JP2706673B2 - Printed wiring board - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board using a surface mounting method, and more particularly, to a method for mounting a surface mounting component on an insulating substrate.
The present invention relates to a printed wiring board formed by adhering to a conductive pattern provided on a printed circuit board.

[0002]

2. Description of the Related Art Among component mounting methods on a printed wiring board, a surface mounting method is widely adopted as a means for reducing component mounting costs in OA equipment and the like constituted by high-performance and high-density components. In addition, with the miniaturization of electric and electronic components and the development of integrated circuit components, the number and arrangement of conductive patterns of surface mount components on printed wiring boards have been diversified, and the spacing between conductive patterns has also become narrower. I have. On the other hand, OA equipment and information processing equipment, which frequently use printed wiring boards, have become widely used in general, so that the use environment conditions of the equipment have become severe, and demands for improved reliability of printed wiring boards have increased. I have.

[0003]

In order to securely and electrically bond a surface-mounted component to a printed wiring board, the surface-mounted component is horizontally bonded to a conductive pattern and soldered. It is important to prevent variations in the hot-dip plating, and it is necessary to bond the conductive patterns so that the conductive patterns are not short-circuited by solder. The present invention has been made in order to solve the above-described problem, and can fix a surface mount component to a conductive pattern on an insulating substrate horizontally, and can correct a variation in a molten solder plating provided on the conductive pattern. it is an object to provide a printed wiring board having an improved soldering method in insulated substrate so as to.

[0004]

In order to solve the above-mentioned problems, a printed wiring board according to the present invention is provided on an insulating substrate.
Bonding surface mount components via the conductive pattern
In the printed wiring board, the conductive pattern
The peripheral part of is formed by solder resist,
Size and number according to the shape and arrangement of the conductive pattern
While the solid silk having the predetermined pattern is not in contact with the conductive pattern.
Formed on the solder resist while keeping a gap,
By the temporary bond applied on the solid silk,
The solder melting plate provided on the surface mount component and the conductive pattern
The distance from the key is kept uniform, and the surface
The surface-mounted components are bonded together .

[0005]

The contrast becomes clear when the color of the solid silk printed together with the external silk is made distinct from the solder resist or the conductive pattern. Therefore, when this solid silk is used as a target in applying the temporary bond, the temporary bond can be accurately applied onto the solid silk. Also,
Since it is easy to determine whether or not the application amount and the position of the temporary bond are acceptable, the surface mount component can be horizontally adhered to the solid silk. Therefore, the variation in the hot-dip solder plating between the surface-mounted component and the conductive pattern is reduced. What
The size and arrangement of the solid silk depends on the shape of the conductive pattern and
The surface mount components are insulated
Helps to adhere accurately on top.

[0006]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the printed wiring board according to the present invention will be described below with reference to the drawings.

[0007] Figure 1 is I sectional view showing a structure of a printed wiring board according to the present invention, surface-mounted on both sides of the insulating substrate 1
It is a printed wiring board to which parts can be attached. Figure 1
Around the conductive pattern 2 provided on the insulating substrate 1
The portion is formed with a solder resist 3, and a surface mount component (not shown) is adhered on the conductive pattern 2 via a molten solder plating 5. Also, Vesitark
4 is the size of the conductive pattern depending on its shape and arrangement.
And the number are determined, and soldering cash register with the outer silk 6
It is formed on the strike 3. FIG. 2 is a plan view showing a conductive pattern forming surface when a 2125 type chip component is mounted. Two solid silks 4 are formed between two conductive patterns 2 with a distance of 0.1 mm between them.
This is an example. Figure 3 shows SOP (Small Outline Package)
FIG. 3 is a plan view when mounting an IC,
This is an example in which the outer shape of C is divided into four to form two solid silks 4. FIG. 4 is a plan view of a case where a QFP (Quad Flat Package) / IC is mounted, and is an example in which a solid silk 4 contacting an outer silk 6 from the center of the IC is formed. Further, FIG. 5 is a plan view in case of mounting a mini mold 3 terminals, Betashiruku 4 in the central portion of the IC
Are formed at a distance of 0.1 mm from each conductive pattern 2. Note that the base in the above-described embodiment is
The tasque 4 has a circular shape.
May be selected as appropriate.

As described above, since the shape and arrangement of the conductive patterns also change depending on the type and shape of the surface mount component, it is necessary to determine the size and number of the solid silk according to each situation. . Note that the gap between the conductive pattern and the solid silk is about 0.1 mm in any case.

[0009]

As described above, the printed wiring board according to the present invention is provided with a solid silk in accordance with the shape and arrangement of the conductive pattern for bonding the surface mount components. The mounted components can be accurately bonded to the insulating substrate. Therefore, it is possible to reduce the detachment of the surface mount component, and to make the color of the solid silk different from the color of the solder resist or the conductive pattern so that it can be easily seen, so that the target of the bond application for temporarily fixing the surface mount component can be used. It has the effect of facilitating the pass / fail judgment of the application amount and position of the surface mount component temporary fixing bond,
Further, there is an advantage that a short circuit between the conductive patterns in the bonding step can be prevented.

[Brief description of the drawings]

FIG. 1 is a sectional view showing the structure of a printed wiring board according to the present invention.

FIG. 2 is a plan view when a 2125 type chip component is mounted.

FIG. 3 is a plan view when an SOP IC is mounted.

FIG. 4 is a plan view when a QFP / IC is mounted.

FIG. 5 is a plan view when a mini mold is mounted.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Insulating substrate 2 Conductive pattern 3 Solder resist 4 Solid silk 5 Solder fusion plating 6 External silk

Claims (1)

(57) [Claims] 1. A conductive type in which a surface mount component is provided on an insulating substrate.
In a printed wiring board configured to be adhered to a pattern, on the insulating substrate according to the type and shape of the surface mount component
The peripheral portion of the conductive pattern provided on the substrate is formed by a solder resist, and the shape and arrangement of the conductive pattern are formed.
Battered silk with the size and number corresponding to the rows
Conductive pattern at a distance that is not in contact with is formed on the solder resist, further, uniformly the gap between the molten solder plating provided on the surface mount component and the conductive pattern on the tacking bond coated on the Betashiruku preservation
So, before the surface mounting component through the molten solder plating
Printed circuit board, characterized in that to uniformly adhere to the serial conductive pattern.