JP2728996B2 - Multi-terminal connection structure - Google Patents
Multi-terminal connection structureInfo
- Publication number
- JP2728996B2 JP2728996B2 JP3262076A JP26207691A JP2728996B2 JP 2728996 B2 JP2728996 B2 JP 2728996B2 JP 3262076 A JP3262076 A JP 3262076A JP 26207691 A JP26207691 A JP 26207691A JP 2728996 B2 JP2728996 B2 JP 2728996B2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- temporary connection
- connection
- terminals
- fine pitch
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Description
【０００１】[0001]
【産業上の利用分野】この発明は、液晶パネルやＥＬパ
ネルおよびフレキシブル配線基板等を接続する多端子接
続構造における接続不良の低減に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to reduction of connection failure in a multi-terminal connection structure for connecting a liquid crystal panel, an EL panel, a flexible wiring board, and the like.
【０００２】[0002]
【従来の技術】液晶パネルやＥＬパネルなどを利用した
平面型ディスプレイパネルが商品化されるとともに、各
種部品の平面実装化および端子配線の微細ピッチ化が急
速に進んでいる。図７は従来の薄膜表示素子２１とフレ
キシブル配線基板２２との接続部を示す図である。薄膜
表示素子２１およびフレキシブル配線基板２２には、そ
れぞれ、同一ピッチの複数の微細ピッチ端子２３、２４
が半田メッキされ設けられている。また、複数の微細ピ
ッチ端子２３、２４の両端には同じく半田メッキされた
仮接続端子２５、２６が設けられている。この仮接続端
子２５、２６は素子とは接続されておらず、組み立て時
の接続強度をあげるためのものである。このため、他の
微細ピッチ端子２３、２４に比べて大きくされている。
このような薄膜表示素子２１およびフレキシブル配線基
板２２の各端子を相互結線する際には、両者の仮接続端
子２５、２６に加熱して仮接続をした後、全体に加熱し
て微細ピッチ端子２３、２４を接続する。2. Description of the Related Art A flat display panel using a liquid crystal panel, an EL panel, or the like has been commercialized, and a flat mounting of various components and a fine pitch of terminal wiring have been rapidly advanced. FIG. 7 is a diagram showing a connection portion between a conventional thin film display element 21 and a flexible wiring board 22. A plurality of fine pitch terminals 23, 24 having the same pitch are provided on the thin film display element 21 and the flexible wiring board 22, respectively.
Is provided by solder plating. Further, temporary connection terminals 25 and 26 which are also plated with solder are provided at both ends of the plurality of fine pitch terminals 23 and 24. These temporary connection terminals 25 and 26 are not connected to the elements, but serve to increase the connection strength during assembly. For this reason, it is larger than the other fine pitch terminals 23 and 24.
When the terminals of the thin film display element 21 and the flexible wiring board 22 are interconnected, the temporary connection terminals 25 and 26 are heated and temporarily connected to each other, and then heated to a fine pitch terminal 23. , 24 are connected.
【０００３】[0003]
【発明が解決しようとする課題】上述のような接続方法
では、仮接続端子は微細ピッチ端子に比べてパターン幅
が極めて大きいことから、放熱も速く半田メッキも厚く
なり、微細ピッチ端子を接続する際の熱では充分に溶解
できない。このため、図８に示すように仮接続端子付近
の微細ピッチ端子で接続不良が起きてしまう。また、該
不良を無くすため仮接続端子に加える熱を大きくする
と、微細ピッチ端子にかかる熱が適正接続温度より高く
なるため、端子の銅配線と基材とを接着している接着剤
が劣化し、銅配線が基材から剥がれて断線することがあ
る。In the connection method as described above, since the temporary connection terminal has an extremely large pattern width as compared with the fine pitch terminal, heat dissipation is quick and the solder plating is thick, so that the fine pitch terminal is connected. It cannot be melted sufficiently by heat at the time. For this reason, as shown in FIG. 8, a connection failure occurs at a fine pitch terminal near the temporary connection terminal. Also, if the heat applied to the temporary connection terminals is increased to eliminate the defect, the heat applied to the fine pitch terminals becomes higher than the proper connection temperature, so that the adhesive bonding the copper wiring of the terminals and the base material deteriorates. In some cases, the copper wiring is peeled off from the base material to cause disconnection.
【０００４】この発明の目的は、微細ピッチ端子へ熱的
影響を与えず、仮止めした仮接続端子の半田を充分に溶
解して仮接続端子周辺で起きる微細ピッチ端子の接続不
良を回避し、かつ仮接続端子の接続強度を損なうことな
く部品の接続が行える多端子接続構造を提供することに
ある。SUMMARY OF THE INVENTION It is an object of the present invention to prevent the fine pitch terminals from being thermally affected, to sufficiently melt the solder of the temporarily fixed temporary connection terminals, and to prevent poor connection of the fine pitch terminals which occurs around the temporary connection terminals. Another object of the present invention is to provide a multi-terminal connection structure capable of connecting components without deteriorating the connection strength of the temporary connection terminals.
【０００５】[0005]
【課題を解決するための手段】この発明は、被覆された
微細ピッチパターンの端部の一面を露出させて微細ピッ
チ端子とした第１部品と、該第１部品に対向する微細ピ
ッチ端子を備えた第２部品とを、両部品の微細ピッチ端
子の両側に設けた仮接続端子により仮止めを行って半田
付けする多端子接続構造において、前記第１部品の仮接
続端子を前記被覆内部にまで形成するとともに、前記仮
接続端子を前記被覆の端部以外で複数に分割したことを
特徴とする。SUMMARY OF THE INVENTION The present invention provides a coated
A first component which is exposed to one surface of an end portion of a fine pitch pattern with a fine pitch terminal, and a second component comprising a fine fine pitch terminal facing the first part, each side of the fine pitch terminals of both parts In the multi-terminal connection structure in which the temporary connection is temporarily performed by the temporary connection terminals provided and soldered , the temporary connection of the first component is performed.
A connection terminal is formed up to the inside of the coating, and the temporary connection terminal is divided into a plurality at portions other than ends of the coating .
【０００６】[0006]
【作用】切り欠きを設け分割された仮接続端子は、熱伝
導（放熱）が微細ピッチ端子と同等またはそれ以下にな
る。このため、仮接続後微細ピッチ端子の半田メッキを
溶解する程度の加熱で、仮接続端子の仮止めした半田も
溶解することが可能となる。従って、仮接続端子の周辺
で起こっていた接続不良はなくなり、従来の接続強度を
損なうこともない。The thermal connection (radiation) of the divided temporary connection terminal provided with the notch is equal to or less than that of the fine pitch terminal. Therefore, it is possible to melt the temporarily fixed solder of the temporary connection terminal by heating to such an extent that the solder plating of the fine pitch terminal is melted after the temporary connection. Therefore, the connection failure occurring around the temporary connection terminal is eliminated, and the conventional connection strength is not impaired.
【０００７】[0007]
【実施例】図面を参照してこの発明の実施例について説
明する。An embodiment of the present invention will be described with reference to the drawings.
【０００８】図１（Ａ）はこの発明の実施例である多端
子接続構造をもつ薄膜ＥＬパネル表示装置を示す図であ
り、同図（Ｂ）は多端子接続部の拡大図である。薄膜Ｅ
Ｌパネル表示装置は、薄膜表示素子１と該薄膜表示素子
１を駆動するためのＩＣを実装したフレキシブル配線基
板２で構成される。薄膜表示素子１は、薄膜表示素子を
形成した透光性基板と背面板とで構成されている。薄膜
表示パネルの外周には、任意の間隔をもった複数の接続
端子が形成されており、フレキシブル配線基板に形成さ
れた対向する接続端子と半田付けで接続される。このフ
レキシブル配線基板は、薄膜表示パネルを表示装置とし
て駆動するためのＩＣを実装している。FIG. 1A is a diagram showing a thin-film EL panel display device having a multi-terminal connection structure according to an embodiment of the present invention, and FIG. 1B is an enlarged view of a multi-terminal connection portion. Thin film E
The L-panel display device includes a thin-film display element 1 and a flexible wiring board 2 on which an IC for driving the thin-film display element 1 is mounted. The thin-film display device 1 includes a light-transmitting substrate on which the thin-film display device is formed and a back plate. A plurality of connection terminals having an arbitrary interval are formed on the outer periphery of the thin film display panel, and are connected by soldering to the opposite connection terminals formed on the flexible wiring board. This flexible wiring board is mounted with an IC for driving the thin film display panel as a display device.
【０００９】また、前記接続の際、薄膜表示パネルとフ
レキシブル配線基板を仮止めするために、両者には複数
の接続端子の両端に仮接続端子が設けられている。薄膜
表示素子１の外周には任意の間隔をもった複数の微細ピ
ッチ端子３と、仮接続端子４が設けられている。仮接続
端子４は微細ピッチ端子３の両端に設けられており、組
み立て時の接続強度を補強するため、微細ピッチ端子３
よりパターン幅を大きくしている。また、仮接続端子４
の熱伝導を微細ピッチ端子３と同等にするため、加えら
れた熱が逃げないように切り欠きを設けて分割してい
る。フレキシブル配線基板２にも薄膜表示素子１の微細
ピッチ端子３、および仮接続端子４と対向する微細ピッ
チ端子５と仮接続端子６が設けられている。この仮接続
端子６も前記仮接続端子４と同様に切り欠きを設け、分
割されている。さらに、これらの端子３、４、５、６は
それぞれ半田７でメッキされている。In order to temporarily fix the thin film display panel and the flexible wiring board during the connection, temporary connection terminals are provided at both ends of a plurality of connection terminals. A plurality of fine pitch terminals 3 having an arbitrary interval and temporary connection terminals 4 are provided on the outer periphery of the thin film display element 1. The temporary connection terminals 4 are provided at both ends of the fine pitch terminal 3.
The pattern width is made larger. In addition, temporary connection terminal 4
In order to make the heat conduction of the micropitch terminal 3 equal to that of the fine pitch terminal 3, a cutout is provided so as to prevent the applied heat from escaping. The fine wiring terminal 2 is also provided with a fine pitch terminal 3 of the thin film display element 1, a fine pitch terminal 5 facing the temporary connection terminal 4, and a temporary connection terminal 6. This temporary connection terminal 6 is also provided with a cutout similarly to the temporary connection terminal 4 and is divided. Furthermore, these terminals 3, 4, 5, and 6 are plated with solder 7, respectively.
【００１０】図２は薄膜表示素子１とフレキシブル配線
基板２の各端子３、４、５、６を対向するように配置し
た接続端子の断面図である。薄膜表示素子１とフレキシ
ブル配線基板２は、仮接続端子４、６に加熱することに
より半田７が溶解し仮止めされる。その後、全体に加熱
して微細ピッチ端子３、５の半田７も溶解され、薄膜表
示素子１とフレキシブル配線基板２の各端子が接続され
る。このようにして接続されたフレキシブル配線基板２
は、接続部以外の部分で薄膜表示素子１の後方に折り曲
げて組み立てられる。FIG. 2 is a sectional view of a connection terminal in which the terminals 3, 4, 5, and 6 of the thin-film display element 1 and the flexible wiring board 2 are arranged to face each other. When the thin film display element 1 and the flexible wiring board 2 are heated to the temporary connection terminals 4 and 6, the solder 7 is melted and temporarily fixed. After that, the solder 7 of the fine pitch terminals 3 and 5 is melted by heating the whole, and the thin film display element 1 and the terminals of the flexible wiring board 2 are connected. Flexible wiring board 2 connected in this way
Is assembled by bending it behind the thin film display element 1 at a portion other than the connection portion.
【００１１】なお、この折り曲げ部分は、カバーフィル
ムによりサンドウィッチ状に保護されているため、仮接
続端子４、６の切り欠きが折り曲げ部に設けられても、
何ら問題はない。Since the bent portion is protected in a sandwich shape by the cover film, even if the notches of the temporary connection terminals 4 and 6 are provided in the bent portion,
There is no problem at all.
【００１２】また、この実施例では鉤形の切り欠きを設
け、仮接続端子４、６の熱が逃げないようにしている
が、熱が伝わりやすくするように仮接続端子４、６を任
意の数に分割して面積を小さくしても良い。In this embodiment, a hook-shaped notch is provided to prevent the heat of the temporary connection terminals 4 and 6 from escaping. However, the temporary connection terminals 4 and 6 may be arbitrarily set so that heat is easily transmitted. The area may be reduced by dividing into numbers.
【００１３】図３、４、５、６はこの発明の他の実施例
である仮接続端子の形状を示す図である。図３、４、５
は熱を逃がさないように切り欠きを設けたものであり、
図６は面積を小さくして熱伝導を良くしたものである。FIGS. 3, 4, 5, and 6 show the shapes of temporary connection terminals according to another embodiment of the present invention. Figures 3, 4, 5
Is provided with a notch so that heat does not escape,
FIG. 6 shows a case where the heat conduction is improved by reducing the area.
【００１４】[0014]
【発明の効果】この発明によれば、薄膜表示素子とフレ
キシブル配線基板とを接続する際、微細ピッチ端子に適
正接続温度以上の加熱をすることなく仮接続端子の仮止
めした半田を溶解できるため、仮接続端子周辺の接続不
良をなくすことができる。また、接続後の強度補強を損
なうこともない。According to the present invention, when the thin film display element is connected to the flexible wiring board, the solder temporarily fixed at the temporary connection terminal can be melted without heating the fine pitch terminal to a temperature higher than the proper connection temperature. In addition, it is possible to eliminate poor connection around the temporary connection terminal. Also, the strength reinforcement after connection is not impaired.
【図面の簡単な説明】[Brief description of the drawings]
【図１】この発明の実施例である多端子接続構造をもつ
薄膜ＥＬパネル表示装置の構造を示す図である。FIG. 1 is a diagram showing a structure of a thin-film EL panel display device having a multi-terminal connection structure according to an embodiment of the present invention.
【図２】対向する薄膜表示素子とフレキシブル配線基板
の断面図である。FIG. 2 is a cross-sectional view of a thin film display element and a flexible wiring board facing each other.
【図３】他の実施例である仮接続端子の構成図である。FIG. 3 is a configuration diagram of a temporary connection terminal according to another embodiment.
【図４】他の実施例である仮接続端子の構成図である。FIG. 4 is a configuration diagram of a temporary connection terminal according to another embodiment.
【図５】他の実施例である仮接続端子の構成図である。FIG. 5 is a configuration diagram of a temporary connection terminal according to another embodiment.
【図６】他の実施例である仮接続端子の構成図である。FIG. 6 is a configuration diagram of a temporary connection terminal according to another embodiment.
【図７】従来の多端子接続構造を示す図である。FIG. 7 is a diagram showing a conventional multi-terminal connection structure.
【図８】従来の多端子接続構造を示す図である。FIG. 8 is a diagram showing a conventional multi-terminal connection structure.
１ 薄膜表示素子 ２ フレキシブル配線基板 ３ 微細ピッチ端子 ４ 仮接続端子 ５ 微細ピッチ端子 ６ 仮接続端子 ７ 半田 DESCRIPTION OF SYMBOLS 1 Thin-film display element 2 Flexible wiring board 3 Fine pitch terminal 4 Temporary connection terminal 5 Fine pitch terminal 6 Temporary connection terminal 7 Solder
Claims (1)
一面を露出させて微細ピッチ端子とした第１部品と、該
第１部品に対向する微細ピッチ端子を備えた第２部品と
を、両部品の微細ピッチ端子の両側に設けた仮接続端子
により仮止めを行って半田付けする多端子接続構造にお
いて、前記第１部品の仮接続端子を前記被覆内部にまで形成す
るとともに、 前記仮接続端子を前記被覆の端部以外で複
数に分割したことを特徴とする多端子接続構造。1. A coated end of the fine pitch pattern
A first component which is a fine-pitch terminal to expose the one side, and a second component comprising a fine fine pitch terminal facing the first component, the temporary connection terminals arranged on both sides of the fine-pitch terminal of both parts In the multi-terminal connection structure in which the temporary connection and the soldering are performed, the temporary connection terminal of the first component is formed up to the inside of the coating.
And the temporary connection terminal is duplicated except at the end of the coating.
Multi-terminal connection structure characterized by being divided into numbers .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3262076A JP2728996B2 (en) | 1991-10-09 | 1991-10-09 | Multi-terminal connection structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3262076A JP2728996B2 (en) | 1991-10-09 | 1991-10-09 | Multi-terminal connection structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05102633A JPH05102633A (en) | 1993-04-23 |
| JP2728996B2 true JP2728996B2 (en) | 1998-03-18 |
Family
ID=17370698
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3262076A Expired - Lifetime JP2728996B2 (en) | 1991-10-09 | 1991-10-09 | Multi-terminal connection structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2728996B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07272849A (en) | 1994-03-31 | 1995-10-20 | Nippondenso Co Ltd | Thin film el display and its manufacture |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6310492A (en) * | 1986-06-27 | 1988-01-18 | 日立マクセル株式会社 | Structure for connecting circuits of different types of substrates |
| JPS6447082U (en) * | 1987-09-18 | 1989-03-23 |
-
1991
- 1991-10-09 JP JP3262076A patent/JP2728996B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH05102633A (en) | 1993-04-23 |
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