JP2710395B2 - Reflow solder plating material - Google Patents
Reflow solder plating materialInfo
- Publication number
- JP2710395B2 JP2710395B2 JP1089673A JP8967389A JP2710395B2 JP 2710395 B2 JP2710395 B2 JP 2710395B2 JP 1089673 A JP1089673 A JP 1089673A JP 8967389 A JP8967389 A JP 8967389A JP 2710395 B2 JP2710395 B2 JP 2710395B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solder plating
- reflow solder
- reflow
- plating material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Electroplating Methods And Accessories (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は、リフローはんだめっき材の表面状態に関す
るもので、均一な半光沢表面を有するリフローはんだめ
っき材に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface condition of a reflow solder plating material, and more particularly to a reflow solder plating material having a uniform semi-glossy surface.
［従来の技術］ リフローはんだめっき材とは、電着したはんだめっき
を電気炉、熱風炉等により溶融し、水冷もしくは空冷等
により凝固させたものをいう。リフローはんだめっき材
は、溶融、凝固処理を行わないで、めっき浴中に添加剤
を入れることにより平滑な表面をもたせるようにした光
沢はんだめっき材にくらべて、プレス加工時の粉の発生
やヒゲバリと呼ばれるめっきのヒゲ状剥離が起きにくい
という特徴をもつ。[Related Art] A reflow solder plating material is one in which electrodeposited solder plating is melted in an electric furnace, a hot air furnace, or the like, and solidified by water cooling, air cooling, or the like. Reflow solder plating materials do not undergo melting or solidification treatment, but generate powder and burrs during press working compared to bright solder plating materials that have an additive in the plating bath to provide a smooth surface. It is characterized in that the whisker-like peeling of plating, which is referred to as, is unlikely to occur.
リフローはんだめっき材の製造方法は、類似技術であ
るリフロー錫めっき材と同様に、炉で溶融後水冷槽で凝
固する方法を用いるのが一般的である。As a method of manufacturing a reflow solder plating material, a method of melting in a furnace and then solidifying in a water-cooled bath is generally used, similarly to the reflow tin plating material of a similar technique.
［発明が解決しようとする課題］ しかし、錫めっきとはんだめっきとでは、その金属的
性質が異るため、リフロー後の冷却の条件で、リフロー
錫めっきでは見られないめっき表面光沢状況の変化が見
られ、安定した表面状態を得ることが難しかった。[Problems to be Solved by the Invention] However, since tin plating and solder plating have different metallic properties, changes in the plating surface gloss condition that cannot be seen with reflow tin plating under cooling conditions after reflow. It was difficult to obtain a stable surface state.
また、リフローはんだめっき材は通常鏡面光沢の表面
をもつものが使用されているが、用途によっては全面均
一な半光沢表面の材料が要求されることがある。これは
鏡面光沢をもつ材料では取扱い時のすり傷や指紋等の汚
れが目立ちやすいこと、表面検査を人間が行う場合に目
が疲れやすいことが原因である。Although a reflow solder plating material having a mirror glossy surface is usually used, a material having a uniform semi-glossy surface may be required depending on the application. This is due to the fact that scratches and fingerprints and other stains during handling are easily conspicuous in a material having a specular gloss, and eyes are easily fatigued when a surface inspection is performed by a human.
しかしながら、リフローはんだめっきで半光沢面を作
るには、はんだ電着面の粗化、リフロー時の表面酸化に
よる表面粗化等の方法しかなく、これらの方法では全面
均一な半光沢面を得ることはとても難しかった。However, the only way to make a semi-glossy surface by reflow solder plating is to roughen the electrodeposited surface of the solder, or to roughen the surface by oxidizing the surface during reflow. Was very difficult.
そこで本発明は均一な半光沢表面をもつリフローはん
だめっき材を製造せんとするものである。Therefore, the present invention is to manufacture a reflow solder plating material having a uniform semi-glossy surface.
［課題を解決するための手段］ 本発明は、金属材料の表面に錫−鉛合金を電気めっき
した後、加熱溶融処理によって得られるリフローはんだ
めっき材において、そのめっき表面α相の各組織最大長
さの平均値が1.0μｍ以上3.0μｍ以下であることを特徴
とするリフローはんだめっき材である。[Means for Solving the Problems] The present invention relates to a reflow solder plating material obtained by electroplating a tin-lead alloy on a surface of a metal material and then subjecting the material to a heat melting treatment, wherein a maximum length of each structure of a plating surface α phase is obtained. A reflow solder plating material characterized by having an average value of 1.0 μm or more and 3.0 μm or less.
ここで、α相とは第３図に示す表面２次電子像におい
て白く見える組織のことで、その最大長さとは、第１図
に模式的に示す２つのα相Ａ、Ｂにおいて、α相Ａでは
ａ、β相Ｂではｂとしたものである。したがって、α相
Ａにおける長さａ′は最大長さとはいわない。又、α相
とは第２図に示す錫−鉛合金状態図においてα相として
いる部分のことである。Here, the α phase is a structure that looks white in the surface secondary electron image shown in FIG. 3, and the maximum length is the α phase in the two α phases A and B schematically shown in FIG. In A, it is a, and in β phase B, it is b. Therefore, the length a 'in the α-phase A is not said to be the maximum length. The α phase is a portion which is set to the α phase in the tin-lead alloy phase diagram shown in FIG.
このα相組織は、冷却速度により、その組織最大長さ
が変化する。つまり冷却速度が速いと組織の成長が進ま
ず、組織最大長さは短くなり、冷却速度が遅いと組織の
成長が進み、組織最大長さは長くなる。The maximum length of the α-phase structure changes depending on the cooling rate. That is, when the cooling rate is high, the growth of the tissue does not progress, and the maximum length of the tissue becomes short. When the cooling rate is low, the growth of the tissue progresses, and the maximum length of the tissue becomes long.
第４図は組織が成長した反射電子線凹凸像で、α相と
β相との凹凸が激しくなる。この凹凸のために表面が半
光沢となる。FIG. 4 shows a reflected electron beam unevenness image in which a tissue is grown, and the unevenness of the α phase and the β phase becomes severe. Due to this unevenness, the surface becomes semi-glossy.
つまり、本発明では冷却速度を遅くして、組織を成長
させて、α相組織最大長さの平均を1.0μｍ以上3.0μｍ
未満にすることによって、均一な半光沢表面を持つリフ
ローはんだめっき材が得られる。That is, in the present invention, the cooling rate is reduced to grow the structure, and the average of the α-phase structure maximum length is set to 1.0 μm or more and 3.0 μm or more.
By making it less than the above, a reflow solder plating material having a uniform semi-glossy surface can be obtained.
ここでα相組織最大長さの平均を1.0μｍ以上3.0μｍ
以下としたのは1.0μｍ未満だとめっき表面が光沢とな
るため好ましくなく、また、3.0μｍを超える長さにす
るには冷却速度を極端に遅くする必要があるため実用的
でないためである。Here, the average of the maximum length of the α-phase structure is 1.0 μm or more and 3.0 μm
The reason for this is that if the thickness is less than 1.0 μm, the plating surface becomes glossy, which is not preferable, and if the length exceeds 3.0 μm, the cooling rate must be extremely slowed down, which is not practical.
このリフローはんだめっき材の母材となる金属には、
銅合金としてはりん青銅、黄銅、洋白、ベリリウム銅、
チタン銅等が、鉄合金としては、ステンレス鋼、42％ニ
ッケル合金、アンバー合金、封着用合金等が用いられ
る。The base metal of this reflow solder plating material includes
Phosphor bronze, brass, nickel silver, beryllium copper,
Titanium copper and the like, and as the iron alloy, stainless steel, 42% nickel alloy, invar alloy, sealing alloy and the like are used.
これらの金属は、条、板やプレスされたフープ状の部
品、プレス後の部品等の形態でめっきされる。These metals are plated in the form of strips, plates, pressed hoop-shaped parts, pressed parts, and the like.
母材の金属材料は、一般にアルカリ脱脂もしくは有機
溶媒脱脂、電解脱脂、酸洗等の前処理を施された後、下
地めっきを施される。下地めっきは、銅もしくはニッケ
ルめっきが主に使用される。下地めっきの厚さは通常0.
5〜３μｍ程度である。The base metal material is generally subjected to a pretreatment such as alkali degreasing or organic solvent degreasing, electrolytic degreasing, pickling, and the like, followed by base plating. Copper or nickel plating is mainly used for the base plating. The thickness of the base plating is usually 0.
It is about 5 to 3 μm.
母材の金属材料は、下地めっきを施された後、はんだ
めっきを施される。次にこれをはんだの融点以上の温度
に保持し、はんだを溶融させた後、水冷凝固させる。The base metal material is subjected to solder plating after being subjected to base plating. Next, this is kept at a temperature equal to or higher than the melting point of the solder, and after the solder is melted, it is solidified by water cooling.
めっき前処理、銅めっき、ニッケルめっき、はんだめ
っきの条件は公知のことである、これらの中から適宜選
択して実施することができる。The conditions for the plating pretreatment, copper plating, nickel plating, and solder plating are known in the art.
はんだめっきは錫90wt％−鉛10wt％又は錫60wt％−鉛
40wt％の組成のものが最も多く用いられる。そしてその
厚さは通常0.5〜３μｍてある。Solder plating is tin 90wt% -lead 10wt% or tin 60wt% -lead
A composition having a composition of 40 wt% is most often used. And its thickness is usually 0.5 to 3 μm.
加熱溶融処理には、重油、ブタン等の直火型の炉の
他、電気炉、赤外線炉、高周波加熱炉等いずれを用いて
も良く、また、その炉内雰囲気についても特に規定しな
い。ただし、炉内の酸素濃度が高い場合には、酸化によ
る光沢不良が発生するために均一な表面となりにくい。
そのため酸素濃度は低い方が好ましい。In the heating and melting treatment, any of an electric furnace, an infrared furnace, a high-frequency heating furnace and the like may be used in addition to a direct-fired furnace such as heavy oil and butane, and the atmosphere in the furnace is not particularly limited. However, when the oxygen concentration in the furnace is high, a glossy defect due to oxidation occurs, so that it is difficult to obtain a uniform surface.
Therefore, a lower oxygen concentration is preferable.
また、冷却方法には水冷が一般的に用いられるが、空
冷によってこれを行っても問題はない。ただし、空冷の
場合、粒界が目視される様になることが多いためあまり
好ましくない。また、冷却方法で水以外の油や水溶液等
を用いても良い。In addition, although water cooling is generally used as a cooling method, there is no problem if this is performed by air cooling. However, air cooling is not preferred because the grain boundaries often become visible. Further, an oil other than water, an aqueous solution, or the like may be used in the cooling method.
このようにして、α相組織最大長さの平均値を1.0μ
ｍ以上3.0μｍ以下としたリフローはんだめっき材は安
定した半光沢表面をもつ。In this way, the average value of the maximum length of the α-phase
The reflow solder plating material having a thickness of not less than m and not more than 3.0 μm has a stable semi-glossy surface.
［実施例］ 以下に、本発明を実施例並びに比較例によって説明す
る。EXAMPLES Hereinafter, the present invention will be described with reference to Examples and Comparative Examples.
実施例１ 以下に示す条件でリフローはんだめっき材を作成し
た。Example 1 A reflow solder plating material was prepared under the following conditions.
めっきライン：連続めっきライン 母材:C5210−Ｒ−Ｈ、厚さ0.3mm めっき仕様：下地めっき 銅めっき 0.5μｍ 上地めっき 9/1はんだめっき 1.8μｍ めっき条件：ラインスピード10m/min ◎前処理条件 ○アルカリ脱脂 クリーナー 160 濃度45g/l 処理時間 21秒 処理温度 50℃ ○電解脱脂 クリーナー 160 濃度45g/l 処理時間 21秒 処理温度 50℃ 電流密度 4.8A/dm2 ○酸 洗 硫酸 濃度100g/l 処理時間 21秒 処理温度 15℃ ◎下地めっき条件 ○銅めっき浴組成 硫酸銅 200g/l 硫酸 100g/l 処理時間 42秒 処理温度 15℃ 電流密度 4.8A/dm2 ◎上地めっき条件 ○はんだめっき アルカノールスルホン酸浴 処理時間 42秒 処理温度 15℃ 電流密度 8A/dm2 ◎リフロー温度 炉温 390℃ ◎水冷温度 水温20℃ 以上の条件で作成したはんだめっき材の表面２次電子
像を撮影し、それよりα相組織最大長さの平均を求めた
ところ、平均1.5μｍであった。Plating line: Continuous plating line Base material: C5210-RH, thickness 0.3 mm Plating specification: Underlayer plating Copper plating 0.5 μm Upper plating 9/1 Solder plating 1.8 μm Plating conditions: Line speed 10 m / min ◎ Pretreatment conditions ○ Alkaline degreasing cleaner 160 concentration 45g / l Processing time 21 seconds Processing temperature 50 ° C ○ Electrolytic degreasing cleaner 160 concentration 45g / l Processing time 21 seconds Processing temperature 50 ° C Current density 4.8A / dm 2 ○ Pickling sulfuric acid concentration 100g / l processing Time 21 seconds Processing temperature 15 ° C ◎ Plating conditions ○ Copper plating bath composition Copper sulfate 200g / l Sulfuric acid 100g / l Processing time 42 seconds Processing temperature 15 ° C Current density 4.8A / dm 2 ◎ Top plating conditions ○ Solder plating Alkanol sulfone Acid bath Processing time 42 seconds Processing temperature 15 ° C Current density 8A / dm 2 ◎ Reflow temperature Furnace temperature 390 ° C ◎ Water cooling temperature Water temperature 20 ° C Take a secondary electron image of the surface of the solder plating material created under the above conditions. α phase structure maximum length It was determined the average, with an average of 1.5μm.
このリフローはんだめっき材は均一な半光沢表面をも
つものであった。This reflow solder plating material had a uniform semi-gloss surface.
比較例１ めっき条件は実施例１と同様にして、リフロー後の水
冷までの時間を半分にして冷却を行った。Comparative Example 1 Plating conditions were the same as in Example 1, and cooling was performed by halving the time until water cooling after reflow.
このリフローはんだめっき材のα相組織最大長さの平
均を求めたところ、平均0.5μｍであった。When the average of the maximum length of the α-phase structure of the reflow solder plating material was determined, it was 0.5 μm on average.
このリフローはんだめっき材は光沢表面をもつもので
あった。This reflow solder plating material had a glossy surface.
［発明の効果］ 本発明のリフローはんだめっき材は均一な半光沢表面
をもつものである。[Effect of the Invention] The reflow solder plating material of the present invention has a uniform semi-glossy surface.
第１図は本発明における組織最大長さの説明図、第２図
は錫−鉛合金状態図、第３図、第４図はリフローはんだ
めっき材の表面の金属組織を示す電子顕微鏡写真であ
る。FIG. 1 is an explanatory diagram of the maximum structure length in the present invention, FIG. 2 is a phase diagram of a tin-lead alloy, and FIGS. 3 and 4 are electron micrographs showing a metal structure on the surface of a reflow solder plating material. .
Claims (1)
した後、加熱溶融処理によって得られるリフローはんだ
めっき材において、そのめっき表面α相の各組織最大長
さの平均値が1.0μｍ以上3.0μｍ以下であることを特徴
とするリフローはんだめっき材。1. A reflow solder plating material obtained by electroplating a tin-lead alloy on a surface of a metal material and then subjecting the same to a heat melting treatment, wherein the average value of the maximum length of each structure in the α phase of the plating surface is 1.0 μm or more. A reflow solder plating material having a thickness of 3.0 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1089673A JP2710395B2 (en) | 1989-04-11 | 1989-04-11 | Reflow solder plating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1089673A JP2710395B2 (en) | 1989-04-11 | 1989-04-11 | Reflow solder plating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02270987A JPH02270987A (en) | 1990-11-06 |
| JP2710395B2 true JP2710395B2 (en) | 1998-02-10 |
Family
ID=13977270
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1089673A Expired - Fee Related JP2710395B2 (en) | 1989-04-11 | 1989-04-11 | Reflow solder plating material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2710395B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2766358B2 (en) * | 1989-12-21 | 1998-06-18 | 日鉱金属株式会社 | Reflow solder plating material |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56152992A (en) * | 1980-04-28 | 1981-11-26 | Hitachi Cable Ltd | Tin-lead alloy plated lead wire |
-
1989
- 1989-04-11 JP JP1089673A patent/JP2710395B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02270987A (en) | 1990-11-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101203438B1 (en) | Tin-plated material for electronic part | |
| JP2710395B2 (en) | Reflow solder plating material | |
| US4767508A (en) | Strike plating solution useful in applying primer plating to electronic parts | |
| JP2766358B2 (en) | Reflow solder plating material | |
| US3505181A (en) | Treatment of titanium surfaces | |
| CN103459678B (en) | Tin plated materials | |
| JPH02270988A (en) | Reflow solder plating material | |
| JPH02270990A (en) | Production of reflow solder plating material | |
| JPH03191088A (en) | Production of reflow solder plated material | |
| JP2002069688A (en) | Tin alloy plated material for terminal and connector | |
| JP2718793B2 (en) | Copper or copper alloy with bright tin plating | |
| US2739108A (en) | Electroplating chromium-nickel alloy coatings | |
| JP2732972B2 (en) | Reflow tin or reflow tin alloy plating bath | |
| JPH02270989A (en) | Production of reflow solder plating material | |
| US3063918A (en) | Method of making electric conduit with alloyed coating | |
| JPH0125398B2 (en) | ||
| US2347450A (en) | Electrodeposition of copper from fused baths | |
| US2970091A (en) | Method of alloying aluminum and copper | |
| JPS6013095A (en) | Material for electronic parts and its manufacture | |
| US2918415A (en) | Antimony plating process | |
| JPH02149695A (en) | Surface treatment of magnesium material | |
| JPH06235088A (en) | Steel products for electronic parts and their production | |
| JPH01152294A (en) | Production of material for insoluble anode | |
| Wilson | Electrodeposited Eutectic Tin--Bismuth Alloy on a Conductive Substrate | |
| JP2672869B2 (en) | High corrosion resistance tin plate manufacturing method that does not require reflow treatment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |