JP2715756B2 - Substrate cleaning device - Google Patents
Substrate cleaning deviceInfo
- Publication number
- JP2715756B2 JP2715756B2 JP3313421A JP31342191A JP2715756B2 JP 2715756 B2 JP2715756 B2 JP 2715756B2 JP 3313421 A JP3313421 A JP 3313421A JP 31342191 A JP31342191 A JP 31342191A JP 2715756 B2 JP2715756 B2 JP 2715756B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- brush
- cleaning
- motor
- torque limiter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000758 substrate Substances 0.000 title claims description 35
- 238000004140 cleaning Methods 0.000 title claims description 21
- 239000010409 thin film Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- 230000032683 aging Effects 0.000 description 3
- 239000010408 film Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000002161 passivation Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003599 detergent Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 238000000643 oven drying Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000009291 secondary effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
- B08B1/36—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members rotating about an axis orthogonal to the surface
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、基板洗浄装置に関し、
特に表面に液晶ディスプレイ用アクティブ素子のような
薄膜トランジスタが、完成または半完成の状態で形成さ
れている絶縁基板の洗浄装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate cleaning apparatus,
In particular, the present invention relates to an apparatus for cleaning an insulating substrate having a thin film transistor such as an active element for a liquid crystal display formed on a surface in a completed or semi-finished state.
【0002】[0002]
【従来の技術】液晶表示用アクティブマトリックス基板
の製造工程においては、工程中で、付着した10μm程
度のパーティクルやドライエッチング工程後の残渣等を
除去するために、ブラシ洗浄を行う必要がある。2. Description of the Related Art In a manufacturing process of an active matrix substrate for a liquid crystal display, it is necessary to perform a brush cleaning in order to remove adhered particles of about 10 μm and residues after a dry etching process.
【0003】図3は、この種従来の洗浄装置を示す断面
図である。基板3は、シャフト2により駆動される搬送
ローラ1により搬送される。基板3を洗浄するためのブ
ラシ6は、軸受部材9により支持され、モータ11によ
って駆動される回転軸7に直結されている。軸受部材9
内には、回転軸7のスムーズな回転のためにベアリング
10が設けられており、また軸受部材9にはテーブル8
に対して上下動できるようにねじが刻まれている。テー
ブル8は、送りねじ4により上下動せしめられる。この
ときブラシ6の基板3方向への移動量は、装置壁13に
固定されたダイアルゲージ6によって検出される。FIG. 3 is a sectional view showing a conventional cleaning apparatus of this kind. The substrate 3 is transported by a transport roller 1 driven by a shaft 2. A brush 6 for cleaning the substrate 3 is supported by a bearing member 9 and is directly connected to a rotating shaft 7 driven by a motor 11. Bearing member 9
A bearing 10 is provided in the inside for smooth rotation of the rotating shaft 7.
The screw is carved so that it can move up and down. The table 8 is moved up and down by the feed screw 4. At this time, the amount of movement of the brush 6 in the direction of the substrate 3 is detected by the dial gauge 6 fixed to the apparatus wall 13.
【0004】洗浄に先立って各ブラシ毎に軸受部材9を
上下させてブラシと基板間の接触ゼロ点の調整を行う。
即ち、軸受部材9の位置を調整してブラシ6が接触圧ゼ
ロで基板と接触するようにする。次に、送りねじ4を回
し、所定の押し込み量が得られる点まで、テーブル8を
降下させる。ここで、押し込み量とは、接触ゼロ点から
のブラシの降下距離をいう。この状態で基板3の表面に
表面活性剤を供給し、モータ11によりブラシ6を回転
させて洗浄を行う。Prior to cleaning, the contact point between the brush and the substrate is adjusted by raising and lowering the bearing member 9 for each brush.
That is, the position of the bearing member 9 is adjusted so that the brush 6 comes into contact with the substrate with zero contact pressure. Next, the feed screw 4 is turned, and the table 8 is lowered to a point where a predetermined pushing amount is obtained. Here, the pushing amount refers to the distance that the brush descends from the zero contact point. In this state, the surface active agent is supplied to the surface of the substrate 3 and the brush 6 is rotated by the motor 11 to perform cleaning.
【0005】[0005]
【発明が解決しようとする課題】上述した従来の洗浄装
置では、ブラシと基板間の接触ゼロ点の調整を個人の感
覚に頼っていた。そのため、 接触ゼロ点の調整位置
に関して個人差が生じる、 各々のブラシの接触ゼロ
点が一致しない、等の問題点があった。その結果、基板
間、基板内で均一な洗浄効果が得られず、均一な品質の
製品が得られないという不都合が生じた。In the conventional cleaning apparatus described above, adjustment of the zero point of contact between the brush and the substrate depends on the sense of the individual. For this reason, there are problems such as individual differences in the adjustment position of the contact zero point, and the contact zero point of each brush does not match. As a result, there is a problem that a uniform cleaning effect cannot be obtained between and within the substrates, and a product of uniform quality cannot be obtained.
【0006】また、量産する段階においては、基板が重
なったり、搬送ローラ上に乗り上げる等の不規則な動き
をする場合もあるが、従来例では、このような場合に基
板割れが発生するという問題も起こった。[0006] In the stage of mass production, the substrates may move irregularly, such as overlapping or riding on conveying rollers. However, in the conventional example, there is a problem that the substrate cracks in such a case. Also happened.
【0007】[0007]
【課題を解決するための手段】前記問題点を解決するた
めに、本発明に係る基板洗浄装置においては、各々のブ
ラシ回転軸とモータとの間にトルクリミッタが設置され
ている。In order to solve the above-mentioned problems, in the substrate cleaning apparatus according to the present invention, a torque limiter is provided between each brush rotating shaft and the motor.
【0008】[0008]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。図1は、本発明の第1の実施例を示す縦断
面図である。基板3は、シャフト2により駆動される搬
送ローラ1により搬送される。基板3を洗浄するための
ブラシ6は、回転軸7に直結され、モータ11により回
転せしめられる。モータ11と回転軸7との間にはトル
クリミッタ12が設置されており、このトルクリミッタ
の作用により基板3へは一定以上のトルクはかからない
ようになされている。Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a longitudinal sectional view showing a first embodiment of the present invention. The substrate 3 is transported by a transport roller 1 driven by a shaft 2. A brush 6 for cleaning the substrate 3 is directly connected to a rotating shaft 7 and is rotated by a motor 11. A torque limiter 12 is provided between the motor 11 and the rotating shaft 7, so that the torque of the torque limiter does not apply a predetermined torque to the substrate 3.
【0009】全てのブラシは、送りねじ4により上下さ
れるテーブル8に軸受部材9を介して支持されている。
テーブル8に対するブラシ位置は軸受部材9により調整
される。ブラシ6の基板3への押し込み量は、ダイアル
ゲージ5により検出される。All brushes are supported via a bearing member 9 on a table 8 which is moved up and down by a feed screw 4.
The brush position with respect to the table 8 is adjusted by the bearing member 9. The amount by which the brush 6 is pushed into the substrate 3 is detected by the dial gauge 5.
【0010】本実施例の洗浄装置を用いて次の態様にて
洗浄を行った。 基板:400mm(基板の流れ方向)×300mm 逆スタガー型TFT基板(パッシベーション膜なし) ブラシ:径60φのもの3個、0.2φナイロン製 ブラシ位置:基板の流れ方向と垂直に、基板の端から7
5mm、150mm、225mmに一列に設置 ブラシ回転数:200rpm 洗剤:界面活性剤(NCW−601;和光純薬製) 基板搬送速度:0.3m/min ゼロ点調整:トルクリミッタのリミット値を、ブラシが
無負荷状態で回転しうる最低点にセットする。軸受部材
9を降下させてリミッタが動作を開始する点で固定す
る。 押し込み量:2.0mm トルクリミッタ設定値:通常洗浄時の負荷(押し込み量
2.0mm)のときの5倍の負荷で動作するようにセットUsing the cleaning apparatus of this embodiment, cleaning was performed in the following manner. Substrate: 400mm (substrate flow direction) x 300mm Inverted stagger type TFT substrate (no passivation film) Brush: 3 pieces with a diameter of 60φ, made of 0.2φ nylon Brush position: perpendicular to the substrate flow direction, from the edge of the substrate 7
5mm, 150mm, 225mm arranged in a row Brush rotation speed: 200rpm Detergent: Surfactant (NCW-601; manufactured by Wako Pure Chemical Industries) Substrate transfer speed: 0.3m / min Zero adjustment: limit the torque limiter with a brush Is set to the lowest point that can rotate without load. The bearing member 9 is lowered and fixed at the point where the limiter starts operating. Push-in amount: 2.0 mm Torque limiter set value: Set to operate with a load five times that of the load during normal washing (push-in amount 2.0 mm)
【0011】ブラシ洗浄後は、18.1MΩ・cmの純水
で水洗し、エアーナイフにて水切りを行った後、115
℃でオーブン乾燥を行った。この作業の後、パッシベー
ション膜を被着し、このTFT基板をモジュールに組み
立てた。After brush cleaning, the product is washed with pure water of 18.1 MΩ · cm, drained with an air knife, and then washed with an air knife.
Oven drying was performed at ℃. After this operation, a passivation film was applied, and the TFT substrate was assembled into a module.
【0012】組み立てられたモジュールに対し、50℃
エージングを行いながら、VG OFFを測定した。ここで、
VG OFF とは、オン状態となるTFTとオフ状態となる
TFTとが混在するときのゲート電圧のことであり、こ
の電圧の印加状態では、パネル上に表示ムラが観測され
る。測定結果を図2に示す。図2に示されるように、本
実施例により洗浄された領域(エリア〜)では、エ
ージング時間を通して、VG OFFのレンジが小さくなって
いる。即ち、本実施例により面内で均等な基板洗浄が行
われ、その結果TFTオフ特性の劣化度合いが面内で均
一化されている。At 50 ° C. for the assembled module
While aging, were measured V G OFF. here,
The V G OFF, and that the gate voltage when where the TFT serving as the TFT and the off-state which is turned mixed, in the applied state of the voltage, the display unevenness on the panel is observed. FIG. 2 shows the measurement results. As shown in FIG. 2, in the cleaning area by the present embodiment (area ~), through aging time, V G OFF range is small. That is, according to the present embodiment, uniform substrate cleaning is performed in the plane, and as a result, the degree of deterioration of the TFT off characteristic is uniformed in the plane.
【0013】[0013]
【発明の効果】以上説明したように、本発明はブラシと
駆動モータとの間にトルクリミッタを設置したものであ
るので、本発明によれば、ゼロ点位置調整の個人差、
ブラシ毎のゼロ点の不一致、が一挙に解決されるとい
う効果が得られる。その結果、基板内および基板間で均
一な洗浄効果が得られ、カラーLCDモジュールの動作
において、VG OFF特性のエージングによるばらつきを抑
制することができる。As described above, according to the present invention, the torque limiter is installed between the brush and the drive motor.
The effect is obtained that the zero point disagreement for each brush can be solved at once. As a result, uniform cleaning effect across substrate and the substrate is obtained, it is possible in the operation of the color LCD module, to suppress the variation due to aging V G OFF characteristics.
【0014】また、洗浄中に基板が搬送ローラへ乗り上
げる等の不規則な動きをしても、トルクリミッタが働く
ため、基板割れが抑制できるという副次的効果もある。Further, even if the substrate moves irregularly such as riding on the transport roller during cleaning, there is also a secondary effect that the substrate can be suppressed from cracking because the torque limiter works.
【図1】本発明の一実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図2】図1の実施例の効果を示すグラフ。FIG. 2 is a graph showing the effect of the embodiment of FIG.
【図3】従来例の断面図。FIG. 3 is a sectional view of a conventional example.
1 搬送ローラ 2 シャフト 3 基板 4 送りねじ 5 ダイアルゲージ 6 ブラシ 7 回転軸 8 テーブル 9 軸受部材 10 ベアリング 11 モータ 12 トルクリミッタ 13 装置壁面 DESCRIPTION OF SYMBOLS 1 Conveyance roller 2 Shaft 3 Substrate 4 Feed screw 5 Dial gauge 6 Brush 7 Rotating shaft 8 Table 9 Bearing member 10 Bearing 11 Motor 12 Torque limiter 13 Device wall
Claims (1)
完成状態で形成されている基板の洗浄装置であって、基
板表面と接触する回転ブラシと、前記回転ブラシと直結
した駆動軸と、前記回転ブラジを上下動かさせる機構
と、前記回転ブラシを回転させるためのモータと、前記
モータと前記駆動軸との間に配置されたトルクリミッタ
と、を具備する基板洗浄装置。An apparatus for cleaning a substrate having a thin film transistor formed on a surface thereof in a completed or semi-finished state, comprising: a rotating brush in contact with a substrate surface; a driving shaft directly connected to the rotating brush; A substrate cleaning apparatus comprising: a mechanism for moving the brush vertically; a motor for rotating the rotary brush; and a torque limiter disposed between the motor and the drive shaft.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3313421A JP2715756B2 (en) | 1991-11-01 | 1991-11-01 | Substrate cleaning device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3313421A JP2715756B2 (en) | 1991-11-01 | 1991-11-01 | Substrate cleaning device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05129260A JPH05129260A (en) | 1993-05-25 |
JP2715756B2 true JP2715756B2 (en) | 1998-02-18 |
Family
ID=18041096
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3313421A Expired - Lifetime JP2715756B2 (en) | 1991-11-01 | 1991-11-01 | Substrate cleaning device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2715756B2 (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100619383B1 (en) * | 1998-03-30 | 2006-09-06 | 동경 엘렉트론 주식회사 | Scrub washing apparatus and scrub washing method |
JP4616267B2 (en) | 2003-10-28 | 2011-01-19 | アプライド マテリアルズ インコーポレイテッド | Scrubber box and how to use it |
US20070212983A1 (en) | 2006-03-13 | 2007-09-13 | Applied Materials, Inc. | Apparatus and methods for conditioning a polishing pad |
JP4555843B2 (en) * | 2007-07-30 | 2010-10-06 | Okiセミコンダクタ株式会社 | Substrate cleaning method |
JP5323455B2 (en) * | 2008-11-26 | 2013-10-23 | 株式会社荏原製作所 | Roll gap adjustment method for substrate processing apparatus |
KR101584445B1 (en) * | 2014-07-21 | 2016-01-11 | 주식회사 브러쉬텍 | Semiconductor wafer cleaning method |
-
1991
- 1991-11-01 JP JP3313421A patent/JP2715756B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH05129260A (en) | 1993-05-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP2001356353A (en) | Assembly device for substrate | |
JP2715756B2 (en) | Substrate cleaning device | |
US10870136B2 (en) | Cleaning device, cleaning apparatus and cleaning method | |
JPH10229062A (en) | Substrate processing system | |
US7225917B2 (en) | Conveyor system having width adjustment unit | |
KR101048828B1 (en) | Substrate cleaning device and method for removing foreign substances from brush unit of substrate cleaning device | |
JP2001154199A (en) | Rubbing device, method of rubbing substrate for liquid crystal device and substrate for liquid crystal device, and liquid crystal device manufactured by the same | |
JP2001343632A (en) | Method for manufacturing liquid crystal display device | |
KR100790479B1 (en) | Air Knife Dryer | |
JPH10289889A (en) | Substrate treatment apparatus | |
JP2978806B2 (en) | Substrate processing method | |
JP2002336761A (en) | Substrate rotation type treatment apparatus | |
KR200464570Y1 (en) | Transfering Unit for Lib Cleaning Device | |
JP2002261142A (en) | Angle conversion device for substrate | |
JP4023907B2 (en) | Substrate processing method | |
KR200317728Y1 (en) | Apparatus for cleaning leadframe using aerosol | |
JP2000155424A (en) | Coating applicator and coating application method | |
KR100987674B1 (en) | Apparatus And Method For Cleaning Nozzle | |
JP3007869B2 (en) | Manufacturing method of liquid crystal display element | |
CN110416128B (en) | Etching device | |
JPH10340873A (en) | Apparatus for treating substrate | |
JP2001151345A (en) | Carrying device | |
JPH10289892A (en) | Substrate retaining apparatus and substrate treatment apparatus using substrate retaining apparatus | |
KR101001069B1 (en) | System for roller brush controlling | |
KR100370112B1 (en) | floating chuck for fabricating TFT-array |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071107 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081107 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081107 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091107 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091107 Year of fee payment: 12 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101107 Year of fee payment: 13 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111107 Year of fee payment: 14 |
|
EXPY | Cancellation because of completion of term |