a sectional view of the embodiment of FIG.

FIG. 3 is an enlarged perspective view schematically illustrating a main part of the embodiment of FIG. 1;

FIG. 4 is a perspective view illustrating a roll-off δ that quantitatively represents edge dripping in lapping polishing.

[Explanation of symbols]

 10: Polishing surface plate 14: Backup member 16: Polished surface 18: Resin polishing layer 20: Base material 22: Soft metal particles 24: Pores 26: Porous agent

Claims (7)

(57) [Claims] 1. A polishing surface plate of a lapping polishing apparatus for lapping and polishing a surface of a member to be polished using a polishing liquid containing free abrasive grains, wherein a base material made of synthetic resin fixed to a highly rigid backup member And soft metal particles that are dispersed in the base material and are plastically deformed by the pressing of the free abrasive grains on the polishing plane to bury the free abrasive grains, and dispersed in a solid state in the base material, A polishing agent for forming a plurality of independent pores that are opened to the polishing surface by being discharged into the polishing liquid on the polishing surface. 2. The base material is an epoxy resin, a phenol resin, a polyurethane resin, a polyester resin,
The polishing platen of the lapping polishing apparatus according to claim 1, wherein the polishing plate is a thermosetting resin selected from a phthalic acid-based resin and a melamine-based resin and is contained at a ratio of 20 to 50% by volume. 3. The soft metal particle comprises copper powder, tin powder,
It is a simple or mixed powder selected from lead powder.
The polishing platen of the lapping polishing apparatus according to claim 1, wherein the polishing table has a particle size of not more than μm. 4. The polishing platen of the lapping polishing apparatus according to claim 3, wherein the soft metal particles are contained at a ratio of 20 to 50% by volume. 5. The polishing platen of the lapping polishing apparatus according to claim 1, wherein said pore-forming agent is a water-soluble organic compound softer than said free abrasive grains. 6. The pore-forming agent has a thickness of 50 to 500 μm.
The polishing platen of the lapping polishing apparatus according to claim 5, wherein the polishing table has a particle size of: 7. The polishing platen of the lapping polishing apparatus according to claim 6, wherein the pore forming agent is contained at a ratio of 5 to 40% by volume.