JP2682588B2 - IC socket - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC socket equipped with a semiconductor integrated circuit.

[0002]

2. Description of the Related Art Electric appliances may generate noise when they are operated, and may malfunction when they receive unnecessary noise. As automation is progressing in various fields, the adverse effects of noise emitted from electronic devices are attracting attention in various countries, and even in Japan, the amount of EMI (electromagnetic radiation) noise generated for information processing devices such as personal computers and word processors. To keep VCI within a certain limit
(Voluntary regulation of radio wave interference for information processing equipment) standard has come into effect.

These are radiated noises as a system, but the same can be said at the level of individual elements constituting the system, and particularly for semiconductor elements (hereinafter referred to as ICs) that handle minute signals, noise is caused. Since there is a concern of malfunction, it is necessary to design the system considering them.

FIG . 5 is a perspective view showing a conventional IC socket, in which 1 is a socket body made of an insulating resin,
Reference numeral 2 denotes an electrode that makes electrical contact with an IC to be mounted, and contacts an IC lead when an IC (not shown) is inserted. Reference numeral 3 is a lead terminal connected to the electrode 2 in a one-to-one relationship. The lead terminal is electrically soldered to a board or the like (not shown).
It is fixed mechanically.

Many conventional measures against noise have been taken for the above-mentioned boards and the like, but not for sockets.

Also, when conducting an electrical test of an IC operating at a very high frequency or an IC sensitive to noise, the IC generates GN due to noise generated by itself.
Since the D level fluctuation may occur and accurate measurement may not be possible, the GND line is strengthened on the measurement board. Also in this case, the IC socket as shown in FIG. 5 is used, and how the GND on the measurement board is used.
Even if the line was strengthened, noise was picked up on the electrodes 2 and the lead terminals 3 of the IC socket.

[0007]

Since the conventional IC socket is constructed as described above, it is easy to receive the radiation noise from the surrounding electric products, and the radiation noise generated from the IC on the socket is easily received. , There was a problem that it has no shield effect.

An IC sensitive to electrical noise
When it is used for the electrical test, there is a problem that noise is apt to be placed on the GND line and an accurate test cannot be performed.

The present invention has been made in order to solve the above-mentioned problems, and in the electrical test of IC, G
To obtain an IC socket that is less likely to have noise on the ND line
Aim.

[0010]

An IC socket according to the present invention is arranged in or on an insulator of a socket body.
Connected conductor to the specific lead of the IC socket,
It is provided with electrodes that can be connected and connected arbitrarily.

[0011]

[Action] IC socket in the present invention, electrical IC
The ground level of GND stabilizes when used for dynamic tests
Therefore, an accurate test becomes possible.

[0012]

[Embodiment 1] An embodiment of the present invention will be described below with reference to the drawings. 1 and 2, 1 to 3 are the same as the conventional ones. 4 is a conductor embedded in the insulating resin of the socket body 1.
Body. FIG. 2 is a view showing a cross section taken along the line AA of FIG.
However, in the figure, the conductor 4 is
It is connected to the lead terminal 3 of the GND pin. Also, 7
Is a planar conductor plate for wiring connected to the conductor 4.

The IC socket configured as described above is
When mounting on a measurement board (not shown) for conducting an electrical test of the IC, the wiring conductive plate 7 is wired on the GND solid surface on the measurement board over as wide a range as possible. As a result, the GND pin on the socket and the GND of the measurement board can be connected on a wide surface, and the GND supplied to the IC to be measured can be made extremely stable in which the potential does not fluctuate due to noise. .

Example 2. Still another embodiment will be described with reference to the drawings. In FIG. 3 , 1 to 3 are the same as the conventional ones, but in the figure, 2a and 2b are a GND pin and a power supply pin, respectively. FIG. 4 is a view showing a BB cross section of FIG. 4a,
Reference numeral 4b is a conductor connected to the GND pin 2a and the power supply pin 2b by conductor joints 6a and 6b. The conductors are insulated from each other and each has a wiring conductor plate 7a, 7b.

When an IC measuring board is produced using the IC socket constructed as described above, the wiring conducting plate 7a is used.
The GND of the above measurement board for strengthening the GND line
Wiring is performed on the solid surface, and the wiring conductive plate 7b is wired to the power supply line of the measurement board for reinforcing the power supply line.

Embodiment 3. In the above example, the conductor 4 is arranged inside the insulator of the socket body, but it may be attached to the outer surface of the insulator of the socket body .
No.

Embodiment 4. In the above example, the lead terminal 3 connecting the conductor 4 is GN.
Although shown as a D pin, it may be another pin (eg, a power pin) if desired.

[0018]

As it is evident from the foregoing description, according to the present invention, socket
The conductor placed in or on the surface of the insulator
An electrode that connects to a specific lead of the C socket and grounds the conductor
Since a terminal is provided, it suppresses GND fluctuation during electrical testing.
Therefore, a highly accurate test can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an IC socket according to an embodiment of the present invention.

FIG. 2 is a sectional view taken along line AA of FIG. 1;

FIG. 3 is a perspective view showing an IC socket according to another embodiment of the present invention.

FIG. 4 is a sectional view taken along line BB of FIG. 3;

FIG. 5 is a perspective view showing a conventional IC socket.

[Explanation of symbols]

 1 IC socket body 2 Electrode 3 Lead terminal 4 Conductor 6 Connection between conductor and electrode 7 Conductive plate for wiring

Claims (2)

(57) [Claims] 1. An IC socket in which the semiconductor device is mounted to obtain electrical contact with a signal terminal of the semiconductor device. The IC socket is provided on or in an insulator of a main body of the IC socket and electrically connected to an electrode of the IC socket. Insulated conductor
With at least one or more IC sockets
A surface that is connected to the electrode and is connected to the conductor and can be wired to the outside
An IC socket having a terminal in the shape of a pin. 2. At least two or more independent conductors provided on the surface of the insulator of the IC socket body or in the insulator are respectively connected to the electrodes of the IC socket, and can be externally wired corresponding to the conductors. The IC socket according to claim 1, wherein the IC socket has a planar terminal.