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JP2798274B2 - Manufacturing method of chip-shaped parts - Google Patents

Manufacturing method of chip-shaped parts

Info

Publication number
JP2798274B2
JP2798274B2 JP23509189A JP23509189A JP2798274B2 JP 2798274 B2 JP2798274 B2 JP 2798274B2 JP 23509189 A JP23509189 A JP 23509189A JP 23509189 A JP23509189 A JP 23509189A JP 2798274 B2 JP2798274 B2 JP 2798274B2
Authority
JP
Japan
Prior art keywords
shaped
substrate
substrates
strip
chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23509189A
Other languages
Japanese (ja)
Other versions
JPH0397108A (en
Inventor
隆之 古橋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Corp
Kuroda Precision Industries Ltd
Original Assignee
Kyocera Corp
Kuroda Precision Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kyocera Corp, Kuroda Precision Industries Ltd filed Critical Kyocera Corp
Priority to JP23509189A priority Critical patent/JP2798274B2/en
Publication of JPH0397108A publication Critical patent/JPH0397108A/en
Application granted granted Critical
Publication of JP2798274B2 publication Critical patent/JP2798274B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Magnetic Heads (AREA)

Description

【発明の詳細な説明】 [概要] チップ状部品の製造方法に関し、 チップ状部品の製造のために必要な加工を施す被加工
用基板を、スライシング加工を要することなしに作成す
ることを目的とし、 製造目的のチップ状部品の基板を複数個、隣接する状
態で1方向に整列させたときの全体形状を持つ複数個の
短冊状セラミック基板の長側面同士あるいは短側面同士
を接着することにより、前記複数個の短冊状セラミック
基板を連結して1枚の被加工用基板を作成し、当該被加
工用基板の状態で必要な加工を施し、次にダイシング加
工と当該被加工用基板の接着部分を剥がす加工とを行な
って個々のチップ状部品にする構成を有する。
DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a method for manufacturing a chip-shaped component, and aims at producing a substrate to be processed on which a process required for manufacturing a chip-shaped component is performed without requiring slicing. By bonding the long side surfaces or short side surfaces of a plurality of strip-shaped ceramic substrates having the overall shape when a plurality of chip-shaped component substrates to be manufactured are aligned in one direction in an adjacent state, The plurality of strip-shaped ceramic substrates are connected to form a single substrate to be processed, necessary processing is performed in the state of the substrate to be processed, and then dicing and a bonding portion of the substrate to be processed are performed. And peeling off to form individual chip-shaped components.

[産業上の利用分野] 本発明は、チップ状部品の製造方法に関する。[Industrial application field] The present invention relates to a method for manufacturing a chip-shaped component.

一般に、磁気ヘッドのスライダ等のセラミック部品等
のチップ状部品を製造するさいには、先ず多数個取りが
可能な大きさの板材あるいは角柱材に焼結形成したセラ
ミック素材をスライシングして被加工用基板を切り出
し、この状態で加工(例えば、研削,ラッピング,ポリ
ッシング等の各種処理)を行なって、多数の部品加工を
一括して行ない、次に、この被加工用基板をダイシング
加工して個々のチップ状部品としている。
Generally, when manufacturing chip-shaped parts such as ceramic parts such as sliders of a magnetic head, first, a ceramic material formed by sintering a plate material or a prism material of a size that can be obtained in large numbers is sliced and processed. A substrate is cut out, and processing (for example, various processings such as grinding, lapping, and polishing) is performed in this state, and a large number of parts are processed at a time. Then, the substrate to be processed is diced and individually processed. It is a chip-shaped part.

本発明は、特に、製造目的のチップ状部品の基板を複
数個、隣接する状態で1方向に整列させたときの全体形
状を持つ短冊状セラミック基板を複数個作成し、異なる
短冊状基板の長側面同士あるいは短側面同士を接着する
ことにより、前記複数個の短冊状基板を連結して1枚の
被加工用基板を作成して、この被加工用基板に必要な加
工を施す手段を提供する。
The present invention particularly provides a plurality of chip-shaped component substrates, and a plurality of strip-shaped ceramic substrates having an overall shape when aligned in one direction in a state of being adjacent to each other. By bonding the side surfaces or the short side surfaces to each other, the plurality of strip-shaped substrates are connected to form one substrate to be processed, and a means for performing necessary processing on the substrate to be processed is provided. .

[従来の技術] チップ状部品の1例である磁気ヘッド部品の従来の製
造方法は、第3図に示すようになっていた。
[Prior Art] A conventional method of manufacturing a magnetic head component, which is an example of a chip-shaped component, is as shown in FIG.

すなわち、 ′ 多数個取りが可能な形状に成形し、焼成して素材
11を作成する。
In other words, ′
Create 11.

′ 素材11をスライシング加工して基板12を作成し、
この基板へ研磨,ポリッシング更に各種処理を含む加工
を施す。
′ Slicing the material 11 to make the substrate 12,
The substrate is subjected to processing including polishing, polishing, and various processing.

′ ダイシング加工により個々の磁気ヘッド部品13を
作成する。
′ Individual magnetic head parts 13 are prepared by dicing.

′ 個々の磁気ヘッド部13へ他の部品を取り付けて最
終製品14を製造する。
'Attach other components to the individual magnetic heads 13 to produce the final product 14.

の各工程からなっている。It consists of each process.

[発明が解決しようとする課題] 第3図の磁気ヘッド部品の製造方法では、前記′の
工程で、素材11をスライシング加工することにより基板
を作成している。このため、基板に、割れが発生した
り、スライシング加工歪が残留したりする。そして、こ
の加工歪のために、その後の加工処理によって不良品が
発生する率が高くなる。また、個々の磁気ヘッド部品に
するまでに、′の工程でのスライシング加工および
′の工程での2方向へのダイシング加工の合計3回の
切断加工が必要であり、切断加工による割れの発生率も
高いといった問題点がある。
[Problems to be Solved by the Invention] In the method of manufacturing a magnetic head component shown in FIG. 3, the substrate is formed by slicing the material 11 in the step (1). For this reason, cracks are generated on the substrate, and slicing processing distortion remains. Then, due to the processing distortion, the rate at which defective products are generated by the subsequent processing increases. In addition, before the individual magnetic head parts are formed, it is necessary to perform a total of three times of slicing processing in the step of ′ and dicing processing in two directions in the step of ′. Is also expensive.

そこで、本発明は、スライシング加工を要せずに短冊
状の被加工用基板を作成し、また個々のチップ状部品に
するために必要なダイシング加工も1方向のみとする手
段を提供して、前記の問題点を解決することを目的とし
ている。
Therefore, the present invention provides a means for producing a strip-shaped substrate to be processed without the need for slicing, and for dicing only one direction in order to make individual chip-shaped components. It is intended to solve the above problems.

[課題を解決するための手段] 本発明は、セラミック素材については、短冊状基板で
あればスライシング加工を要せずに容易に作成できるこ
とに着目して、この短冊状基板をベースに加工を行うよ
うにし、また短冊状基板では加工単位が小さくなること
から、さらにこの短冊状基板を複数個隣り合わせに接着
してウェーハ状の大きな被加工用基板を作成し、この被
加工用基板を用いて従来の磁気ヘッド部品の加工に比較
して大巾に能率を向上させた加工を行なうことを可能に
するものである。
[Means for Solving the Problems] The present invention focuses on the fact that a ceramic substrate can be easily formed without the need for slicing if it is a rectangular substrate, and processing is performed based on this rectangular substrate. In addition, since the processing unit becomes smaller in the strip-shaped substrate, a plurality of the strip-shaped substrates are further bonded side by side to create a large wafer-shaped processing substrate, and the conventional processing is performed using the processing substrate. This makes it possible to perform processing with greatly improved efficiency as compared with the processing of magnetic head parts described above.

第1図は、本発明の方法を磁気ヘッド部品である磁気
ヘッドスライダの製造の場合に適用した実施例の説明図
である。
FIG. 1 is an explanatory view of an embodiment in which the method of the present invention is applied to the case of manufacturing a magnetic head slider as a magnetic head component.

以下、第1図にしたがって本発明の原理を説明する。 Hereinafter, the principle of the present invention will be described with reference to FIG.

第1図において、 1は、セラミック等からなる短冊状基板であり、その形
状は、製造目的の磁気ヘッドスライダ5の基板を複数
個、隣接する状態で1方向に整列させたときの全体形状
と略同一の短冊状のものである。
In FIG. 1, reference numeral 1 denotes a strip-shaped substrate made of ceramic or the like, which has the same shape as a plurality of substrates of the magnetic head slider 5 to be manufactured, which are aligned in one direction in an adjacent state. They are almost the same strip shape.

2は、異なる短冊状基板1の長側面6同士を接着して連
結することにより形成した被加工用基板である。
Reference numeral 2 denotes a substrate to be processed formed by bonding and connecting the long side surfaces 6 of different strip-shaped substrates 1 to each other.

3は、被加工用基板2を載せて支持する加工用テーブル
である。
Reference numeral 3 denotes a processing table on which the substrate to be processed 2 is placed and supported.

4は、被加工用基板2をテーブル3上へ位置決めするた
めの位置決め部である。
Reference numeral 4 denotes a positioning unit for positioning the substrate to be processed 2 on the table 3.

5は、磁気ヘッドスライダである。Reference numeral 5 denotes a magnetic head slider.

6は、短冊状基板1の長側面である。6 is a long side surface of the strip-shaped substrate 1.

ここで、磁気ヘッドスライダ5の製造工程は次のよう
になっている。
Here, the manufacturing process of the magnetic head slider 5 is as follows.

すなわち、 公知のセラミック成型方法により作成されたセラミ
ック短冊状素材の各面(6面全体)を精密加工して、製
造目的のチップ状部品の基板を複数個並べた大きさの短
冊状基板1(例えば、厚さ0.5mm,巾2.5mm,長さ100mmの
大きさ)を複数個作成する。
That is, each surface (all six surfaces) of a ceramic strip-shaped material prepared by a known ceramic molding method is precision-processed, and a strip-shaped substrate 1 (a size of a plurality of chip-shaped components to be manufactured is arranged). For example, a plurality of pieces having a thickness of 0.5 mm, a width of 2.5 mm, and a length of 100 mm) are prepared.

短冊状基板1の長側面6同士を接着して、複数の短
冊状基板を連結した被加工用基板2を作成する。
By bonding the long side surfaces 6 of the strip-shaped substrates 1 to each other, a substrate 2 to be processed in which a plurality of strip-shaped substrates are connected is created.

被加工用基板2を加工用テーブル3に載せるととも
に位置決め部4に押しつけて、当該被加工用基板2を加
工用テーブル3の所定位置へセットする。そして、加工
用テーブル3に支持された被加工用基板2の表面部(上
面)に研磨,ラッピング,ポリッシング等の加工を行な
う。
The substrate to be processed 2 is placed on the table for processing 3 and pressed against the positioning portion 4 to set the substrate for processing 2 at a predetermined position on the table for processing 3. Then, processing such as polishing, lapping, and polishing is performed on the surface portion (upper surface) of the processing target substrate 2 supported by the processing table 3.

加工の終了した基板2の接着部を剥がして、元の複
数個の短冊状基板1の状態にする。
The bonded portion of the processed substrate 2 is peeled off to return to the original plural strip-shaped substrates 1.

短冊状基板1のそれぞれをダイシングして個々の磁
気ヘッドスライダ5とする。
Each of the strip-shaped substrates 1 is diced into individual magnetic head sliders 5.

の工程で磁気ヘッドスライダを製造している。In this process, a magnetic head slider is manufactured.

[作用] 以上のように、従来の磁気ヘッドスライダを製造する
工程に比べて、本発明のそれは工程,が特に相違し
ている。すなわち、製造目的のチップ状部品の基板を複
数個、隣接する状態で1方向に整列させたときの全体形
状を持つ短冊状基板を複数個作成し、異なる短冊状基板
の長側面同士を接着することにより、前記複数個の短冊
状基板を連結して1枚の被加工用基板を作成している。
[Operation] As described above, the steps of the present invention are particularly different from the steps of manufacturing the conventional magnetic head slider. That is, a plurality of substrates of chip-like components for manufacturing purposes, a plurality of rectangular substrates having the overall shape when aligned in one direction in an adjacent state are prepared, and the long sides of different rectangular substrates are bonded to each other. Thus, the plurality of strip-shaped substrates are connected to form one substrate to be processed.

したがって、スライシング加工に伴う割れの発生,ス
ライシング加工歪の残留といった現象が生じることはな
く、不良品の発生を極力抑えることができる。
Therefore, phenomena such as generation of cracks due to slicing and residual slicing distortion do not occur, and generation of defective products can be suppressed as much as possible.

[実施例] 前記のように、第1図は、磁気ヘッドスライダの場合
についての実施例を示している。ここで、前記の工程
ととは、順序を逆にして第2図のように、加工後に被
加工用基板2を、長側面6を横切る方向にダイシング加
工して、単一の磁気ヘッドスライダの側面同士が接着し
ている状態とし、その後、接着部分を剥がして個々の磁
気ヘッドスライダを製造することもできる。また、複数
個の短冊状基板1を連結した被加工用基板2の作成にさ
いしては、長側面6同士を接着することに代えて、短冊
状基板1の短側面7同士を接着してもよい。
Embodiment As described above, FIG. 1 shows an embodiment in the case of a magnetic head slider. Here, the order is reversed from the above-mentioned step, and as shown in FIG. 2, after processing, the substrate 2 to be processed is diced in a direction crossing the long side surface 6 to form a single magnetic head slider. It is also possible to manufacture individual magnetic head sliders by making the side surfaces adhere to each other and then peeling off the adhered portions. Further, in producing the substrate to be processed 2 in which a plurality of strip-shaped substrates 1 are connected, instead of bonding the long side surfaces 6 to each other, the short side surfaces 7 of the strip-shaped substrate 1 may be bonded to each other. Good.

[発明の効果] 本発明は、以上説明したように構成されているので、
次のような効果を持つ。
[Effects of the Invention] Since the present invention is configured as described above,
It has the following effects.

(a) スライシング加工に伴う割れの発生,スライシ
ング加工歪の残留といった現象が生じることはなく、不
良なチップ状部品の発生を極力抑えることができる。ま
た、個々のICチップにするまでに、前記またはの工
程における1方向へのダイシング加工の1回のみの切断
加工が必要となるだけであり、切断加工による割れの発
生率も小さくなる。
(A) The occurrence of cracks due to slicing and the occurrence of residual slicing distortion do not occur, and the occurrence of defective chip-shaped components can be suppressed as much as possible. In addition, only one dicing process in one direction in the above-described process is required before each individual IC chip is formed, and the incidence of cracks due to the cutting process is reduced.

(b) チップ状部品の基板をインラインに並べた状態
と同一の短冊状のものを1単位として被加工用基板の形
状を構成しているので、基板材料の無駄な部分がなく、
全体としての低コスト化を図ることができる。
(B) Since the shape of the substrate to be processed is configured by using the same strip-shaped one as a unit in which the substrates of the chip-shaped components are arranged in-line, there is no wasted portion of the substrate material.
Cost reduction as a whole can be achieved.

(c) 前記の工程の加工時において、短冊状基板同
士を接着している接着剤がケミカル・シーリングの働き
をして、不要な化学作用の発生を防止することができ
る。
(C) At the time of the processing in the above-mentioned step, the adhesive bonding the strip-shaped substrates acts as a chemical sealing, so that generation of unnecessary chemical action can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

第1図は本発明の実施例を示す説明図、第2図は本発明
の他の実施例を示す説明図、第3図は従来例を示す説明
図である。 第1図,第2図中、 1……短冊状基板 2……被加工用基板(ウェーハ状) 3……加工用テーブル 4……位置決め部 5……チップ状部品(磁気ヘッドスライダ) 6……短冊状基板の長側面 7……短冊状基板の短側面
FIG. 1 is an explanatory view showing an embodiment of the present invention, FIG. 2 is an explanatory view showing another embodiment of the present invention, and FIG. 3 is an explanatory view showing a conventional example. In Fig. 1 and Fig. 2, 1 ... strip-shaped substrate 2 ... substrate to be processed (wafer-shaped) 3 ... processing table 4 ... positioning part 5 ... chip-shaped component (magnetic head slider) 6 ... … Long side of strip-shaped substrate 7 …… Shorten side of strip-shaped substrate

フロントページの続き (58)調査した分野(Int.Cl.6,DB名) B28D 1/22 B28B 11/14 G11B 5/127Continuation of the front page (58) Field surveyed (Int.Cl. 6 , DB name) B28D 1/22 B28B 11/14 G11B 5/127

Claims (2)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】製造目的のチップ状部品の基板を複数個、
隣接する状態で1方向に整列させたときの全体形状を持
つ複数個の短冊状セラミック基板の長側面同士あるいは
短側面同士を接着することにより、前記複数個の短冊状
セラミック基板を連結して1枚の被加工用基板を作成
し、 当該被加工用基板の状態で、必要な加工を施し、 次に、当該被加工用基板の接着部分を剥がして、元の複
数個の短冊状基板の状態にし、 次に、この短冊状基板のそれぞれについてダイシング加
工をして個々のチップ状部品を切り出す ことを特徴とするチップ状部品の製造方法。
1. A method for manufacturing a plurality of chip-shaped component substrates, comprising:
By bonding the long side surfaces or the short side surfaces of a plurality of strip-shaped ceramic substrates having an overall shape when aligned in one direction in an adjacent state, the plurality of strip-shaped ceramic substrates are connected to each other to form a one-piece. A plurality of substrates to be processed are prepared, necessary processing is performed in the state of the substrate to be processed, and then, an adhesive portion of the substrate to be processed is peeled off, and the state of the original plurality of strip-shaped substrates is removed. Next, a dicing process is performed on each of the strip-shaped substrates to cut out individual chip-shaped components.
【請求項2】製造目的のチップ状部品の基板を複数個、
隣接する状態で1方向に整列させたときの全体形状を持
つ複数個の短冊状セラミック基板の長側面同士あるいは
短側面同士を接着することにより、前記複数個の短冊状
セラミック基板を連結して1枚の被加工用基板を作成
し、 当該被加工用基板の状態で、必要な加工を施し、 次に、当該被加工用板を、接着面を横切る方向にダイシ
ング加工して、単一のチップ状部品の基板の側面同士が
接着している状態とし、 次に、当該側面同士の接着部分を剥がして、個々のチッ
プ状部品にする ことを特徴とするチップ状部品の製造方法。
2. The method according to claim 1, wherein a plurality of chip-shaped component substrates to be manufactured are provided.
By bonding the long side surfaces or the short side surfaces of a plurality of strip-shaped ceramic substrates having an overall shape when aligned in one direction in an adjacent state, the plurality of strip-shaped ceramic substrates are connected to each other to form a one-piece. A plurality of substrates to be processed are prepared, necessary processing is performed in the state of the substrate to be processed, and then the plate to be processed is diced in a direction crossing the bonding surface to obtain a single chip. A method of manufacturing a chip-shaped component, wherein the side surfaces of the substrate of the chip-shaped component are adhered to each other, and then the bonded portions of the side surfaces are peeled off to form individual chip-shaped components.
JP23509189A 1989-09-11 1989-09-11 Manufacturing method of chip-shaped parts Expired - Fee Related JP2798274B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23509189A JP2798274B2 (en) 1989-09-11 1989-09-11 Manufacturing method of chip-shaped parts

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23509189A JP2798274B2 (en) 1989-09-11 1989-09-11 Manufacturing method of chip-shaped parts

Publications (2)

Publication Number Publication Date
JPH0397108A JPH0397108A (en) 1991-04-23
JP2798274B2 true JP2798274B2 (en) 1998-09-17

Family

ID=16980935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23509189A Expired - Fee Related JP2798274B2 (en) 1989-09-11 1989-09-11 Manufacturing method of chip-shaped parts

Country Status (1)

Country Link
JP (1) JP2798274B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112008845A (en) * 2020-07-22 2020-12-01 巢湖市永安新型建材有限责任公司 Cutting and separating mechanism for aerated block

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112008845A (en) * 2020-07-22 2020-12-01 巢湖市永安新型建材有限责任公司 Cutting and separating mechanism for aerated block

Also Published As

Publication number Publication date
JPH0397108A (en) 1991-04-23

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