JP2701578B2 - Manufacturing method of resin sealing element - Google Patents
Manufacturing method of resin sealing elementInfo
- Publication number
- JP2701578B2 JP2701578B2 JP9262591A JP9262591A JP2701578B2 JP 2701578 B2 JP2701578 B2 JP 2701578B2 JP 9262591 A JP9262591 A JP 9262591A JP 9262591 A JP9262591 A JP 9262591A JP 2701578 B2 JP2701578 B2 JP 2701578B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sealing
- resin
- concave portion
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明は、例えば電圧操作により
着消色するエレクトロクロミック素子等の素子を外部か
らの物理的及び化学的作用から保護する樹脂によって封
止した樹脂封止素子の製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a resin-encapsulated element in which an element such as an electrochromic element which is discolored by a voltage operation is sealed with a resin for protecting the element from external physical and chemical actions. About.
【0002】[0002]
【従来の技術】電圧を印加すると可逆的に電解酸化また
は還元反応が起こり可逆的に着色する現象をエレクトロ
クロミズムと言う。このような現象を示すエレクトロク
ロミック(以下、ECと略称する)物質を用いて、電圧
操作により着消色するEC素子(以下、ECDと略す)
を作り、このECDを光量制御素子(例えば、防眩ミラ
ー)や7セグメントを利用した数字表示素子に利用しよ
うとする試みは、20年以上前から行われている。2. Description of the Related Art A phenomenon in which an electrolytic oxidation or reduction reaction occurs reversibly when a voltage is applied to cause reversible coloring is called electrochromism. An EC element (hereinafter, abbreviated as ECD) that uses an electrochromic (hereinafter, abbreviated as EC) substance exhibiting such a phenomenon to perform coloration and decoloration by voltage operation.
An attempt to use this ECD for a light quantity control element (for example, an anti-glare mirror) or a numerical display element using 7 segments has been made for more than 20 years.
【0003】例えば、ガラス基板の上に透明電極膜(陰
極)、三酸化タングステン薄膜、二酸化ケイ素のような
絶縁膜、電極膜(陽極)を順次積層してなるECD(特
公昭52−46098号参照)が全固体型ECDとして
知られている。For example, an ECD (see Japanese Patent Publication No. 52-46098) in which a transparent electrode film (cathode), a tungsten trioxide thin film, an insulating film such as silicon dioxide, and an electrode film (anode) are sequentially laminated on a glass substrate. ) Is known as an all-solid-state ECD.
【0004】このECDに電圧を印加すると三酸化タン
グステン(WO3)薄膜が青色に着色する。その後、こ
のECDに逆の電圧を印加すると、WO3 薄膜の着色が
消えて無色になる。この着色・消色する機構は詳しくは
解明されていないが、WO 3 薄膜および絶縁膜(イオ
ン導電層)中に含まれる少量の水分がWO3 の着色・消
色を支配していると理解されている。When a voltage is applied to the ECD, the tungsten trioxide (WO 3 ) thin film is colored blue. Thereafter, when a reverse voltage is applied to the ECD, the color of the WO 3 thin film disappears and the ECD becomes colorless. Although the mechanism of coloring and erasing is not elucidated in detail, it is understood that a small amount of water contained in the WO 3 thin film and the insulating film (ion conductive layer) controls the coloring and erasing of WO 3. ing.
【0005】尚、着色の反応式は下記の化学式のように
推定されている。 H2 O → H+ +OH- (WO3 膜=陰極側)WO3 +nH+ +ne- →Hn WO3 (無色透明) (青色) (絶縁膜=陽極側)OH- →1/2H2 O+1/4O2 ↑+1/2e- [0005] The reaction formula for coloring is estimated as the following chemical formula. H 2 O → H + + OH − (WO 3 film = cathode side) WO 3 + nH + + ne − → H n WO 3 (colorless and transparent) (blue) (insulating film = anode side) OH − → 1 / 2H 2 O + 1 / 4O 2 ↑ + 1 / 2e -
【0006】ところで、EC層を直接又は間接的に挟む
一対の電極層は、EC層の着消色を外部に見せるために
少なくとも一方は透明でなければならない。特に透過型
のECDの場合には両方とも透明でなければならない。Meanwhile, at least one of the pair of electrode layers directly or indirectly sandwiching the EC layer must be transparent in order to make the coloration and decoloration of the EC layer appear to the outside. In particular, in the case of a transmission type ECD, both must be transparent.
【0007】透明な電極材料としては、現在のところS
nO2 ,In2 O3 ,ITO(SnO2 とIn2 O3 と
の混合物)、ZnOなどが知られているが、これらの材
料は比較的透明度が悪いために薄くせねばならず、この
理由及びその他の理由からECDは基板例えばガラス板
やプラスチック板等の基板上に形成するのが普通であ
り、更に、ECDを形成した基板を保護基板との間に樹
脂と共に素子を封止して物理的及び化学的作用から保護
している。このようなECDの構造の一例を次に示す。At present, as a transparent electrode material, S
Known materials include nO 2 , In 2 O 3 , ITO (a mixture of SnO 2 and In 2 O 3 ), ZnO, and the like. However, these materials have to be made thin because their transparency is relatively poor. For other reasons, the ECD is usually formed on a substrate such as a glass plate or a plastic plate, and furthermore, the substrate on which the ECD is formed is sealed with a resin between the protective substrate and a device to seal the device. Protection from chemical and chemical effects. An example of the structure of such an ECD is shown below.
【0008】図5は、2枚の基板の間に樹脂と共に素子
を封止したECDの構成を示す模式断面図であり、図6
は封止する前のECDの概略断面図である。図5に於い
て、矩形のガラス製素子基板(1) の表面全体にITOで
電極層を形成し、次にフォトエッチングまたはレーザー
カッティングにより上部電極(6) 用の取出し部(7) と、
下部電極(2) との間に溝を形成した。尚、ITOをマス
ク蒸着することにより直接にこれらの取出し部(7)と下
部電極層(2) とのパターンを形成することも行われてい
る。FIG. 5 is a schematic cross-sectional view showing the structure of an ECD in which an element is sealed together with a resin between two substrates.
1 is a schematic sectional view of an ECD before sealing. In FIG. 5, an electrode layer is formed on the entire surface of the rectangular glass element substrate (1) with ITO, and then an extraction part (7) for the upper electrode (6) is formed by photoetching or laser cutting;
A groove was formed between the lower electrode (2). It is also practiced to directly form a pattern of the extraction portion (7) and the lower electrode layer (2) by mask vapor deposition of ITO.
【0009】次に酸化イリジウムと酸化スズとの混合物
からなる可逆的電解酸化層(3) と、酸化タンタルからな
るイオン導電層(4) と、酸化タングステンからなる還元
着色性EC層(5) とを順に形成した。Next, a reversible electrolytic oxide layer (3) composed of a mixture of iridium oxide and tin oxide, an ion conductive layer (4) composed of tantalum oxide, and a reduced coloring EC layer (5) composed of tungsten oxide are provided. Were formed in order.
【0010】最後に上部電極(6) としてITOを蒸着し
てECDを作製した。この時ITOは既に素子基板(1)
上に形成された取出し部(7) と一端が接触するように形
成した。ここで電極接点として断面がコの字型のリン青
銅製の導電性クリップ(8) を2本用意した。このクリッ
プ(8) 2本を素子基板(1) の端辺側にそれぞれ装着し、
これによりクリップ(8) が上部、下部各電極の取出し部
を圧着するようにして、図6に示された素子基板(1) 上
に形成されたECDを得た。Finally, ITO was deposited as an upper electrode (6) to produce an ECD. At this time, ITO has already been used for the element substrate (1).
It was formed so that one end was in contact with the take-out part (7) formed above. Here, two conductive clips (8) made of phosphor bronze having a U-shaped cross section were prepared as electrode contacts. Attach the two clips (8) to the end sides of the element board (1),
Thus, the ECD formed on the element substrate (1) shown in FIG. 6 was obtained, with the clip (8) pressing the upper and lower electrode extraction portions by pressure bonding.
【0011】図6に示された素子基板(1) 上に形成され
たECDは更に、前述の通り外部からの物理的及び化学
的作用から保護するため、上部電極(6) 上方を保護用封
止基板(9) で覆い、その間に封止樹脂(10)を封止した。The ECD formed on the element substrate (1) shown in FIG. 6 further has a protective seal above the upper electrode (6) in order to protect it from external physical and chemical effects as described above. The substrate was covered with a stop substrate (9), and a sealing resin (10) was sealed between the substrates.
【0012】基本的にはこれら下部電極(2) 〜上部電極
(6) の積層構造だけでECDが構成される。即ち、下部
電極(2) 及び上部電極(6) の取出し部(7) 各々はクリッ
プ(8) に導通され、更に各々外部配線(11)(12)を駆動電
源(13)に配線する。前述の通り、このECDに対する電
圧操作により着消色する。Basically, these lower electrode (2) to upper electrode
An ECD is constituted only by the laminated structure of (6). That is, each of the lower electrode (2) and the extraction portion (7) of the upper electrode (6) is electrically connected to the clip (8), and further, external wirings (11) and (12) are respectively wired to the drive power supply (13). As described above, the color is turned on / off by the voltage operation on the ECD.
【0013】[0013]
【発明が解決しようとする課題】しかしながら、素子基
板(1) と保護用封止基板(9) との間に保持される封止樹
脂の量は、少なくすぎると、素子面が十分に封止されな
い。また、多すぎると2つの基板の外周辺にはみ出して
塊状に硬化付着する為、基板の周辺処理に時間を要し、
場合によっては処理時に素子に損傷を与えることもあり
問題であった。However, if the amount of the sealing resin held between the element substrate (1) and the protective sealing substrate (9) is too small, the element surface is sufficiently sealed. Not done. Also, if too much, it will protrude to the outer periphery of the two substrates and harden and adhere in a lump, so it takes time for peripheral processing of the substrate,
In some cases, the device may be damaged during processing, which is a problem.
【0014】本発明は、基板周辺にはみ出した封止剤の
処理を容易にし、また、処理時の素子損傷を防ぐことを
目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to facilitate the treatment of a sealant that has protruded to the periphery of a substrate and to prevent element damage during the treatment.
【0015】[0015]
【課題を解決するための手段】本請求項1に記載の発明
に係る樹脂封上素子の製造方法では、第1基板と第2基
板との間に樹脂と共に素子を封止する樹脂封止素子の製
造方法において、前記第1基板の周辺外形に係合密着す
る第1の凹部を備えた第1封止用治具の第1の凹部に第
1基板を保持し、前記第2基板の周辺外形に係合密着す
る第2の凹部を備えた第2封止用治具の第2の凹部に第
2基板を保持し、前記第1基板と第2基板との何れかの
基板上に樹脂及び素子を載置し、前記第1封止用治具と
第2封止用治具とを係合して前記2つの封止治具の間隙
部分から過剰の樹脂を排出する方法である。According to a first aspect of the present invention, there is provided a method of manufacturing a resin-sealed element, wherein a resin-sealed element is provided between a first substrate and a second substrate together with a resin. In the manufacturing method of (1), the first substrate is held in the first concave portion of the first sealing jig provided with the first concave portion which engages and adheres to the peripheral outer shape of the first substrate, and the periphery of the second substrate is The second substrate is held in the second concave portion of the second sealing jig provided with the second concave portion that engages and adheres to the outer shape, and the resin is placed on one of the first substrate and the second substrate. And mounting the element, engaging the first sealing jig and the second sealing jig, and discharging excess resin from a gap between the two sealing jigs.
【0016】また更に、前記2つの封止治具の係合部分
に過剰の樹脂を排出する排出口を備えたものである。Still further, a discharge port for discharging excess resin is provided at an engagement portion between the two sealing jigs.
【0017】[0017]
【作用】本発明では、第1基板の周辺外形に係合密着す
る第1の凹部を備えた第1封止用治具の第1の凹部に第
1基板を保持し、第2基板の周辺外形に係合密着する第
2の凹部を備えた第2封止用治具の第2の凹部に第2基
板を保持し、前記第1基板と第2基板との何れかの基板
上に樹脂及び素子を載置し、前記第1封止用治具と第2
封止用治具とを係合して前記2つの封止治具の間隙部分
から過剰の樹脂を排出する方法であるため、過剰の封止
樹脂は第1基板及び第2基板の周辺からはみ出ることな
く、間隙部からのみはみ出し、バリ状となって硬化す
る。このため、基板からはみ出した封止樹脂の除去処理
が容易であり、基板の周辺処理時に素子に損傷を与える
ことがなく、操作が容易となる。According to the present invention, the first substrate is held in the first concave portion of the first sealing jig provided with the first concave portion which engages and adheres to the peripheral outer shape of the first substrate, and the periphery of the second substrate is The second substrate is held in the second concave portion of the second sealing jig provided with the second concave portion that engages and adheres to the outer shape, and the resin is placed on one of the first substrate and the second substrate. And a device, and the first sealing jig and the second
Since this is a method of engaging with a sealing jig and discharging excess resin from a gap between the two sealing jigs, the excess sealing resin protrudes from the periphery of the first substrate and the second substrate. Without this, it protrudes only from the gap, becomes a burr-like state, and hardens. For this reason, the sealing resin protruding from the substrate is easily removed, and the device is not damaged during peripheral processing of the substrate, and the operation is facilitated.
【0018】本発明では、第1基板と第2基板との間に
樹脂と共に素子を封止する構成の素子であれば、素子に
影響を与えない封止樹脂を選択することにより、如何な
る素子にも適用が可能である。In the present invention, if the element has a structure in which the element is sealed together with the resin between the first substrate and the second substrate, the sealing resin which does not affect the element is selected, so that any element can be formed. Is also applicable.
【0019】尚、後述する実施例では、好適な例として
ECDに付いて記載しているが、ECDの積層構造は、
特にどれと限定されるものではないが、固体型ECDの
構造としては、例えば電極層/EC層/イオン導電層
/電極層のような4層構造;電極層/還元着色型EC
層/イオン導電層/可逆的電解酸化層/電極層のような
5層構造があげられる。In the embodiments described later, an ECD is described as a preferred example.
Although not particularly limited, the structure of the solid-type ECD includes a four-layer structure such as an electrode layer / EC layer / ion conductive layer / electrode layer;
A five-layer structure such as a layer / ion conductive layer / reversible electrolytic oxide layer / electrode layer can be given.
【0020】透明電極の材料としては、例えば、SnO
2 ,In2 O3 ,ITOなどが使用される。このような
電極層は、一般には真空蒸着、イオンプレーテイング、
スパッタリングなどの真空薄膜形成技術で形成される。
(還元着色性)EC層としては一般にWO3 ,MoO3
などが使用される。As a material of the transparent electrode, for example, SnO
2 , In 2 O 3 , ITO and the like are used. Such electrode layers are generally vacuum deposited, ion plated,
It is formed by a vacuum thin film forming technique such as sputtering.
(Reduction coloring) WO 3 , MoO 3
Are used.
【0021】イオン導電層としては、例えば酸化ケイ
素、酸化タンタル、酸化チタン、酸化アルミニウム、酸
化ニオブ、酸化ジルコニウム、酸化ハフニウム、酸化ラ
ンタン、フッ化マグネシウムなどが使用される。これら
の物質薄膜は製造方法により電子に対して絶縁体である
が、プロトン(H+ )およびヒドロキシイオン(OH
- )に対しては良導体となる。EC層の着色消色反応に
はカチオンが必要とされ、H+ イオンやLi+ イオンを
EC層その他に含有させる必要がある。H+ イオンは初
めからイオンである必要はなく、電圧が印加されたとき
にH+ イオンが生じればよく、従ってH+ イオンの代わ
りに水を含有させてもよい。この水は非常に少なくて十
分であり、しばしば、大気中から自然に侵入する水分で
も着消色する。As the ion conductive layer, for example, silicon oxide, tantalum oxide, titanium oxide, aluminum oxide, niobium oxide, zirconium oxide, hafnium oxide, lanthanum oxide, magnesium fluoride and the like are used. These material thin films are insulators for electrons depending on the manufacturing method, but proton (H + ) and hydroxy ions (OH
- ) Is a good conductor. A cation is required for the color decoloring reaction of the EC layer, and it is necessary to include H + ions and Li + ions in the EC layer and the like. The H + ion does not need to be an ion from the beginning, and it is sufficient that H + ion is generated when a voltage is applied, and thus water may be contained instead of the H + ion. This water is very small and sufficient, and often discolors even water that naturally enters from the atmosphere.
【0022】EC層とイオン導電層とは、どちらを上に
しても下にしてもよい。さらにEC層に対して間にイオ
ン導電層を挟んで(場合により酸化着色性EC層ともな
る)可逆的電解酸化層ないし触媒層を配設してもよい。
このような層としては、例えば酸化ないし水酸化イリジ
ウム、同じくニッケル、同じくクロム、同じくバナジウ
ム、同じくルテニウム、同じくロジウムなどがあげられ
る。これらの物質は、イオン導電層又は透明電極中に分
散されていても良いし、それらを分散してもよい。不透
明な電極層は、反射層と兼用していてもよく、例えば
金、銀、アルミニウム、クロム、スズ、亜鉛、ニッケ
ル、ルテニウム、ロジウム、ステンレスなどの金属が使
用される。Either the EC layer or the ion conductive layer may be on the upper side or the lower side. Further, a reversible electrolytic oxide layer or a catalyst layer may be provided between the EC layer and the ion conductive layer (in some cases, also an oxidative coloring EC layer).
Examples of such a layer include iridium oxide or hydroxide, nickel, chromium, vanadium, ruthenium, rhodium, and the like. These substances may be dispersed in the ion conductive layer or the transparent electrode, or they may be dispersed. The opaque electrode layer may also serve as the reflection layer, and for example, a metal such as gold, silver, aluminum, chromium, tin, zinc, nickel, ruthenium, rhodium, and stainless steel is used.
【0023】[0023]
【実施例】以下に本発明の一実施例を説明する。前述の
図6に示した素子基板(1) 上に形成されたECDの上部
電極(6) 上方を保護用封止基板(9) で覆い、その間に封
止樹脂(10)を封止する。尚、前述の符号と同一の符号は
同一又は相当の部分である。An embodiment of the present invention will be described below. The upper part of the upper electrode (6) of the ECD formed on the element substrate (1) shown in FIG. 6 is covered with a protective sealing substrate (9), and a sealing resin (10) is sealed therebetween. Note that the same reference numerals as those described above are the same or corresponding parts.
【0024】図1は本発明の一実施例で使用する一対の
封止用治具(20)(21)の断面図である。図に示すように、
第1封止用治具(20)及び第2封止用治具(21)の一対の封
止用治具(20)(21)は、各々素子基板(1) 及び保護用封止
基板(9) の各々の周辺外形に係合密着する凹部が形成さ
れている。各々の凹部の周縁は互いに係合する係合部が
形成されている。各々の封止用治具(20)(21)は、弾性の
あるシリコンゴム製であり、各々の凹部に素子基板(1)
又は保護用封止基板(9) を押し付けることにより素子基
板(1) 及び封止基板(9) の周辺部端面と良好に密着し
て、封止樹脂の回り込みがないように形成されている。FIG. 1 is a sectional view of a pair of sealing jigs (20) and (21) used in one embodiment of the present invention. As shown in the figure,
The pair of sealing jigs (20) and (21) of the first sealing jig (20) and the second sealing jig (21) are respectively an element substrate (1) and a protective sealing substrate ( 9), a concave portion is formed so as to engage with and close to each peripheral outer shape. Engaging portions that engage with each other are formed on the periphery of each concave portion. Each of the sealing jigs (20) and (21) is made of elastic silicon rubber, and has an element substrate (1) in each recess.
Alternatively, by pressing the protective sealing substrate (9), the sealing resin is tightly adhered to the peripheral end surfaces of the element substrate (1) and the sealing substrate (9) so that the sealing resin does not flow around.
【0025】図2は第2封止用治具(21)の凹部に保護用
封止基板(9) を装填した状態を示す断面図である。図に
示すように矩形のガラス製封止基板(9) を凹部にあて
て、封止基板(9) を凹部に押し込むことにより、凹部に
装填して、封止基板(9) の周辺外形の端面と密着させ
る。そして封止基板(9) の上部に封止樹脂(10)を塗布し
た。FIG. 2 is a cross-sectional view showing a state in which a protective sealing substrate (9) is loaded in the concave portion of the second sealing jig (21). As shown in the figure, the rectangular glass sealing substrate (9) is placed in the concave portion, and the sealing substrate (9) is pushed into the concave portion, thereby being loaded into the concave portion and forming the peripheral outer shape of the sealing substrate (9). Adhere to the end face. Then, a sealing resin (10) was applied to the upper part of the sealing substrate (9).
【0026】図3は第1封止用治具(20)の凹部に素子基
板(1) を装填して図2に示した第2封止用治具(21)上に
載置した状態を示す断面図である。図に示すように、封
止基板(9) と同様にして、第1封止用治具(20)の凹部に
素子面を封止基板(9) 側にして素子基板(1) を装填す
る。更に、図2に示した封止樹脂(10)を塗布した封止基
板(9) の上に素子基板(1) を載せる。この時、素子基板
(1) と封止基板(9) との間に空気が入らないようにす
る。FIG. 3 shows a state in which the element substrate (1) is loaded into the concave portion of the first sealing jig (20) and placed on the second sealing jig (21) shown in FIG. FIG. As shown in the figure, in the same manner as the sealing substrate (9), the element substrate (1) is loaded into the recess of the first sealing jig (20) with the element surface facing the sealing substrate (9). . Further, the element substrate (1) is placed on the sealing substrate (9) coated with the sealing resin (10) shown in FIG. At this time, the element substrate
Prevent air from entering between (1) and the sealing substrate (9).
【0027】図4は図3に示した一対の封止用治具を係
合させて過剰の樹脂を係合部の間隙に排出した状態を示
す断面図である。図に示すように、第1,第2封止用治
具(20)(21)を基板平面に垂直な方向に加圧して、素子基
板(1) 及び封止基板(9) が装填された凹部の周縁の係合
部の間隙ができるだけ小さく(1mm以下に)なるよう
にする。こうすると、各凹部からはみ出した過剰の封止
樹脂(10)は第1,第2封止用治具(20)(21)の係合部の間
隙から排出される。FIG. 4 is a cross-sectional view showing a state where the pair of sealing jigs shown in FIG. 3 are engaged and excess resin is discharged into the gap between the engaging portions. As shown in the figure, the first and second sealing jigs (20) and (21) were pressed in a direction perpendicular to the substrate plane, and the element substrate (1) and the sealing substrate (9) were loaded. The gap between the engaging portions on the periphery of the concave portion is made as small as possible (1 mm or less). In this case, the excess sealing resin (10) protruding from each concave portion is discharged from the gap between the engaging portions of the first and second sealing jigs (20, 21).
【0028】図4に示した状態で、常温又はやや加熱下
で放置して封止樹脂(10)を硬化した後、封止用治具(20)
(21)から、封止した基板をとりはずすと、基板周辺の外
側に間隙部から排出された封止樹脂が薄いバリ状に形成
される。In the state shown in FIG. 4, the sealing resin (10) is cured by leaving it at room temperature or slightly under heating, and then the sealing jig (20)
When the sealed substrate is removed from (21), the sealing resin discharged from the gap outside the substrate is formed in a thin burr shape.
【0029】このバリ状の封止樹脂は、ナイフ等で容易
に除去できる。封止樹脂を除去した後、上部電極及び下
部電極の取出し用導電性クリップ(8) に、各々外部配線
(11)(12)を配線して樹脂封止ECDを得た。この樹脂封
止ECDに駆動電源(13)(Su)から、着色電圧(+
1.35V)を付加すると基板に入射させた波長633
nmの光に対して透過率は20%に減少し(10秒
後)、この透過率は電圧印加を止めても、しばらく保た
れた。今度は消色電圧(−1.35V)を印加すると、
同じく透過率は70%に回復した。(10秒後)This burr-shaped sealing resin can be easily removed with a knife or the like. After removing the sealing resin, connect the external wiring to the conductive clips (8) for taking out the upper and lower electrodes, respectively.
(11) By wiring (12), a resin-sealed ECD was obtained. A coloring voltage (+) is applied to the resin-sealed ECD from the driving power supply (13) (Su).
When 1.35 V) is applied, the wavelength 633 incident on the substrate is obtained.
The transmittance for nm light was reduced to 20% (after 10 seconds), and this transmittance was maintained for a while even when the voltage application was stopped. This time, when the decoloring voltage (-1.35V) is applied,
Similarly, the transmittance was restored to 70%. (After 10 seconds)
【0030】以上の通り、封止時に、基板よりはみ出し
た封止樹脂を基板周辺の外側に薄いバリ状に出して硬化
させてあるので、はみ出した封止樹脂の除去処理が容易
となり、また処理時に素子に損傷を与えることがなくな
った。As described above, at the time of sealing, the sealing resin protruding from the substrate is exposed to the outside of the periphery of the substrate in a thin burr shape and hardened, so that the protruding sealing resin can be easily removed. Occasionally, the element was not damaged.
【0031】尚、前述の実施例では、2つの封止用治具
の係合部の間隙全体から過剰の樹脂を排出したが、2つ
の封止治具の係合部分の各々又は一方に幾つかの溝を形
成し、この溝から過剰の樹脂を排出してもよい。この場
合、はみ出した封止樹脂を除去する箇所が限定され、よ
り除去処理が容易となる。In the above-described embodiment, the excess resin is discharged from the entire gap between the engaging portions of the two sealing jigs. Such a groove may be formed, and excess resin may be discharged from this groove. In this case, the place where the protruding sealing resin is removed is limited, and the removal processing is further facilitated.
【0032】尚、封止樹脂(10)が硬化後に付着しないの
で都合が良い。また、封止用治具全体を弾性体とするの
ではなく、少なくとも一対の封止用治具の各基板の周辺
部と密着させる凹部を、シリコンゴム等の弾力体で構成
しても、2つの基板上への封止樹脂の回り込みを防ぐこ
とができる。It is convenient because the sealing resin (10) does not adhere after curing. Further, instead of making the entire sealing jig an elastic body, at least the concave portion of the pair of sealing jigs which are brought into close contact with the peripheral portions of the respective substrates is made of an elastic body such as silicon rubber. It is possible to prevent the encapsulation resin from flowing onto one substrate.
【0033】[0033]
【発明の効果】以上説明した通り、本発明では、第1基
板の周辺外形に係合密着する第1の凹部を備えた第1封
止用治具の第1の凹部に第1基板を保持し、第2基板の
周辺外形に係合密着する第2の凹部を備えた第2封止用
治具の第2の凹部に第2基板を保持し、前記第1基板と
第2基板との何れかの基板上に樹脂及び素子を載置し、
前記第1封止用治具と第2封止用治具とを係合して前記
2つの封止治具の間隙部分から過剰の樹脂を排出する方
法であるため、過剰の封止樹脂は間隙部からはみ出し、
バリ状となって硬化する。このため、基板からはみ出し
た封止樹脂の除去処理が容易であり、基板の周辺処理時
に素子に損傷を与えることがなく、操作が容易となる等
の効果を有する。As described above, according to the present invention, the first substrate is held in the first concave portion of the first sealing jig provided with the first concave portion which engages with the outer peripheral shape of the first substrate. Then, the second substrate is held in the second concave portion of the second sealing jig provided with the second concave portion which engages and adheres to the peripheral outer shape of the second substrate, and the first substrate and the second substrate are separated from each other. Place the resin and element on any substrate,
Since the first sealing jig and the second sealing jig are engaged with each other to discharge excess resin from a gap between the two sealing jigs, the excess sealing resin is Protruding from the gap,
It becomes burrs and hardens. For this reason, the removal treatment of the sealing resin protruding from the substrate is easy, and there is an effect that the element is not damaged at the time of peripheral processing of the substrate and the operation is easy.
【図1】本発明の一実施例で使用する一対の封止用治具
(20)(21)の断面図である。FIG. 1 shows a pair of sealing jigs used in one embodiment of the present invention.
It is sectional drawing of (20) and (21).
【図2】第2封止用治具(21)の凹部に保護用封止基板
(9) を装填した状態を示す断面図である。FIG. 2 shows a protective sealing substrate in a recess of a second sealing jig (21).
FIG. 9 is a sectional view showing a state where (9) is loaded.
【図3】第1封止用治具(20)の凹部に素子基板(1) を装
填して図2に示した第2封止用治具(21)上に載置した状
態を示す断面図である。FIG. 3 is a cross-sectional view showing a state where an element substrate (1) is loaded into a concave portion of a first sealing jig (20) and placed on a second sealing jig (21) shown in FIG. 2; FIG.
【図4】図3に示した一対の封止用治具を係合させて過
剰の樹脂を係合部に排出した状態を示す断面図である。4 is a cross-sectional view showing a state in which a pair of sealing jigs shown in FIG. 3 are engaged and excess resin is discharged to an engaging portion.
【図5】2枚の基板の間に樹脂と共に素子を封止したE
CDの構成を示す模式断面図である。FIG. 5 shows an E in which an element is sealed between two substrates together with a resin.
FIG. 2 is a schematic cross-sectional view illustrating a configuration of a CD.
【図6】封止する前のECDの概略断面図である。FIG. 6 is a schematic sectional view of an ECD before sealing.
(1)素子基板、(2)下部電極、(3)可逆的電解酸
化層、(4)イオン導電層、(5)WO3層又は還元着
色性EC層、(6)上部電極、(7)取出し部、(8)
導電性クリップ、(9)封止基板、(10)封止樹脂、
(11)(12)配線、(13)駆動電源、(20)第
1封止用治具、(21)第2封止用治具(1) element substrate, (2) a lower electrode, (3) a reversible electrolytic oxidation layer, (4) the ion conductive layer, (5) WO 3 layer or reductive coloring EC layer, (6) an upper electrode, (7) Take-out part, (8)
Conductive clip, (9) sealing substrate, (10) sealing resin,
(11) (12) wiring, (13) drive power supply, (20) first sealing jig, (21) second sealing jig
Claims (2)
素子を封止する樹脂封止素子の製造方法において、 前記第1基板の周辺外形に係合密着する第1の凹部を備
えた第1封止用治具の第1の凹部に第1基板を保持し、 前記第2基板の周辺外形に係合密着する第2の凹部を備
えた第2封上用治具の第2の凹部に第2基板を保持し、 前記第1基板と第2基板との何れかの基板上に樹脂及び
素子を載置し、 前記第1封止用治具と第2封止用治具とを係合して前記
2つの封止治具の間隙部分から過剰の樹脂を排出するこ
とを特徴とする樹脂封止素子の製造方法。1. A method for manufacturing a resin-encapsulated element for sealing an element together with a resin between a first substrate and a second substrate, comprising: a first concave portion which is engaged with and adheres to a peripheral outer shape of the first substrate. Holding the first substrate in the first concave portion of the first sealing jig, and the second sealing jig provided with the second concave portion which is engaged with and adhered to the peripheral outer shape of the second substrate. Holding the second substrate in the concave portion, placing a resin and an element on any one of the first substrate and the second substrate , the first sealing jig and the second sealing jig And discharging excess resin from the gap between the two sealing jigs.
樹脂を排出する排出口を備えたことを特徴とする請求項
1に記載の樹脂封止素子の製造方法。2. The method according to claim 1, wherein a discharge port for discharging excess resin is provided at an engagement portion of the two sealing jigs.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9262591A JP2701578B2 (en) | 1991-04-01 | 1991-04-01 | Manufacturing method of resin sealing element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9262591A JP2701578B2 (en) | 1991-04-01 | 1991-04-01 | Manufacturing method of resin sealing element |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04304431A JPH04304431A (en) | 1992-10-27 |
JP2701578B2 true JP2701578B2 (en) | 1998-01-21 |
Family
ID=14059627
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9262591A Expired - Lifetime JP2701578B2 (en) | 1991-04-01 | 1991-04-01 | Manufacturing method of resin sealing element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2701578B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5953150A (en) * | 1997-12-22 | 1999-09-14 | Ppg Industries Ohio, Inc. | Edge design for electrochromic devices |
JP5257010B2 (en) * | 2008-11-14 | 2013-08-07 | セイコーエプソン株式会社 | Electro-optical device and electronic apparatus |
JP5386941B2 (en) * | 2008-11-14 | 2014-01-15 | セイコーエプソン株式会社 | ELECTRO-OPTICAL DEVICE, MANUFACTURING METHOD THEREOF, AND ELECTRONIC DEVICE |
-
1991
- 1991-04-01 JP JP9262591A patent/JP2701578B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH04304431A (en) | 1992-10-27 |
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