JP2750255B2 - Electronic component storage package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for accommodating electronic components such as a semiconductor element and a quartz oscillator.

[0002]

2. Description of the Related Art Conventionally, an electronic component housing package for housing electronic components such as a semiconductor element and a quartz oscillator is generally made of an electrically insulating material such as an aluminum oxide sintered body, and a semiconductor is provided substantially at the center of the upper surface thereof. An insulating base having a recess for accommodating an electronic component such as an element, and having a metallized wiring layer made of a refractory metal powder of tungsten, molybdenum, manganese, or the like led out from around the recess to the outside; An external lead terminal attached to the metallized wiring layer via a brazing material such as silver brazing to electrically connect to an external electric circuit, and a lid made of an electrically insulating material such as an aluminum oxide sintered body. An electronic component such as a semiconductor element is bonded and fixed to the bottom surface of the concave portion of the insulating base via an adhesive, and each electrode of the electronic component is bonded to a metallized wiring layer. The electronic component is connected to the upper surface of the insulating base with a brazing material made of solder or the like, and the electronic components are hermetically contained in a container consisting of the insulating base and the lid. Electronic device.

In such a conventional package for housing electronic parts, the lid is bonded to the insulating base by forming a layer made of a high melting point metal powder such as tungsten, molybdenum, or manganese on the opposing main surfaces of the insulating base and the lid. An annular metal layer having a three-layer structure consisting of a metal layer and a layer made of nickel and a layer made of gold is adhered, and the annular metal layers adhered to each of the insulating base and the lid are joined via a brazing material such as solder. It is done by doing.

[0004] Further, the insulating base and the lid are joined with a brazing material such as solder previously bonded to the entire surface of the annular metal layer adhered to the lid, and the lid is placed on the annular metal layer of the insulating base. Is placed so that the brazing material is sandwiched therebetween, and then the lid is pressed against the insulating base with a constant pressure, and about 30
This is performed by applying a temperature of 0 to 350 ° C. and heating and melting the brazing material.

[0005]

However, in this conventional electronic component housing package, the annular metal layer attached to the insulating base and the annular metal layer attached to the lid are made of a brazing material such as solder. When the electronic component is hermetically sealed in a container formed of an insulating base and a lid, the brazing material is heated and melted while pressing the lid against the insulating base at a constant pressure. Of the insulating base and the lid, the amount of brazing material interposed between the insulating base and the lid is reduced, and the bonding strength between the insulating base and the lid is reduced. There is a disadvantage that the reliability of hermetic sealing of the container made of the body is greatly deteriorated.

[0006]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned drawbacks, and has as its object to provide a container comprising an insulating base and a lid with a predetermined amount of brazing material interposed between the insulating base and the lid. It is an object of the present invention to provide an electronic component storage package that allows normal and stable operation of electronic components stored in a container for a long period of time by perfecting airtight sealing.

[0007]

SUMMARY OF THE INVENTION The present invention comprises an insulating substrate having an annular metal layer attached to the outer peripheral portion of the upper surface and a lid having an annular metal layer attached to the outer peripheral portion of the lower surface. An electronic component housing package in which electronic components are hermetically housed by joining the annular metal layer thus formed and the annular metal layer attached to the lid via a brazing material, An inorganic powder is embedded in a brazing material for joining the annular metal layer of the base and the annular metal layer of the lid.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG. 1 shows an embodiment of a package for accommodating an electronic component according to the present invention, in which 1 is an insulating base made of an electrically insulating material, and 2 is a lid also made of an electrically insulating material. This insulating base 1
The lid 2 constitutes a container 4 for accommodating electronic components 3 such as semiconductor elements.

The insulating substrate 1 is provided with a stepped recess 1a in the center of the upper surface thereof for forming a space for accommodating an electronic component 3 such as a semiconductor element, and the bottom of the recess 1a is provided with an electronic component. 3 is attached via an adhesive such as an epoxy resin.

A plurality of metallized wiring layers 5 are formed on the insulating substrate 1 from the periphery of the concave portion 1a to the outside of the container 4, and electronic components 3 are formed around the concave portion 1a of the metallized wiring layer 5. Are electrically connected via bonding wires 6, and external lead terminals 7 connected to an external electric circuit are attached to a portion led out of the container 4 via a brazing material such as silver brazing. You.

The insulating substrate 1 is made of an electrically insulating material such as an aluminum oxide sintered body, and is made of aluminum oxide (Al ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO) or the like. A ceramic green sheet (ceramic green sheet) is obtained by adding a suitable organic solvent and a solvent to the raw material powder to form a slurry by mixing and using a conventionally known doctor blade method or calender roll method. The ceramic green sheet is manufactured by subjecting the ceramic green sheet to appropriate punching, laminating a plurality of sheets, and firing at a high temperature.

The metallized wiring layer 5 is made of a high melting point metal powder such as tungsten, molybdenum or manganese. A metal paste obtained by adding a suitable organic solvent or a solvent to the high melting point metal powder such as tungsten is used as an insulating substrate. 1
The ceramic green sheet is printed and applied in a predetermined pattern by a conventionally known screen printing method, so that the ceramic green sheet is adhered and formed so as to be led out of the container 4 from around the concave portion 1a of the insulating substrate 1.

The exposed surface of the metallized wiring layer 5 is coated with a metal having excellent corrosion resistance such as nickel and gold and a good wettability with a brazing material by a plating method or the like to a thickness of 1.0 to 20.0 μm.
When the metallized wiring layer 5 is layered, the oxidation corrosion of the metallized wiring layer 5 can be effectively prevented, and the bonding of the bonding wire 6 to the metallized wiring layer 5 and the soldering of the external lead terminals 7 to the metallized wiring layer 5 can be prevented. The attachment becomes extremely strong. Therefore, oxidation corrosion of the metallized wiring layer 5 is prevented, and the bonding wire 6 is formed on the metallized wiring layer 5.
In order to bond the external lead terminals 7 firmly, nickel or gold is applied to the exposed surface of the metallized wiring layer 5 by 1.0 to 20.0.
It is preferable to coat the layer to a thickness of μm.

Further, the external lead terminals 7 brazed to the metallized wiring layer 5 are used for the electronic components 3 housed inside the container.
To the external electrical circuit
7 is connected to an external electric circuit, so that the electronic component 3 housed therein is electrically connected to the external electric circuit via the metallized wiring layer 5 and the external lead terminals 7.

The external lead terminal 7 is made of a metal material such as Kovar metal (iron-nickel-cobalt alloy) or 42 alloy (iron-nickel alloy). It is formed into a predetermined plate shape by applying a conventionally known metal working method such as a method.

The external lead terminal 7 is preferably formed by plating a metal having excellent corrosion resistance, such as nickel and gold, and a good wettability with a brazing material to a thickness of 1.0 to 20.0 μm on a surface thereof by plating or the like. In addition, the oxidative corrosion of the external lead terminals 7 can be effectively prevented, and the connection of the external lead terminals 7 to the external electric circuit is reliably and firmly made. Therefore, it is preferable that nickel, gold or the like is layered on the surface of the external lead terminal 7 to a thickness of 1.0 to 20.0 μm in order to effectively prevent oxidation corrosion and the like.

The insulating substrate 1 is further provided with an annular metal layer 8 on its upper surface, and a lid 2 is joined to the metal layer 8 via a brazing material 9, whereby the inside of the container 4 is The electronic component 3 is hermetically sealed.

The annular metal layer 8 adhered to the upper surface of the insulating base 1 is made of a high melting point metal powder such as tungsten, molybdenum, manganese or the like. An organic solvent and a solvent are added to the high melting point metal powder and mixed. The obtained metal paste is used as an insulating substrate.
The ceramic green sheet that becomes 1 is printed and applied by adopting the conventionally known screen printing method,
The ceramic green sheet is fired at a high temperature,
At the same time, it is adhered to the upper surface of the insulating base 1.

The surface of the annular metal layer 8 has a brazing material 9
A layer made of nickel and a layer made of gold are sequentially deposited in order to improve the wettability.

The lid 2 joined to the upper surface of the insulating base 1 is made of an electrically insulating material such as an aluminum oxide sintered body, and an annular metal layer 10 is previously applied to the outer periphery of the lower surface thereof. The lid 2 is joined to the insulating base 1 by joining the annular metal layer 10 to the metal layer 8 on the upper surface of the insulating base 1 via a brazing material 9.

The lid 2 is made of, for example, aluminum oxide (A
l ₂ O ₃ ), silica (SiO ₂ ), calcia (CaO), magnesia (MgO), etc., are filled in a predetermined press mold and pressed at a constant pressure to be molded. It is manufactured by firing a molded article at a temperature of about 1500 ° C.

The lid 2 is further provided with an annular metal layer 10 on the outer periphery of the lower surface thereof. The annular metal layer 10 is made of a high melting point metal powder such as tungsten or manganese, or a metal such as silver-palladium. A metal paste obtained by adding and mixing an organic solvent and a solvent to a powder of tungsten or the like is preliminarily printed and applied by a screen printing method to a molded body to be the lid 2, or a lid obtained by firing a molded article. The lower surface of the body 2 is printed and applied by a screen printing method, and is baked to be attached to the outer peripheral portion of the lower surface of the lid 2.

When the annular metal layer 10 is formed of silver-palladium comprising 70.0 to 95.0% by weight of silver and 5.0 to 30.0% by weight of palladium, the adhesion strength of the metal layer 10 to the cover 2 is increased, and The wettability of the brazing material 9 can be made very good. Therefore, in order to increase the reliability of hermetic sealing of the container 3 composed of the insulating base 1 and the lid 2, the metal layer 10 is adhered to the lid 2 and the silver
To 95.0% by weight, and 5.0 to 30.0% by weight of palladium.

The annular metal layer 10 attached to the lid 2
In order to improve the workability of joining the insulating base 1 and the lid 2, a brazing material 9 is previously joined, and the joining of the brazing material 9 to the metal layer 10 adhered to the lid 2 is An organic solvent is added to a powder of solder or the like constituting the brazing material 9, and a solder paste obtained by adding and mixing a solvent is printed on the metal layer 10 adhered to the lid 2 by a conventionally known screen printing method, and thereafter, About 35
This is performed by reflowing at a temperature of 0 to 400 ° C. for a short time.

As the brazing material 9, a low melting point brazing material such as solder is used, and the metal layer 8 and the lid are attached to the upper surface of the insulating base 1.
By joining the metal layer 10 adhered to the lower surface of the container 3, the inside of the container 3 is air-tightly sealed.

The brazing material 9 has an inorganic powder embedded therein, and the inorganic powder is composed of an annular metal layer 8 attached to the insulating base 1 and an annular metal layer attached to the lid 2. layer
When the soldering material 10 is joined with the brazing material 9 such as solder, a predetermined gap is formed between the insulating base 1 and the lid 2 and an action is taken such that a predetermined amount of the brazing material 9 is interposed between the two. Do
As a result, the annular metal layer 8 of the insulating base 1 and the annular metal layer 10 of the lid 2 are firmly joined via the brazing material 9, and the electronic component 3 is placed inside the container 4 composed of the insulating base 1 and the lid 2. Completely hermetically sealed.

The inorganic powder embedded in the brazing material 9 is silica (SiO ₂ ), alumina (Al ₂ O ₃ ), boron oxide (B
₂ O ₃ ), etc., and the inorganic powder such as silica or alumina does not react at all with the brazing material 9 such as solder and does not change the properties of the brazing material 9. 8 and the brazing material interposed between the insulating base 1 and the lid 2 while maintaining the strong bonding of the lid 2 and the annular metal layer 10.
9, you can control the quantity.

If the amount of the inorganic powder to be embedded in the brazing material 9 is less than 1.0% by weight, when the insulating base 1 and the cover 2 are joined via the brazing material 9, Substrate 1
The amount of the brazing material 9 interposed between the cover member 2 and the cover member 2 tends to be small, so that it is difficult to firmly join the two. If it exceeds 20.0% by weight, the insulating base 1 and the cover member 2 Are joined together via the brazing material 9, the insulating base 1 and the lid
Since the contact between the annular metal layers 8 and 10 and the brazing material 9 tends to be hindered by the inorganic powder and it becomes difficult to firmly join the insulating base 1 and the lid 2, the brazing material 9 The amount of the inorganic powder to be embedded is 1.0 to 20.0% by weight
Is preferably set in the range.

When the inorganic powder embedded in the brazing material 9 has a particle size of less than 5.0 μm, the insulating substrate 1 and the lid
When the brazing material 2 is joined via the brazing material 9, the gap formed between the insulating base 1 and the lid 2 is narrowed, and the amount of the brazing material 9 is reduced, so that it is difficult to firmly join the two. When the thickness exceeds 70.0 μm,
Since holes are formed in the brazing material 9 that joins 1 and the lid 2, and the reliability of hermetic sealing of the container 4 tends to decrease, the inorganic powder embedded in the brazing material 9 is It is preferable that the particle size is in the range of 5.0 to 70.0 μm.

Thus, according to the above-described electronic component storage package, the electronic component 3 is attached to the bottom surface of the concave portion 1a of the insulating base 1 via an adhesive, and each electrode of the electronic component 3 is bonded to the metallized wiring layer 5 by a bonding wire. 6 and then the lid 2 is joined to the upper surface of the insulating base 1 with a brazing material 9, and the electronic component 3 is hermetically sealed inside the container 3. Device.

It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention.
Although the metal layer 10 adhered to 2 is formed of silver-palladium, it may be formed of silver-platinum.

As the brazing material 9, a low melting point brazing material such as solder is used. In particular, at least one of tin and indium is 1.0 to 10.0% by weight, silver is 1.0 to 10.0% by weight, and the balance is lead. By using this, the melting temperature of the brazing material 9 can be lowered, and the metal layers 8 and 10 adhered to the insulating base 1 and the lid 2 can be firmly bonded to each other with good wettability.

Further, in the above-described embodiment, the brazing material 9 is previously joined to the metal layer 10 attached to the lid 2, but may be joined to the metal layer 8 attached to the insulating base 1 in advance. Good.

[0034]

According to the electronic component housing package of the present invention, the inorganic powder is embedded in the brazing material for joining the annular metal layer of the insulating base and the annular metal layer of the lid, so that the insulating base can be covered. When joining the attached annular metal layer and the annular metal layer attached to the lid via a brazing material such as solder, a predetermined gap is formed by the inorganic powder between the insulating base and the lid. As a result, a predetermined amount of brazing material is interposed between the two, and as a result, the bonding between the annular metal layer of the insulating base and the annular metal layer of the lid becomes extremely strong via the brazing material, and The electronic component can be completely hermetically sealed inside the container including the body.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view showing an embodiment of an electronic component storage package according to the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Insulating base 2 ... Lid 3 ... Semiconductor element 4 ... Container 5 ... Metallized wiring layer 7 ... External lead terminal 8 ····· Circular metal layer 9 ···· Brazing material

Claims (3)

(57) [Claims] An insulating base having an annular metal layer attached to an outer peripheral portion thereof; and a lid having an annular metal layer attached to a lower peripheral portion. The annular metal layer and the lid attached to the insulating substrate. An electronic component housing package in which an electronic component is hermetically housed by joining an annular metal layer adhered to a body via a brazing material, wherein the annular metal layer of the insulating base and a lid are provided. An electronic component storage package, characterized in that an inorganic powder is embedded in a brazing material for bonding to an annular metal layer of a body. 2. The electronic component storage package according to claim 1, wherein the amount of the inorganic powder embedded is 1.0 to 20.0% by weight. 3. The inorganic powder has a particle size of 5.0 to 70.0 μm.
The electronic component storage package according to claim 1, wherein: