JP2846726B2 - Bonding wire surface cleaning method and apparatus - Google Patents
Bonding wire surface cleaning method and apparatusInfo
- Publication number
- JP2846726B2 JP2846726B2 JP2286263A JP28626390A JP2846726B2 JP 2846726 B2 JP2846726 B2 JP 2846726B2 JP 2286263 A JP2286263 A JP 2286263A JP 28626390 A JP28626390 A JP 28626390A JP 2846726 B2 JP2846726 B2 JP 2846726B2
- Authority
- JP
- Japan
- Prior art keywords
- bonding wire
- photon energy
- wire
- drawn
- electric furnace
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/43—Manufacturing methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L2224/745—Apparatus for manufacturing wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】 〈産業上の利用分野〉 本発明は半導体素子のチップ電極と外部リードを接続
する例えばAu線,Al線,Cu線又はそれらに添加元素を含有
させた合金線等からなるボンディングワイヤの表面浄化
方法及び装置に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial application field> The present invention relates to a method for connecting a chip electrode of a semiconductor element and an external lead, such as an Au wire, an Al wire, a Cu wire, or an alloy wire containing an additive element to them. The present invention relates to a method and an apparatus for cleaning the surface of a bonding wire.
〈従来の技術〉 従来、この種のボンディングワイヤはその表面に潤滑
剤を供給して伸線加工し、その後工程で電気炉内を通し
て焼なまし処理が施されることにより、表面に残ってい
る潤滑剤の薄膜を蒸発させて巻取っている。<Conventional technology> Conventionally, this type of bonding wire remains on the surface by supplying a lubricant to the surface and drawing the wire, and then subjected to an annealing process through an electric furnace in a subsequent process. The lubricant film is evaporated and wound.
〈発明が解決しようとする課題〉 しかし乍ら、このような従来のボンディングワイヤで
は、焼なまし処理を施しても表面の薄膜を除去できず、
表面に薄膜が不均一に残留するため、この焼なまし処理
後に残留した均一状の薄膜により巻取った線どおしがく
っ付いて、ワイヤボンダにて使用される際にボンディン
グワイヤを円滑にほどき出すことができず、その結果ボ
ンディング時に変形ループが発生し易いという問題があ
る。<Problems to be Solved by the Invention> However, such a conventional bonding wire cannot remove the thin film on the surface even after annealing.
Since the thin film remains non-uniformly on the surface, the wire wound by the uniform thin film remaining after this annealing process sticks, and when used in a wire bonder, the bonding wire can be unwound smoothly. As a result, there is a problem that a deformation loop is easily generated at the time of bonding.
そこで、伸線加工されたボンディングワイヤの表面を
例えばフロンやトリエタン等の有機溶剤か又は純水によ
り湿式洗浄するものがある。Therefore, there is a method in which the surface of the drawn bonding wire is wet-cleaned with an organic solvent such as Freon or triethane or pure water.
しかし、有機溶剤により洗浄する場合には環境を汚染
したり、その設備が大型化して場所を取ると共に、洗浄
後の残留物が半導体素子に悪影響を及ぼすという問題が
あり、又純水により洗浄する場合には純水を多量に使用
しても汚れが落ち難く洗浄効率が悪いという問題があ
る。However, when washing with an organic solvent, there is a problem that the environment is polluted, the equipment becomes large and a space is required, and the residue after washing has an adverse effect on the semiconductor element. In this case, even if a large amount of pure water is used, there is a problem that dirt is hardly removed and cleaning efficiency is poor.
一方、ボンディングワイヤがAu線の場合にはその表面
に薄膜がなくAuが露出していると、線どおしがくっ付き
易いという問題もある。On the other hand, when the bonding wire is an Au wire, if the Au wire is exposed without a thin film on the surface, there is also a problem that the wires tend to stick together.
本発明は斯る従来事情に鑑み、乾式洗浄にてボンディ
ングワイヤの表面に残留する薄膜を適正に制御して巻取
った線どおしのくっ付きを防止することを目的とする。The present invention has been made in view of the above circumstances, and has as its object to appropriately control a thin film remaining on the surface of a bonding wire by dry cleaning to prevent sticking of wound wires.
〈課題を解決するための手段〉 上記課題を解決するために本発明が講ずる技術的手段
は、伸線加工されたボンディングワイヤに光子エネルギ
ーを照射して巻取る方法である。<Means for Solving the Problems> A technical means taken by the present invention to solve the above problems is a method of irradiating a drawn bonding wire with photon energy to wind it.
そして、伸線加工されたボンディングワイヤを、電気
炉内を通して焼なまし処理を施した後に、光子エネルギ
ーを照射することが好ましい。It is preferable that the drawn wire is subjected to an annealing treatment through an electric furnace and then irradiated with photon energy.
また、伸線加工されたボンディングワイヤに光子エネ
ルギーを照射した後に、電気炉内を通して焼なまし処理
を施しても良い。Moreover, after irradiating the drawn bonding wire with photon energy, annealing treatment may be performed through an electric furnace.
更に、伸線加工されたボンディングワイヤに光子エネ
ルギーを照射した後に、電気炉に通して焼なまし処理を
施し、その後に光子エネルギーを照射しても良い。Furthermore, after irradiating the drawn bonding wire with photon energy, it may be subjected to an annealing treatment through an electric furnace, followed by irradiation with photon energy.
そして、伸線加工されたボンディングワイヤの繰り出
し路に、該ボンディングワイヤが通過する間に焼なまし
処理を施す電気炉を配設し、この繰り出し炉の下流端に
ボンディングワイヤを巻取りスプールに巻取る巻取り機
構を配設すると共に、上記繰り出し路の途中にボンディ
ングワイヤが通過する間に光子エネルギーを照射する光
子エネルギー発光源を配置したことを特徴とするもので
ある。Then, an electric furnace for performing an annealing process while the bonding wire passes is disposed in a drawing path of the drawn bonding wire, and the bonding wire is wound on a take-up spool at a downstream end of the drawing furnace. A take-up winding mechanism is provided, and a photon energy emission source for irradiating photon energy while a bonding wire passes through the feeding path is provided.
〈作用〉 本発明は上記技術的手段によれば、光子エネルギーが
ボンディングワイヤの表面に照射されることにより、表
面に残留する薄膜を線どおしがくっ付かない程度に洗浄
するものである。<Function> According to the above technical means, the photonic energy is applied to the surface of the bonding wire to clean the thin film remaining on the surface so that the lines do not stick together.
〈実施例〉 以下、本発明の一実施例を図面に基づいて説明する。<Example> An example of the present invention will be described below with reference to the drawings.
この実施例は第１図に示す如く前工程で伸線加工され
たボンディングワイヤＡが巻取られている供給スプール
１を、該ボンディングワイヤＡの繰り出し路Ｂの上流端
に遊転且つ着脱自在に軸支し、その下流側に電気炉２及
び光子エネルギー発光源３を順次配設すると共に、繰り
出し路Ｂの下流端に巻取り機構４を配設したものであ
る。In this embodiment, as shown in FIG. 1, a supply spool 1 on which a bonding wire A drawn in a previous step is wound is freely rotatable and detachably attached to an upstream end of a feeding path B of the bonding wire A. The electric furnace 2 and the photon energy light emitting source 3 are sequentially arranged downstream of the shaft, and a winding mechanism 4 is arranged at the downstream end of the feeding path B.
電気炉２は従来周知構造のもので、その内部を所定温
度、例えば300〜500℃に保持してボンディングワイヤＡ
が所定速度で通過することにより、該ボンディングワイ
ヤＡに焼なまし処理を施してボンディング特性に必要な
ワイヤ特性が付与される。The electric furnace 2 has a conventionally well-known structure. The inside of the electric furnace 2 is maintained at a predetermined temperature, for example, 300 to 500 ° C., and the bonding wire A
Is passed at a predetermined speed, whereby the bonding wire A is subjected to an annealing treatment so that the wire characteristics required for the bonding characteristics are imparted.
光子エネルギー発光源３は103eV〜10-1eVの光子エネ
ルギー、詳しくは紫外線や可視光線や赤外線等を発光す
るランプであり、本実施例の場合には繰り出されたボン
ディングワイヤＡを挾んで紫外線ランプ3aを２本夫々繰
り出し路Ｂと平行に並設し、これら両紫外線ランプ3a,3
aの間をボンディングワイヤＡが所定速度で通過するこ
とにより、その表面に紫外線が照射されて、該表面残留
する薄膜を線どおしがくっ付かない程度に洗浄する。The photon energy emission source 3 is a lamp that emits photon energy of 10 3 eV to 10 −1 eV, specifically, ultraviolet light, visible light, infrared light, or the like. In the case of this embodiment, the bonding wire A drawn out is sandwiched. Two ultraviolet lamps 3a are respectively arranged in parallel with the feeding path B, and these two ultraviolet lamps 3a, 3
As the bonding wire A passes at a predetermined speed between a, the surface is irradiated with ultraviolet rays, and the thin film remaining on the surface is cleaned to such an extent that the thin lines do not stick together.
また、両紫外線ランプ3a,3aの周囲には例えばステン
レス等からなる箱3bでこれらを覆うことにより、紫外線
が必要以外の場合に照射されることを防止して、作業者
や作業場の雰囲気に悪影響を与えないようにしている。In addition, by surrounding the two ultraviolet lamps 3a, 3a with a box 3b made of, for example, stainless steel, etc., it is possible to prevent ultraviolet rays from being irradiated when it is not necessary, thereby adversely affecting the atmosphere of workers and workplaces. Not to give.
巻取り機構４はモータが連係する回転軸4aに巻取りス
プール4bを回転不能で且つ着脱自在に軸支する従来周知
構造のもので、回転軸4aを回転することによりボンディ
ングワイヤＡがドラバースさせて巻取りスプール4bに巻
取られる。The take-up mechanism 4 has a conventionally well-known structure in which the take-up spool 4b is non-rotatably and detachably supported on a rotary shaft 4a to which a motor is linked, and the bonding wire A is drawn by rotating the rotary shaft 4a. It is wound on the take-up spool 4b.
また、図中５はテンションローラで６はガイドローラ
である。In the figure, 5 is a tension roller and 6 is a guide roller.
而して斯るボンディングワイヤの表面浄化装置は供給
スプール１から繰り出す伸線加工されたボンディングワ
イヤＡが、先ず電気炉２内を通って焼なまし処理が施さ
れた後に、紫外線ランプ3a,3aの間を通って紫外線が照
射され表面洗浄し、その後に巻取りスプール4bに巻取ら
れる。Thus, the bonding wire surface cleaning apparatus of the present invention is configured such that the drawn bonding wire A drawn from the supply spool 1 is first subjected to an annealing treatment through the electric furnace 2 and then to the ultraviolet lamps 3a, 3a. Then, the surface is cleaned by irradiating ultraviolet rays, and then wound on a take-up spool 4b.
更に、第２図及び第３図に示すものは夫々本発明の他
の実施例を示すものである。FIGS. 2 and 3 show other embodiments of the present invention.
第２図のものは伸線加工されたボンディングワイヤＡ
が巻取られている供給スプール１の下流側に、光子エネ
ルギー発光源３として紫外線ランプ3a,3a、電気炉２及
び巻取り機構４を次配設し、供給スプール１から繰り出
す伸線加工されたボンディングワイヤＡが紫外線ランプ
3a,3aの間を通って紫外線が照射された後に、電気炉２
内を通って焼なまし処理が施され、その後に巻取りスプ
ール4bに巻取られる。FIG. 2 shows a drawn bonding wire A.
The UV lamps 3a, 3a, the electric furnace 2, and the winding mechanism 4 are disposed next to the supply spool 1 on which is wound as a photon energy emission source 3, and the wire is drawn out from the supply spool 1. Bonding wire A is an ultraviolet lamp
After being irradiated with ultraviolet light through the space between 3a and 3a, the electric furnace 2
After passing through the inside, an annealing process is performed, and thereafter, the film is wound on a winding spool 4b.
第３図のものは伸線加工されたボンディングワイヤＡ
が巻取られている供給スプール１の下流側に、光子エネ
ルギー発生源３として紫外線ランプ3a,3a、電気炉２、
光子エネルギー発生源３として紫外線ランプ３及び巻取
り機構４を順次配設し、供給スプール１から繰り出す伸
線加工されたボンディングワイヤＡに紫外線ランプ3a,3
aの間を通って紫外線が照射された後に、電気炉２内を
通って焼なまし処理が施され、その後に紫外線ランプ3
a,3aを通って紫外線が照射されてから巻取りスプール4b
に巻取られる。FIG. 3 shows a drawn bonding wire A.
On the downstream side of the supply spool 1 on which is wound, ultraviolet lamps 3a, 3a, an electric furnace 2,
An ultraviolet lamp 3 and a winding mechanism 4 are sequentially disposed as a photon energy generation source 3, and the ultraviolet lamps 3 a and 3 are attached to the drawn bonding wire A drawn from the supply spool 1.
a, after being irradiated with ultraviolet rays, passed through the electric furnace 2 and subjected to an annealing treatment.
a, 3a, and after the ultraviolet rays are irradiated, take-up spool 4b
It is wound up.
そして、第１図〜第３図に示す実施例１〜３のボンデ
ィングワイヤの表面浄化装置により波長184.9〜253.7nm
の紫外線を0.5〜1.5秒照射して巻取った直径30μ,1000m
の各Au線及び伸線加工されたボンディングワイヤに焼な
まし処理のみを施して巻取る従来装置により得られる直
径30μ,1000mのAu線を使用して、ボンディング時の変形
ループ発生率と、自重によりほどいてほどきが終了する
までの間に引っ掛った回数とを測定した結果を次表に示
す。Then, the wavelength of 184.9 to 253.7 nm was obtained by the bonding wire surface cleaning apparatus of Examples 1 to 3 shown in FIGS.
30μ, 1000m diameter wound by irradiating with ultraviolet light for 0.5 to 1.5 seconds
Using the Au wire with a diameter of 30μ, 1000m obtained by the conventional device that only performs annealing treatment and winds each Au wire and the drawn bonding wire, the deformation loop generation rate during bonding and its own weight The following table shows the results of measurement of the number of times of unraveling and the number of hooks until the end of unraveling.
この測定結果により本発明の各実施例により得られる
ものは、変形ループ発生率と自重ほどき引っ掛り回数が
従来装置により得られるものに比行べて明らかに少ない
ことが判り、巻取った線どおしのくっ付きが著しく減少
していることが理解される。 From these measurement results, it was found that the wire obtained by each embodiment of the present invention was clearly less in the deformation loop occurrence rate and the number of times of hooking as compared with that obtained by the conventional device, and the wound wire It can be seen that sticking of the pulp is significantly reduced.
尚、前示実施例では前工程で伸線加工されたボンディ
ングワイヤＡが巻取られている供給スプール１を繰り出
し路Ｂの上流端に配置したが、これに限定されず、繰り
出し路Ｂの上流側に伸線機を配設して、一台の装置で伸
線加工と焼なまし処理と光子エネルギー照射が行えるよ
うにしても良い。In the above-described embodiment, the supply spool 1 on which the bonding wire A drawn in the previous step is wound is disposed at the upstream end of the pay-out path B, but is not limited thereto. A wire drawing machine may be provided on the side to perform wire drawing, annealing and photon energy irradiation with one device.
また、光子エネルギー発光源３も紫外線ランプに限定
されず、他の赤外線ランプ等により構成しても良く、更
にその形状も図示せるも限定されない。Further, the photon energy emission source 3 is not limited to an ultraviolet lamp, but may be constituted by another infrared lamp or the like.
〈発明の効果〉 本発明は上記の構成であるから、以下の利点を有す
る。<Effect of the Invention> Since the present invention has the above configuration, it has the following advantages.
光子エネルギーがボンディングワイヤの表面に照射
されることにより、表面に残留する薄膜を線どおしがく
っ付かない程度に洗浄するので、乾式洗浄にてボンディ
ングワイヤの表面に残留する薄膜を適正に制御して巻取
った線どおしのくっ付きを防止することができる。By irradiating the surface of the bonding wire with photon energy, the thin film remaining on the surface is cleaned to the extent that the lines do not stick together, so the dry cleaning properly controls the thin film remaining on the surface of the bonding wire. It is possible to prevent sticking of the wound wire.
従って、ボンディングワイヤの表面に残留した均一な
薄膜により巻取った線どおしがくっ付く従来のものに比
べ、ワイヤボンダにて使用される際にボンディングワイ
ヤを円滑にほどき出すことができて、ボンディング時に
変形ループが発生しないと共に、伸線加工されたボンデ
ィングワイヤの表面を有機溶剤により洗浄するものに比
べ、環境汚染の心配がなく設備が大型化せず洗浄後の残
留物で半導体素子に悪影響を及ぼすことがなく、又純水
により洗浄するものに比べ、洗浄効率が良い。Therefore, when used in a wire bonder, the bonding wire can be unwound more smoothly than the conventional wire in which the wound wire is adhered by a uniform thin film remaining on the surface of the bonding wire. Deformation loops do not occur during bonding, and there is no need to worry about environmental pollution compared to cleaning the drawn wire surface with an organic solvent. And cleaning efficiency is higher than that of cleaning with pure water.
伸線加工後に焼なまし処理を施して巻取ったボンデ
ィングワイヤが、湿度の高い状態で保管されると、ボン
ディングワイヤの表面に付着したバクテリアが繁殖して
線どおしをくっ付け、ほどき難くなったりキャピラリ詰
りが発生し易くなるが、光子エネルギーとして紫外線を
ボンディングワイヤの表面に照射すれば、紫外線には殺
菌効果があるので、ボンディングワイヤの表面にバクテ
リアが付着せず、これを巻取って湿度の高い状態で保管
したとしてもバクリテアの繁殖によるほどき不良やキャ
ピラリ詰りを防止できる。If the bonding wire wound after annealing after wire drawing is stored in a humid condition, bacteria attached to the surface of the bonding wire will propagate and stick the wire together. Although it is difficult to cause capillary clogging, if ultraviolet rays are radiated to the surface of the bonding wire as photon energy, the ultraviolet rays have a bactericidal effect. Even if stored in a humid state, unraveling failure and clogging of capillaries due to breeding of bakritea can be prevented.
第１図は本発明の一実施例を示すボンディングワイヤの
表面浄化装置の正面図、第２図及び第３図は夫々本発明
の他の実施例を示すボンディングワイヤの表面浄化装置
の正面図である。 Ａ……ボンディングワイヤ、Ｂ……繰り出し路 ２……電気炉 ３……光子エネルギー発光源 ４……巻取り機構、4b……巻取りスプールFIG. 1 is a front view of a bonding wire surface cleaning apparatus showing one embodiment of the present invention, and FIGS. 2 and 3 are front views of a bonding wire surface cleaning apparatus showing another embodiment of the present invention. is there. A: bonding wire, B: payout path 2: electric furnace 3: photon energy emission source 4: winding mechanism, 4b: winding spool
Claims (5)
エネルギーを照射して巻取るボンディングワイヤの表面
浄化方法。1. A method for cleaning a surface of a bonding wire which is wound by irradiating a drawn bonding wire with photon energy.
気炉内を通して焼なまし処理を施した後に、光子エネル
ギーを照射する請求項１記載のボンディングワイヤの表
面浄化方法。2. The method for cleaning the surface of a bonding wire according to claim 1, wherein the drawn wire is subjected to an annealing treatment through an electric furnace and then irradiated with photon energy.
エネルギーを照射した後に、電気炉内を通して焼なまし
処理を施す請求項１記載のボンディングワイヤの表面浄
化方法。3. The method for cleaning the surface of a bonding wire according to claim 1, wherein after the drawing wire is irradiated with photon energy, annealing treatment is performed through an electric furnace.
エネルギーを照射した後に、電気炉を通して焼なまし処
理を施し、その後に光子エネルギーを照射する請求項１
記載のボンディングワイヤの表面浄化方法。4. The method according to claim 1, further comprising the step of irradiating the drawn bonding wire with photon energy, performing an annealing treatment through an electric furnace, and thereafter irradiating the photon energy.
A method for cleaning a surface of a bonding wire according to the above.
出し路に、該ボンディングワイヤが通過する間に焼なま
し処理を施す電気炉を配設し、この繰り出し路の下流端
にボンディングワイヤを巻取りスプールに巻取る巻取り
機構を配設すると共に、上記繰り出し路の途中にボンデ
ィングワイヤが通過する間に光子エネルギーを照射する
光子エネルギー発光源を配置したことを特徴とするボン
ディングワイヤの表面浄化装置。5. An electric furnace for performing an annealing treatment while the bonding wire passes through the paying-out path of the drawn bonding wire, and winding the bonding wire at a downstream end of the paying-out path. An apparatus for cleaning a surface of a bonding wire, comprising a winding mechanism for winding on a spool, and a photon energy emission source for irradiating photon energy while the bonding wire passes in the middle of the payout path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2286263A JP2846726B2 (en) | 1990-10-23 | 1990-10-23 | Bonding wire surface cleaning method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2286263A JP2846726B2 (en) | 1990-10-23 | 1990-10-23 | Bonding wire surface cleaning method and apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04159736A JPH04159736A (en) | 1992-06-02 |
| JP2846726B2 true JP2846726B2 (en) | 1999-01-13 |
Family
ID=17702101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2286263A Expired - Fee Related JP2846726B2 (en) | 1990-10-23 | 1990-10-23 | Bonding wire surface cleaning method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2846726B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060219754A1 (en) * | 2005-03-31 | 2006-10-05 | Horst Clauberg | Bonding wire cleaning unit and method of wire bonding using same |
| CN109570134B (en) * | 2018-11-28 | 2020-08-14 | 重庆市润金新材料科技有限公司 | Bonding gold wire belt cleaning device |
-
1990
- 1990-10-23 JP JP2286263A patent/JP2846726B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH04159736A (en) | 1992-06-02 |
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