JP2797703B2 - How to set the inspection frame for electronic components - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to a method for setting an inspection frame for an electronic component, and more particularly, to an inspection frame for performing a visual inspection of an electronic component mounted on a substrate using a camera. How to set automatically.

(Prior art) After mounting an electronic component on a substrate, the electronic component is displaced,
Appearance inspections, such as missing parts and front / back inversion, are performed. Conventionally, such visual inspection has been performed by visual inspection, but in recent years, automatic inspection by optical means such as a camera has gradually become widespread.

In order to perform an appearance inspection using such a camera, an inspection frame for specifying an inspection target portion must be set. Conventionally, the inspection frame is set by observing the sample substrate with a camera, capturing the image, displaying the image on a monitor TV, and manually moving the inspection frame on the monitor screen while the operator manually moves the inspection frame. The inspection was performed in accordance with the part to be inspected, such as the molded body or the solder of the component.

(Problems to be Solved by the Invention) However, the above conventional means is very troublesome,
In addition to requiring a great deal of time and effort, there has been a problem that individual errors and mistakes of workers are likely to occur.

Accordingly, an object of the present invention is to provide a method for automatically and accurately setting an inspection frame of an electronic component.

(Means for Solving the Problems) The present invention provides: (1) a margin frame having a size larger than the image of the sample electronic component is set in the field of view of the camera, and the image of the sample electronic component is placed inside the margin frame A first step of capturing and setting a master pattern; and (2) setting an inspection frame matching the image of the sample electronic component inside the margin frame and determining a position of the inspection frame in the margin frame. And (3) setting a search area including the electronic components mounted on the sample substrate, and scanning the inside of the search area with the above-mentioned margin frame to extract a margin frame with a good matching ratio. And (4) a fourth step of setting an inspection frame inside the margin frame from the position of the inspection frame in the margin frame determined in the second step. By repeating the above steps for other electronic components mounted on the pull substrate, the inspection frames of these electronic components are sequentially set.

(Operation) According to the above configuration, the inspection frame can be accurately set at a high speed. In addition, since data for each type of electronic component can be registered in the computer, data management for each type of electronic component can be performed. Even if the type of board is changed, the registered data for registered electronic components can be saved. Utilization can be used to set an inspection frame.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 shows a sample electronic component P taken into a camera.
The image of FIG. A is a margin frame, which is set slightly larger than the image size of the electronic component P so that an image of the electronic component P can be captured therein.

OA (X1, Y1) is the coordinates of the corner, which is the characteristic point of the margin A. In this way, an image is captured and a master pattern is set. This master pattern is registered in the computer as binarized information or multi-valued information such as gray scale (the first step).

Next, an inspection frame B that matches the image of the sample electronic component P is set. At this time, the distance z in the XY direction of the corner OB (X2, Y2), which is a feature point of the inspection frame B, from the corner OA.
a, ya and the horizontal and vertical dimensions a and b of the inspection frame B are measured (above,
2nd step). By this second step, the position and size of the inspection frame B in the margin frame A can be determined. OA above,
Numerical values such as OB, a, and b are registered in the computer together with the master pattern as attached data unique to the electronic component P.

The above procedure is performed for each type of electronic component, and the respective master patterns and attached data are registered in the computer. When registration of all electronic components mounted on the board is completed, an inspection frame is set on the sample board by the procedure described below.

In FIG. 2, reference numeral 1 denotes a sample substrate on which various types of electronic components P1, P2, P3,... Are mounted. First, a search area S including the target electronic component P1 is set. Next, a margin frame A is set inside the search area S, and the margin frame A is scanned in the X and Y directions to extract a margin frame A1 having the best matching rate (the third frame is described above).
Steps). Next, an inspection frame B1 is set inside the margin frame A1. (4th step). In this case, since the position of the inspection frame B in the margin frame A is determined by the second step, the position of the inspection frame B1 in the margin frame A1 can be immediately determined.

If the position of the inspection frame B1 of the electronic component P1 on the sample substrate 1 is set by the above procedure, the other electronic components are set.
For P2, P3 ..., the inspection frame B2,
Set B3 ...

As described above, according to the present method, the inspection frame B of the electronic component can be automatically set on the sample substrate 1. Of course, for the other electronic components P2, P3,... As well as the electronic component P1, the master pattern and the attached data are registered in the computer.

In the above-described means, the inspection frames B1, B2,... Are set so as to match the image of the electronic component, but the electronic components on the board usually have a slight displacement, There is a possibility that it will protrude from B1 and B2. Therefore, after setting the inspection frames B1, B2,..., It is desirable to set the inspection frames B1 ′, B2 ′,. The sizes of the margin dimensions xm and ym are determined by required mounting accuracy, and are registered in the computer as attached data.

(Effects of the Invention) As described above, according to the present invention, it is possible to automatically and accurately set an inspection frame for visual inspection by a camera at a high speed. Also, since the master pattern and attached data are set for each type of electronic component and registered in the computer, even if the type of board is changed, if the electronic component is already registered, it is registered in the computer. Since the collected data can be used as it is, the versatility is extremely high, and it is possible to manage each electronic component type.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is an image view of an electronic component, and FIG. 2 is an image view of a substrate. A: extra frame B: inspection frame S: search area P: electronic component 1: sample board

Claims (1)

(57) [Claims] 1. A first step of setting a margin frame larger in size than an image of a sample electronic component in a field of view of a camera, taking an image of the sample electronic component into the margin frame, and setting a master pattern. A second step of setting an inspection frame matching the image of the sample electronic component inside the margin frame and determining the position of the inspection frame in the margin frame; A third step of setting a search area to be included and scanning the inside of the search area with the above-mentioned margin, and extracting a margin with a good matching rate; A fourth step of setting an inspection frame inside the margin frame from the position, and wherein the other electronic components mounted on the sample substrate are:
A method for setting an inspection frame for an electronic component, wherein the inspection frame for the electronic component is sequentially set by repeating the above steps.