JP2889108B2 - Polishing device for wafer peripheral part - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing apparatus for polishing a peripheral portion of a wafer, and more particularly to a polishing apparatus for polishing a chamfered portion of the peripheral portion of a wafer.

[0002]

2. Description of the Related Art In a single crystal silicon wafer or a compound semiconductor wafer (hereinafter, referred to as a wafer), a chamfered portion is formed by grinding an outer peripheral portion thereof. When the chamfered portion is formed on the wafer in this way, cracking or chipping from the chamfered portion can be prevented during handling or alignment, but generation of fine powder cannot be prevented. Therefore, there is a risk that the yield and reliability of semiconductor device production may be reduced due to the fine powder.
Therefore, conventionally, after the chamfering of the wafer, the chamfered portion is polished.

In this polishing, polishing is performed by pressing a rotating polishing buff against a chamfered portion of a wafer. At that time, a polishing agent (colloidal silica) in which colloidal silica or the like is dispersed in an alkaline solution is used. Abrasive grains) are supplied to the polishing section.

However, when the polishing agent is supplied to the polishing portion, the polishing agent is also applied to portions other than the polishing portion (for example, the front and back surfaces of the wafer), and the portion is damaged by the etching action of the alkali. This flaw cannot be removed in a cleaning step for cleaning the abrasive. Nevertheless, scratches on the wafer surface are removed by mirror polishing performed later, so there is no problem, but the scratches left on the back surface of the wafer remain on the product as it is, this becomes a source of new fine powder, thereby Inconveniences such as a yield at the time of device manufacturing and deterioration of characteristics of the semiconductor device occur.

In recent years, as a polishing apparatus for polishing without using an abrasive, an apparatus for polishing a chamfered portion of a wafer by using a tape carrying fixed abrasive grains has been considered. This apparatus does not use a polishing agent containing alkali, so that there is no problem of scratches on the back surface of the wafer. However, in the case of a tape carrying fixed abrasive grains, unlike free abrasive grain polishing, the abrasive grains are not replaced on the working surface, so if the same surface of the tape is used repeatedly, the fixed abrasive grains will wear or clog. Will occur. Therefore, in order to polish the chamfered portion efficiently, it is necessary to successively apply new surfaces of the tape to the chamfered portion. For that purpose, in a polishing apparatus using a tape carrying fixed abrasive grains, a new surface of the tape is fed out by a reel for feeding out, the used surface is polished, and the used portion is sequentially wound by a winding reel. Ingenuity is taken such as taking.

FIG. 13 shows an outline of the polishing apparatus. The polishing apparatus 1 includes a wafer holding means 2 for holding a wafer W, a pressing member 3 for pressing a tape T against a chamfered portion of the wafer W to be polished, and a tape T
And a take-up reel 5 for winding up a used portion of the tape T. In this apparatus 1, the tape T is fed out by the feeding reel 4, and the fed-out tape T is pressed against the chamfered portion of the wafer W by the pressing member 3, and is polished by the new surface of the tape T, and the used portion is sequentially removed. Reel 5 for winding
During the polishing, the tape T itself is swung slightly in the width direction, and the wafer W held by the wafer holding means 2 is rotated so that the tape T is caught between the chamfered portion of the wafer W and the tape. Gives relative speed.

[0007]

However, this polishing apparatus has the following problems.

When polishing is performed with the tape T, the new surface feeding speed of the tape T and the relative speed between the chamfered portion and the tape T in the polishing portion are important factors in performing good polishing. In the polishing device 1, the winding speed of the tape T can be changed arbitrarily, and therefore, the new surface feeding speed of the tape T can be changed. However, since the tape T is used in the width direction due to vibration in the tape width direction, It is difficult to use the entire surface effectively and the wafer W
Is rotated at high speed, the wafer W with respect to its rotation axis
While the occurrence of vibrations due to the eccentricity is concerned, the corners of the orientation flat may be excessively polished.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a polishing apparatus for an outer peripheral portion of a wafer, which can perform good polishing stably and quickly.

[0010]

A polishing apparatus according to the present invention is a polishing apparatus for polishing an outer peripheral portion of a wafer with a tape having fixed abrasive particles carried on a surface thereof, wherein the tape is wound and held. A reel for feeding out the tape, a winding reel for winding the tape fed from the reel for feeding, a rotating drum in which both reels are detachably installed, and a rotating drum. A polishing device having a motor and a motor for rotating the take-up reel, wherein the intermediate portion of the tape wound around the two reels is spirally wound around the outer periphery of the rotating drum. A plurality of machines, the wafer can support the wafer so that the main surface of the wafer is orthogonal to the drum rotation axis, and the wafer to rotate the wafer And a lifting means, a plurality of the polishing machine, in which are installed at predetermined intervals along the outer periphery of the wafer supported on the wafer holding means. Further, in this case, the plurality of polishing machines use the tapes having different fixed abrasive grain sizes, and the outer peripheral portion of the wafer parallel to the main surface of the wafer supported by the wafer holding means. A means for rotating the rotary drum or the wafer about an axis existing on a line passing through the vicinity is provided.

[0011]

According to the above-mentioned means, the tape is wound around the outer periphery of the rotary drum, and the tape moves relatively to the outer periphery of the wafer by rotation of the take-up reel. Successively, a new portion of the tape is brought into contact with the outer periphery of the wafer, and the rotation of the rotating drum provides a sufficient relative speed between the outer periphery and the tape. As a result, stable polishing can be performed.

Further, since the polishing apparatus is configured to be polished by a plurality of polishing machines, for example, if simultaneous polishing is performed by a plurality of polishing machines using tapes having the same fixed abrasive grain size, The polishing time can be shortened. On the other hand, even when polishing is performed with a plurality of polishing machines using tapes having different fixed abrasive grains, the inclination of the rotating drum with respect to the main surface of the wafer is continuously or stepwise changed, and In order that the rough polishing and the fine polishing do not interfere with each other in place, if the fine polishing is performed in a form following the rough polishing, the time during which the rough polishing and the fine polishing are simultaneously performed is performed. The polishing time can be shortened by the minute. Further, for example, polishing is performed by two pairs of polishing machines using tapes having different fixed abrasive grain sizes. First, a pair of polishing machines having relatively large fixed abrasive grain sizes are used to grind the outer peripheral portion of the wafer. Can be reduced by roughly polishing the outer peripheral portion of the wafer with a pair of polishing machines having relatively small fixed abrasive grains.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A polishing apparatus according to an embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is a plan view of the polishing apparatus according to the first embodiment, and FIG. 2 is a perspective view showing the external appearance of the polishing apparatus. The polishing apparatus 6 includes two polishing machines 6a and 6b and a wafer holding means 7. These polishing machines 6a, 6b
Are respectively a rotating drum 32 and this rotating drum 32
A reel 9 (FIG. 3) and a take-up reel 10 (FIG. 3) installed therein, a motor 11 for driving the rotary drum 32 to rotate, and a motor 12 for driving the take-up reel 10 to rotate. have. Each polishing machine 6a, 6b
Is wound spirally around the outer circumference of the rotary drum 32 and then guided again inside the rotary drum 32 to be taken up by the take-up reel 10. ing. As shown in FIG. 3, a bearing 14 is provided on the outer peripheral portion of the rotary drum 32, and the tape 14 can be smoothly moved by the bearing 14. A rubber material 15 is provided on the outer surface of the bearing 14 along the circumferential direction thereof.
Is baked. The rubber material 15 functions as a cushion when the wafer W is pressed against the tape T,
It functions to increase the contact area between the chamfered portion of the wafer W and the tape T.

Here, the tape T will be described. As shown in FIG. 4, the tape T is obtained by bonding fixed abrasive grains 13c to a tape base 13a via an adhesive 13b, for example. The fixed abrasive 13c is wound around the reel 9 so that the surface on which the fixed abrasive 13c is formed faces outward. At this time, between the two polishing machines 6a and 6b, tapes T having mutually different fixed abrasive grain sizes are used. That is, the polishing machine 6a
Uses a tape T having a large particle size (coarse tape T1), and a polishing machine 6b uses a tape T having a small particle size (fine tape T2). Although not shown, the tape T may be of a type in which a paint in which fixed abrasive grains are mixed is applied on a tape base material.

Next, the rotary drum 32 will be described. As shown in FIG.
And a cylindrical body 21 provided with a top plate 21a. Of these, the cylinder 20
The dimension of the peripheral wall 20b along the generatrix direction is the peripheral wall 2 of the cylindrical body 21.
1b. Further, the peripheral wall 20b of the cylindrical body 20 has a large diameter at the base end side, and an upper half portion of the small diameter part connected to the large diameter part is configured to be able to fit inside the cylindrical body 21, A bearing 14 can be fitted to the outside of the lower half of the small diameter portion. Furthermore, the cylinder 2
The reel support shaft 23 is erected on the bottom plate 20a of the “0”, and the reel 9 for feeding is attached to the reel support shaft 23 so as to be idle and detachable. Also, the bottom plate 2 of the cylindrical body 20
The lower part of 0a is fixed to the motor shaft 11a of the motor 11. On the other hand, a motor 12 is provided on the cylinder 21, and a motor shaft 12 a of the motor 12 passes through a top plate 21 a of the cylinder 21 and faces the inside of the cylinder 21. The motor shaft 12a is a reel support shaft, and a take-up reel 10 is fixed to a portion of the motor shaft 12a facing the inside of the cylindrical body 21. As shown in FIG. 2, tape slits 24a, 24b are formed on the peripheral walls of the cylindrical bodies 20, 21.
The tape T fed from the reel 9 is once guided to the outside of the rotary drum 32 and spirally wound around the outer periphery thereof, and then guided again to the inside of the rotary drum 32 to take up the reel 10 Can be wound up.

The polishers 6a and 6b having the rotating drum 32 constructed as described above are installed at a predetermined interval along the outer periphery of the wafer W supported by the wafer holding means 7, and the two rotating drums 32 The wafer W held by the holding means 7 can be simultaneously contacted.

On the other hand, the wafer holding means 7 shown in FIG. 2 will be described. The wafer holding means 7 comprises a suction disk 7a for vacuum-suctioning the wafer W and a motor for rotating the wafer W supported by the suction disk 7a. (Not shown),
Stage 7b for supporting the suction disk 7a and the motor
It has.

Although not shown, the polishing machines 6a, 6b
Of the rotating drum 32, respectively.
An air cylinder device capable of pressing the wafer toward the center of the wafer W held by the wafer holding means 7 is additionally provided. With this air cylinder device, the tape T of the rotating drum 32 can be pressed against the chamfered portion of the wafer W with a predetermined pressure. When both the rotating drums 32 come into contact with the chamfered portion of the wafer W within the range of the central angle 90 ° of the wafer W, the air cylinder device may be provided on the wafer holding means 7 side. The rotating drum 32 has an axis parallel to the main surface of the wafer W supported by the wafer holding means 7 and located on a line passing through the vicinity of the chamfered portion (outer peripheral portion) of the wafer W. 32 to rotate the rotating drum 3 against the chamfered portion of the wafer W.
2 is provided with a tilting means (not shown) for tilting.

Next, a method of using the polishing apparatus 6 of this embodiment will be described.

First, the cylindrical body 20 and the cylindrical body 21 are separated from each other, the reel 9 for feeding the tape T wound thereon is set on the cylindrical body 20 side, and the winding reel 10 is mounted on the cylindrical body 21 side. Is set. Then, the tip of the tape T wound on the payout reel 9 is pulled out from the tape slit 24a of the cylinder 20, guided to the outside of the rotary drum 32, and spirally wound around the outer periphery thereof. Tape slit 24
b to the take-up reel 10. Then
The cylinder 20 and the cylinder 21 are fitted together, and the motor 12 is driven to remove the slack of the tape T. This operation is performed for the two polishing machines 6a and 6b. At this time, as described above, the rough tape T1 is applied to the polishing machine 6a, and the polishing machine 6b
Is attached with a fine tape T2.

On the other hand, the wafer W is suctioned substantially concentrically on the suction disk 7a of the wafer holding means 7. Next, the rotating drum 32 of the polishing machine 6a is moved toward the chamfered portion of the wafer W by an air cylinder device (not shown), and the rough tape T1 wound around the outer periphery of the rotating drum 32 is brought into contact with the chamfered portion of the wafer W. . In this contact, it is preferable that the rotating drum 32 be rotated by the motor 11, the wafer W be rotated by the motor (not shown), and the tape T be moved by the motor 12. It is desirable that the rotation direction of the rotary drum 32 and the movement direction of the tape T1 be the same. Further, by tilting means (not shown),
As shown in (1), the rotary drum 32 is first inclined forward (tilt angle θ0).

Thus, rough polishing is performed by bringing the tape T1 into contact with the chamfered portion. In this case, the wafer W is rotated at a low speed in order to move the polished portion of the wafer W in the circumferential direction of the wafer W. As shown in the timing chart of FIG. 6, the rotating drum 32 is gradually raised by the tilting means (not shown) as the rough polishing proceeds. In this case, the tilting speed of the rotating drum 32 is set to a value such that each portion of the chamfered portion of the wafer W can be roughly polished without leakage.

When the rotating drum 32 of the polishing machine 6a rotates once or twice and the rotating drum 32 of the polishing machine 6a rises slightly, the rotating drum 32 of the polishing machine 6b is chamfered by an air cylinder device (not shown). And the rotating drum 3
Then, the fine tape T2 wound around the outer periphery of No. 2 is brought into contact. In this contact, as in the polishing machine 6a, the rotating drum 32 is rotated by the drive of the motor 11 and the wafer W is rotated by the drive of a motor (not shown), and the tape 12 is moved to the tape T2 by the drive of the motor 12. It is preferable to keep it. It is desirable that the rotating direction of the rotating drum 32 and the moving direction of the tape T2 be the same. Further, as shown in FIG. 5, the rotating drum 32 of the polishing machine 6b is inclined forward (tilt angle θ0) so that the rough polishing and the fine polishing do not interfere with each other locally, and the rough polishing is performed. Fine polishing is performed in a manner to follow.

As described above, when the tilt angle of the rotating drum 32 of the polishing machine 6a becomes -θ0, the rotating drum 32 of the polishing machine 6a is retracted with respect to the wafer W to finish the rough polishing. For example, by the end of the rough polishing, the wafer W rotates 5 to 20 times. Next, the rotating drum 32 of the polishing machine 6b
When the tilt angle of the wafer becomes −θ0, the rotating drum 32 of the polishing machine 6b is moved backward with respect to the wafer W to finish the fine polishing.

According to the polishing apparatus 6 configured as described above, the tape T is spirally wound around the rotary drum 32, and the tape T is moved by the rotation of the take-up reel 10. The new surface of the tape T is successively fed out, and the rotation of the rotary drum 32 provides a sufficient relative speed between the chamfered portion and the tape. Therefore, good polishing can be stably performed. The rotating drum 32 has a tape T
Is spirally wound, so that the contact portion with the outer peripheral portion of the wafer W makes the tape T
Is moved obliquely across the tape T, and furthermore, the tape T is slowly rolled up to move to the new surface side at a fine pitch, so that the entire surface of the tape T can be used effectively.

The rough polishing is followed by two polishing machines 6a and 6b having different fixed abrasive grains of the tape T so that the rough polishing and the fine polishing do not interfere with each other locally. Since the fine polishing is performed in such a manner, the polishing time can be reduced by the time during which the rough polishing and the fine polishing are simultaneously performed as shown in FIG.

FIG. 7 is a plan view of a polishing apparatus according to the second embodiment, and FIG. 8 is a perspective view showing the appearance of a part of the polishing apparatus. This polishing apparatus 30 is similar to the polishing apparatus 6 of the first embodiment.
Therefore, the same reference numerals are used for the corresponding parts or corresponding parts, and detailed description thereof is omitted.

In the polishing apparatus 30 of the second embodiment, instead of the polishing machines 6a and 6b in the polishing apparatus 6 of the first embodiment, polishing machines 30a and 30b having a different configuration are provided.

As shown in FIG. 8, the rotating drum 32 in each of the polishing machines 30a and 30b has a bottom plate 33a.
And a lid 34 for closing the opening of the cylindrical body 33. The lower part of the bottom plate 33a of the cylindrical body 33 is attached to the motor shaft 11a of the motor 11. Further, another motor 12 is attached below the cylindrical body 33, and the motor shaft 12a of the motor 12 is provided.
9, extends through the bottom plate 33a of the cylindrical body 33 and extends to the inside of the cylindrical body 33. The winding reel 10 can be set on the motor shaft 12a. A reel support shaft 35 is provided upright on the bottom plate 33a of the cylindrical body 33.
5, a reel 9 for feeding can be set.

As shown in FIGS. 8 and 10, a tape slit 36 reaching the upper end of the cylindrical body 33 is formed in the outer peripheral portion. The tape T can be led out and introduced from the tape slit 36. Further, a tension roller 37 and a pressing roller 38 are provided inside the cylindrical body 33. Then, the tension roller 37 or the pressing roller 3
By counting the number of rotations of 8, the feed amount of the tape T can be controlled.

In the polishing machines 30a and 30b,
The tape T fed out from the pay-out reel 9 is wound around the outer peripheral surface of the rotary drum 32 substantially once along the circumferential direction, and then guided again inside the rotary drum 32 to be taken up by the take-up reel 10. It can be wound up. The rubber material 15 is baked on the outer peripheral surface of the rotary drum 32 along the circumferential direction. Although not shown, the polishing apparatus 30 has an elevating device (moving means) for moving the rotary drum 32 up and down by the tape width. The other configuration, for example, the point that the wafer holding means 7 and the tilting means are provided is the same as that of the first embodiment.

Next, a method of using the polishing apparatus 30 of this embodiment will be described.

First, the cover 34 is removed from the cylinder 33, and the reel 9 for feeding the tape T wound thereon and the empty reel 10 for winding are set on the cylinder 33. Then, the tip of the tape T wound on the reel 9 for feeding is connected to the cylindrical body 3.
Pull out from the tape slit 36 of the rotating drum 3
After being wound about one turn, it is attached to the take-up reel 10 through the tape slit 36 of the cylindrical body 33. At this time, the rough tape T1 is applied to the polishing machine 30a,
The fine tape T2 is attached to the polishing machine 30b.

Next, a lid 34 is attached to the cylinder 33,
The motor 12 is driven to remove the slack of the tape T and set to a stopped state. When the polishing of the outer peripheral portion of the wafer is started, the position of the rotary drum 32 is previously set to a lowermost position by an elevating device (not shown) so that the upper end of the tape T is pressed against the outer peripheral portion of the wafer. Keep it.

On the other hand, the wafer W is adsorbed almost concentrically on the suction disk 7a of the wafer holding means 7, and the rotating drum 32 of the polishing machine 30a is moved by an air cylinder device (not shown) to the chamfered portion of the wafer W. Rotating drum 32
The tape T wound around the outer periphery of is contacted. In this contact, the rotating drum 32 is driven by the motor 11 and the wafer W is driven by the motor (not shown).
Are preferably rotated.

The procedure of the subsequent polishing is almost the same as in the first embodiment. However, during the polishing, the rotary drum 32 is raised by an elevating device (not shown) so that the tape T
Is different from the first embodiment in that the contact portion is shifted in the width direction of the tape T and the chamfered portion of the wafer W is polished with a new portion in the width direction of the tape T. The width of a unit indicated by a hatched portion in FIG. 11 is a tape width required for polishing the outer peripheral portion of one wafer W. As described above, when the rotating drum 32 is raised and the contact portion of the tape T is moved in the width direction of the tape T, and the plurality of wafers W are polished using the same surface of the tape T, the width of the tape T is reduced. The direction can be used effectively. When the entire width of the tape T has been used up, the rotary drum 32 itself is again lowered to the lowest position by the elevating device, and the motor 12 is driven to move the tape T by one turn so that the new surface is removed. I will put it out. After that, polishing is performed in the same manner as described above.

According to the polishing apparatus 30 configured as described above, the rotating drum 32 moves the wafer W during polishing.
As the tape T moves in the axial direction, it is the same as a new surface being successively unwound over the entire length and width of the tape T, and the rotation of the rotary drum 32 provides a sufficient relative speed between the chamfered portion and the tape. Will be done. Therefore, good polishing can be performed stably and quickly.

Further, since the reel 9 for feeding and the reel 10 for winding are provided in the same plane perpendicular to the drum rotation axis, the reels 9 and 10 can be easily attached and detached. Become.

Although the embodiments made by the present inventors have been described above, the present invention is not limited to such embodiments, and it goes without saying that various modifications can be made without departing from the gist of the invention.

For example, in both of the above embodiments, the tilting means for tilting the rotary drum 32 with respect to the wafer W is provided. However, the tilting means may be provided not on the rotary drum 32 but on the wafer holding means 7 side. .

In the second embodiment, a lifting device for moving the rotary drum 32 up and down is provided in order to use the width direction of the tape T effectively. An elevating device for elevating may be provided.

In the above embodiment, as shown in FIG. 6, the rotary drum 32 is continuously tilted. However, the rotary drum 32 may be tilted stepwise. For example, if the tilt is 3
After rough polishing of the chamfered portion on the front side of the wafer W is finished, rough polishing of the chamfered end surface of the wafer W and fine polishing of the chamfered portion on the front side are performed. Furthermore, during rough polishing of the chamfered portion on the back side of the wafer W,
The chamfered end face should be finely polished. Finally, the chamfered portion on the back side of the wafer W may be finely polished.

Further, in both of the above-described embodiments, the tape T having the fixed abrasive grains having different particle sizes was used between the polishing machines 6a and 6b and between the polishing machines 30a and 30b. The tape T having the same grain size may be used. In this case, the polishing time can be reduced to about 以下 or less of the related art.

As shown in FIG. 12, two polishing machines 40a and 40a using a rough tape are used.
Two polishing machines 40b and 40b using fine tape are installed at predetermined intervals along the outer periphery of the wafer W, and rough polishing is first performed by the polishing machines 40a and 40a. Fine polishing may be performed by the machines 40b, 40b.

[0046]

According to the present invention, the outer peripheral portion of the wafer is
A polishing apparatus for polishing with a tape having fixed abrasive particles carried on a surface thereof, wherein the tape is wound and held, and a reel for reeling out the tape, and winding the tape reeled out from the reel for reeling out A take-up reel, a rotating drum on which both reels are detachably installed, and a motor for rotating the rotating drum,
A motor for rotating the take-up reel, and a plurality of polishing machines configured such that a middle part of the tape wound around the both reels is spirally wound around the outer periphery of the rotating drum. And a wafer holding means for supporting the wafer so that the main surface of the wafer is orthogonal to the drum rotation axis, and for rotating the wafer, a plurality of polishing machines, Since the wafers are provided at predetermined intervals along the outer periphery of the wafer supported by the means, good polishing can be performed stably and quickly.

[Brief description of the drawings]

FIG. 1 is a plan view of a polishing apparatus according to a first embodiment.

FIG. 2 is an external perspective view of the polishing apparatus according to the first embodiment.

FIG. 3 is a longitudinal sectional view for explaining a configuration of the polishing machine according to the first embodiment.

FIG. 4 is a schematic configuration diagram of a tape.

FIG. 5 is a view showing a tilted state of the rotary drum according to the first embodiment.

FIG. 6 is a timing chart of the rotary drum according to the first embodiment in a tilted state.

FIG. 7 is a plan view of a polishing apparatus according to a second embodiment.

FIG. 8 is an external perspective view of a polishing machine according to a second embodiment.

FIG. 9 is a longitudinal sectional view of a polishing apparatus according to a second embodiment.

FIG. 10 is a plan view of a polishing machine according to a second embodiment.

FIG. 11 is a diagram showing an example of a method of using a tape in a second embodiment.

FIG. 12 is a plan view of a polishing apparatus according to another embodiment.

FIG. 13 is a schematic configuration diagram of a conventional polishing apparatus.

[Explanation of symbols]

 6, 30, 40 Polishing device 6a, 6b, 30a, 30b Polisher 32 Rotary drum 9 Reel for reel 10 Reel for reel 11, 12 Motor T Tape W Wafer

──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yasuka Kuroda 150 Odaikura Osaikura, Nishigo-mura, Nishishirakawa-gun, Fukushima Prefecture Inside the Semiconductor Shirakawa Research Laboratory, Shin-Etsu Semiconductor Co., Ltd. No. Fujiuchi Machine Industry Co., Ltd. (72) Inventor Yasuo Inada 1650 Kiyono, Matsushiro-machi, Nagano City, Nagano Prefecture Fujitsu Machine Industry Co., Ltd. (56) References JP-A-61-293764 (JP, A) Kaihei 1-1101758 (JP, U) JP-A 61-148560 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) B24B 9/00 601 B24B 21/00 H01L 21/304 301

Claims (2)

(57) [Claims] 1. A polishing apparatus for polishing an outer peripheral portion of a wafer with a tape having fixed abrasive grains carried on a surface thereof, wherein the tape is wound and held, and a reel for feeding the tape is provided. A take-up reel for taking up the tape fed from the pay-out reel, a rotating drum in which both reels are detachably mounted, a motor for rotating the rotating drum, and rotating the take-up reel And a plurality of polishing machines configured so that a middle part of the tape wound around the two reels is spirally wound around the outer periphery of the rotating drum, and a main part of the wafer. Wafer holding means for supporting the wafer so that the surface is orthogonal to the drum rotation axis, and for rotating the wafer,
A plurality of polishing machines are provided at predetermined intervals along an outer periphery of the wafer supported by the wafer holding means, and a polishing apparatus for an outer peripheral portion of a wafer is provided. 2. A plurality of polishing machines, wherein the tapes having different fixed abrasive grain sizes are used, and the tape is parallel to the main surface of the wafer supported by the wafer holding means and near the outer periphery of the wafer. Around the axis that exists on the line that passes through
2. The apparatus according to claim 1, further comprising means for rotating the rotating drum or the wafer.