JP2841683B2 - IC mounting method and device - Google Patents
IC mounting method and deviceInfo
- Publication number
- JP2841683B2 JP2841683B2 JP2093612A JP9361290A JP2841683B2 JP 2841683 B2 JP2841683 B2 JP 2841683B2 JP 2093612 A JP2093612 A JP 2093612A JP 9361290 A JP9361290 A JP 9361290A JP 2841683 B2 JP2841683 B2 JP 2841683B2
- Authority
- JP
- Japan
- Prior art keywords
- component
- mounting
- recognition camera
- board
- head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000758 substrate Substances 0.000 description 5
- 238000007689 inspection Methods 0.000 description 4
- 238000005259 measurement Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は、実装基体認識カメラと部品認識カメラとを
有するIC実装装置に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC mounting apparatus having a mounting substrate recognition camera and a component recognition camera.
従来の技術 以下、従来のIC実装装置について第３図を参照して説
明する。XYロボット１に部品装着ヘッド２と基板認識カ
メラ３が縦並びに搭載され、部品装着ヘッド２は、XYロ
ボット１により部品供給部９上へ移動して部品供給部９
からIC部品８を吸着保持して取り出し、そしてXYロボッ
ト１により部品認識カメラ７上へ移動し、部品装着ヘッ
ド２に吸着保持されたIC部品８の吸着位置を部品認識カ
メラ７によって認識測定する。さらに、XYテーブル６に
よって実装基板４上のIC部品装着位置５を基板認識カメ
ラ３の下方位置に移動させておき、IC部品装着位置５を
基板認識カメラ３により認識測定して、以上２つの認識
測定結果より部品装着ヘッド２の補正値を計算して、XY
ロボット１により部品装着ヘッド２に吸着保持されたIC
部品８と、実装基板４上のIC部品装着位置５を位置合わ
せして装着するように構成されており、XYロボット１に
より基板認識カメラ３を装着されたIC部品８上に移動さ
せることにより、IC部品８の実装基板４上への装着状態
を基板認識カメラ３によって検査することが可能であ
る。2. Description of the Related Art A conventional IC mounting apparatus will be described below with reference to FIG. The component mounting head 2 and the board recognition camera 3 are mounted vertically on the XY robot 1, and the component mounting head 2 is moved onto the component supply unit 9 by the XY robot 1 and
The XY robot 1 moves the IC component 8 onto the component recognition camera 7 by suction, holds the IC component 8, and recognizes and measures the suction position of the IC component 8 held by the component mounting head 2 by the component recognition camera 7. Further, the IC component mounting position 5 on the mounting board 4 is moved to a position below the board recognition camera 3 by the XY table 6, and the IC component mounting position 5 is recognized and measured by the board recognition camera 3. Calculate the correction value of the component mounting head 2 from the measurement result, and
IC held by the robot 1 on the component mounting head 2
The component 8 and the IC component mounting position 5 on the mounting board 4 are configured to be positioned and mounted. By moving the board recognition camera 3 onto the mounted IC component 8 by the XY robot 1, The mounting state of the IC component 8 on the mounting board 4 can be inspected by the board recognition camera 3.
発明が解決しようとする課題 しかしながら、従来のIC実装装置は、IC部品８の実装
基板４上への装着状態を基板認識カメラ３で確認するた
め実装基板４の表側からしか検査できないという課題を
有していた。Problems to be Solved by the Invention However, the conventional IC mounting apparatus has a problem that the mounting state of the IC component 8 on the mounting board 4 can be checked only by the front side of the mounting board 4 because the board recognition camera 3 checks the mounting state. Was.
そこで本発明はこの課題を解決するため、IC部品の実
装基板上への装着状態を実装基板の裏側からも検査でき
るIC実装装置を提供するものである。Therefore, in order to solve this problem, the present invention provides an IC mounting apparatus capable of inspecting a mounting state of an IC component on a mounting board from the back side of the mounting board.
課題を解決するための手段 本発明は、部品認識カメラを実装基板の下方位置に駆
動可能なXYテーブル上に配置し、前記部品認識カメラ
は、前記部品装着ヘッドに吸着された電子部品を下方か
ら認識した後、前記所定の部品装着位置の下方に移動
し、実装された電子部品を実装基板の裏面から認識する
ことを特徴とするものである。Means for Solving the Problems The present invention arranges a component recognition camera on an XY table that can be driven to a position below a mounting board, and the component recognition camera moves the electronic component sucked to the component mounting head from below. After the recognition, the electronic component is moved below the predetermined component mounting position, and the mounted electronic component is recognized from the back surface of the mounting board.
作用 本発明によれば、部品認識カメラがXYテーブル上に配
置されているため実装基体の下方位置にも移動可能で、
IC部品の実装基体上への装着状態を実装基体の裏側から
も部品認識カメラによって確認することができる。According to the present invention, since the component recognition camera is disposed on the XY table, it can be moved to a position below the mounting base,
The mounting state of the IC component on the mounting base can be confirmed by the component recognition camera from the back side of the mounting base.
実 施 例 本発明の実施例について以下図面を参照しながら説明
する。Embodiments Embodiments of the present invention will be described below with reference to the drawings.
実施例１ 第１図は本発明の第１の実施例におけるIC実装装置の
斜視図である。Embodiment 1 FIG. 1 is a perspective view of an IC mounting apparatus according to a first embodiment of the present invention.
同図において、１はXYロボット、２はXYロボット１に
取付けられた部品装着ヘッド、３はXYロボット１に取付
けられた基板認識カメラ、４は実装基板、５は実装基板
４上にあるIC部品装着位置、６は実装基体４の下方に設
置されたXYテーブル、７はXYテーブル６に取付けられた
部品認識カメラ、８はIC部品、９はIC部品８を供給する
部品供給部である。In the drawing, 1 is an XY robot, 2 is a component mounting head mounted on the XY robot 1, 3 is a board recognition camera mounted on the XY robot 1, 4 is a mounting board, and 5 is an IC component on the mounting board 4. A mounting position, 6 is an XY table installed below the mounting base 4, 7 is a component recognition camera mounted on the XY table 6, 8 is an IC component, and 9 is a component supply unit for supplying the IC component 8.
本実施例によれば、部品認識カメラ７がXYテーブル６
上に配置されているため実装基板４の下方位置にも移動
可能なため、IC部品８の実装基板４上への装着状態を実
装基板４の裏側からも部品認識カメラ７によって検査す
ることができる。もちろん従来例のように、基板認識カ
メラ３と部品装着ヘッド２の位置関係と、IC部品装着位
置５と部品認識カメラ７の位置関係が同一になる様に、
部品認識カメラ７が取り付けられたXYテーブル６を移動
させれば、IC部品装着位置５の認識測定と、部品装着ヘ
ッド２に吸着保持されたIC部品８の位置測定とがXYロボ
ット１からみた場合同一座標で認識測定できたり、ある
いはIC部品８の実装基板４上への装着状態を基板認識カ
メラ３によって確認することによる実装基板４の表側か
らの検査も可能であり、従来例の特長をすべて維持した
上でさらに新しい効果を付加したものである。According to the present embodiment, the component recognition camera 7 is
Since it is arranged on the upper side, it can be moved to a position below the mounting board 4, so that the mounting state of the IC component 8 on the mounting board 4 can be inspected from behind the mounting board 4 by the component recognition camera 7. . Of course, as in the conventional example, the positional relationship between the board recognition camera 3 and the component mounting head 2 and the positional relationship between the IC component mounting position 5 and the component recognition camera 7 become the same.
When the XY table 6 on which the component recognition camera 7 is attached is moved, the recognition measurement of the IC component mounting position 5 and the position measurement of the IC component 8 sucked and held by the component mounting head 2 are viewed from the XY robot 1. Inspection from the front side of the mounting board 4 is also possible by recognizing and measuring at the same coordinates, or by checking the mounting state of the IC component 8 on the mounting board 4 by the board recognition camera 3, and has all the features of the conventional example. A new effect is added after maintaining it.
特に、実装基板４がガラスの様に透明であったり、フ
リップチップボンディングの様にIC部品８の実装基板４
上への装着状態の検査を実装基板４の裏側から主に検査
するものに対しては非常に有効である。In particular, the mounting substrate 4 is transparent such as glass, or the mounting substrate 4 of the IC component 8 such as flip chip bonding.
This is very effective for the inspection of the mounting state on the top mainly from the back side of the mounting board 4.
実施例２ 第２図は本発明の第２の実施例におけるIC実装装置の
斜視図である。同図において、第１の実施例と同一物に
は同一番号を付し説明を省略する。Embodiment 2 FIG. 2 is a perspective view of an IC mounting apparatus according to a second embodiment of the present invention. In the figure, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.
同図において、第１の実施例と異なる点は実装基板４
の代りにフィルムキャリア10を配置し、さらにXYテーブ
ル６上にボンディングツール11を設けた点である。In the figure, the difference from the first embodiment is that
Instead, a film carrier 10 is arranged, and a bonding tool 11 is provided on the XY table 6.
フィルムキャリア10にIC部品８を実装する場合、一般
にフィルムキャリア10、IC部品８、ボンディングツール
11の三者をXY方向に位置合わせをしてからボンディング
する必要があり、その意味からXYテーブル６はフィルム
キャリア用のIC実装装置としては必要不可欠なものであ
り、またIC部品８のフィルムキャリア10への装着状態の
検査もフィルムキャリア10の裏側から主に検査するもの
である。When mounting the IC component 8 on the film carrier 10, generally, the film carrier 10, the IC component 8, and the bonding tool
It is necessary to perform bonding after aligning the three members in the X and Y directions. In this sense, the XY table 6 is indispensable as an IC mounting device for a film carrier. The inspection of the state of attachment to the film carrier 10 is mainly performed from the back side of the film carrier 10.
本実施例によれば、IC部品８のフィルムキャリア10へ
の装着状態をフィルムキャリア10の裏側からの確認が部
品認識カメラ７によって可能なため、必要最小限の設備
構成によって、IC部品８のフィルムキャリア10への装着
状態の検査がフィルムキャリア10の裏側から検査でき
る。According to the present embodiment, since the mounting state of the IC component 8 on the film carrier 10 can be checked from the back side of the film carrier 10 by the component recognition camera 7, the film of the IC component 8 can be The inspection of the mounting state on the carrier 10 can be performed from the back side of the film carrier 10.
発明の効果 本発明によれば、部品認識カメラがXYテーブル上に配
置されているため実装基体の下方位置にも移動可能で、
IC部品の実装基体上への装着状態を実装基体の裏側から
も部品認識カメラによって確認かつ検査することができ
る。According to the present invention, since the component recognition camera is arranged on the XY table, it can be moved to a position below the mounting base,
The mounting state of the IC component on the mounting substrate can be confirmed and inspected from behind the mounting substrate by the component recognition camera.
第１図は本発明の第１の実施例におけるIC実装装置の斜
視図、第２図は本発明の第２の実施例におけるIC実装装
置の斜視図、第３図は従来のIC実装装置の構成図であ
る。 １……XYロボット、２……部品装着ヘッド、３……基板
認識カメラ、４……実装基板、５……IC部品装着位置、
６……XYテーブル、７……部品認識カメラ、８……IC部
品、10……フィルムキャリア、11……ボンディングツー
ル。FIG. 1 is a perspective view of an IC mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a perspective view of an IC mounting apparatus according to a second embodiment of the present invention, and FIG. It is a block diagram. 1 XY robot, 2… Component mounting head, 3… Board recognition camera, 4… Mounting board, 5… IC component mounting position,
6 XY table, 7 Component recognition camera, 8 IC component, 10 Film carrier, 11 Bonding tool.
フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H05K 13/04Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) H05K 13/04
Claims (2)
ロボット上に配設し、前記部品装着ヘッドに吸着された
電子部品を部品装着ヘッドの下方に設けられた部品認識
カメラにて認識した後、実装基板の部品装着位置に所定
の電子部品を装着するIC実装方法において、 前記部品認識カメラを実装基板の下方位置に駆動可能な
XYテーブル上に配置し、前記部品認識カメラは、前記部
品装着ヘッドに吸着された電子部品を下方から認識した
後、前記所定の部品装着位置の下方に移動し、実装され
た電子部品を実装基板の裏面から認識することを特徴と
するIC実装方法。1. An XY mounting system for a component mounting head and a mounting board recognition camera.
After being mounted on the robot and recognizing the electronic component adsorbed by the component mounting head with a component recognition camera provided below the component mounting head, a predetermined electronic component is mounted at the component mounting position on the mounting board. In the IC mounting method, the component recognition camera can be driven to a position below a mounting board.
After being placed on an XY table, the component recognition camera recognizes the electronic component sucked by the component mounting head from below, moves to below the predetermined component mounting position, and mounts the mounted electronic component on a mounting board. An IC mounting method characterized by recognizing from the back side of the IC.
XYロボット上に有し、その下方には部品認識カメラをXY
テーブル上に配置したIC実装装置において、 前記XYテーブル上に設けられた部品認識カメラは、部品
装着ヘッドに吸着された電子部品を認識後、実装基板の
下方位置に移動し、実装基板の裏面から実装状態を認識
可能なことを特徴とするIC実装装置。2. A component mounting head and a mounting board recognition camera.
It has it on the XY robot, and a component recognition camera below it
In the IC mounting device arranged on the table, the component recognition camera provided on the XY table, after recognizing the electronic component adsorbed on the component mounting head, moves to a position below the mounting board, and from the back side of the mounting board. An IC mounting device characterized in that a mounting state can be recognized.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2093612A JP2841683B2 (en) | 1990-04-09 | 1990-04-09 | IC mounting method and device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2093612A JP2841683B2 (en) | 1990-04-09 | 1990-04-09 | IC mounting method and device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03291999A JPH03291999A (en) | 1991-12-24 |
| JP2841683B2 true JP2841683B2 (en) | 1998-12-24 |
Family
ID=14087153
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2093612A Expired - Fee Related JP2841683B2 (en) | 1990-04-09 | 1990-04-09 | IC mounting method and device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2841683B2 (en) |
-
1990
- 1990-04-09 JP JP2093612A patent/JP2841683B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03291999A (en) | 1991-12-24 |
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